PCB structure with high heat conduction and heat dissipation performance
By incorporating heat-conducting strips, heat dissipation fins, and metal heat transfer plates on the PCB board, the problems of poor heat dissipation and inconvenient maintenance of the PCB board are solved, achieving efficient heat dissipation and convenient installation, and extending the service life of the PCB board.
Patent Information
- Application Number
- CN202520129891.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-18
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-01-18
AI Technical Summary
The poor thermal conductivity and heat dissipation of existing PCB boards make electronic components prone to damage in high-temperature environments and inconvenient to maintain.
Heat-conducting strips and heat dissipation fins are installed inside the mounting base of the PCB board. Combined with a metal heat transfer plate and a cooling fan, heat is conducted to the heat transfer plate through the heat-conducting strips and dissipated to the outside through the heat dissipation fins. The aluminum profile heat dissipation plate accelerates heat dissipation, and the PCB board can be easily installed and removed through a sliding fixing mechanism.
It improves the heat dissipation efficiency of the PCB board, extends its service life, and facilitates the maintenance and replacement of the PCB board, thus enhancing its practicality.
Smart Images
Figure CN223772220U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board technology, and more specifically to a PCB board structure with strong thermal conductivity and heat dissipation. Background Technology
[0002] A PCB (Printed Circuit Board) is an indispensable component in electronic devices, providing mechanical support and electrical connections for electronic components.
[0003] PCBs can be classified into single-sided, double-sided, and multi-layer circuit boards. Due to the large number of electronic components mounted on them, they generate a lot of heat. However, existing PCBs have poor thermal conductivity and heat dissipation, which prevents the heat from dissipating quickly. This makes electronic components more susceptible to damage when operating in high-temperature environments for extended periods, reducing the lifespan of the PCB. Furthermore, PCBs are inconvenient to maintain and replace, resulting in low practicality. Therefore, we propose a PCB structure with strong thermal conductivity and heat dissipation to solve the above problems. Utility Model Content
[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a PCB board structure with strong thermal conductivity and heat dissipation to solve the problems existing in the background art.
[0005] This utility model provides the following technical solution: a PCB board structure with strong thermal conductivity and heat dissipation, including a mounting substrate, a PCB board body is disposed at the top of the inner cavity of the mounting substrate, and a fixing mounting mechanism is fixedly connected to each of the four corners of the top of the mounting substrate. A plurality of uniformly and equidistantly distributed heat-conducting strips are disposed at the bottom of the inner cavity of the mounting substrate located at the bottom of the PCB board body. A heat-conducting plate is fixedly connected to the bottom of the heat-conducting strips, and a heat dissipation fin is fixedly connected to the bottom of the heat-conducting plate. The heat dissipation fin extends through the bottom of the mounting substrate to the outside. Heat dissipation openings are symmetrically opened on both sides of the mounting substrate. A metal heat transfer plate is fixedly installed in the heat dissipation opening. A metal heat sink is fixedly connected to the side of the metal heat transfer plate away from the mounting substrate.
[0006] Preferably, mounting plates are symmetrically fixedly connected to the inner walls of the two sides adjacent to the heat dissipation vent of the mounting base plate, and several heat dissipation fans are fixedly installed on the other side of the mounting plates.
[0007] Preferably, the fixed installation mechanism includes a fixed plate fixedly connected to the four corners of the top of the mounting base plate. A movable groove is provided in the middle of one side of the fixed plate. A sliding rod is fixedly connected to the fixed plate inside the movable groove. A return spring is sleeved on the outer wall of the top of the sliding rod. A movable block is movably sleeved at one end of the sliding rod near the return spring. A connecting rod is fixedly connected to the bottom of one side of the movable block. A pressure plate is fixedly connected to the bottom of the connecting rod.
[0008] Preferably, the movable block and the movable groove form a sliding connection structure, and an anti-slip pad is fixedly connected to the bottom of the pressure plate.
[0009] Preferably, the inner walls of both sides of the mounting substrate are symmetrically fixed with support plates, and the bottom of the PCB board body is in contact with the top of the support plate.
[0010] Preferably, the metal heat sink is an aluminum profile heat sink, and the top of the heat-conducting strip is in contact with the bottom of the PCB board body.
[0011] The technical effects and advantages of this utility model are as follows:
[0012] 1. In use, the PCB board body dissipates heat during operation. The heat inside the PCB board body is dissipated to the metal heat transfer plate through the heat dissipation vents on both sides of the mounting substrate, and then discharged through the metal heat sink. This allows the heat on the PCB board body to be dissipated through the sides. The heat generated inside the PCB board body is conducted to the surface of the heat conduction plate through the heat conduction strip at the bottom of the PCB board body. The heat conduction plate, when heated, dissipates the heat to the outside of the mounting substrate through multiple heat dissipation fins, which further improves the heat dissipation efficiency. With the cooling fan activated, the heat generated by the PCB board body can be quickly dissipated, which helps to extend the service life of the PCB board body.
[0013] 2. In use, by pulling the moving block upward, the moving block slides upward along the slide rod, squeezing the return spring, thereby causing the pressure plate to move upward. Then, the PCB board body is placed on top of the support plate set on the inner wall of the mounting substrate. Then, the moving block is released, and under the rebound force of the return spring, the moving block is pushed downward along the moving groove, thereby pushing the pressure plate downward to press and fix the PCB board body. The anti-slip soft pad can buffer the contact surface between the pressure plate and the PCB board body, effectively preventing the pressure plate from damaging the PCB board body. The operation is convenient, which helps to improve the efficiency of PCB board body installation and disassembly, and facilitates the maintenance and replacement of the PCB board body. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0015] Figure 2 This is a schematic diagram of the internal side view of the mounting base plate of this utility model.
[0016] Figure 3 This is a top view of the internal structure of the mounting base plate of this utility model.
[0017] Figure 4 This is a schematic diagram of the fixed installation mechanism of this utility model.
[0018] The attached figures are labeled as follows: 1. Mounting base plate; 2. PCB board body; 3. Fixing and mounting mechanism; 31. Fixing plate; 32. Moving groove; 33. Sliding rod; 34. Return spring; 35. Moving block; 36. Connecting rod; 37. Pressure plate; 38. Anti-slip pad; 4. Metal heat transfer plate; 5. Metal heat dissipation plate; 6. Heat dissipation fins; 7. Heat conduction plate; 8. Heat conduction strip; 9. Support plate; 10. Mounting plate; 11. Cooling fan. Detailed Implementation
[0019] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. The PCB board structure with strong thermal conductivity and heat dissipation involved in this utility model is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0020] This invention provides a PCB board structure with strong thermal conductivity and heat dissipation. Please refer to [link / reference]. Figure 1-4 As shown, the system includes a mounting base 1, a PCB board body 2 is disposed at the top of the inner cavity of the mounting base 1, support plates 9 are symmetrically fixedly connected to the inner walls of both sides of the mounting base 1, the bottom of the PCB board body 2 is in contact with the top of the support plates 9, and a fixing mounting mechanism 3 is fixedly connected to each of the four corners of the top of the mounting base 1. Several heat-conducting strips 8 are evenly and equidistantly distributed in the inner cavity of the mounting base 1 at the bottom of the PCB board body 2, a heat-conducting plate 7 is fixedly connected to the bottom of the heat-conducting strips 8, and a heat dissipation fin 6 is fixedly connected to the bottom of the heat-conducting plate 7. The heat dissipation fin 6 extends through the bottom of the mounting base 1 to the outside, and heat dissipation openings are symmetrically opened on both sides of the mounting base 1. A metal heat transfer plate 4 is fixedly installed in the heat dissipation opening, and a metal heat dissipation plate 5 is fixedly connected to the side of the metal heat transfer plate 4 away from the mounting base 1.
[0021] In this embodiment, during use, the PCB board body 2 is first installed. By pulling the moving block 35 upward, the moving block 35 slides upward along the slide rod 33, squeezing the return spring 34, thereby causing the pressure plate 37 to move upward. Then, the PCB board body 2 is placed on top of the support plate 9 provided on the inner wall of the mounting substrate 1. Then, the moving block 35 is released. Under the rebound force of the return spring 34, the moving block 35 is pushed downward along the moving groove 32, thereby pushing the pressure plate 37 downward to press and fix the PCB board body 2. The anti-slip soft pad 38 can buffer the contact surface between the pressure plate 37 and the PCB board body 2, effectively preventing the pressure plate 37 from pressing the PCB board body 2. The problem is that the PCB board body 2 dissipates heat during operation. The heat inside the PCB board body 2 is dissipated to the metal heat transfer plate 4 through the heat dissipation vents on both sides of the mounting substrate 1, and is then conducted out through the metal heat sink 5. This allows the heat on the PCB board body 2 to be dissipated through the sides. The heat generated inside the PCB board body 2 is conducted to the surface of the heat conduction plate 7 through the heat conduction strip 8 at the bottom of the PCB board body 2. When the heat conduction plate 7 is heated, it dissipates the heat to the outside of the mounting substrate 1 through multiple heat dissipation fins 6, which further improves the heat dissipation efficiency. With the start of the cooling fan 11, the heat generated by the PCB board body 2 can be quickly dissipated, which helps to extend the service life of the PCB board body 2.
[0022] Furthermore, mounting plates 10 are symmetrically fixedly connected to the inner walls of the mounting base 1 on both sides adjacent to the heat dissipation vent. Several cooling fans 11 are fixedly installed on the other side of the mounting plate 10. In use, the mounting plates 10 facilitate the faster dissipation of heat generated by the PCB board body 2.
[0023] Furthermore, the fixed mounting mechanism 3 includes fixed plates 31 fixedly connected to the four corners of the top of the mounting base plate 1. A movable groove 32 is provided in the middle of one side of the fixed plate 31. A slide rod 33 is fixedly connected to the fixed plate 31 inside the movable groove 32. A return spring 34 is sleeved on the outer wall of the top of the slide rod 33. A movable block 35 is movably sleeved at one end of the slide rod 33 near the return spring 34. A connecting rod 36 is fixedly connected to the bottom of one side of the movable block 35. A pressure plate 37 is fixedly connected to the bottom of the connecting rod 36. The movable block 35 and the movable groove 32 form a sliding connection structure. An anti-slip pad 38 is fixedly connected to the bottom of the pressure plate 37. In use, by pulling the movable block 35 upward, the movable block 35 moves along... The slide bar 33 slides upward to press the return spring 34, thereby moving the pressure plate 37 upward. Then, the PCB board body 2 is placed on top of the support plate 9 provided on the inner wall of the mounting base plate 1. Then, the moving block 35 is released. Under the rebound force of the return spring 34, the moving block 35 is pushed down along the moving groove 32, thereby pushing the pressure plate 37 down to press and fix the PCB board body 2. The anti-slip soft pad 38 can buffer the contact surface between the pressure plate 37 and the PCB board body 2, effectively preventing the pressure plate 37 from crushing the PCB board body 2. The operation is convenient, which can improve the installation and disassembly efficiency of the PCB board body 2 and facilitate the maintenance and replacement of the PCB board body 2.
[0024] Furthermore, the metal heat sink 5 is an aluminum profile heat sink, and the top of the heat conduction strip 8 is in contact with the bottom of the PCB board body 2. When in use, the metal heat sink 5 is made of aluminum profile, which has excellent thermal conductivity and can effectively conduct heat from the PCB board body 2 to the entire surface of the metal heat sink 5, so that the heat can be quickly dissipated.
[0025] The working principle of this utility model is as follows: First, the PCB board body 2 is installed. By pulling the moving block 35 upwards, the moving block 35 slides upwards along the slide rod 33, compressing the return spring 34, thereby causing the pressure plate 37 to move upwards. Then, the PCB board body 2 is placed on top of the support plate 9 provided on the inner wall of the mounting substrate 1. Next, the moving block 35 is released. Under the rebound force of the return spring 34, the moving block 35 is pushed downwards along the moving groove 32, thereby pushing the pressure plate 37 downwards to press and fix the PCB board body 2. The anti-slip pad 38 provides cushioning for the contact surface between the pressure plate 37 and the PCB board body 2, effectively preventing the pressure plate 37 from pressing the PCB board body 2. When the PCB board body 2 is in operation, it dissipates heat. The heat inside the PCB board body 2 is dissipated to the metal heat transfer plate 4 through the heat dissipation vents on both sides of the mounting substrate 1, and is then conducted out through the metal heat sink 5. This allows the heat on the PCB board body 2 to be dissipated through the sides. The heat generated inside the PCB board body 2 is conducted to the surface of the heat conduction plate 7 through the heat conduction strip 8 at the bottom of the PCB board body 2. When the heat conduction plate 7 is heated, it dissipates the heat to the outside of the mounting substrate 1 through multiple heat dissipation fins 6, which further improves the heat dissipation efficiency. With the start of the cooling fan 11, the heat generated by the PCB board body 2 can be quickly dissipated, which helps to extend the service life of the PCB board body 2.
[0026] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.
[0027] Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.
[0028] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A PCB structure having high thermal conductivity and high heat dissipation, comprising a mounting substrate (1), characterized in that: The inner cavity top of the mounting base plate (1) is provided with a PCB plate body (2), the top of the mounting base plate (1) is fixedly connected with a fixed mounting mechanism (3), the inner cavity of the mounting base plate (1) is provided with a plurality of heat-conducting strips (8) evenly and equidistantly distributed at the bottom of the PCB plate body (2), the bottom of the heat-conducting strip (8) is fixedly connected with a heat-conducting plate (7), the bottom of the heat-conducting plate (7) is fixedly connected with a heat dissipation fin (6), the heat dissipation fin (6) extends to the outside through the bottom of the mounting base plate (1), the two sides of the mounting base plate (1) are symmetrically provided with heat dissipation openings, the heat dissipation openings are fixedly provided with metal heat-conducting plates (4), and the metal heat-conducting plates (4) are fixedly connected with metal heat dissipation plates (5) away from the mounting base plate (1).
2. The PCB board structure with high heat conduction and heat dissipation according to claim 1, characterized in that: The two inner walls of the mounting base plate (1) adjacent to the heat dissipation openings are fixedly connected with mounting plates (10), and the other sides of the mounting plates (10) are fixedly provided with a plurality of heat dissipation fans (11).
3. The PCB board structure with high heat conduction and heat dissipation according to claim 1, characterized in that: The fixed mounting mechanism (3) comprises fixed plates (31) fixedly connected to the top of the mounting base plate (1), a moving groove (32) is formed in the middle of one side of the fixed plate (31), a sliding rod (33) is fixedly connected to the inside of the moving groove (32), a return spring (34) is sleeved on the top outer wall of the sliding rod (33), a moving block (35) is movably sleeved on one end of the sliding rod (33) close to the return spring (34), a connecting rod (36) is fixedly connected to the bottom of one side of the moving block (35), and a pressing plate (37) is fixedly connected to the bottom of the connecting rod (36).
4. The PCB board structure with high heat conduction and heat dissipation according to claim 3, characterized in that: The moving block (35) and the moving groove (32) constitute a sliding connection structure, and the bottom of the pressing plate (37) is fixedly connected with an anti-skid soft pad (38).
5. The PCB board structure with high heat conduction and heat dissipation according to claim 1, characterized in that: The two inner walls of the mounting base plate (1) are symmetrically fixedly connected with supporting plates (9), and the bottom of the PCB plate body (2) is in contact with the top of the supporting plate (9).
6. The PCB board structure with high heat conduction and heat dissipation according to claim 1, characterized in that: The metal heat dissipation plate (5) is an aluminum profile heat dissipation plate, and the top of the heat-conducting strip (8) is in contact with the bottom of the PCB plate body (2). The metal heat dissipation plate (5) is an aluminum profile heat dissipation plate, and the top of the heat-conducting strip (8) is in contact with the bottom of the PCB plate body (2).