Heat dissipation structure of solid-state circuit breaker
By designing a compact heat dissipation structure in solid-state circuit breakers, the problem of poor heat dissipation in semiconductor devices is solved, achieving efficient heat dissipation and a reasonable device layout.
Patent Information
- Application Number
- CN202423065138.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2034-12-11
AI Technical Summary
In existing solid-state circuit breakers, the heat dissipation structure of semiconductor devices occupies a large space, has poor heat dissipation effect, affects device layout and limits the current carrying capacity of the device.
Design a heat dissipation structure in which a heat sink is placed between power semiconductors and a cooling fan is installed on top of it. The openings of several heat dissipation channels extend along the direction of the heat dissipation channels. The air blowing direction of the fan is consistent with the air channels. The exhaust position corresponds to the recess of the housing, forming a compact heat dissipation structure.
A compact heat dissipation structure was achieved, which occupies little space, has high heat dissipation efficiency, solves the problem of poor heat dissipation, and optimizes the device layout.
Smart Images
Figure CN223772356U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit breaker technology, specifically relating to a heat dissipation structure for a solid-state circuit breaker. Background Technology
[0002] With the increasing demand for electricity across society, the number of electrical devices has also increased accordingly, and the issue of ensuring electrical safety has become increasingly prominent. When mechanical circuit breakers disconnect the main circuit they are connected to, the inherent characteristics of mechanical switches make them prone to generating electric arcs during power interruption, which is detrimental to safety. To overcome the hazards caused by mechanical circuit breakers during disconnection, solid-state circuit breakers have been widely used. Solid-state circuit breakers feature fast switching speed, contactless breaking, and long switching life, enabling them to overcome the shortcomings of traditional mechanical circuit breakers.
[0003] Low-voltage DC solid-state circuit breakers typically incorporate N-type power semiconductor devices for power distribution and tripping protection on the positive voltage bus, i.e., the high side. The drive circuit for these high-side N-type power semiconductor devices is complex, generally powered by a charge pump or a high-side switch integrating power supply and protection functions. However, in existing technologies, solid-state switches suffer from overheating and poor heat dissipation during normal operation and frequent switching due to their size, hindering the full utilization of the device's current-carrying capacity. Furthermore, current semiconductor device heat dissipation structures occupy excessive space, affecting the arrangement of other components and resulting in an unreasonable layout of components within the solid-state circuit breaker housing. Utility Model Content
[0004] The purpose of this invention is to address the shortcomings of existing solid-state circuit breakers, such as excessive space occupation and poor heat dissipation effect of semiconductor device heat dissipation structures. This invention provides a heat dissipation structure for solid-state circuit breakers by changing the position and structure of the power semiconductor heat dissipation structure, resulting in a compact heat dissipation structure that occupies less space and dissipates heat quickly.
[0005] Technical solution
[0006] To achieve the above technical objectives, this utility model provides a heat dissipation structure for a solid-state circuit breaker, characterized in that: it includes a heat dissipation body, which is placed between a power semiconductor one and a power semiconductor two, a cooling fan is mounted on the top of the heat dissipation body, and a plurality of heat dissipation ducts are provided on the heat dissipation body. The opening direction of the plurality of heat dissipation ducts extends from the bottom of the heat dissipation body to the top of the heat dissipation body, the blowing direction of the cooling fan is the same as the extension direction of the heat dissipation ducts, and the exhaust position of the cooling fan corresponds to the groove on the housing.
[0007] In one embodiment, power semiconductor one and power semiconductor two are perpendicular to the circuit board.
[0008] In one embodiment, two opposite sides of the four sides of the heat dissipation body are heat dissipation plates, and heat dissipation air ducts are provided on the heat dissipation plates. Accommodation spaces are provided on the other two opposite sides of the four sides of the heat dissipation body, and power semiconductor one and power semiconductor two are embedded in the corresponding accommodation spaces.
[0009] In one embodiment, a heat-conducting layer is disposed inside the heat dissipation body, and the heat-conducting layer is in close contact with the heat dissipation plate 101.
[0010] In one embodiment, a first fastener and a second fastener are also included, the first fastener and the second fastener passing through the power semiconductor one and the power semiconductor two, the side with the accommodating space and the corresponding thermal conductive layer in sequence.
[0011] In one embodiment, the surface of the heat sink near the groove on the housing is the top surface, and a cooling fan is mounted on the top surface.
[0012] In one embodiment, the four sides of the heat sink are perpendicular to the circuit board.
[0013] In one embodiment, the heat dissipation plates on the four sides of the heat dissipation body are arranged symmetrically about the center of the heat dissipation body.
[0014] In one embodiment, the bottom surface of the heat sink is provided with a support for detachably mounting the heat sink onto a circuit board.
[0015] In one embodiment, the heat dissipation body is a hollow frame structure.
[0016] Beneficial effects
[0017] This utility model provides a heat dissipation structure for a solid-state circuit breaker, comprising a heat dissipation body positioned between two power semiconductors. A cooling fan is mounted on the top of the heat dissipation body, and several heat dissipation ducts are arranged on the heat dissipation body. The opening direction of the heat dissipation ducts extends from the bottom to the top of the heat dissipation body, and the airflow direction of the cooling fan is the same as the extension direction of the heat dissipation ducts. The exhaust position of the cooling fan corresponds to a groove on the housing. By changing the position and structure of the power semiconductor heat dissipation structure, the entire heat dissipation structure is compact, occupies little space, and dissipates heat quickly. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Appendix Figure 1 This is a schematic diagram of the power semiconductor mounting position in an embodiment of this utility model;
[0020] Appendix Figure 2a This is a schematic diagram showing the installation positions of the power semiconductor and the heat sink in an embodiment of this utility model;
[0021] Appendix Figure 2b This is a schematic diagram of the fastener installation position in an embodiment of this utility model;
[0022] Appendix Figure 3 This is a schematic diagram of the installation position of the heat dissipation body and the housing in an embodiment of this utility model;
[0023] Appendix Figure 4a This is a schematic diagram of the heat dissipation structure in an embodiment of this utility model. Figure 1 ;
[0024] Appendix Figure 4b This is a second schematic diagram of the heat dissipation structure in an embodiment of this utility model; Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.
[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0029] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.
[0030] Example
[0031] In the existing technology, solid-state switches suffer from problems such as excessive temperature and poor heat dissipation due to their size during normal operation and frequent switching, which prevents them from fully utilizing the current carrying capacity of the device. In addition, the heat dissipation structure of current semiconductor devices occupies too much space, affecting the arrangement of other devices and resulting in an unreasonable layout of devices inside the solid-state circuit breaker housing.
[0032] To address this challenge, as shown in Figure 2, this embodiment provides a heat dissipation structure for a solid-state circuit breaker. It includes a heat dissipation body 1, positioned between a power semiconductor 2 and a power semiconductor 3. A cooling fan 4 is mounted on the top of the heat dissipation body 1. A plurality of cooling ducts 1a are provided on the heat dissipation body 1, with their openings extending from the bottom to the top of the heat dissipation body 1. The airflow direction of the cooling fan 4 is the same as the extension direction of the cooling ducts 1a. Figure 3As shown, the exhaust position of the cooling fan 4 corresponds to the groove 501 on the housing 5. The cooling fan 4 is used to concentrate the generated heat in one direction, that is, directly towards the groove on the surface of the housing, and the heat is dissipated from the groove. The air blowing direction of the cooling fan 4 is the same as the extension direction of the heat dissipation duct 1a, which is compact in structure, occupies little space, and dissipates heat quickly.
[0033] More specifically, as shown in Figure 4, in this embodiment, the heat dissipation body 1 is a hollow frame structure. (See attached figure.) Figure 1 As shown in Figure 4, power semiconductor 2 and power semiconductor 3 are perpendicular to circuit board 6. The surface of heat sink 1 closest to the groove on housing 5 is the top surface, and a cooling fan 4 is mounted on the top surface. The four sides of heat sink 1 are perpendicular to circuit board 6. As shown in Figure 4, two opposite sides of the four sides of heat sink 1 are heat sink plates 101, and heat dissipation ducts 1a are provided on the heat sink plates 101. The other two opposite sides of the four sides of heat sink 1 are provided with receiving spaces 102, and power semiconductor 2 and power semiconductor 3 are embedded in the corresponding receiving spaces 102. The opposite heat sink plates 101 on the four sides of heat sink 1 are arranged symmetrically with respect to the center of heat sink 1.
[0034] As attached Figure 4b As shown, a heat dissipation body 1 has a heat-conducting layer 103 inside, which is in close contact with the heat dissipation plate 101. A support column 104 is provided on the bottom surface of the heat dissipation body 1 for detachably mounting the heat dissipation body 1 onto the circuit board 6. (See attached diagram) Figure 2b As shown, the heat dissipation structure also includes a first fastener (not shown in the figure) and a second fastener 7, which pass through the power semiconductor 1 2 and the power semiconductor 2 3, the side with the accommodating space 102 and the corresponding heat-conducting layer 103 in sequence.
[0035] This utility model provides a heat dissipation structure for a solid-state circuit breaker, comprising a heat dissipation body 1, which is positioned between a power semiconductor 2 and a power semiconductor 3. A cooling fan 4 is mounted on the top of the heat dissipation body 1. Several cooling ducts 1a are arranged on the heat dissipation body 1, with their openings extending from the bottom to the top of the heat dissipation body 1. The airflow direction of the cooling fan 4 is the same as the extension direction of the cooling ducts 1a, and the exhaust position of the cooling fan 4 corresponds to a groove on the housing 5. By changing the position and structure of the power semiconductor heat dissipation structure, the entire heat dissipation structure is compact, occupies little space, and dissipates heat quickly.
[0036] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0037] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A heat dissipation structure of a solid state circuit breaker, characterized by: The application relates to a heat dissipation body (1) arranged between a power semiconductor one (2) and a power semiconductor two (3), wherein the top of the heat dissipation body (1) is provided with a heat dissipation fan (4), a plurality of heat dissipation air ducts (1a) are arranged on the heat dissipation body (1), the opening direction of the heat dissipation air ducts (1a) extends from the bottom of the heat dissipation body (1) to the top of the heat dissipation body (1), the blowing direction of the heat dissipation fan (4) is the same as the extending direction of the heat dissipation air ducts (1a), and the exhaust position of the heat dissipation fan (4) corresponds to a groove on a shell (5).
2. The heat dissipation structure of a solid-state circuit breaker according to claim 1, characterized in that: The power semiconductor one (2) and the power semiconductor two (3) are perpendicular to a circuit board (6).
3. The heat dissipation structure of a solid-state circuit breaker according to claim 2, wherein: Two opposite sides of four sides of the heat dissipation body (1) are heat dissipation plates (101), the heat dissipation air ducts (1a) are arranged on the heat dissipation plates (101), the other two opposite sides of the four sides of the heat dissipation body (1) are provided with accommodating spaces (102), and the power semiconductor one (2) and the power semiconductor two (3) are embedded in the corresponding accommodating spaces (102).
4. The heat dissipation structure of a solid-state circuit breaker according to claim 3, wherein: A heat conduction layer (103) is arranged in the heat dissipation body (1) and tightly contacts the heat dissipation plates (101).
5. The heat dissipation structure of a solid-state circuit breaker according to claim 4, characterized in that: First and second fasteners (7) are arranged in sequence and correspond to the power semiconductor one (2) and the power semiconductor two (3), the sides provided with the accommodating spaces (102) and the corresponding heat conduction layers (103) in sequence.
6. The heat dissipation structure of a solid state circuit breaker according to claim 1, wherein: The top of the heat dissipation body (1) is close to the groove on the shell (5), and the heat dissipation fan (4) is arranged on the top.
7. The heat dissipation structure of a solid-state circuit breaker according to claim 1, wherein: The four sides of the heat dissipation body (1) are perpendicular to the circuit board (6).
8. The heat dissipation structure of a solid-state circuit breaker according to claim 1, wherein: The heat dissipation plates (101) of the four sides of the heat dissipation body (1) are symmetrically arranged with the center of the heat dissipation body (1) as the center.
9. The heat dissipation structure of a solid-state circuit breaker according to claim 1, wherein: The bottom of the heat dissipation body (1) is provided with a support column (104) for detachably mounting the heat dissipation body (1) on the circuit board (6).
10. The heat dissipation structure of a solid state circuit breaker according to claim 1, wherein: The heat dissipation body (1) is a hollow frame structure.