Heat exchange assembly and electronic equipment
By designing a combined structure of liquid cooling channels and air cooling channels on the liquid cooling plate, the problem of low cooling capacity utilization of the liquid cooling plate is solved, and a high-efficiency heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202423053841.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2034-12-10
AI Technical Summary
The existing liquid cooling plates have low cooling capacity utilization, making it difficult to meet the high-efficiency heat dissipation requirements of high-power devices.
Design a heat exchange component including a liquid-cooled cover plate and an air-cooled cover plate to form a liquid-cooled flow channel and an air-cooled flow channel. Improve the utilization rate of cooling capacity through heat exchange between the air-cooled flow channel and the liquid-cooled flow channel.
It achieves full utilization of the cooling capacity on both sides of the liquid cooling plate, and has the advantages of compact structure and large heat exchange capacity, thus improving heat dissipation efficiency.
Smart Images
Figure CN223772355U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology for electronic devices, and more specifically, to a heat exchange component and an electronic device. Background Technology
[0002] As the power consumption of components installed inside electronic chassis continues to rise, the power density within the chassis has increased significantly. Given that many chassis need to meet outdoor usage requirements, meaning their structure must be sealed, this undoubtedly exacerbates the difficulty of chassis heat dissipation. When the components inside the chassis do not have particularly high heat dissipation demands, the common practice is to install fans inside the chassis to achieve a cooling effect by agitating the air. However, when the components inside the chassis have high power consumption and high heat dissipation requirements, relying solely on internal fans is clearly insufficient. Therefore, for some high-power components, chassis commonly use liquid cooling plates for liquid cooling, but this suffers from low heat dissipation efficiency.
[0003] Therefore, how to improve the utilization rate of cooling capacity of liquid cooling plates has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content
[0004] In view of this, the purpose of this application is to provide a heat exchange component to improve the cooling capacity utilization of a liquid cooling plate.
[0005] Another object of this application is to provide an electronic device including the above-described heat exchange components.
[0006] To achieve the above objectives, this application provides the following technical solution:
[0007] A heat exchange assembly includes a liquid-cooled cover plate, an air-liquid-cooled plate, and an air-cooled cover plate;
[0008] The liquid-cooled cover plate is disposed on the first side of the air-cooled liquid-cooled plate, and a liquid-cooled flow channel for coolant to pass through is formed between the air-cooled liquid-cooled plate and the air-cooled liquid-cooled plate.
[0009] The air-cooled cover plate is disposed on the second side of the air-liquid cooling plate, and forms an air-cooled flow channel for heat exchange airflow between the air-liquid cooling plate and the air-liquid cooling plate.
[0010] Optionally, in the heat exchange assembly described above, the cross-sectional area of the liquid cooling channel gradually increases or progressively increases in the direction from the inlet end to the outlet end; and / or,
[0011] Along the direction from the air inlet to the air outlet of the air-cooled channel, the cross-sectional area of the air-cooled channel gradually increases segment by segment.
[0012] Optionally, in the heat exchange assembly described above, a first turbulence structure is provided in the liquid cooling channel to agitate the flow of the coolant; and / or,
[0013] The air-cooled flow channel is equipped with a second turbulence structure that disturbs the flow of heat exchange air.
[0014] Optionally, in the heat exchange assembly described above, the first turbulence structure is arranged in segments along the direction from the liquid inlet to the liquid outlet of the liquid-cooled flow channel, and the heat exchange area increases segment by segment; and / or,
[0015] Along the direction from the air inlet to the air outlet of the air-cooled flow channel, the second turbulence structure is arranged in segments, and the heat exchange area increases segment by segment.
[0016] Optionally, in the heat exchange assembly described above, the shape of the air-cooled channel is adapted to the shape of the liquid-cooled channel, and the air inlet end of the air-cooled channel corresponds to the liquid inlet end of the liquid-cooled channel, and the air outlet end of the air-cooled channel corresponds to the liquid outlet end of the liquid-cooled channel.
[0017] Optionally, in the heat exchange assembly described above, the liquid cooling channel includes an inlet pipe section, parallel pipe sections, and an outlet pipe section. The parallel pipe sections are multiple pipes connected in parallel between the inlet pipe section and the outlet pipe section, and both ends of the parallel pipe sections are respectively connected to the inlet pipe section and the outlet pipe section. Along the flow direction of the coolant, the cross-sectional area of each of the parallel pipe sections may vary in the same way or in different ways.
[0018] Optionally, in the heat exchange assembly described above, a heat dissipation structure is provided on the side of the air-cooled cover plate facing away from the air-cooled liquid plate;
[0019] The heat dissipation structure includes at least one of heat dissipation fins, a heat spreader, and a heat pipe.
[0020] An electronic device includes a chassis, a device to be cooled, a heat exchange fan, and the aforementioned heat exchange assembly;
[0021] The heat exchange component is connected to the chassis. The device to be cooled and the heat exchange fan are both located inside the chassis. The device to be cooled is located on the liquid cooling cover plate. The heat exchange fan supplies heat exchange airflow from inside the chassis into the air cooling channel.
[0022] Optionally, in the above-described electronic device, the heat exchange assembly is disposed inside the chassis; or,
[0023] The heat exchange assembly is disposed outside the chassis, and the side of the liquid-cooled cover plate facing away from the air-cooled liquid plate is attached to the outer wall of the chassis; or,
[0024] The heat exchange components and the various side panels of the chassis together enclose the internal space of the chassis, and the liquid cooling cover is arranged facing the inside of the chassis.
[0025] Optionally, in the above-described electronic device, the heat exchange fan is located at the air inlet or air outlet of the air-cooling channel; or,
[0026] The air inlet and outlet of the air-cooled channel are respectively connected to the first heat exchange pipe and the second heat exchange pipe. One of the first heat exchange pipe and the second heat exchange pipe is connected to the heat exchange fan, and the air inlet of the first heat exchange pipe and the air outlet of the second heat exchange pipe extend to different heat dissipation devices.
[0027] Optionally, in the above-mentioned electronic device, the air-cooled plate is provided with a first air inlet and a first air outlet, and the liquid-cooled cover is provided with a second air inlet and a second air outlet.
[0028] The two ends of the first air inlet are respectively connected to the air inlet end of the air-cooled channel and the second air inlet, and the two ends of the first air outlet are respectively connected to the air outlet end of the air-cooled channel and the second air outlet.
[0029] The heat exchange assembly provided in this application includes a liquid-cooled cover plate, an air-liquid-cooled plate, and an air-cooled cover plate. The liquid-cooled cover plate is disposed on the first side of the air-liquid-cooled plate, forming a liquid-cooled flow channel through which coolant can pass. The air-cooled cover plate is disposed on the second side of the air-liquid-cooled plate, forming an air-cooled flow channel through which heat exchange airflow can pass. The first and second sides of the air-liquid-cooled plate are opposite sides of the air-liquid-cooled plate. The electronic device to be cooled can be directly disposed on the liquid-cooled cover plate and exchange heat with the first side of the coolant in the liquid-cooled flow channel. The air-liquid-cooled plate and the liquid-cooled cover plate together perform the liquid-cooled heat exchange function of the liquid-cooled plate. The air-cooled flow channel located on the second side of the air-liquid-cooled plate allows heat exchange airflow to pass through. While the heat exchange airflow passes through, it can exchange heat with the coolant in the liquid-cooled flow channel through the air-liquid-cooled plate, thereby utilizing the cooling capacity of the second side of the liquid-cooled flow channel, achieving cooling of the heat exchange airflow, and improving the utilization rate of the coolant.
[0030] Compared with the prior art, the heat exchange component provided in this application makes full use of the cooling capacity on both sides of the liquid cooling plate by adding an air-cooled flow channel, and has the advantages of compact structure and large heat exchange capacity.
[0031] The electronic device provided in this application includes a heat-dissipating device, a heat exchange fan, and the aforementioned heat exchange assembly. The heat exchange assembly is connected to a chassis. Both the heat-dissipating device and the heat exchange fan are housed inside the chassis, with the heat-dissipating device mounted on a liquid-cooling cover. The heat exchange assembly dissipates heat from the heat-dissipating device, and the heat exchange fan supplies gas from inside the chassis into the air-cooling channel. This gas serves as the aforementioned heat exchange airflow. By guiding the hot air from inside the chassis into the air-cooling channel for heat exchange, the heat exchange fan can effectively reduce the ambient temperature inside the chassis. Since it includes the aforementioned heat exchange assembly, it also possesses the aforementioned structure and beneficial effects. Other structural details are based on existing technology and will not be elaborated upon here. Attached Figure Description
[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. The arrows in the figures indicate the flow direction of the coolant or heat exchange airflow.
[0033] Figure 1 This is a schematic diagram of the overall structure of the heat exchange component disclosed in the embodiments of this application;
[0034] Figure 2 This is an exploded view of the heat exchange component disclosed in the embodiments of this application;
[0035] Figure 3 This is a front view of the air-cooled liquid cooling plate disclosed in the embodiments of this application;
[0036] Figure 4 This is a side view of the air-cooled liquid cooling plate disclosed in an embodiment of this application;
[0037] Figure 5 This is a rear view of the air-cooled liquid cooling plate disclosed in an embodiment of this application;
[0038] Figure 6 This is an isometric view of the electronic device disclosed in the embodiments of this application;
[0039] Figure 7 This is a first front view of the electronic device disclosed in the embodiments of this application;
[0040] Figure 8 This is a second front view of the electronic device disclosed in the embodiments of this application;
[0041] Figure 9 This is a third front view of the electronic device disclosed in the embodiments of this application;
[0042] Figure 10 This is a side view of the electronic device disclosed in an embodiment of this application.
[0043] Among them, 100 is the liquid cooling cover plate, 101 is the second air inlet, 102 is the second air outlet, 200 is the air-liquid cooling plate, 201 is the water inlet, 202 is the water outlet, 203 is the first air inlet, 204 is the first air outlet, 210 is the liquid cooling channel, 211 is the first turbulence structure, 220 is the air cooling channel, 221 is the second turbulence structure, 300 is the air cooling cover plate, 400 is the chassis, 500 is the device to be cooled, 600 is the heat dissipation fins, 700 is the heat exchange fan, 710 is the first heat exchange pipe, and 720 is the second heat exchange pipe. Detailed Implementation
[0044] The core of this application is to disclose a heat exchange component to improve the cooling capacity utilization of liquid cooling plates.
[0045] Another key aspect of this application is the disclosure of an electronic device that includes the aforementioned heat exchange components.
[0046] Hereinafter, embodiments will be described with reference to the accompanying drawings. Furthermore, the embodiments shown below do not limit the scope of the utility model as described in the claims. Additionally, the complete contents of the structures represented in the embodiments below are not limited to those necessary for the solution of the utility model as described in the claims. It should be noted that, for ease of description, only the parts relevant to the utility model are shown in the drawings. Unless otherwise specified, the embodiments and features described in this application can be combined with each other.
[0047] Combination Figures 1-10 The heat exchange assembly disclosed in this application includes a liquid-cooled cover plate 100, an air-liquid-cooled plate 200, and an air-cooled cover plate 300. The liquid-cooled cover plate 100 is disposed on a first side of the air-liquid-cooled plate 200, forming a liquid-cooled flow channel 210 between the liquid-liquid-cooled plate 200 and the air-liquid-cooled plate 200, forming an air-cooled flow channel 220 between the liquid-liquid-cooled plate 200 and the air-liquid-cooled plate 200, allowing heat exchange airflow to pass through. The first and second sides of the air-liquid-cooled plate 200 are opposite sides of the air-liquid-cooled plate 200.
[0048] Electronic components requiring heat dissipation can be directly mounted on the liquid-cooled cover plate 100 and exchange heat with the first side of the coolant in the liquid-cooled flow channel 210. The air-cooled plate 200 and the liquid-cooled cover plate 100 together perform the liquid-cooled heat exchange function of the liquid-cooled plate. The air-cooled flow channel 220 located on the second side of the air-cooled plate 200 allows heat exchange airflow to pass through. Simultaneously, the heat exchange airflow can exchange heat with the coolant in the liquid-cooled flow channel 210 through the air-cooled plate 200, thereby utilizing the cooling capacity on the second side of the liquid-cooled flow channel 210, achieving cooling of the heat exchange airflow, and improving the utilization rate of the coolant. For example, combined with... Figure 6 and Figure 7 Taking the heat exchange components arranged inside the chassis 400 to dissipate heat from the device 500 inside the chassis 400 as an example, the first side of the liquid cooling channel 210 directly exchanges heat with the device 500 inside the chassis 400 through the liquid cooling cover plate 100. The air cooling channel 220 can be circulated with high-temperature heat exchange airflow inside the chassis 400. During the flow, the high-temperature heat exchange airflow exchanges heat with the coolant through the air-liquid cooling plate 200, reduces its temperature, and returns to the chassis 400, further reducing the ambient temperature inside the chassis 400 and improving the heat dissipation efficiency.
[0049] Compared with the prior art, the heat exchange component disclosed in this application makes full use of the cooling capacity on both sides of the liquid cooling plate by adding an air-cooled flow channel 220, and has the advantages of compact structure and large heat exchange capacity.
[0050] Specifically, the liquid cooling channel 210 can be formed by dividing the air-cooled liquid plate 200 or the liquid cooling cover plate 100 with partition plates, or by slotting the air-cooled liquid plate 200 or the liquid cooling cover plate 100. The partition plates and the air-cooled liquid plate 200 or the liquid cooling cover plate 100 can be connected by welding or other methods. For example, the liquid cooling channel 210 can be bent into a serpentine shape or the like. The air cooling channel 220 can be formed by dividing the air-cooled liquid plate 200 or the air cooling cover plate 300 with partition plates, or by slotting the air-cooled liquid plate 200 or the air cooling cover plate 300. The partition plates and the air-cooled liquid plate 200 or the air cooling cover plate 300 can be connected by welding or other methods. For example, the air cooling channel 220 can be serpentine or the like. In addition, the liquid-cooled cover plate 100 and the air-cooled cover plate 300 are sealed to the air-cooled and liquid-cooled plate 200 by means of sealing rings or welding methods such as brazing and friction stir welding, so as to avoid liquid leakage in the liquid-cooled flow channel 210 and air leakage in the air-cooled flow channel 220, thereby ensuring the reliability of the heat exchange operation of the heat exchange components.
[0051] Along the direction from the inlet to the outlet of the liquid cooling channel 210, the cross-sectional area of each position of the liquid cooling channel 210 can remain consistent. Further optimization involves gradually increasing the cross-sectional area of the liquid cooling channel 210 from the inlet to the outlet along the flow direction of the coolant, to ensure uniform heat exchange at all positions on the liquid cooling cover plate 100 of the heat exchange component. This gradual increase in cross-sectional area creates pressure variations, making the pressure at the inlet greater than the pressure at the outlet. This reduces the flow velocity of the coolant at the outlet, prolonging the heat exchange time between the coolant and the heat exchanger 500 and the airflow, thus ensuring consistent cooling effects at both the inlet and outlet of the liquid cooling channel 210 and achieving uniform heat dissipation for the heat exchanger 500.
[0052] Along the direction from the air inlet to the air outlet of the air-cooled channel 220, the cross-sectional area of the air-cooled channel 220 can remain consistent. Further optimization involves increasing the cross-sectional area of the air-cooled channel 220 segment by segment to ensure uniform heat exchange throughout the channel, since the temperature at the air inlet is higher than at the air outlet along the flow direction of the heat exchange airflow. This change in cross-sectional size creates a pressure change, making the pressure at the air inlet greater than the pressure at the air outlet. This reduces the flow velocity of the heat exchange airflow at the air outlet, prolongs the heat exchange time with the liquid-cooled channel 210, and enhances the heat exchange effect.
[0053] Combination Figure 3 A first turbulence structure 211 is provided inside the liquid cooling channel 210, combined with Figure 5 A second turbulence structure 221 is provided in the air-cooled flow channel 220. Specifically, the first turbulence structure 211 and the second turbulence structure 221 can be protruding plate-shaped or block-shaped structures or recessed groove structures, which are used to turbulent the flow of coolant and heat exchange airflow, thereby improving heat exchange efficiency. For example, in some embodiments, the first turbulence structure 211 and the second turbulence structure 221 are protruding plate-like structures. The first turbulence structure 211 can be set on the air-cooled liquid plate 200 or the liquid-cooled cover plate 100 by welding or other methods, or the first turbulence structure 211 can be set as a structure processed by the air-cooled liquid plate 200 itself. The coolant enters the liquid-cooled flow channel 210 through the inlet 201 and flows out through the outlet 202. During the flow in the liquid-cooled flow channel 210, it continuously absorbs heat, and the heat exchange area increases when passing through the first turbulence structure 211, thus increasing the heat exchange capacity and greatly enhancing the heat exchange effect. The second turbulence structure 221 can be set on the air-cooled liquid plate 200 or the air-cooled cover plate 300 by welding or other methods, or the second turbulence structure 221 can be set as a structure processed by the air-cooled liquid plate 200 itself. Its working principle is the same as that of the first turbulence structure 211, and will not be described again here.
[0054] To further optimize the design, the first turbulence structure 211 is arranged in segments along the direction from the liquid inlet to the liquid outlet of the liquid cooling channel 210, with the heat exchange area increasing segment by segment, in order to enhance the heat exchange effect at the liquid outlet of the liquid cooling channel 210 and achieve uniform heat exchange at all locations of the liquid cooling channel 210; the second turbulence structure 221 is arranged in segments along the direction from the air inlet to the air outlet of the air cooling channel 220, with the heat exchange area increasing segment by segment, in order to enhance the heat exchange effect at the air outlet of the air cooling channel 220 and achieve uniform heat exchange at all locations of the air cooling channel 220. For example, the first turbulence structure 211 can be a plurality of first turbulence plates arranged in parallel. By arranging different numbers of first turbulence plates in different sections of the liquid cooling channel 210, the heat exchange area of the first turbulence structure 211 can be changed, which is convenient for adjustment. The second turbulence structure 221 can be a plurality of second turbulence plates arranged in parallel. By arranging different numbers of second turbulence plates in different sections of the air cooling channel 220, the heat exchange area of the second turbulence structure 221 can be changed, which is convenient for adjustment.
[0055] In a specific embodiment disclosed in this application, the shape of the air-cooled channel 220 is adapted to the shape of the liquid-cooled channel 210, and the air inlet end of the air-cooled channel 220 corresponds to the liquid inlet end of the liquid-cooled channel 210, and the air outlet end of the air-cooled channel 220 corresponds to the liquid outlet end of the liquid-cooled channel 210. This allows the heat exchange airflow with a higher temperature at the air inlet end of the air-cooled channel 220 to exchange heat with the coolant with a lower temperature at the liquid inlet end of the liquid-cooled channel 210, and the heat exchange airflow with a lower temperature at the air outlet end of the air-cooled channel 220 to exchange heat with the coolant with a higher temperature at the liquid outlet end of the liquid-cooled channel 210. This balances the heat dissipation effect at various locations of the liquid-cooled channel 210 and achieves uniform heat exchange of the heat exchange component with the heat dissipation device 500.
[0056] In some embodiments, the specific structure of the liquid cooling channel 210 can be specifically arranged according to the specific position of the heat dissipation device 500 on the liquid cooling cover plate 100. That is, the shape of the liquid cooling channel 210 can be adjusted so that different areas of the liquid cooling cover plate 100 form zones with different heat exchange efficiencies. Thus, the heat dissipation device 500 with higher heat dissipation requirements can be placed in the zone with higher heat exchange efficiency, and the heat dissipation device 500 with lower heat dissipation requirements can be placed in the zone with lower heat exchange efficiency. For example, in conjunction with... Figure 3The liquid-cooled flow channel 210 includes an inlet pipe section, parallel pipe sections, and an outlet pipe section. Multiple parallel pipe sections are connected between the inlet and outlet pipe sections, with both ends of each parallel pipe section connected to the inlet and outlet pipe sections respectively. Along the flow direction of the coolant, the cross-sectional area of each parallel pipe section may vary. Furthermore, the number and form of the first turbulence structures 211 arranged in different parallel pipe sections may be the same or different to further adjust the heat exchange efficiency at different locations on the liquid-cooled cover plate 100, performing targeted heat dissipation and improving the heat dissipation effect. The number of air-cooled flow channels 220 includes, but is not limited to, the one shown in the figure, and may also be multiple. Preferably, the air-cooled flow channels 220 extend to as many locations as possible on the air-cooled cover plate 300 to increase the heat exchange area and improve the heat exchange efficiency.
[0057] In some embodiments disclosed in this application, a heat dissipation structure is provided on the side of the air-cooled cover plate 300 facing away from the air-cooled liquid plate 200. This heat dissipation structure includes at least one of heat dissipation fins 600, a vapor chamber, and a heat pipe. When the heat exchange airflow enters the air-cooled flow channel 220, one side exchanges heat with the liquid-cooled flow channel 210 through the air-cooled liquid plate 200, and the other side exchanges heat with its surrounding environment through the air-cooled cover plate 300. Adding this heat dissipation structure further improves the heat dissipation efficiency between the heat exchange airflow and the environment. Combined with... Figure 9 The invention presents a heat dissipation structure consisting of heat dissipation fins 600, which extend beyond the chassis 400 and directly exchange heat with the external environment, thereby enhancing the heat exchange effect. A vapor chamber and / or heat pipes can be positioned between the heat dissipation fins 600 and the air-cooled cover plate 300 to improve heat exchange efficiency.
[0058] Combination Figures 6-10 The electronic device disclosed in this application includes a heat-dissipating device 500, a heat exchange fan 700, and the aforementioned heat exchange assembly. The heat exchange assembly is connected to a chassis 400. Both the heat-dissipating device 500 and the heat exchange fan 700 are disposed within the chassis 400, with the heat-dissipating device 500 mounted on a liquid-cooling cover plate 100. The heat exchange assembly dissipates heat from the heat-dissipating device 500. The heat exchange fan 700 supplies gas from within the chassis 400 into the air-cooling channel 220. The gas within the chassis 400 serves as the aforementioned heat exchange airflow. By guiding the hot air from within the chassis 400 into the air-cooling channel 220 for heat exchange, the heat exchange fan 700 can effectively reduce the ambient temperature within the chassis 400. Since it includes the aforementioned heat exchange assembly, it also possesses the aforementioned structure and beneficial effects. Other structures refer to existing technologies and will not be described in detail here. The heat-dissipating device 500 includes, but is not limited to, power devices.
[0059] In some embodiments, the heat exchange components are disposed within the chassis 400 to directly participate in the heat exchange cycle within the internal space of the chassis 400, resulting in strong heat exchange performance and ensuring the airtightness of the chassis 400. In other embodiments, combined with Figure 8The heat exchange components are located outside the chassis 400, and the side of the liquid cooling cover plate 100 facing away from the air-cooled liquid cooling plate 200 is attached to the outer wall of the chassis 400. The device to be cooled 500 indirectly contacts and exchanges heat with the liquid cooling cover plate 100 through the chassis wall of the chassis 400 to ensure the airtightness of the chassis 400. In some other embodiments, combined with Figure 7 The heat exchange components and the side panels of the chassis 400 together enclose the sealed internal space of the chassis 400. The liquid cooling cover plate 100 is arranged facing inward of the chassis 400, and the air cooling cover plate 300 is arranged facing outward of the chassis 400, so that the heat exchange airflow in the air cooling channel 220 can exchange heat with the external environment through the air cooling cover plate 300 and the heat dissipation fins 600 on the air cooling cover plate 300, thereby enhancing the heat exchange effect.
[0060] The heat exchange fan 700 can be specifically installed at the air inlet or outlet of the air-cooled flow channel 220, and the air inlet and outlet of the air-cooled flow channel 220 can be installed on the circumferential sidewall or surface of the air-cooled liquid cooling plate 200 or the air-cooled cover plate 300. In a specific embodiment disclosed in this application, combined with Figure 10 The air inlet and outlet of the air-cooled channel 220 are connected to the first heat exchange pipe 710 and the second heat exchange pipe 720, respectively. One of the first heat exchange pipe 710 and the second heat exchange pipe 720 is connected to the heat exchange fan 700. The air inlet end of the first heat exchange pipe 710 and the air outlet end of the second heat exchange pipe 720 extend to the device to be cooled 500. Specifically, when the air inlet end of the first heat exchange pipe 710 extends to the device to be cooled 500, it can guide the high-temperature airflow in the environment where the device to be cooled 500 is located to the air-cooled channel 220 for cooling. When the air outlet end of the second heat exchange pipe 720 extends to the device to be cooled 500, it can guide the low-temperature heat exchange airflow cooled by the air-cooled channel 220 to the device to be cooled 500, further realizing the air-cooled heat dissipation of the device to be cooled 500. To ensure heat exchange efficiency, the air inlet of the first heat exchange pipe 710 and the air outlet of the second heat exchange pipe 720 need to be extended to different heat dissipation devices 500 or different locations within the chassis 400.
[0061] Since the liquid-cooled cover plate 100 is usually arranged facing upwards, and the air-cooled cover plate 300 is usually arranged facing downwards, in order to avoid affecting the arrangement of the heat exchange fan 700, the first heat exchange pipe 710, and the second heat exchange pipe 720, combined with... Figure 2 and Figure 3The air-cooled liquid cooling plate 200 has a first air inlet 203 and a first air outlet 204, and the liquid cooling cover plate 100 has a second air inlet 101 and a second air outlet 102. The two ends of the first air inlet 203 are connected to the air inlet end of the air-cooled flow channel 220 and the second air inlet 101, respectively. The two ends of the first air outlet 204 are connected to the air outlet end of the air-cooled flow channel 220 and the second air outlet 102, respectively. This enables the air-cooled flow channel 220 to enter and exit air at the second air inlet 101 and the second air outlet 102. Correspondingly, the heat exchange fan 700, the first heat exchange pipe 710 and the second heat exchange pipe 720 can be connected to the liquid cooling cover plate 100 for easy installation and layout. During operation, the side of the liquid cooling cover 100 away from the air-cooled liquid cooling plate 200 is in direct contact with the chassis 400 or the device to be cooled 500. The high-temperature airflow inside the chassis 400 enters the air-cooled channel 220 through the second air inlet 101 and the first air inlet 203 under the blowing or suction of the heat exchange fan 700. After heat exchange in the air-cooled channel 220, it passes through the first air outlet 204 and the second air outlet 102 and returns to the chassis 400. During its flow in the air-cooled channel 220, part of the heat is transferred to the surrounding environment through natural convection by the air-cooled cover 300; another part of the heat is transferred to the coolant in the liquid-cooled channel 210 through the air-cooled liquid cooling plate 200 to achieve a temperature reduction.
[0062] The number of the first air inlet 203, the first air outlet 204, the second air inlet 101, and the second air outlet 102 includes, but is not limited to, four arranged in an array as shown in the figure, and their shapes include, but are not limited to, circles and squares.
[0063] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Specific technical means in some embodiments may be incorporated, in whole or in part, into another embodiment unless explicitly excluded by another embodiment. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A heat exchange assembly, characterized by The heat exchange assembly comprises a liquid cooling cover plate (100), an air-liquid cooling plate (200), and an air cooling cover plate (300); The liquid cooling cover plate (100) is arranged on the first side of the air-liquid cooling plate (200) and forms a liquid cooling flow channel (210) for cooling liquid between the liquid cooling cover plate (100) and the air-liquid cooling plate (200); The air cooling cover plate (300) is arranged on the second side of the air-liquid cooling plate (200) and forms an air cooling flow channel (220) for heat exchange airflow between the air cooling cover plate (300) and the air-liquid cooling plate (200).
2. The heat exchange assembly of claim 1, wherein, The cross-sectional area of the liquid cooling flow channel (210) gradually increases along the direction from the liquid inlet end to the liquid outlet end; and / or The cross-sectional area of the air cooling flow channel (220) gradually increases along the direction from the air inlet end to the air outlet end.
3. The heat exchange assembly of claim 1, wherein, The liquid cooling flow channel (210) is provided with a first turbulence structure (211) for disturbing the flow of cooling liquid; and / or The air cooling flow channel (220) is provided with a second turbulence structure (221) for disturbing the flow of heat exchange airflow.
4. The heat exchange assembly of claim 3, wherein, The first turbulence structure (211) is arranged in sections and the heat exchange area gradually increases along the direction from the liquid inlet end to the liquid outlet end of the liquid cooling flow channel (210); and / or The second turbulence structure (221) is arranged in sections and the heat exchange area gradually increases along the direction from the air inlet end to the air outlet end of the air cooling flow channel (220).
5. The heat exchange assembly of claim 1, wherein, The shape of the air cooling flow channel (220) is matched with the shape of the liquid cooling flow channel (210), and the air inlet end of the air cooling flow channel (220) corresponds to the liquid inlet end of the liquid cooling flow channel (210), and the air outlet end of the air cooling flow channel (220) corresponds to the liquid outlet end of the liquid cooling flow channel (210).
6. The heat exchange assembly of claim 1, wherein, The liquid cooling flow channel (210) comprises a liquid inlet pipe section, a plurality of parallel pipe sections, and a liquid outlet pipe section, the parallel pipe sections are connected in parallel between the liquid inlet pipe section and the liquid outlet pipe section, the ends of the parallel pipe sections are communicated with the liquid inlet pipe section and the liquid outlet pipe section respectively, and the cross-sectional areas of the parallel pipe sections change the same or differently along the flow direction of the cooling liquid.
7. The heat exchange assembly of claim 1, wherein, The air cooling cover plate (300) is provided with a heat dissipation structure on the side facing away from the air-liquid cooling plate (200); The heat dissipation structure comprises at least one of a heat dissipation fin (600), a uniform temperature plate, and a heat pipe.
8. An electronic device, comprising: The heat exchange assembly comprises a case (400), a device to be cooled (500), a heat exchange fan (700), and a heat exchange assembly according to any one of claims 1-7; The heat exchange assembly is connected with the case (400), the device to be cooled (500) and the heat exchange fan (700) are arranged in the case (400), and the device to be cooled (500) is arranged on the liquid cooling cover plate (100), and the heat exchange fan (700) supplies heat exchange airflow in the air cooling flow channel (220) to the case (400).
9. The electronic device of claim 8, wherein, The heat exchange assembly is arranged in the case (400); or, The heat exchange assembly is arranged outside the case (400), and one side of the liquid cooling cover plate (100) away from the air liquid cooling plate (200) is attached to the outer wall of the case (400); or, The heat exchange assembly and each side plate of the case (400) jointly enclose the internal space of the case (400), and the liquid cooling cover plate (100) is arranged towards the inside of the case (400).
10. The electronic device of claim 8, wherein, The heat exchange fan (700) is arranged at the air inlet or the air outlet of the air cooling flow channel (220); or, The air inlet and the air outlet of the air cooling flow channel (220) are respectively communicated with the first heat exchange pipeline (710) and the second heat exchange pipeline (720), one of the first heat exchange pipeline (710) and the second heat exchange pipeline (720) is communicated with the heat exchange fan (700), and the air inlet end of the first heat exchange pipeline (710) and the air outlet end of the second heat exchange pipeline (720) extend to different heat dissipation devices (500).
11. The electronic device of claim 8, wherein, The air liquid cooling plate (200) is provided with a first air inlet (203) and a first air outlet (204), and the liquid cooling cover plate (100) is provided with a second air inlet (101) and a second air outlet (102); The two ends of the first air inlet (203) are respectively communicated with the air inlet end of the air cooling flow channel (220) and the second air inlet (101), and the two ends of the first air outlet (204) are respectively communicated with the air outlet end of the air cooling flow channel (220) and the second air outlet (102).