Component carrier

Abstract

The embodiment of the utility model provides a component bearing piece. The component carrier includes: a stack including a plurality of insulating layer structures and at least one electrically conductive layer structure, at least one of the plurality of insulating layer structures being a fiber-free insulating layer structure; a cavity, which is formed in the stack; and a component embedded in the cavity wherein at least one major surface of the component is in contact with at least one of the fiber-free insulating layer structures.

Description

Technical Field

[0001] This application relates to the field of semiconductor device manufacturing, and in particular to a component carrier. Background Technology

[0002] This section provides background information relating to this application, but such information does not necessarily constitute prior art.

[0003] With the increasing functionality of products equipped with component carriers (such as printed circuit boards) containing one or more electronic components, the miniaturization of these electronic components, and the rising number of electronic components to be mounted on component carriers, increasingly robust array-shaped components or packages with several electronic components are being adopted. These array-shaped components or packages have multiple contacts or connections, with the spacing between these contacts or connections becoming increasingly smaller. Such component carriers must possess mechanical robustness and electrical reliability to operate even under harsh conditions.

[0004] Improving the stability and electrical reliability of embedded components in component carriers is challenging. The goal is for components to be embedded in component carriers with higher electrical reliability and greater stability. Utility Model Content

[0005] This section provides a general overview of the application, rather than a full disclosure of the entire scope or all features of the application.

[0006] According to an exemplary embodiment of this application, a component carrier is provided, the component carrier comprising: a stack, the stack including a plurality of insulating layer structures and at least one electrically conductive layer structure, wherein at least one of the plurality of insulating layer structures is a fiber-free insulating layer structure; a cavity formed in the stack; and a component embedded in the cavity, wherein at least one main surface of the component is in contact with at least one of the fiber-free insulating layer structures.

[0007] In the context of this application, the term "component carrier structure" may specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical and / or optical and / or thermal connections. In other words, a component carrier can be configured as a mechanical and / or electronic carrier for a component.

[0008] In the context of this application, the term "stacked component" may specifically refer to an apparatus comprising a plurality of planar layer structures arranged in parallel with each other.

[0009] In the context of this application, the term "layer structure" may specifically refer to continuous layers, patterned layers, or multiple discontinuous islands in a common plane. Layer structures may be electrically insulating and / or electrically conductive. In the context of this application, "insulating layer structure" may specifically refer to an electrically insulating layer structure.

[0010] In the context of this application, the term "fiber-free insulating layer structure" can specifically refer to an insulating layer structure that does not contain fibers. The "fiber" can be, for example, glass fiber, glass fiber cloth, aramid fiber, carbon fiber, polymer fiber, or ceramic fiber. In some embodiments, the fiber-free insulating layer structure can be an insulating layer structure made of fiber-free resin materials such as epoxy resin, bismaleimide-triazine resin, cyanate ester, polyphenylene derivative, polyimide, or polyamide. In some embodiments, the fiber-free insulating layer structure can be an insulating layer structure made of fiber-free liquid crystal polymer, polytetrafluoroethylene (PTFE), or ceramic. In some embodiments, the fiber-free insulating layer structure can include an Ajinomoto multilayer film (ABF film). For example, in some embodiments, the layer structure covering the upper and / or lower main surfaces of the embedded component includes resin-coated copper foil (RCC), particularly ABF-containing RCC (i.e., an ABF film combined with copper foil). The Ajinomoto multilayer film (ABF film) has excellent dielectric properties, thermal stability, and mechanical properties. During the manufacturing process of component carriers, attaching an Ajinomoto multilayer film to its functional surface to use the Ajinomoto multilayer film as a dielectric layer is beneficial for providing precise electrical isolation and supporting the formation of electrical conduction paths in subsequent manufacturing processes.

[0011] In the context of this application, the term "main surface" of a component may specifically refer to an accessible surface on which the electrical function or operation of the component depends. The main surface of a component may have areas responsible for electrical connections, signal transmission, or heat conduction.

[0012] In some embodiments, at least one primary surface of the component is in contact with the primary surface of the fiberless insulation structure. The primary surface of the fiberless insulation structure can refer to the surface of the fiberless insulation structure that typically has the largest surface area. It is understood that the definition of the primary surface may vary depending on the design and application of the component or insulation structure, but its common characteristic is that it is the main working surface on the component or insulation structure used for the operation of the component and the provision of electrical functions.

[0013] In the context of this application, "lateral" can specifically refer to a direction parallel to the planar surface of the stacked components. Correspondingly, "vertical" can specifically refer to a direction perpendicular to the planar surface of the stacked components, that is, "vertical" can specifically refer to a direction parallel to the stacking direction of the stacked components.

[0014] An exemplary embodiment provides a component carrier comprising a stack having multiple conductive layer structures and multiple insulating layer structures. At least one of the multiple insulating layer structures is a fiber-free insulating layer structure. A cavity is formed in the stack, and a component is embedded in the cavity such that at least one main surface of the component is in contact with at least one of the fiber-free insulating layer structures. In some embodiments, the component carrier includes only one fiber-free insulating layer structure, which (particularly its main surface) is in contact with one main surface of the component. In some embodiments, the component carrier includes two or more fiber-free insulating layer structures, with only one main surface of the component in contact with one of the two or more fiber-free insulating layer structures. In some embodiments, the component carrier includes two or more fiber-free insulating layer structures, with two main surfaces of the component (particularly a vertically opposed upper main surface and a lower main surface) respectively in contact with different fiber-free insulating layer structures.

[0015] By contacting at least one main surface of the embedded component with a fiber-free insulating layer structure, the connection stability and electrical reliability of the embedded component can be improved. The fiber-free insulating layer structure allows the material of the insulating layer, such as resin material, to flow appropriately around the embedded component and / or into the gap between the embedded component and the cavity sidewalls during lamination, thereby enhancing the mechanical stability of the embedded component. Fiber-free insulating layer structures, such as Ajinomoto laminated films (ABF films), typically also have excellent processability, making it easier to fabricate fine features and complex shapes, which can be advantageous for cavity designs requiring embedded, particularly precision components. Fiber-free insulating layer structures can also exhibit superior electrical properties (such as low dielectric constant and low loss), helping to ensure that the electrical performance of the embedded component is not compromised, and therefore may be more suitable for applications in advanced packaging or high-frequency applications containing embedded components. Fiber-free insulating layer structures also provide more uniform material anisotropy, reducing non-uniform electrical or thermal properties that may result from fiber orientation. This uniformity is important for high-density and high-frequency circuits. The fiber-free insulation structure can also better match the coefficient of thermal expansion of copper or other metals, which helps to reduce thermal mismatch problems caused by thermal cycling during manufacturing or use, thereby improving electrical reliability.

[0016] The following will explain another exemplary embodiment of the component carrier.

[0017] In some alternative embodiments, the fiberless insulation layer structure in contact with the main surface of the component is a glass fiber-free insulation layer structure. Compared to insulation layer structures containing reinforcing glass fiber material, glass fiber-free insulation layer structures have relatively low mechanical strength. This allows for better flowability, enabling the glass fiber-free insulation layer structure to flow relatively freely around the embedded component and / or flow into the gap between the embedded component and the sidewall of the cavity during lamination processes performed by pressure or heat, thereby ensuring that the embedded component is securely embedded in the cavity.

[0018] In these embodiments, the component carrier may include multiple insulating layer structures, at least two of which are fiber-free insulating layer structures, and at least one of these fiber-free insulating layer structures is a glass fiber-free insulating layer structure. One of the at least two glass fiber-free insulating layer structures is arranged to contact a main surface of the embedded component.

[0019] In some alternative embodiments, the fiberless insulation layer structure in contact with the main surface of the component is a fiberglass-free insulation layer structure. Compared to insulation layer structures containing reinforcing fiberglass cloth, fiberglass-free insulation layer structures have lower mechanical strength, which allows for better flowability. This allows the fiberglass-free insulation layer structure to flow relatively freely around the embedded component and / or flow into the gap between the embedded component and the sidewall of the cavity during lamination processes performed by pressure or heat, thereby ensuring that the embedded component is securely embedded in the cavity.

[0020] In these embodiments, the component carrier may include multiple insulating layer structures, at least two of which are fiberless insulating layer structures, and at least one of these fiberless insulating layer structures is a fiberglass-free insulating layer structure. One of the fiberglass-free insulating layer structures is arranged to contact a main surface of the embedded component.

[0021] In other embodiments, at least one of the plurality of insulating layer structures is a fiberless insulating layer structure, and at least one other of the plurality of insulating layer structures is a fiberless cloth insulating layer structure. In such embodiments, the component can be arranged such that only one of its main surfaces contacts the fiberless insulating layer structure. For example, only the lower main surface of the component contacts the fiberless insulating layer structure, or only the lower main surface of the component contacts the fiberless cloth insulating layer structure. The component can also be arranged such that both of its main surfaces contact the fiberless insulating layer structure. For example, both main surfaces of the component contact the fiberless insulating layer structure, or both main surfaces of the component contact the fiberless cloth insulating layer structure, or both main surfaces of the component contact the fiberless insulating layer structure and the fiberless cloth insulating layer structure, respectively.

[0022] In some alternative embodiments, at least a portion of the component is inserted into the fiberless insulation structure in contact with the component. This arrangement allows the component to be more stably embedded in the cavity of the component carrier, which is beneficial for improving the electrical performance of the component carrier. For example, more stable embedding of the component can reduce poor electrical connections and decrease noise and interference caused by possible component movement. Furthermore, fiberless materials typically have uniform thermal conductivity, and inserting at least a portion of the component into the fiberless insulation structure allows for more efficient heat dissipation from the embedded component.

[0023] The component may be arranged such that only a portion of the lower main surface adjacent to the component is inserted into a fiberless insulating layer structure in contact with the lower main surface of the component. The vertical extension of said portion adjacent to the lower main surface of the component may account for, for example, 0 to 1 / 3 of the total vertical extension of the component, excluding the left endpoint value. It is understood that in some embodiments, the vertical extension of said portion adjacent to the lower main surface of the component may also account for more than 1 / 3 of the total vertical extension of the component. The component may also be arranged such that only a portion of the upper main surface adjacent to the component is inserted into a fiberless insulating layer structure in contact with the upper main surface of the component. The vertical extension of said portion adjacent to the upper main surface of the component may account for, for example, 0 to 2 / 3 of the total vertical extension of the component, excluding the left endpoint value. It is understood that in some embodiments, the vertical extension of said portion adjacent to the upper main surface of the component may also account for more than 2 / 3 of the total vertical extension of the component. The components may also be arranged such that a portion of the upper main surface of an adjacent component and a portion of the lower main surface of an adjacent component are inserted into fiberless insulation structures that are in contact with the upper and lower main surfaces of the component, respectively. In this case, the fiberless insulation structures in contact with the upper main surface of the component and the fiberless insulation structures in contact with the lower main surface of the component may or may not meet around the component (i.e., there is no contact between the interfaces of the two fiberless insulation structures facing each other).

[0024] In some alternative embodiments, the component has one or more pads on at least one of the main surfaces in contact with the fiberless insulation structure. At least a portion of one or more of the pads is inserted into the corresponding fiberless insulation structure. The component may have pads on only one of its main surfaces or on both of its main surfaces. The padded main surface may be inserted into the corresponding fiberless insulation structure together with the pads thereon. However, the padded main surface may also not be inserted into the corresponding fiberless insulation structure together with the pads thereon. For example, the corresponding pad may only be partially inserted into the fiberless insulation structure such that the fiberless insulation structure does not contact the main surface. Alternatively, the corresponding pad may be fully inserted into the fiberless insulation structure, but the fiberless insulation structure only contacts the main surface without any portion extending vertically beyond the main surface. It is understood that even if the fiberless insulation structure has individual portions extending vertically beyond the main surface, but does not form a state of surrounding the component, it cannot be considered that the main surface is inserted into the fiberless insulation structure.

[0025] By partially inserting the pad into the fiberless insulation structure, additional mechanical support and fixation can be provided, reducing unwanted swaying of components during normal operation and thermal cycling, thereby improving the overall structural stability.

[0026] In some alternative embodiments, the component has a plurality of pads on at least one of the main surfaces in contact with the fiberless insulation structure, the fiberless insulation structure in contact with the pads partially protruding into the space between the pads. The fiberless insulation structure may protrude into the space between a portion of the pads. The fiberless insulation structure may also protrude into the space between every two adjacent pads. The fiberless insulation structure may protrude into the space between the pads and partially fill the space. Alternatively, the fiberless insulation structure may protrude into the space between the pads and completely fill the space. The fiberless insulation structure protruding into the space between the pads can provide additional mechanical support and fixation, which is beneficial for improving the mechanical stability and electrical performance stability of the component.

[0027] In some embodiments, the upper surface of the fiberless insulation layer structure that contacts the lower main surface of the component is substantially flush with the lower main surface of the component. In such embodiments, the fiberless insulation layer structure substantially lacks any protrusions that at least partially surround the component along the circumferential sidewalls of the component.

[0028] In some alternative embodiments, at least one of the fiberless insulating layer structures that contact the main surface of the component protrudes into the cavity, such that at least a portion of the component is circumferentially surrounded by the fiberless insulating layer structure protruding into the cavity. In some embodiments, the gap between the sidewall of the cavity and the sidewall of the component is at least partially filled by the fiberless insulating layer structure that contacts the main surface of the component, which helps to improve the mechanical stability and electrical performance stability of the component.

[0029] During the manufacturing process of the component carrier, the fiberless insulation layer structure in contact with the main surface of the component may undergo a lamination process by pressure and / or heat. During lamination, the fiberless insulation layer structure flows appropriately, causing some of the fiberless insulation material to flow into the cavity and, upon curing, form a protrusion from the planar surface of the layer structure into the cavity. The fiberless insulation layer structure may also flow appropriately around the component, such that the portion of the component near the fiberless insulation layer structure is circumferentially surrounded by the protrusion of the fiberless insulation layer structure into the cavity. The protrusion can accordingly fill the gap between the component and the cavity wall.

[0030] When embedding a component into the cavity of a stack, a pre-baked fiberless insulating layer structure can be pre-covered on the bottom side of the stack to completely seal the cavity from the bottom. The component can then be placed on the pre-baked fiberless insulating layer structure, and the adhesive properties of the pre-baked fiberless insulating layer structure temporarily secure the component in the cavity. Subsequently, an additional insulating layer structure, particularly an additional fiberless insulating layer structure, can be covered on the top side of the stack to completely seal the cavity from the top. A lamination process is then performed. The incompletely cured portion of the fiberless insulating layer structure on the bottom side flows during lamination, forming a protrusion that at least partially surrounds the lower portion of the component and correspondingly fills the gap between the component and the cavity wall. The additional insulating layer structure sealing the cavity from the top side may be substantially fully cured or incompletely cured before application, depending on the specific application requirements of the component carrier. If the additional insulating layer structure is substantially fully cured, significant material flow may not occur during lamination. Advantageously, this additional insulating layer structure exhibits slight material flow to meet the requirements of lamination onto the adjacent layer structure, but such slight flow results in almost no protrusion forming part of the component, nor does it fill the gap between the component and the cavity wall. If the additional insulating layer structure is not fully cured, appropriate material flow may occur during lamination, thereby forming additional protrusions that surround the component in the upper portion of the component and correspondingly fill the gap between the component and the cavity wall. Surrounding the component from both the upper and lower portions promotes a more secure placement of the component within the cavity.

[0031] In some alternative embodiments, the fiberless insulating layer structure that contacts the lower main surface of the component protrudes into the cavity and extends in the cavity to a height not less than 1 / 10 of the height of the cavity, in particular, not less than 1 / 5 of the height of the cavity, and more particularly, not less than 1 / 3 of the height of the cavity.

[0032] In some alternative embodiments, the stack includes a component receiving structure. The component receiving structure includes an intermediate insulating portion and a lower electrically conductive layer structure that at least partially covers the lower side of the intermediate insulating portion. It is readily understood that this lower electrically conductive layer structure may be closer to the lower main surface of the component compared to the upper electrically conductive layer structure described below, and vice versa. The intermediate insulating portion includes one or more of the insulating layer structures. The cavity extends at least partially within the component receiving structure to receive the component to be embedded, wherein the cavity extends vertically through and terminates at the lower electrically conductive layer structure. By designing the component receiving structure as a combination of the intermediate insulating portion and the lower electrically conductive layer structure, more stable and reliable contact may be achieved along the path of electrical connection, which is beneficial for reducing contact resistance and improving signal transmission integrity. The lower electrically conductive layer structure can also help conduct heat generated by the component out of the cavity, improving heat dissipation efficiency.

[0033] In some alternative embodiments, the fiberless insulating layer structure in contact with the lower main surface of the component may be laminated onto the lower conductive layer structure such that the fiberless insulating layer structure in contact with the lower main surface can partially protrude into the cavity and completely cover the lower conductive layer structure in its lateral extension. Laminizing the fiberless insulating layer structure onto the lower conductive layer structure effectively provides insulation protection against unwanted electrical short circuits or crosstalk. The complete coverage of the lower conductive layer structure by the fiberless insulating layer structure provides a physical barrier, protecting the lower conductive layer structure from chemical and mechanical damage.

[0034] In some alternative embodiments, the component receiving structure may further include an upper electrically conductive layer structure that at least partially covers the upper side of the intermediate insulating portion. The cavity may extend through the component receiving structure such that it also extends vertically through the upper electrically conductive layer structure. Specifically, the cavity may extend vertically through and terminate within the upper electrically conductive layer structure. The vertical extension range of the cavity can be determined according to actual application requirements, which increases design flexibility.

[0035] In some alternative embodiments, the lateral extension of the fiberless insulation layer structure in contact with the main surface of the component partially overlaps with the lateral extension of the intermediate insulation portion.

[0036] In some alternative embodiments, the component receiving structure forms at least a portion of the core structure of the component carrier.

[0037] In the context of this application, the term "core structure" (also referred to as "core") can specifically refer to a rigid plate structure used for a component carrier. This core structure includes a preferably fully cured dielectric (such as the intermediate insulating portion described above), which may be covered with corresponding electrically conductive layer structures, such as patterned metal layers, on one or both opposite main surfaces. Optionally, the two opposite main surfaces of the core structure may be electrically coupled to each other, for example, through vertical vias filled with conductive material. More specifically, the core structure of the component carrier may be a rigid base material, which may optionally be laminated on one or both sides with additional electrically conductive layer structures and / or additional electrically insulating layer structures.

[0038] In some alternative embodiments, at least one insulating layer structure in the intermediate insulating portion is a glass fiber insulating layer structure. Insulating layer structures containing reinforcing materials such as glass fiber, forming the intermediate insulating portion of the component housing structure, helps to enhance the rigidity of the structure.

[0039] In some alternative embodiments, the lower main surface of the component contacts a non-fiber insulating layer structure among the plurality of insulating layer structures; at least one additional insulating layer structure, other than the non-fiber insulating layer structure contacting the lower main surface, is configured to contact the upper main surface of the component and also contact the non-fiber insulating layer structure contacting the lower main surface of the component. Specifically, this additional insulating layer structure contacts the non-fiber insulating layer structure contacting the lower main surface of the component in the gap between the cavity wall and the component. More specifically, the contact between the additional insulating layer structure and the non-fiber insulating layer structure contacting the lower main surface of the component forms an interface contour connection portion, which includes at least one convex protrusion facing the additional insulating layer structure.

[0040] In some examples, the additional insulating layer structure is a fiber-free insulating layer structure, particularly a fiber-free insulating layer structure. Thus, the fiber-free insulating layer structure can close the cavity from the top side and contact the upper main surface of the component, while the additional fiber-free insulating layer structure can close the cavity from the bottom side and contact the lower main surface of the component. During the lamination process related to component embedding, both the fiber-free insulating layer structure on the top side and the fiber-free insulating layer structure on the bottom side flow freely, allowing materials from both layers to flow into and meet in the gap between the component and the cavity wall. This allows the gap to be substantially completely filled with the fiber-free insulating material. In some embodiments, the meeting of materials from the two layers in the gap may result in a mixture of different materials. In other embodiments, the meeting of different materials from the two layers in the gap may form an interface contour connection without material fusion or mixing. In the context of this application, the term "forming an interface contour connection" can specifically refer to a connection formed by a first protrusion into the gap formed by material flowing into the cavity from the top side of the fiberless insulation layer structure (especially the glass fiberless insulation layer structure), and a second protrusion into the gap formed by material flowing into the cavity from the bottom side of the fiberless insulation layer structure (especially the glass fiberless insulation layer structure), in such a manner that the interface contacts and the interface contours are distinguishable. In the example, during the insertion of the component, the fiberless insulation material on the bottom side undergoes an extrusion and curing process before the fiberless insulation material on the top side, causing the fiberless insulation material on the bottom side to flow into the gap first, thereby forming an upward (towards the top side) protruding protrusion. Subsequently, the fiberless insulation material on the top side is laminated, thereby finally forming an interface contour connection including a convex protrusion towards the top side fiberless insulation layer structure.

[0041] In other examples, the additional insulating layer structure is a fiber-containing insulating layer structure, particularly a glass fiber-containing insulating layer structure. The fiber-containing insulating layer structure can close the cavity from the top side and contact the upper main surface of the component, while the non-fiber-containing insulating layer structure can close the cavity from the bottom side and contact the lower main surface of the component. During the component insertion process, the non-fiber-containing insulating material on the bottom side undergoes extrusion and curing before the fiber-containing insulating material on the top side, causing the non-fiber-containing insulating material on the bottom side to flow into the gap first and form an upwardly protruding protrusion. Then, the fiber-containing insulating material on the top side is laminated, ultimately forming an interface profile connection including a convex protrusion facing the top fiber-containing insulating layer structure. Furthermore, in such examples, because the non-fiber-containing insulating layer structure has better material flowability compared to the fiber-containing insulating layer structure, even when simultaneously subjected to lamination, the non-fiber-containing insulating layer structure may form a cured portion protruding towards the top insulating layer structure, thus ensuring that the interface profile connection includes at least one convex protrusion of the fiber-containing insulating layer structure facing the top.

[0042] The top insulating layer structure (especially the fiberless insulating layer structure) and the bottom fiberless insulating layer structure are in contact in the gap between the component and the cavity wall, so that the component is basically completely surrounded by the insulating material, especially by the fiberless insulating material, which significantly improves the component's embedding stability.

[0043] In some alternative embodiments, the contact between the additional insulating layer structure and the fiberless insulating layer structure in contact with the lower main surface of the component can be formed by chemical cross-linking, particularly by chemical cross-linking after heating. Chemical cross-linking, by forming covalent bonds at the molecular level, helps to improve the adhesion strength between the layers. This strong bond reduces the risk of separation between the layers and improves the mechanical integrity of the structure. Furthermore, cross-linked structures tend to exhibit higher thermal stability and heat resistance. Chemical cross-linking after heating enables the material to remain stable under high-temperature conditions, making it less prone to deformation or failure, which is important for component carriers that frequently undergo thermal cycling.

[0044] In an embodiment, the component carrier comprises a stack of at least one insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the aforementioned insulating and electrically conductive layer structures, particularly a laminate formed by applying mechanical pressure and / or heat. The aforementioned stack can provide a plate-like component carrier that provides a large mounting surface for other components while remaining very thin and compact.

[0045] In this implementation, the component carrier is formed as a plate. This contributes to a compact design, where the component carrier still provides a large base for mounting components. Furthermore, in particular, bare wafers, as an example of embedded electronic components, can be easily embedded in thin sheet materials such as printed circuit boards due to their small thickness.

[0046] In one embodiment, the component carrier or its preform is configured as one of a printed circuit board, a substrate (particularly an IC substrate), and an interposer.

[0047] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a sheet-like component carrier formed by laminating multiple electrically conductive layer structures with multiple insulating layer structures, for example by applying pressure and / or providing heat. Various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminates, for example by laser drilling or mechanical drilling, and by partially or completely filling said holes with an electrically conductive material (particularly copper), thereby forming vias such as through-hole connections. In addition to embedding one or more components, PCBs are generally configured to house one or more components on one or two opposite surfaces of the sheet-like PCB. They can be soldered to the respective main surfaces. The dielectric portions of the PCB can be composed of resin with reinforcing fibers (such as glass fiber).

[0048] In the context of this application, the term "substrate" can specifically refer to a component carrier. A substrate can be a relatively small component carrier associated with a PCB, on which one or more components can be mounted, and which can act as a connection medium between one or more chips and another PCB. For example, a substrate can have a size substantially the same as the component (particularly electronic components) to be mounted thereon (e.g., in the case of a chip-scale package (CSP)). More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks and a component carrier equivalent to a printed circuit board (PCB), but with a considerably high density of lateral and / or vertically arranged connectors. Lateral connectors are, for example, electrical conduction paths, while vertical connectors can be, for example, drilled holes. These lateral and / or vertical connectors are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections, particularly for enclosed or unenclosed components (such as bare wafers) of IC chips, to the printed circuit board or intermediate printed circuit board. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can be composed of resin with reinforcing particles (such as reinforcing spheres, especially glass spheres).

[0049] The substrate or interlayer may include or consist of layers of at least the following substances: glass; silicon and / or photosensitive or dry-etchable organic materials, such as epoxy-based laminated materials (e.g., epoxy-based laminated films); or polymer compounds (polymer compounds may include or may not include photosensitive and / or thermosensitive molecules).

[0050] In embodiments, at least one insulating layer structure comprises at least one of the following: resin (e.g., reinforced or unreinforced resin, such as epoxy resin or bismaleimide-triazine resin), cyanate ester resin, polyphenylene derivative, glass (especially glass fiber, multilayer glass, glass-like materials), prepreg material (e.g., FR-4 or FR-5), polyimide, polyamide, liquid crystal polymer (LCP), epoxy resin-based laminated film, polytetrafluoroethylene (PTFE, Teflon), ceramics, and metal oxides. Reinforcing structures made of glass (multilayer glass), such as meshes, fibers, or spheres, may also be used. While prepreg, particularly FR4, is generally preferred for rigid PCBs, other materials, particularly epoxy resin-based laminated films or photo-imageable dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as PTFE, liquid crystal polymers and / or cyanate ester resins, low-temperature co-fired ceramics (LTCC), or other low, very low, or ultra-low DK materials may be applied as the electrical insulating layer structure in the component carrier.

[0051] In embodiments, at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, magnesium, carbon, (particularly doped) silicon, titanium, and platinum. Although copper is generally preferred, other materials or coating variations thereof, particularly those coated with superconducting materials or conductive polymers, are also possible, such as graphene or poly(ethylene).

[0052] In an embodiment, at least one component may be embedded in the stack. Such a component may be selected from at least one of the following: non-conductive inlays, conductive inlays (e.g., metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), light guiding elements (e.g., optical waveguides or optical conductor connectors), electronic components, or combinations thereof. The inlay may be, for example, a metal block (IMS-inlay) with or without an insulating material coating, which may be embedded or surface-mounted for the purpose of facilitating heat dissipation. Suitable materials are defined by their thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, alumina (Al₂O₃), or aluminum nitride (AlN). Other geometries with increased surface area are also frequently used to improve heat exchange capacity. In addition, the components can be active electronic components (having at least one implemented pn junction), passive electronic components such as resistors, inductors or capacitors, electronic chips, storage devices (e.g., DRAM or other data memories), filters, integrated circuits (e.g., field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs) and complex programmable logic devices (CPLDs)), signal processing components, power management components (e.g., field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs), or insulated-gate field-effect transistors). In-Gigabit Electron Devices (IGFETs), which are based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), indium phosphide (InP), and / or any other suitable inorganic compound, can be used as optoelectronic interface elements, light-emitting diodes (LEDs), optocouplers, voltage converters (e.g., DC / DC converters or AC / DC converters), cryptographic components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components can also be embedded in component carriers. For example, magnetic elements can be used as components. Such magnetic elements can be permanent magnetic elements (e.g., ferromagnetic, antiferromagnetic, multiferroic, or ferrimagnetic elements, such as ferrite cores) or paramagnetic elements. However, the component can also be an IC substrate, an interposer, or other component carriers, such as those in a board-in-board configuration. The component can be surface-mounted on a component carrier and / or embedded within the component carrier. Furthermore, other components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

[0053] The foregoing limitations and other aspects of the present invention will become apparent from the examples of embodiments to be described below, and will be explained with reference to these examples of embodiments. Attached Figure Description

[0054] The features and advantages of embodiments of this application will become more readily understood from the following description with reference to the accompanying drawings, which are not drawn to scale and some features are enlarged or reduced to show details of specific components.

[0055] Figure 1 A schematic cross-sectional view of a component carrier according to an exemplary embodiment of this application is provided.

[0056] Figure 2 A schematic cross-sectional view of a component receiving structure according to an exemplary embodiment of this application is provided. Detailed Implementation

[0057] The present application will now be described in detail with reference to the accompanying drawings and exemplary embodiments thereof. It should be noted that the following detailed description is for illustrative purposes only and is not intended to limit the scope of the application. Furthermore, the same reference numerals are used to denote the same parts in the various drawings.

[0058] It should also be noted that, for clarity, not all features of the actual specific embodiments are described and shown in the specification and drawings. In addition, in order to avoid unnecessary details from obscuring the technical solutions of interest in this application, only the arrangement structure closely related to the technical content of this application is described and shown in the specification and drawings, while other details that are not closely related to the technical content of this application and are known to those skilled in the art are omitted.

[0059] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the various embodiments of this application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of this application to facilitate the reader's better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and with various changes and modifications based on the following embodiments. The division of the various embodiments below is for the convenience of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.

[0060] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0061] In this application, terms such as "upper," "lower," "outer," and "inner" used to describe orientation are for descriptive purposes only and should not be considered limiting. Furthermore, although this application has been described with reference to exemplary embodiments, it should be understood that this application is not limited to the specific embodiments described and shown herein. Various modifications to the exemplary embodiments can be made by those skilled in the art without departing from the scope defined by the claims of this application.

[0062] Reference Figure 1 According to an exemplary embodiment of this application, a component carrier 100 includes a stack 102 formed of a plurality of insulating layer structures 104 and at least one electrically conductive layer structure 106. One or more of the plurality of insulating layer structures 104 are fiberless insulating layer structures. A cavity 108 is formed in the stack 102, the cavity 108 extending partially over the entire vertical extension of the stack 102. A component 110 is embedded in the cavity 108, and at least one main surface of the component 110 is in contact with at least one fiberless insulating layer structure included in the stack 102.

[0063] Contacting the main surface of component 110 with the fiberless insulation layer structure can improve the connection stability and electrical reliability of the embedded component. The fiberless insulation layer structure allows insulating material, such as resin material, to flow appropriately around component 110 and / or into the gap 118 between component 110 and the sidewall of cavity 108 during lamination, permanently securing component 110 within cavity 108. Fiberless insulation layer structures (such as layer structures containing only resin material) have low dielectric constants and low losses, which helps protect the electrical performance of component 110 from damage. The fiberless insulation layer structure also provides more uniform material anisotropy, reducing non-uniform electrical or thermal properties that may result from fiber orientation. This uniformity is important for high-density and high-frequency circuits. The fiberless insulation layer structure also better matches the coefficient of thermal expansion of copper or other metals, helping to reduce thermal mismatch problems caused by thermal cycling during manufacturing or use, thereby improving electrical reliability.

[0064] In manufacturing such Figure 1 In the process of exemplary embodiment of the component carrier 100 according to the present application, when it is necessary to embed the component 110 into the cavity 108, it is possible to first place it on the bottom side of the stacked component 102 (in Figure 1 A non-woven insulating layer structure with a certain degree of adhesion is covered (on the side closest to pad 116) to close the cavity 108 from the bottom side of the stack 102. Then, the component 110 is placed in the cavity 108 and rests on the non-woven insulating layer structure with a certain degree of adhesion, such that the lower main surface 114 of the component 110 and / or the pad 116 disposed on the lower main surface 114 contact the upper surface of the non-woven insulating layer structure, so as to temporarily fix the component 110 in the cavity 108 by utilizing the adhesion of the non-woven insulating layer structure. During the lamination process, the material of the non-woven insulating layer structure can flow appropriately to achieve interconnection between different structures such as the sidewalls of the cavity 108, the component 110, and the non-woven insulating layer structure, thereby permanently fixing the component 110 in the cavity 108. Thus, the non-woven insulating layer structure becomes part of the final component carrier 100, without needing to be removed after the lamination process as in related art, where temporary carriers such as tape used in the embedding process of the component 110 are removed.

[0065] For example, the "fiberless insulating layer structure exhibiting a certain degree of viscosity" can be a fiberless insulating layer structure that has been pre-baked to exhibit a certain degree of viscosity, or it can be a fiberless insulating layer structure that exhibits a certain degree of viscosity at room temperature, such as an Ajinomoto laminated film. In particular, in some embodiments, before sealing the cavity 108 from the bottom side of the stack 102 with the Ajinomoto laminated film, the Ajinomoto laminated film can be bonded to a copper foil, for example, through a pre-baking operation, to form a preform. The preform is placed on the bottom side of the stack 102 with the Ajinomoto laminated film facing the cavity, so as to seal the cavity 108 from the bottom side of the stack 102 with the preform. Then, the component 110 is placed in the cavity 108 and rests on the Ajinomoto laminated film of the preform.

[0066] In embodiments of this application, the fiberless insulation layer structure in contact with the main surface of component 110 can be a glass fiber-free insulation layer structure and / or a glass fiber cloth-free insulation layer structure.

[0067] During the lamination operation involved in the embedding process of component 110, material from at least one of the fiberless insulating layer structures in contact with the main surface of component 110 will flow around component 110 and / or flow into the gap 118 between component 110 and the sidewall of cavity 108, such that at least a portion of component 110 is inserted into the fiberless insulating layer structure in which the material flow occurs.

[0068] For example, in some examples, the non-fiber-free insulating layer structure (in contact with the lower main surface 114 of component 110) that serves as a non-temporary support for component 110 in the embedding process, as described above, may experience significant material flow during lamination, causing a portion of component 110 near the lower main surface 114 to insert into the non-fiber-free insulating layer structure. In some examples, alternatively or additionally, the insulating layer structure 104 in contact with the upper main surface 112 of component 110 is a non-fiber-free insulating layer structure. In some examples, the insulating layer structure 104 in contact with the upper main surface 112 of component 110 includes an Ajinomoto laminate. In some examples, the layer structure in contact with the upper main surface 112 of component 110 includes RCC, particularly ABF-containing RCC. During lamination, significant material flow may occur in the non-fiber-free insulating layer structure in contact with the upper main surface 112 of component 110, causing a portion of component 110 near the upper main surface 112 to insert into the non-fiber-free insulating layer structure.

[0069] One or more pads 116 may be provided on the upper main surface 112 and / or the lower main surface 114 of component 110. The pads 116 are at least partially inserted into the fiberless insulation layer structure due to the flow of the fiberless insulation material during lamination. The flow of the fiberless insulation material can cause the main surface of component 110 (upper main surface 112 or lower main surface 114) together with the pads 116 thereon to be inserted into the corresponding fiberless insulation layer structure. Alternatively, the flow of the fiberless insulation material can cause only the pads 116 on the main surface of component 110 (upper main surface 112 or lower main surface 114) to be inserted into the corresponding fiberless insulation layer structure, while the main surface itself only contacts the corresponding fiberless insulation layer structure but is not inserted into it, or the main surface itself does not have any contact with the corresponding fiberless insulation layer structure.

[0070] The fiberless insulation material can flow into the space between adjacent pads 116 on the main surface of component 110 during the lamination process, so that the fully cured fiberless insulation layer structure has a portion protruding into the space between pads 116.

[0071] In some embodiments, the upper surface of the fiberless insulating layer structure that contacts the lower main surface 114 of component 110 is substantially flush with the lower main surface 114 of component 110. This fiberless insulating layer structure substantially lacks any protrusions that at least partially surround the component 110 along its circumferential sidewalls. For example, the fiberless insulating layer structure may protrude into the space between adjacent pads 116 in the region corresponding to pad 116, while in the portion corresponding to cavity 108, in the remaining regions other than those described above, the upper surface of the fiberless insulating layer structure may be substantially flush with the lower main surface 114 of component 110.

[0072] In some embodiments, at least one of the fiberless insulating layer structures that contact the upper main surface 112 and / or the lower main surface 114 of component 110 protrudes into cavity 108, such that at least a portion of component 110 (e.g., pad 116 (if present), and the portion of component 110 near the main surface excluding pad 116) is circumferentially surrounded by the fiberless insulating layer structure protruding into cavity 108. The gap 118 between the sidewall of cavity 108 and component 110 can be at least partially filled accordingly.

[0073] The fiberless insulation layer structure in contact with the upper main surface 112 and / or lower main surface 114 of component 110 needs to undergo a lamination process involving pressure and / or heat. During lamination, the fiberless insulation layer structure may flow appropriately, causing some fiberless insulation material to flow into the cavity and, upon curing, form a protrusion extending from the planar surface of the layer structure into the cavity 108. The fiberless insulation layer structure may also flow appropriately around component 110, such that component 110 is circumferentially surrounded by the protrusion of the fiberless insulation layer structure extending into the cavity 108. The protrusion may accordingly fill the gap 118 between component 110 and the sidewall of cavity 108.

[0074] In some embodiments, the fiberless insulating layer structure that contacts the lower main surface 114 of component 110 protrudes into cavity 108 and extends within cavity 108 to a height not less than 1 / 10 of the height of cavity 108, particularly not less than 1 / 5 of the height of cavity 108, and more specifically, not less than 1 / 3 of the height of cavity 108. It is understood that the above numerical ranges are merely exemplary.

[0075] Reference Figure 1 and combined Figure 2 The component carrier 100 according to an exemplary embodiment of this application may include a component receiving structure 1020. The component receiving structure 1020 includes an intermediate insulating portion 1022 and a lower electrically conductive layer structure 1024 that at least partially covers the lower side surface of the intermediate insulating portion 1022. The intermediate insulating portion 1022 includes one or more insulating layer structures 104. At least one of the one or more insulating layer structures 104 included in the intermediate insulating portion 1022 may be a glass fiber insulating layer structure. A cavity 108 extends at least partially within the component receiving structure 1020 to receive a component 110 to be embedded. The cavity 108 may extend vertically through and terminate at the lower electrically conductive layer structure 1024. Such an arrangement may facilitate a more stable electrical connection path. The lower electrically conductive layer structure 1024 may also help conduct heat generated by the component 110 out of the cavity 108, improving heat dissipation efficiency.

[0076] The fiberless insulating layer structure in contact with the lower main surface 114 of component 110 can cover the lower conductive layer structure 1024, such that the fiberless insulating layer structure partially protrudes into the cavity 108 during lamination. The fiberless insulating layer structure in contact with the lower main surface 114 can completely cover the lower conductive layer structure 1024 in its lateral extension.

[0077] The component receiving structure 1020 may further include an upper conductive layer structure 1026. The upper conductive layer structure 1026 and the lower conductive layer structure 1024 are located on opposite sides of the intermediate insulating portion 1022. The upper conductive layer structure 1026 at least partially covers the upper side of the intermediate insulating portion 1022 opposite to the lower side. A cavity 108 may extend through the component receiving structure 1020, that is, the cavity 108 extends vertically through the lower conductive layer structure 1024 and also extends vertically through the upper conductive layer structure 1026. Specifically, the cavity 108 may extend through and terminate at the upper conductive layer structure 1026.

[0078] The lateral extension of the fiberless insulation layer structure that contacts the upper main surface 112 and / or the lower main surface 114 of component 110 may partially overlap with the lateral extension of the intermediate insulation portion 1022.

[0079] In some embodiments, the component receiving structure 1020 may form at least a portion of the core structure of the component carrier 100. In particular, the component receiving structure 1020 is the core structure of the component carrier 100.

[0080] In some embodiments, at least one of the fiberless insulating layer structures included in the component carrier 100 contacts the lower main surface 114 of the component 110, while at least one additional insulating layer structure (e.g., a fiberglass-containing insulating layer structure or a fiberless insulating layer structure) other than the fiberless insulating layer structure contacting the lower main surface is configured to contact the upper main surface 112 of the component 110, and this additional insulating layer structure also contacts the fiberless insulating layer structure contacting the lower main surface 114 of the component 110. Specifically, the additional insulating layer structure and the fiberless insulating layer structure contacting the lower main surface 114 of the component 110 contact each other in the gap 118 between the sidewall of the cavity 108 and the component 110. More specifically, the contact between the additional insulating layer structure and the fiberless insulating layer structure contacting the lower main surface 114 of the component 110 forms an interface contour connection portion, which may include at least one convex protrusion 120 facing the additional insulating layer structure.

[0081] The contact between the additional insulating layer structure that contacts the upper main surface 112 of component 110 and the fiberless insulating layer structure that contacts the lower main surface 114 of component 110 can be formed by chemical cross-linking, particularly by chemical cross-linking after heating.

[0082] Although this application has been described with reference to exemplary embodiments, it should be understood that this application is not limited to the specific embodiments described and shown herein. Various changes can be made to the exemplary embodiments by those skilled in the art without departing from the scope defined by the claims of this application.

[0083] The features mentioned and / or shown in the above description of exemplary embodiments of this application may be combined in the same or similar manner with one or more other embodiments, combined with features in other embodiments, or substituted for corresponding features in other embodiments. Such combinations or substitutions should also be considered as including within the scope of protection of this application.

Claims

1. A component carrier (100), characterized by The component carrier (100) comprises: a stack (102) comprising a plurality of insulating layer structures (104) and at least one electrically conductive layer structure (106), wherein at least one of the plurality of insulating layer structures (104) is a fiber-free insulating layer structure; a cavity (108) formed in the stack (102); a component (110) embedded in the cavity (108), wherein at least one main surface of the component (110) is in contact with at least one of the fiber-free insulating layer structures.

2. The component carrier (100) according to claim 1, characterized in that The fiber-free insulating layer structure in contact with a main surface of the component (110) is a glass-fiber-free insulating layer structure.

3. The component carrier (100) according to claim 1, characterized in that The fiber-free insulating layer structure in contact with a main surface of the component (110) is a glass-fiber-free cloth insulating layer structure.

4. The component carrier (100) according to any one of claims 1 to 3, characterized in that At least a portion of the component (110) is inserted into the fiber-free insulating layer structure in contact with the component (110).

5. The component carrier (100) according to any one of claims 1 to 3, characterized in that The component (110) is provided with one or more pads (116) on at least one of the main surfaces in contact with the fiber-free insulating layer structure, at least a portion of the one or more pads (116) being inserted into the respective fiber-free insulating layer structure.

6. The component carrier (100) according to any one of claims 1 to 3, characterized in that The component (110) is provided with a plurality of pads (116) on at least one of the main surfaces in contact with the fiber-free insulating layer structure, the fiber-free insulating layer structure in contact with the pads (116) partially protruding into the space between the pads (116).

7. The component carrier (100) according to any one of claims 1 to 3, characterized in that At least one of the fiber-free insulating layer structures in contact with a main surface of the component (110) protrudes into the cavity (108) such that at least a portion of the component (110) is circumferentially surrounded by the fiber-free insulating layer structure protruding into the cavity (108).

8. The component carrier (100) according to claim 1, characterized in that The stack (102) comprises a component accommodation structure (1020) comprising an intermediate insulating portion (1022) and a lower electrically conductive layer structure (1024) at least partially covering a lower side of the intermediate insulating portion (1022), wherein the intermediate insulating portion (1022) comprises one or more of the insulating layer structures (104), The cavity (108) at least partially extends in the component accommodation structure (1020) for receiving the component (110) to be embedded, wherein the cavity (108) extends vertically through the lower electrically conductive layer structure (1024) and ends at the lower electrically conductive layer structure (1024).

9. The component carrier (100) according to claim 8, characterized in that The fiber-free insulating layer structure in contact with a lower main surface (114) of the component (110) is laminated on the lower electrically conductive layer structure (1024) such that the fiber-free insulating layer structure in contact with the lower main surface (114) partially protrudes into the cavity (108) and completely covers the lower electrically conductive layer structure (1024) in a lateral extension.

10. The component carrier (100) according to claim 8, characterized in that The component-accommodating structure (1020) further comprises an upper electrically conductive layer structure (1026) at least partially covering an upper side of the intermediate insulating portion (1022), the cavity (108) extending through the component-accommodating structure (1020) such that the cavity (108) also extends vertically through the upper electrically conductive layer structure (1026).

11. The component carrier (100) according to any one of claims 8 to 10, characterized in that A lateral extension of the fiber-free insulating layer structure in contact with a main surface of the component (110) partially overlaps a lateral extension of the intermediate insulating portion (1022).

12. The component carrier (100) according to any one of claims 8 to 10, characterized in that The component-accommodating structure (1020) forms at least a portion of a core structure of the component carrier (100).

13. The component carrier (100) according to any one of claims 8 to 10, characterized in that At least one insulating layer structure (104) in the intermediate insulating portion (1022) is a glass-fiber-containing insulating layer structure.

14. The component carrier (100) according to any one of claims 1 to 3, characterized in that A gap (118) between a side wall of the cavity (108) and a side wall of the component (110) is at least partially filled by the fiber-free insulating layer structure in contact with a main surface of the component (110).

15. The component carrier (100) according to any one of claims 1 to 3, characterized in that An upper surface of the fiber-free insulating layer structure in contact with a lower main surface (114) of the component (110) is flush with the lower main surface (114) of the component (110).

16. The component carrier (100) according to any one of claims 1 to 3, characterized in that The fiber-free insulating layer structure in contact with a lower main surface (114) of the component (110) protrudes into the cavity (108) and extends in the cavity (108) to a height that is not less than 1 / 10 of a height of the cavity (108).

17. The component carrier (100) according to any one of claims 1 to 3, characterized in that The fiber-free insulating layer structure in contact with a lower main surface (114) of the component (110) protrudes into the cavity (108) and extends in the cavity (108) to a height that is not less than 1 / 5 of a height of the cavity (108).

18. The component carrier (100) according to any one of claims 1 to 3, characterized in that The fiber-free insulating layer structure in contact with a lower main surface (114) of the component (110) protrudes into the cavity (108) and extends in the cavity (108) to a height that is not less than 1 / 3 of a height of the cavity (108).

19. The component carrier (100) according to any one of claims 1 to 3, characterized in that A lower main surface (114) of the component (110) is in contact with a fiber-free insulating layer structure of the plurality of insulating layer structures (104); at least one further insulating layer structure of the plurality of insulating layer structures (104) other than the fiber-free insulating layer structure in contact with the lower main surface (114) is arranged in contact with an upper main surface (112) of the component (110) and also in contact with the fiber-free insulating layer structure in contact with the lower main surface (114) of the component (110).

20. The component carrier (100) according to claim 19, characterized by An interface profile connection between the further insulating layer structure and the fiber-free insulating layer structure in contact with the lower main surface (114) of the component (110) comprises at least one convex protrusion (120) towards the further insulating layer structure.

21. The component carrier (100) according to claim 19, characterized in that The additional insulating layer structure is in contact with the fibre-free insulating layer structure in contact with the lower major surface (114) of the component (110) in a gap (118) between the side wall of the cavity (108) and the component (110).

22. The component carrier (100) according to claim 19, characterized by The contact between the additional insulating layer structure and the fibre-free insulating layer structure in contact with the lower major surface (114) of the component (110) is formed by chemical cross-linking.

23. The component carrier (100) according to claim 19, characterized by The additional insulating layer structure is a glass-fibre-free insulating layer structure.

24. The component carrier (100) according to claim 19, characterized by The additional insulating layer structure is a glass-fibre-containing insulating layer structure.

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