Server cooling cabinet with liquid cooling backboard

Abstract

The utility model relates to the field of server heat dissipation, and particularly discloses a server cooling cabinet with a liquid cooling backboard, which comprises a cabinet body, an opening is formed in one side of the cabinet body, the liquid cooling backboard is arranged at the opening, an air outlet is formed in one side, opposite to the liquid cooling backboard, of the cabinet body, and a first fan is mounted in the air outlet; the liquid cooling back plate is provided with an air inlet channel, a first flow guide plate is fixed on the liquid cooling back plate, the first flow guide plate is opposite to the air inlet channel, the first flow guide plate and the air inlet channel are arranged at an interval, and the projection of the first flow guide plate on the liquid cooling back plate covers the air inlet channel. According to the scheme, the cabinet body can be a vertical or horizontal cabinet body, and the air cooling time can be prolonged through the arrangement of the first flow guide plate, so that the heat dissipation effect on the electronic components is improved; cold air is shunted through the second flow guide plate, main cold air dissipates high heat of a CPU, a GPU and the like through the first air guide channel, the second air guide channel dissipates other low-heat elements, and the heat dissipation effect is guaranteed in an air channel combination mode.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of server cooling, in particular to a server cooling cabinet with a liquid-cooled backboard. BACKGROUND

[0002] The liquid-cooled board server is a server device adopting a liquid cooling technology for heat dissipation. The liquid-cooled board server mainly realizes heat dissipation of internal heat generating components through a liquid-cooled board. The liquid-cooled board is usually made of metal materials and contains flowing cooling liquid. When the server is running, the heat generated by the heat generating components is transferred to the liquid-cooled board, and the cooling liquid flows in the liquid-cooled board to take away the heat, thereby reducing the temperature of the server.

[0003] The liquid-cooled board is generally a water-cooled board, but the existing water-cooled board is directly passed through by air, and the utilization rate of the water-cooled board is low, and the heat dissipation effect is poor. CONTENT OF THE UTILITY MODEL

[0004] In order to improve the heat dissipation problem, the application provides a server cooling cabinet with a liquid-cooled backboard.

[0005] The application provides a server cooling cabinet with a liquid-cooled backboard, which adopts the following technical scheme:

[0006] The server cooling cabinet with a liquid-cooled backboard comprises a cabinet body, an opening is arranged on one side of the cabinet body, a liquid-cooled backboard is arranged at the opening, an air outlet is arranged on the side opposite to the liquid-cooled backboard of the cabinet body, and a first fan is installed in the air outlet; the liquid-cooled backboard is provided with an air inlet channel, the liquid-cooled backboard is fixed with a first flow guide plate, the first flow guide plate is arranged opposite to and spaced from the air inlet channel, and the projection of the first flow guide plate on the liquid-cooled backboard covers the air inlet channel.

[0007] Through the above technical scheme, the first fan is started, air enters the liquid-cooled backboard through the air inlet channel behind the liquid-cooled backboard to form cold air, and then passes through the inside of the cabinet body, the cold air is cooled to the electronic elements in the inside of the cabinet body, and then is discharged from the air outlet. In the present application, due to the arrangement of the first flow guide plate, the contact time of air and the liquid-cooled backboard is long, the air is colder, and the heat dissipation effect of the electronic elements is better.

[0008] Optionally, the first flow guide plate has a plurality of supporting legs, one end of the supporting leg is connected with the first flow guide plate, and the other end of the supporting leg is connected with the liquid-cooled backboard or the cabinet body.

[0009] Through the above technical scheme, the first flow guide plate is arranged at intervals through the supporting legs.

[0010] Optionally, the inner side of the liquid cooling backboard is provided with a second flow guide plate, the center of the second flow guide plate is provided with a first air guide channel, the first air guide channel gradually reduces in cross section from one end to the other end, and the end with smaller cross section is inserted into the air inlet channel; the liquid cooling backboard is arranged in a spaced manner with the second flow guide plate, and the second flow guide plate is arranged in a spaced manner with the inner wall of the cabinet body to form a second air guide channel.

[0011] By adopting the above technical scheme, the first air guide channel is the main cold air channel, and the second air guide channel is the secondary air cooling channel, for example, the elements with high heat concentration such as CPU and GPU are located on the path of the first air guide channel, and other elements with low heat dissipation are mainly cooled through the second air guide channel.

[0012] Optionally, a flow guide hole is formed in the center of the second flow guide plate, and an air guide cylinder is detachably installed on the flow guide hole.

[0013] By adopting the above technical scheme, the air is guided by the air guide cylinder.

[0014] Optionally, a second fan is arranged between the liquid cooling backboard and the second flow guide plate or in the second air guide channel.

[0015] By adopting the above technical scheme, the second fan is used to guide part of the cold air to pass through the second air guide channel.

[0016] Optionally, a mounting ring is fixed on the air guide cylinder, and the mounting ring is located on the side of the second flow guide plate away from the liquid cooling backboard.

[0017] By adopting the above technical scheme, the air guide cylinder is quickly mounted by the second mounting ring, or different sizes of air guide cylinders are replaced to change the amount of air entering the air guide cylinder.

[0018] Optionally, the liquid cooling backboard is provided with an inlet pipe and an outlet pipe on the outer side, the inlet pipe and the outlet pipe are arranged at opposite angles, and the first flow guide plate is provided with a first notch avoiding the inlet pipe and a second notch avoiding the outlet pipe.

[0019] By adopting the above technical scheme, the inlet pipe and the outlet pipe are arranged at opposite angles of the liquid cooling backboard, which facilitates the arrangement of the first flow guide plate, and the arrangement of the first notch and the second notch ensures that the installation of the first flow guide plate is not affected.

[0020] Optionally, the supporting leg comprises a mounting portion, a connecting portion and a clamping portion, the mounting portion is connected to the liquid cooling backboard by a first bolt, the connecting portion is connected to the mounting portion and the clamping portion, the clamping portion is provided with a clamping groove, and the edge of the first flow guide plate is clamped into the clamping groove.

[0021] By adopting the technical scheme, the connection of the mounting portion and the liquid cooling back plate is realized through the bolt, and the first flow guide plate is installed through the quick cooperation of the first flow guide plate and the clamping groove.

[0022] To sum up, the present application has at least one of the following beneficial technical effects:

[0023] 1. In the present application, the cabinet body can be a vertical or horizontal cabinet body. The first flow guide plate can increase the time for air cooling, thereby improving the heat dissipation effect on electronic components.

[0024] 2. The cold air is divided by the second flow guide plate. The main cold air is used to dissipate heat from high-heat components such as CPU and GPU through the first air guide channel, and the second air guide channel is used to dissipate heat from other low-heat components. The combination of the air ducts ensures the heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a schematic diagram of the overall structure of the embodiment of the present application Figure 1 ;

[0026] Figure 2 is a schematic diagram of the overall structure of the embodiment of the present application Figure 2 ;

[0027] Figure 3 is an enlarged schematic diagram of part A of Figure 2 ;

[0028] Figure 4 is a top view of the embodiment of the present application

[0029] Figure 5 is a B-B sectional view of Figure 4 .

[0030] Reference signs: 1, cabinet body; 2, liquid cooling back plate; 3, air outlet; 4, first fan; 5, air inlet channel; 6, filter screen; 7, first flow guide plate; 8, mounting edge; 9, supporting leg; 10, mounting portion; 11, connecting portion; 12, clamping portion; 13, clamping groove; 14, strip-shaped through slot; 15, first bolt; 16, liquid inlet pipe; 17, liquid outlet pipe; 18, first notch; 19, second notch; 20, second flow guide plate; 21, air guide cylinder; 22, second fan; 23, first air guide channel; 24, second air guide channel; 25, mounting ring; 26, second bolt. DETAILED DESCRIPTION

[0031] The present application will be further described in detail below with reference to the accompanying drawings. Figures 1-5

[0032] ​The embodiment of the application discloses a server cooling cabinet with a liquid-cooled backboard 2, which comprises a cabinet body 1, an opening is arranged on one side of the cabinet body 1, a liquid-cooled backboard 2 is arranged at the opening, an air outlet 3 is arranged on the side opposite to the liquid-cooled backboard 2 of the cabinet body 1, and two air outlets 3 are arranged, and a first fan 4 is arranged in each air outlet 3.

[0033] The liquid-cooled backboard 2 is provided with an air inlet channel 5, and a filter screen 6 is arranged at the air inlet channel 5 to reduce the entry of external dust. The liquid-cooled backboard 2 is fixed with a first flow guide plate 7, the first flow guide plate 7 is arranged opposite to and spaced from the air inlet channel 5, and the projection of the first flow guide plate 7 on the liquid-cooled backboard 2 covers the air inlet channel 5. Specifically, the size of the first flow guide plate 7 is close to the size of the liquid-cooled backboard 2, and is generally slightly smaller than the liquid-cooled backboard 2. The edge of the liquid-cooled backboard 2 forms a mounting edge 8, and a bolt passes through the mounting edge 8 and is connected with the cabinet body 1 to realize the mounting of the liquid-cooled backboard 2, wherein a sealing ring can also be arranged at the liquid-cooled backboard 2 and the cabinet body 1 to enhance the sealing performance. The liquid-cooled backboard 2 is generally a metal plate, for example, a stainless steel plate, and has a flow channel inside for the flow of cooling liquid.

[0034] The first flow guide plate 7 has a plurality of supporting legs 9, one end of the supporting leg 9 is connected with the first flow guide plate 7, and the other end of the supporting leg 9 is connected with the liquid-cooled backboard 2 or the cabinet body 1. The supporting leg 9 comprises a mounting portion 10, a connecting portion 11 and a clamping portion 12, the mounting portion 10 is connected on the liquid-cooled backboard 2 through a first bolt 15, the connecting portion 11 is integrally formed with the mounting portion 10 and the clamping portion 12, the clamping portion 12 is provided with a clamping groove 13, and the edge of the first flow guide plate 7 is clamped into the clamping groove 13. The mounting portion 10 is provided with a strip-shaped through groove 14, and the shank of the first bolt 15 passes through the strip-shaped through groove 14 and is connected with the liquid-cooled backboard 2. The strip-shaped through groove 14 facilitates the adjustment of the position of the supporting leg 9, so that the clamping groove 13 is tightly clamped with the first flow guide plate 7. The first flow guide plate 7 is generally made of light material, for example, PVC, PC, second fan 22BS and the like.

[0035] The liquid-cooled backboard 2 is provided with an inlet pipe 16 and an outlet pipe 17 on the outer side, the inlet pipe 16 and the outlet pipe 17 are diagonally arranged, the first flow guide plate 7 is provided with a first notch 18 avoiding the inlet pipe 16 and a second notch 19 avoiding the outlet pipe 17. The liquid-cooled backboard 2 is generally externally connected with a water cooling tower through a pipeline during actual use.

[0036] The inner side of the liquid cooling back plate 2 is provided with a second flow guide plate 20, the center of the second flow guide plate 20 is provided with a first air guide channel 23, the first air guide channel 23 gradually reduces in cross section from one end to the other end, and the smaller end is inserted into the air inlet channel 5; specifically, the first air guide channel 23 is mainly formed by a flow guide port and an air guide cylinder 21. The flow guide port is arranged in the center of the second flow guide plate 20, and the air guide cylinder 21 is detachably arranged on the flow guide port, both ends of the air guide cylinder 21 are penetrated, and the air guide cylinder 21 gradually reduces in cross section from one end to the other end. That is, the air guide cylinder 21 is a hollow circular truncated cone or quadrangular truncated cone structure. The air guide cylinder 21 is fixedly provided with a mounting ring 25, the mounting ring 25 is located on the side of the second flow guide plate 20 away from the liquid cooling back plate 2, a second bolt 26 penetrates through the mounting ring 25 and is fixed with the second flow guide plate 20, and the second flow guide plate 20 is connected with the inner wall of the cabinet 1 through a connecting rod, the connecting rod is integrally formed with the second flow guide plate 20, and the connecting rod is welded with the inner wall of the cabinet 1.

[0037] The liquid cooling back plate 2 is arranged in a spaced manner with the second flow guide plate 20, and the second flow guide plate 20 is arranged in a gap with the inner wall of the cabinet 1 to form a second air guide channel 24. In order to enable the cold air to smoothly enter the second air guide channel 24, a second fan 22 can be arranged between the liquid cooling back plate 2 and the second flow guide plate 20 or in the second air guide channel 24. The second fan 22 is generally smaller in volume and power than the first fan 4 in the air outlet 3, and is generally about 20% of the power volume of the first fan 4 in the air outlet 3.

[0038] The implementation principle of the server cooling cabinet with the liquid cooling back plate 2 in the embodiment of the application is as follows: in the scheme, the cabinet 1 can be a vertical or horizontal cabinet 1, external air enters through the gap between the first flow guide plate 7 and the liquid cooling back plate 2, flows through the liquid cooling back plate 2 and enters the air inlet channel 5, thereby increasing the time for air to be cooled, and improving the heat dissipation effect on electronic components; the cold air is divided by the second flow guide plate 20, the main cold air is used for heat dissipation of high-heat components such as CPU and GPU, and in actual installation and use, the inner side of the liquid cooling back plate 2 is also directly connected with the CPU and the GPU through a heat pipe; the second air guide channel 24 is used for heat dissipation of the remaining low-heat components, and the heat dissipation effect is ensured through the combined air duct.

[0039] Remark, wherein Figure 5 The solid line part is the flow direction of the cold air of the second air guide channel 24, and the dotted line part is the flow direction of the air of the first air guide channel 23.

[0040] In the description of the utility model, it is necessary to understand that the terms "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, and a particular orientation configuration and operation, therefore, it cannot be understood as a limitation on the utility model. In addition, "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0041] In the description of the utility model, it should be explained that, unless otherwise expressly specified and limited, the terms "mounting", "connection", "connection" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection, it can be mechanical connection, or electrical connection, it can be directly connected, or indirectly connected through intermediate medium, it can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0042] The above is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process transformation using the contents of the utility model specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.

Claims

1. A server cooling cabinet with liquid-cooled backplane, characterized by: The application relates to a cabinet body, which is provided with an opening on one side, a liquid-cooled back plate arranged at the opening, an air outlet arranged on the side opposite to the liquid-cooled back plate, and a first fan arranged in the air outlet; the liquid-cooled back plate is provided with an air inlet channel, and the liquid-cooled back plate is fixed with a first flow guide plate which is arranged opposite to and spaced from the air inlet channel and whose projection on the liquid-cooled back plate covers the air inlet channel.

2. The server cooling cabinet with liquid-cooled backplane of claim 1, wherein: The first flow guide plate is provided with a plurality of supporting legs, one end of each supporting leg is connected with the first flow guide plate, and the other end of each supporting leg is connected with the liquid-cooled back plate or the cabinet body.

3. The server cooling cabinet with liquid-cooled backplane of claim 1, wherein: The inner side of the liquid-cooled back plate is provided with a second flow guide plate, the second flow guide plate is provided with a first air guide channel in the center, the first air guide channel gradually narrows from one end to the other end in the cross section and the end with the smaller cross section is inserted into the air inlet channel, the liquid-cooled back plate is arranged spaced from the second flow guide plate, and the second flow guide plate is arranged spaced from the inner wall of the cabinet body to form a second air guide channel.

4. The server cooling cabinet with liquid-cooled backplane of claim 3, wherein: The second flow guide plate is provided with a flow guide opening in the center, and an air guide cylinder is detachably arranged on the flow guide opening.

5. The server cooling cabinet with liquid-cooled backplane of claim 1, wherein: A second fan is arranged between the liquid-cooled back plate and the second flow guide plate or in the second air guide channel.

6. The server cooling cabinet with liquid-cooled backplane of claim 4, wherein: The air guide cylinder is fixed with a mounting ring, and the mounting ring is arranged on the side of the second flow guide plate away from the liquid-cooled back plate.

7. The server cooling cabinet with liquid-cooled backplane of claim 1, wherein: The liquid-cooled back plate is provided with an inlet pipe and an outlet pipe on the outer side, the inlet pipe and the outlet pipe are arranged at opposite angles, the first flow guide plate is provided with a first gap avoiding the inlet pipe and a second gap avoiding the outlet pipe.

8. The server cooling cabinet with liquid-cooled backplane of claim 2, wherein: The supporting leg comprises a mounting portion, a connecting portion and a clamping portion, the mounting portion is connected with the liquid-cooled back plate through a first bolt, the connecting portion is connected with the mounting portion and the clamping portion, the clamping portion is provided with a clamping groove, and the edge of the first flow guide plate is clamped into the clamping groove.

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