Solid state disk capable of rapidly dissipating heat

Abstract

The utility model discloses a fast heat dissipation solid state disk, which comprises a metal shell, a PCB (printed circuit board), a main control chip, a base, a heat conduction copper sheet, a copper pipe, a heat dissipation aluminum sheet and a heat dissipation fan, the PCB is arranged at the lower end part of the metal shell, the main control chip is arranged on the upper end wall of the PCB, the base is arranged on the upper end wall of the PCB, the heat conduction copper sheet is embedded in the middle of the base, and the heat dissipation aluminum sheet is embedded in the middle of the copper pipe. The heat conduction copper sheets abut against the main control chip, the heat dissipation aluminum sheets are arranged on the base side by side at intervals, the two ends of the copper pipes are embedded in the heat dissipation aluminum sheets respectively, heat conduction liquid is arranged in the copper pipes, the copper pipes abut against the heat conduction copper sheets respectively, and the heat dissipation fans are arranged at the two ends of the upper end walls of the heat dissipation aluminum sheets respectively. The two ends of the upper end wall of the metal shell are each provided with a through hole in a concave mode, and the cooling fans are located in the through holes respectively. According to the technical scheme, the problem that the solid state disk is poor in heat dissipation can be effectively solved, it is ensured that the solid state disk can stably operate under various use conditions, and the service life of the solid state disk is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of solid-state drive technology, and in particular to a solid-state drive with rapid heat dissipation. Background Technology

[0002] Solid-state drives (SSDs), also known as solid-state drives, are hard drives made using arrays of solid-state electronic storage chips.

[0003] However, most existing solid-state drives (SSDs) on the market currently use passive cooling methods that rely on natural cooling. Passive cooling depends on airflow and physical conduction, which is not ideal for heat dissipation. SSDs generate a lot of heat when operating under high load for a long time. If the heat cannot be dissipated effectively in time, it will cause the SSD temperature to rise, affecting the stability and lifespan of the SSD. Utility Model Content

[0004] The main purpose of this invention is to propose a solid-state drive (SSD) with rapid heat dissipation, aiming to solve the technical problem that existing SSDs use a passive cooling method based on natural cooling, which has an unsatisfactory heat dissipation effect, leading to increased SSD temperature and affecting the stability and lifespan of the SSD.

[0005] To achieve the above objectives, this utility model proposes a solid-state drive with rapid heat dissipation, comprising a metal casing, a PCB board, a main control chip, a base, thermally conductive copper sheets, copper pipes, heat dissipation aluminum fins, and cooling fans. The PCB board is disposed at the lower end of the metal casing, the main control chip is disposed on the upper wall of the PCB board, the base is disposed on the upper wall of the PCB board, the thermally conductive copper sheets are embedded in the middle of the base and abut against the main control chip, the heat dissipation aluminum fins are arranged side by side at intervals on the base, and a thermally conductive gap is formed between two adjacent heat dissipation aluminum fins, the copper pipes are arranged in a U-shape, and both ends of the copper pipes are respectively embedded in the heat dissipation aluminum fins, the copper pipes contain heat-conducting fluid, and the copper pipes abut against the thermally conductive copper sheets, the cooling fans are respectively disposed at both ends of the upper wall of the heat dissipation aluminum fins, and the upper wall of the metal casing is respectively provided with a through hole at both ends, with the cooling fans located in the through holes.

[0006] Optionally, the lower end wall of the thermally conductive copper sheet is provided with a thermally conductive pad or thermally conductive silicone grease.

[0007] Optionally, the two side walls of the metal casing are recessed with heat dissipation grooves.

[0008] Optionally, the metal casing is made of aluminum alloy.

[0009] Optionally, the outer periphery of the metal casing is provided with multiple arc-shaped grooves.

[0010] Optionally, the device also includes a bracket, which is disposed at both ends of the upper end wall of the heat sink aluminum fin, and the heat sink fan is disposed on the bracket, with both ends of the bracket being fixedly connected to the inner top wall of the metal housing.

[0011] Optionally, a slot is recessed at both ends of the upper wall of the heat sink aluminum fin, and the bracket is respectively embedded in the slot.

[0012] Optionally, the base has a recessed groove in the middle that is adapted to the heat-conducting copper sheet, and the heat-conducting copper sheet is embedded in the groove.

[0013] The technical solution of this utility model has the following beneficial effects: The technical solution of this utility model involves a base mounted on the upper wall of a PCB board, a heat-conducting copper sheet embedded in the middle of the base, the heat-conducting copper sheet abutting against the main control chip, and heat-dissipating aluminum sheets arranged side-by-side at intervals on the base, forming a heat-conducting gap between two adjacent heat-dissipating aluminum sheets. Copper tubes are arranged in a U-shape, with both ends embedded in the heat-dissipating aluminum sheets. Heat-conducting liquid is placed inside the copper tubes, and each copper tube abuts against the heat-conducting copper sheet. Cooling fans are respectively located at both ends of the upper wall of the heat-dissipating aluminum sheets. A through hole is recessed at both ends of the upper wall of the metal casing, and the cooling fans are located within the through holes. Effective stacking of heat sink fins, coupled with a cooling fan mounted on top of the fins, enhances heat dissipation through forced convection. The cooling fan provides additional cooling, especially under high loads. The heat sink fins increase the heat dissipation area and improve efficiency. Copper pipes ensure excellent heat conduction, further enhancing cooling. This ensures better heat dissipation and a longer lifespan for the SSD, effectively reducing temperature and ensuring stable operation under full load. This effectively solves the problem of poor SSD heat dissipation, ensuring stable operation under various usage conditions and extending its lifespan. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of a solid-state drive with rapid heat dissipation according to an embodiment of the present invention.

[0016] Figure 2 This is a schematic diagram of the overall structure of a solid-state drive with rapid heat dissipation according to an embodiment of the present invention.

[0017] Figure 3 This is an exploded view of a solid-state drive with rapid heat dissipation according to an embodiment of the present invention.

[0018] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0021] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0022] This invention proposes a solid-state drive with rapid heat dissipation.

[0023] like Figures 1 to 3As shown, in one embodiment of this utility model, the fast-heat dissipation solid-state drive includes a metal casing 101, a PCB board 102, a main control chip 103, a base 104, a thermally conductive copper sheet 105, a copper pipe 106, a heat dissipation aluminum fin 107, and a cooling fan 108. The PCB board 102 is disposed at the lower end of the metal casing 101, the main control chip 103 is disposed on the upper wall of the PCB board 102, the base 104 is disposed on the upper wall of the PCB board 102, and the thermally conductive copper sheet 105 is embedded in the middle of the base 104. The thermally conductive copper sheet 105 and the main control chip 103 are connected... The heat dissipation aluminum fins 107 are arranged side by side on the base 104 with intervals, and a thermally conductive gap (not shown) is formed between two adjacent heat dissipation aluminum fins 107. The copper tubes 106 are arranged in a U-shape, and the two ends of the copper tubes 106 are respectively embedded in the heat dissipation aluminum fins 107. The copper tubes 106 are filled with heat-conducting liquid. The copper tubes 106 are respectively in contact with the heat-conducting copper fins 105. The cooling fans 108 are respectively arranged at both ends of the upper end wall of the heat dissipation aluminum fins 107. The upper end wall of the metal shell 101 is respectively recessed with a through hole 1011, and the cooling fans 108 are respectively located in the through hole 1011.

[0024] Specifically, the lower end wall of the thermally conductive copper sheet 105 is provided with a thermal pad or thermal grease (not shown). The thermal grease can increase the contact area of ​​the thermally conductive copper sheet and improve the heat dissipation efficiency, while the thermal pad can evenly distribute heat and reduce the formation of hot spots to ensure the best heat dissipation effect.

[0025] Specifically, the two side walls of the metal casing 101 are recessed with heat dissipation grooves 1012, which can improve heat dissipation efficiency.

[0026] Specifically, the metal casing 101 is made of aluminum alloy, which has good thermal conductivity, further improving heat dissipation.

[0027] Specifically, the outer periphery of the metal casing 101 is provided with multiple arc-shaped grooves 1013, which can increase the heat dissipation area and improve the heat dissipation efficiency.

[0028] Specifically, it also includes a bracket 109, which is disposed at both ends of the upper end wall of the heat sink aluminum fin 107. The cooling fan 108 is disposed on the bracket 109, and both ends of the bracket 109 are fixedly connected to the inner top wall of the metal shell 101, thereby playing the role of fixing and supporting the metal shell.

[0029] Specifically, a slot (not shown) is recessed at both ends of the upper wall of the heat sink 107, and the bracket 109 is embedded in the slot to facilitate the installation and fixation of the bracket, while also serving as a limit.

[0030] Specifically, the base 104 has a recessed groove 1041 in the middle that is adapted to the heat-conducting copper sheet 105. The heat-conducting copper sheet 105 is embedded in the groove 1041, which serves to limit the position of the heat-conducting copper sheet.

[0031] Specifically, the working principle and engineering of this utility model are as follows:

[0032] By effectively stacking heat sinks and installing cooling fans on top of them, forced convection is used to increase heat dissipation. The cooling fans provide additional cooling, especially under high load. The heat sinks increase the heat dissipation area and improve heat dissipation efficiency. Copper pipes ensure good heat conduction, further enhancing the cooling effect. This ensures that the solid-state drive (SSD) has better heat dissipation and a longer lifespan. It effectively reduces temperature and ensures stable operation of the SSD under full load, thus effectively solving the problem of poor heat dissipation in SSDs and ensuring stable operation under various usage conditions, extending its lifespan.

[0033] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A solid state drive capable of fast heat dissipation, characterized in that, The application relates to a heat dissipation device, which comprises a metal shell, a PCB board, a main control chip, a base, a heat-conducting copper sheet, a copper pipe, heat dissipation aluminum sheets and heat dissipation fans, wherein the PCB board is arranged at the lower end of the metal shell, the main control chip is arranged on the upper end wall of the PCB board, the base is arranged on the upper end wall of the PCB board, the heat-conducting copper sheet is embedded in the middle of the base, the heat-conducting copper sheet abuts against the main control chip, the heat dissipation aluminum sheets are arranged in parallel and at intervals on the base, a heat-conducting gap is formed between two adjacent heat dissipation aluminum sheets, the copper pipe is arranged in a U-shaped structure, the two ends of the copper pipe are embedded in the heat dissipation aluminum sheets respectively, the copper pipe is provided with heat-conducting liquid, the copper pipe abuts against the heat-conducting copper sheet respectively, the heat dissipation fans are arranged at the two ends of the upper end wall of the heat dissipation aluminum sheets respectively, the upper end wall of the metal shell is concave at the two ends and provided with through holes, and the heat dissipation fans are arranged in the through holes respectively.

2. The SSD of claim 1, wherein, The lower end wall of the heat-conducting copper sheet is provided with heat-conducting pads or heat-conducting silicone grease.

3. The SSD of claim 1, wherein, The two side walls of the metal shell are concave and provided with heat dissipation grooves.

4. The SSD of claim 1, wherein, The metal shell is formed of an aluminum alloy material.

5. The SSD of claim 4, wherein, The outer periphery of the metal shell is provided with a plurality of circular-arc-shaped grooves.

6. The SSD of claim 1, wherein, The application further comprises supports arranged at the two ends of the upper end wall of the heat dissipation aluminum sheets, the heat dissipation fans are arranged on the supports, and the two ends of the supports are fixedly connected with the inner top wall of the metal shell.

7. The SSD of claim 6, wherein, The two ends of the upper end wall of the heat dissipation aluminum sheets are concave and provided with clamping grooves, and the supports are embedded in the clamping grooves respectively.

8. The SSD of claim 1, wherein, The middle of the base is concave and provided with a containing groove matched with the heat-conducting copper sheet, and the heat-conducting copper sheet is embedded in the containing groove.

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