Heat dissipation assembly and electronic equipment

Abstract

The utility model discloses a heat dissipation assembly and electronic equipment, and the heat dissipation assembly comprises a liquid cooling plate and a sealing cover, and the liquid cooling plate is internally provided with a liquid cooling flow channel through which a cooling liquid passes; the sealing cover is arranged on the first side of the liquid cooling plate, and a heat exchange space is defined by the sealing cover and the liquid cooling plate. The electronic device to be cooled can be directly arranged on the plate surface of the second side, opposite to the first side, of the liquid cooling plate and exchanges heat with the cooling liquid in the liquid cooling flow channel; the heat exchange space located on the first side of the liquid cooling plate can allow the heat exchange air flow to pass through, and when the heat exchange air flow passes through, the heat exchange air flow can exchange heat with the cooling liquid in the liquid cooling flow channel through the plate face of the first side of the liquid cooling plate, so that the cooling capacity of the first side of the liquid cooling flow channel is utilized, cooling of the heat exchange air flow is achieved, and the utilization rate of the cooling liquid is increased. According to the heat dissipation assembly, the cooling capacity of the two sides of the liquid cooling plate is fully utilized by additionally arranging the heat exchange space, and the heat dissipation assembly has the advantages of being compact in structure and large in heat exchange amount.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more specifically, to a heat dissipation component and an electronic device. Background Technology

[0002] As the power consumption of components installed inside electronic chassis continues to rise, the power density within the chassis has increased significantly. Given that many chassis need to meet outdoor usage requirements, meaning their structure must be sealed, this undoubtedly exacerbates the difficulty of chassis heat dissipation. When the components inside the chassis do not have particularly high heat dissipation demands, the common practice is to install fans inside the chassis to achieve a cooling effect by agitating the air. However, when the components inside the chassis have high power consumption and high heat dissipation requirements, relying solely on internal fans is clearly insufficient. Therefore, for some high-power components, chassis commonly use liquid cooling plates for liquid cooling, but this suffers from low heat dissipation efficiency.

[0003] Therefore, how to improve the utilization rate of cooling capacity of liquid cooling plates has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a heat dissipation component to improve the cooling capacity utilization of the liquid cooling plate.

[0005] Another object of this application is to provide an electronic device including the above-described heat dissipation components.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] A heat dissipation component includes a liquid cooling plate and a sealing cover;

[0008] The liquid cooling plate is provided with a liquid cooling channel for the coolant to pass through;

[0009] The sealing cover is disposed on the first side of the liquid cooling plate and forms a heat exchange space for heat exchange airflow with the liquid cooling plate, and the heat exchange space is provided with an air inlet and an air outlet.

[0010] Optionally, the heat dissipation assembly described above further includes a first heat exchange structure, which is disposed within the heat exchange space.

[0011] Optionally, in the above-mentioned heat dissipation assembly, a partition plate is provided in the heat exchange space. The extension direction of the partition plate is parallel to the first heat exchange structure, and its two sides are respectively connected to the plate surface of the first side of the liquid cooling plate and the sealing cover. The partition plate divides the heat exchange space into multiple airflow channels. Two adjacent airflow channels are connected end to end to form a unidirectional air-cooled flow channel for heat exchange airflow from the air inlet to the air outlet. The first heat exchange structure is disposed in the air-cooled flow channel.

[0012] Optionally, in the above-mentioned heat dissipation assembly, the cross-sectional area of ​​each section of the airflow channel increases sequentially along the direction from the air inlet to the air outlet of the air-cooling channel.

[0013] Optionally, in the above-mentioned heat dissipation assembly, the heat exchange area of ​​the first heat exchange structure in each section of the airflow channel increases sequentially along the direction from the air inlet to the air outlet of the air-cooled flow channel.

[0014] Optionally, in the above-described heat dissipation assembly, the first heat exchange structure includes a heat sink, which is a planar structure or a corrugated surface structure.

[0015] Optionally, in the above-mentioned heat dissipation assembly, a second heat exchange structure is provided on the side of the sealing cover facing away from the liquid cooling plate;

[0016] The second heat exchange structure includes at least one of a heat sink, a vapor chamber, and a heat pipe.

[0017] An electronic device includes a chassis, a device to be cooled, a cooling fan, and the aforementioned heat dissipation components;

[0018] The heat dissipation component is connected to the chassis. The device to be cooled and the cooling fan are both located inside the chassis. The device to be cooled is located on the second side of the liquid cooling plate. The cooling fan supplies heat exchange airflow from inside the chassis to the heat exchange space.

[0019] Optionally, in the above-described electronic device, the heat dissipation component is disposed inside the chassis; or,

[0020] The heat dissipation assembly is located outside the chassis, and the second side of the liquid cooling plate is in contact with the outer wall of the chassis; or,

[0021] The heat dissipation components and the various side panels of the chassis together enclose the internal space of the chassis, and the second side of the liquid cooling plate is arranged facing the inside of the chassis.

[0022] Optionally, in the above-described electronic device, the cooling fan is located at the air inlet or the air outlet; or,

[0023] The air inlet and the air outlet are respectively connected to the first heat exchange pipe and the second heat exchange pipe. One of the first heat exchange pipe and the second heat exchange pipe is connected to the cooling fan, and the air inlet of the first heat exchange pipe and the air outlet of the second heat exchange pipe extend to different heat dissipation devices.

[0024] Optionally, in the above-mentioned electronic device, the air inlet and the air outlet are located on the sealing cover or the liquid cooling plate.

[0025] The heat dissipation assembly provided in this application includes a liquid-cooled plate and a sealing cover. The liquid-cooled plate has a liquid-cooled flow channel for coolant to pass through. The sealing cover is disposed on the first side of the liquid-cooled plate and encloses it to form a heat exchange space. The heat exchange space has an inlet and an outlet for heat exchange airflow to enter and exit. Electronic devices to be cooled can be directly disposed on the second side of the liquid-cooled plate opposite to the first side, and exchange heat with the coolant in the liquid-cooled flow channel. The heat exchange space on the first side of the liquid-cooled plate allows heat exchange airflow to pass through. Simultaneously, the heat exchange airflow exchanges heat with the coolant in the liquid-cooled flow channel through the surface of the first side of the liquid-cooled plate, thereby utilizing the cooling capacity of the first side of the liquid-cooled flow channel, cooling the heat exchange airflow, and improving the utilization rate of the coolant. Compared with the prior art, the heat dissipation assembly provided in this application achieves full utilization of the cooling capacity on both sides of the liquid-cooled plate by adding a heat exchange space, and has the advantages of compact structure and large heat exchange capacity.

[0026] The electronic device provided in this application includes a heat-dissipating device, a cooling fan, and the aforementioned heat dissipation assembly. The heat dissipation assembly is connected to a chassis. Both the heat-dissipating device and the cooling fan are disposed inside the chassis, with the heat-dissipating device located on the second side of the liquid cooling plate. The heat dissipation assembly dissipates heat from the heat-dissipating device. The cooling fan supplies air from inside the chassis into the air-cooling channel. The air inside the chassis serves as the aforementioned heat exchange airflow. By guiding the hot air from inside the chassis into the heat exchange space for heat exchange, the cooling fan can effectively reduce the ambient temperature inside the chassis. Since it includes the aforementioned heat dissipation assembly, it also possesses the aforementioned structure and beneficial effects. Other structures refer to existing technologies and will not be described in detail here. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The arrows in the figures indicate the flow direction of the heat exchange airflow.

[0028] Figure 1 This is an isometric view of the heat dissipation assembly disclosed in the embodiments of this application;

[0029] Figure 2 This is an exploded view of the heat dissipation assembly disclosed in the embodiments of this application;

[0030] Figure 3 This is a side view of the heat dissipation assembly disclosed in an embodiment of this application;

[0031] Figure 4 for Figure 3 Cross-sectional view at point BB;

[0032] Figure 5 for Figure 4 Cross-sectional view at point AA;

[0033] Figure 6 for Figure 5 A magnified view of a section at point C;

[0034] Figure 7 This is a schematic diagram of the structure of the liquid cooling plate disclosed in the embodiments of this application;

[0035] Figure 8 This is a schematic diagram of the structure of the corrugated heat sink disclosed in the embodiments of this application. Figure 1 ;

[0036] Figure 9 This is a schematic diagram of the structure of the corrugated heat sink disclosed in the embodiments of this application. Figure 2 ;

[0037] Figure 10 This is an isometric view of the electronic device disclosed in the embodiments of this application;

[0038] Figure 11 This is a front view of the first electronic device disclosed in the embodiments of this application;

[0039] Figure 12 This is a front view of a second electronic device disclosed in an embodiment of this application.

[0040] Among them, 100 is the liquid cooling plate, 101 is the water inlet, 102 is the water outlet, 103 is the air inlet, 104 is the air outlet, 105 is the sealing groove, 200 is the sealing cover, 300 is the first heat exchange structure, 301 is the transfer chamber, 310 is the protrusion, 400 is the chassis, 500 is the device to be cooled, 600 is the second heat exchange structure, 700 is the cooling fan, 710 is the first heat exchange pipe, and 720 is the second heat exchange pipe. Detailed Implementation

[0041] The core of this application is to disclose a heat dissipation component to improve the cooling capacity utilization of a liquid cooling plate.

[0042] Another key aspect of this application is the disclosure of an electronic device that includes the aforementioned heat dissipation components.

[0043] Hereinafter, embodiments will be described with reference to the accompanying drawings. Furthermore, the embodiments shown below do not limit the scope of the utility model as described in the claims. Additionally, the complete contents of the structures represented in the embodiments below are not limited to those necessary for the solution of the utility model as described in the claims. It should be noted that, for ease of description, only the parts relevant to the utility model are shown in the drawings. Unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0044] Combination Figures 1-12 The heat dissipation assembly disclosed in this application includes a liquid cooling plate 100 and a sealing cover 200. The liquid cooling plate 100 has a liquid cooling channel for coolant to pass through. The sealing cover 200 is disposed on the first side of the liquid cooling plate 100 and encloses it to form a heat exchange space. The heat exchange space has an inlet 103 and an outlet 104 for heat exchange airflow to enter and exit. Electronic devices to be cooled can be directly disposed on the second side of the liquid cooling plate 100 opposite to the first side and exchange heat with the coolant in the liquid cooling channel. The heat exchange space on the first side of the liquid cooling plate 100 allows heat exchange airflow to pass through. Simultaneously, the heat exchange airflow can exchange heat with the coolant in the liquid cooling channel through the surface of the first side of the liquid cooling plate 100, thereby utilizing the cooling capacity of the first side of the liquid cooling channel, cooling the heat exchange airflow, and improving the utilization rate of the coolant. For example, in conjunction with… Figure 11 and Figure 12 Taking the heat dissipation components arranged inside the chassis 400 and dissipating heat from the device 500 to be cooled inside the chassis 400 as an example, the first side of the coolant directly exchanges heat with the heat exchange airflow in the heat exchange space through the first side of the liquid cooling plate 100. Specifically, the heat exchange airflow can be the high-temperature heat exchange airflow inside the chassis 400. After exchanging heat with the coolant, the high-temperature heat exchange airflow is cooled down and returns to the chassis 400, thereby reducing the ambient temperature inside the chassis 400 and improving the heat dissipation efficiency. The second side of the coolant exchanges heat with the device 500 to be cooled directly or indirectly through the second side of the liquid cooling plate 100.

[0045] Compared with the prior art, the heat dissipation component disclosed in this application makes full use of the cooling capacity on both sides of the liquid cooling plate 100 by adding a heat exchange space, and has the advantages of compact structure and large heat exchange capacity.

[0046] The specific structure of the liquid cooling plate 100 is existing technology and will not be described in detail here. The liquid cooling plate 100 and the sealing cover 200 are sealed together using methods such as sealing rings, adhesive bonding, brazing, or friction stir welding to prevent air leakage in the heat exchange space and thus ensure the reliability of the heat exchange operation of the heat dissipation components. When using a sealing ring, a sealing groove 105 for placing the sealing ring is provided on the sealing cover 200 or the liquid cooling plate 100.

[0047] To further optimize the heat exchange effect between the coolant and the heat exchange airflow, the heat dissipation assembly also includes a first heat exchange structure 300. The first heat exchange structure 300 is disposed within the heat exchange space and is connected to at least one of the sealing cover 200 and the liquid cooling plate 100. This increases the heat exchange area, thereby increasing the amount of heat exchanged between the heat exchange airflow and the coolant, and improving heat exchange efficiency. Specifically, the first heat exchange structure 300 includes, but is not limited to, heat sinks, vapor chambers, heat pipes, etc. The heat sink can be a planar structure or a corrugated structure (corrugated heat sink). Planar heat sinks are simple in structure and easy to manufacture; corrugated heat sinks have a larger heat exchange area and a stronger heat exchange effect.

[0048] To prolong the heat exchange time of the heat exchange airflow within the heat exchange space, in a specific embodiment disclosed in this application, a partition plate is provided within the heat exchange space. The extension direction of the partition plate is parallel to the first heat exchange structure 300, and its two sides are respectively connected to the first side of the liquid cooling plate 100 and the sealing cover 200. The partition plate divides the heat exchange space into multiple airflow channels. Adjacent airflow channels are connected end-to-end to form a unidirectional air-cooled flow channel for the heat exchange airflow to flow from the inlet 103 to the outlet 104. The first heat exchange structure 300 is disposed within the air-cooled flow channel, and the heat exchange airflow exchanges heat with the first heat exchange structure 300 during its flow along the air-cooled flow channel. By reasonably setting the number and position of the partition plates, the heat exchange time of the heat exchange airflow can be effectively extended, ensuring the heat exchange effect. For example, the air-cooled flow channel can be configured as a serpentine shape or similar.

[0049] Specifically, the partition plate, liquid cooling plate 100, and sealing cover 200 can be connected by welding or other methods. Along the direction from the air inlet to the air outlet of the air-cooled channel, the cross-sectional area of ​​each airflow channel segment can remain consistent. Further optimization involves increasing the cross-sectional area of ​​each airflow channel segment sequentially from the air inlet to the air outlet to ensure uniform heat exchange throughout the channel. This change in cross-sectional size creates a pressure change, resulting in a higher pressure at the air inlet than at the air outlet. This sequentially reduces the flow velocity of the heat exchange airflow within each channel segment, prolonging the heat exchange time between the airflow and the coolant in the liquid cooling channel at the outlet, thus enhancing the heat exchange effect.

[0050] Combination Figures 4-6In a specific embodiment disclosed in this application, the first heat exchange structure 300 includes corrugated heat sinks. The corrugated heat sinks avoid the locations of the air inlet 103 and the air outlet 104. The heat exchange space forms an air inlet cavity and an air outlet cavity at the air inlet 103 and the air outlet 104, respectively. Part of the corrugated heat sinks can act as the aforementioned partitions to form an S-shaped air-cooling channel within the heat exchange space. Protrusions 310 are provided on both sides of the protrusions 310, which, together with the sealing cover 200 and the liquid cooling plate 100, form a transfer chamber 301. Under the blowing or suction force of the cooling fan 700, the high-temperature heat exchange airflow inside the chassis 400 first enters the air inlet cavity, then flows along the airflow channel of the corrugated heat sinks. After passing through the transfer chamber 301, the heat exchange airflow is redirected by the protrusions 310 and continues to flow in the airflow channel of another part of the corrugated heat sinks until it finally returns to the interior of the chassis 400 through the air outlet cavity. The heat exchange airflow exchanges heat with the corrugated heat sink as it flows within the corrugated heat sink duct. The corrugated heat sink is connected to the sealing cover 200 and the liquid cooling plate 100 by welding or other welding methods. It should be noted that both sides of the corrugated heat sink are tightly fitted to the sealing cover 200 and the liquid cooling plate 100, respectively, to ensure that the heat exchange airflow can flow to all positions within the air-cooled duct according to the designed route.

[0051] Along the direction from the inlet to the outlet of the liquid cooling channel, the cross-sectional area of ​​each position in the liquid cooling channel can remain consistent. Further optimization involves increasing the cross-sectional area of ​​the liquid cooling channel segment by segment along the direction of coolant flow, since the temperature at the inlet is lower and the temperature at the outlet is higher. This ensures uniform heat exchange at all positions on the liquid cooling plate 100. The change in cross-sectional size generates a pressure change, making the pressure at the inlet greater than the pressure at the outlet. This reduces the coolant velocity at the outlet, prolonging the heat exchange time between the coolant and the heat-dissipating device 500 and the heat exchange airflow, thus maintaining consistent cooling performance at both the inlet and outlet of the liquid cooling channel and achieving uniform heat dissipation for the heat-dissipating device 500.

[0052] Furthermore, a turbulence structure can be provided within the liquid cooling channel. Specifically, the turbulence structure can be a protruding plate-like or block-like structure or a recessed groove structure, which serves to disturb the flow of coolant, thereby improving heat exchange efficiency. For example, in some embodiments, the turbulence structure is a protruding plate-like structure. The turbulence structure can be set on the liquid cooling plate 100 by welding or other methods, or the turbulence structure can be a structure machined from the liquid cooling plate 100 itself. The coolant enters the liquid cooling channel through the inlet 101 and flows out through the outlet 102. During its flow within the liquid cooling channel, it continuously absorbs heat, and the heat exchange area increases when passing through the turbulence structure, thus increasing the heat exchange capacity and greatly enhancing the heat exchange effect.

[0053] In a specific embodiment disclosed in this application, the number of first heat exchange structures 300 in each section of the airflow channel increases sequentially from the air inlet to the air outlet along the air-cooled flow channel, thereby increasing the heat exchange area of ​​the first heat exchange structures 300 and enhancing the heat exchange effect of the airflow at the air outlet of the air-cooled flow channel. For example, the first heat exchange structure 300 can be multiple heat sinks arranged in parallel. By arranging different numbers of heat sinks in different airflow channels, the heat exchange area can be changed, making adjustment convenient. Along the liquid inlet to the liquid outlet of the liquid-cooled flow channel, the turbulence structure is arranged in segments, with the heat exchange area increasing segment by segment, to enhance the heat exchange effect at the liquid outlet of the liquid-cooled flow channel and achieve uniform heat exchange at all locations within the liquid-cooled flow channel. For example, the turbulence structure can be multiple turbulence plates arranged in parallel. By arranging different numbers of turbulence plates in different segments of the liquid-cooled flow channel, the heat exchange area of ​​the turbulence structure can be changed, making adjustment convenient.

[0054] In a specific embodiment disclosed in this application, the shape of the air-cooled flow channel is adapted to the shape of the liquid-cooled flow channel, and the air inlet end of the air-cooled flow channel corresponds to the liquid inlet end of the liquid-cooled flow channel, and the air outlet end of the air-cooled flow channel corresponds to the liquid outlet end of the liquid-cooled flow channel. This allows the heat exchange airflow with a higher temperature at the air inlet end of the air-cooled flow channel to exchange heat with the coolant with a lower temperature at the liquid inlet end of the liquid-cooled flow channel, and the heat exchange airflow with a lower temperature at the air outlet end of the air-cooled flow channel to exchange heat with the coolant with a higher temperature at the liquid outlet end of the liquid-cooled flow channel. This balances the heat dissipation effect at various locations of the liquid-cooled flow channel and achieves uniform heat exchange of the heat dissipation component with respect to the heat dissipation device 500.

[0055] In some embodiments, the specific structure of the liquid cooling channel can be strategically arranged according to the specific location of the heat-dissipating device 500 on the liquid cooling plate 100. That is, the shape of the liquid cooling channel can be adjusted so that different areas of the liquid cooling plate 100 form zones with different heat exchange efficiencies. This allows devices with higher heat dissipation requirements to be placed in zones with higher heat exchange efficiency, and devices with lower heat dissipation requirements to be placed in zones with lower heat exchange efficiency. For example, the liquid cooling channel includes an inlet pipe section, parallel pipe sections, and an outlet pipe section. Multiple parallel pipe sections are connected in parallel between the inlet and outlet pipe sections, with both ends of each parallel pipe section connected to the inlet and outlet pipe sections respectively. Along the flow direction of the coolant, the cross-sectional area of ​​each parallel pipe section may vary, corresponding to different heat exchange effects. Furthermore, the number and form of the turbulence-inducing structures arranged in different parallel pipe sections may be the same or different to further adjust the heat exchange efficiency at different locations on the liquid cooling plate 100, enabling targeted heat dissipation and improving the overall heat dissipation effect. The number of air-cooled channels is not limited to the one shown in the figure, but can also be multiple. It is preferable that the air-cooled channels extend to as many locations as possible to increase the heat exchange area and improve the heat exchange efficiency.

[0056] In some embodiments disclosed in this application, combined with Figure 12 A second heat exchange structure 600 is provided on the side of the sealing cover 200 facing away from the liquid cooling plate 100. This second heat exchange structure 600 includes at least one of a heat sink, a vapor chamber, and a heat pipe. When the heat exchange airflow enters the air-cooled channel, one side exchanges heat with the coolant in the liquid cooling channel via the liquid cooling plate 100, and the other side exchanges heat with its surrounding environment via the sealing cover 200. Adding the second heat exchange structure 600 further improves the heat dissipation efficiency of the heat exchange airflow and the environment. Figure 12 The paper presents a technical solution where the second heat exchange structure 600 is a heat sink. This heat sink can extend outside the chassis 400 and directly exchange heat with the external environment, thereby enhancing the heat exchange effect. A vapor chamber and / or heat pipes can be placed between the heat sink and the sealing cover 200 to improve heat exchange efficiency.

[0057] Combination Figures 10-12 The electronic device disclosed in this application includes a heat-dissipating device 500, a cooling fan 700, and the aforementioned heat dissipation assembly. The heat dissipation assembly is connected to a chassis 400. Both the heat-dissipating device 500 and the cooling fan 700 are disposed within the chassis 400, with the heat-dissipating device 500 positioned on the second side of the liquid cooling plate 100. The heat dissipation assembly dissipates heat from the heat-dissipating device 500. The cooling fan 700 supplies gas from within the chassis 400 into the air-cooling channel. The gas within the chassis 400 serves as the aforementioned heat exchange airflow. By guiding the hot air from within the chassis 400 into the heat exchange space, the cooling fan 700 effectively reduces the ambient temperature within the chassis 400. Since it includes the aforementioned heat dissipation assembly, it also possesses the aforementioned structure and beneficial effects. Other structures refer to existing technologies and will not be described in detail here. The heat-dissipating device 500 includes, but is not limited to, power devices.

[0058] In some embodiments, the heat dissipation component is disposed inside the chassis 400 to directly participate in the heat exchange cycle within the chassis 400, resulting in strong heat exchange efficiency and ensuring the airtightness of the chassis 400. In other embodiments, the heat dissipation component is disposed outside the chassis 400, with the second side of the liquid cooling plate 100 abutting against the outer wall of the chassis 400. The device to be cooled 500 indirectly contacts and exchanges heat with the liquid cooling plate 100 through the chassis wall of the chassis 400, thereby ensuring the airtightness of the chassis 400. In still other embodiments, combined with Figure 11 The heat dissipation components and the side panels of the chassis 400 together enclose the sealed internal space of the chassis 400. The second side of the liquid cooling plate 100 is arranged facing inward of the chassis 400, and the sealing cover 200 is arranged facing outward of the chassis 400. This allows the heat exchange airflow in the air-cooling channel to exchange heat with the external environment through the sealing cover 200 and the second heat exchange structure 600 on the sealing cover 200, thereby enhancing the heat exchange effect.

[0059] The cooling fan 700 can be specifically located at the air inlet 103 or air outlet 104 of the heat exchange space. The air inlet 103 and air outlet 104 of the air-cooled flow channel can be located on the circumferential sidewall or plate surface of the liquid cooling plate 100 or the sealing cover 200. In a specific embodiment disclosed in this application, combined with Figure 12 The air inlet 103 and air outlet 104 of the heat exchange space are connected to the first heat exchange pipe 710 and the second heat exchange pipe 720, respectively. One of the first heat exchange pipe 710 and the second heat exchange pipe 720 is connected to the cooling fan 700. The air inlet end of the first heat exchange pipe 710 and the air outlet end of the second heat exchange pipe 720 extend to different heat-dissipating devices 500. Specifically, when the air inlet end of the first heat exchange pipe 710 extends to the heat-dissipating device 500, it can guide the high-temperature airflow in the environment where the heat-dissipating device 500 is located through the first heat exchange pipe 710 into the air-cooling channel for cooling. When the air outlet end of the second heat exchange pipe 720 extends to the heat-dissipating device 500, it can guide the low-temperature heat exchange airflow cooled by the air-cooling channel to the heat-dissipating device 500, further realizing the air-cooling heat dissipation of the heat-dissipating device 500. To ensure heat exchange efficiency, the air inlet of the first heat exchange pipe 710 and the air outlet of the second heat exchange pipe 720 need to be extended to different heat dissipation devices 500 or different locations within the chassis 400.

[0060] Since the second side of the liquid cooling plate 100 is usually arranged facing upwards and the sealing cover 200 is usually arranged facing downwards, in order to avoid affecting the arrangement of the cooling fan 700, the first heat exchange pipe 710 and the second heat exchange pipe 720, the air inlet 103 and the air outlet 104 are preferably connected through the liquid cooling plate 100. Correspondingly, the cooling fan 700, the first heat exchange pipe 710 and the second heat exchange pipe 720 can be connected to the liquid cooling plate 100 for easy installation and layout. During operation, the second side of the liquid cooling plate 100 is in direct contact with the chassis 400 or the device to be cooled 500. The high-temperature airflow inside the chassis 400 enters the heat exchange space through the air inlet 103 under the blowing or suction of the cooling fan 700. After heat exchange in the heat exchange space, it passes through the air outlet 104 and returns to the chassis 400. During its flow in the heat exchange space, part of the heat is transferred to the surrounding environment through natural convection via the sealing cover 200; another part of the heat is transferred to the coolant in the liquid cooling channel through the liquid cooling plate 100, thereby reducing the temperature.

[0061] The number of air inlets 103 and air outlets 104 includes, but is not limited to, the four arranged in an array as shown in the figure, and their shapes include, but are not limited to, circles and squares.

[0062] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Specific technical means in some embodiments may be incorporated, in whole or in part, into another embodiment unless explicitly excluded by another embodiment. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a heat dissipation assembly. The liquid cooling plate (100) is provided with a liquid cooling flow channel for cooling liquid. The sealing cover (200) is arranged on the first side of the liquid cooling plate (100) and forms a heat exchange space with the liquid cooling plate (100) for heat exchange air flow.

2. The heat dissipating assembly of claim 1, wherein, The heat dissipation assembly further comprises a first heat exchange structure (300) arranged in the heat exchange space.

3. The heat dissipating assembly of claim 2, wherein, The heat exchange space is provided with a partition plate, the extension direction of the partition plate is parallel to the first heat exchange structure (300), and the two sides of the partition plate are connected with the plate surface on the first side of the liquid cooling plate (100) and the sealing cover (200), respectively.

4. The heat dissipating assembly of claim 3, wherein, The cross-sectional area of each section of the air flow channel increases in sequence from the air inlet end to the air outlet end of the air cooling flow channel.

5. The heat dissipating assembly of claim 4, wherein, The heat exchange area of the first heat exchange structure (300) in each section of the air flow channel increases in sequence from the air inlet end to the air outlet end of the air cooling flow channel.

6. The heat dissipating assembly of claim 2, wherein, The first heat exchange structure (300) comprises heat dissipation fins, and the heat dissipation fins are in a plane structure or a corrugated surface structure.

7. The heat dissipating assembly of claim 1, wherein, The sealing cover (200) is provided with a second heat exchange structure (600) on the side away from the liquid cooling plate (100). The second heat exchange structure (600) comprises at least one of heat dissipation fins, a uniform temperature plate and a heat pipe.

8. An electronic device, comprising: The heat dissipation assembly is connected with the case (400), the heat dissipation device (500) and the heat dissipation fan (700) are arranged in the case (400), the heat dissipation device (500) is arranged on the second side of the liquid cooling plate (100), and the heat dissipation fan (700) supplies heat exchange air flow in the case (400) into the heat exchange space. The heat dissipation assembly is arranged in the case (400); or, 9. The electronic device of claim 8, wherein, The heat dissipation assembly is arranged outside the case (400), and the second side of the liquid cooling plate (100) is attached to the outer wall of the case (400). The heat dissipation assembly and each side plate of the case (400) jointly form the internal space of the case (400), and the second side of the liquid cooling plate (100) faces the arrangement in the case (400). The heat dissipation fan (700) is arranged at the air inlet (103) or the air outlet (104). ​ 10. The electronic device of claim 8, wherein, ​ The air inlet (103) and the air outlet (104) are communicated with a first heat exchange pipeline (710) and a second heat exchange pipeline (720) respectively, one of the first heat exchange pipeline (710) and the second heat exchange pipeline (720) is communicated with the heat dissipation fan (700), and the air inlet end of the first heat exchange pipeline (710) and the air outlet end of the second heat exchange pipeline (720) extend to different devices (500) to be cooled.

11. The electronic device of claim 8, wherein, The air inlet (103) and the air outlet (104) are arranged on the sealing cover (200) or the liquid cooling plate (100).

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