Heat dissipation assembly, domain controller and vehicle

Abstract

The utility model relates to a heat dissipation assembly, a domain controller and a vehicle, and the heat dissipation assembly comprises a heat conduction part which is used for absorbing heat generated by a device to be subjected to heat dissipation; and the vortex tube is used for sucking gas at the first temperature and outputting gas at the second temperature to the heat conduction piece, and the second temperature is lower than the first temperature. The temperature of surrounding gas of the heat conduction piece is low, the temperature difference between the heat conduction piece and the surrounding gas is large, and the heat dissipation rate of the heat dissipation assembly is improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation component, a domain controller, and a vehicle. Background Technology

[0002] With the development of vehicle intelligence, automobiles are no longer satisfied with a single control unit controlling a single device, but instead use domain controllers to jointly control multiple devices on the vehicle. This results in a large computational load and significant heat generation for the domain controllers, necessitating a better cooling system. Although related technologies have proposed using fans to blow air onto the domain controllers to improve the heat dissipation rate, this is still insufficient to meet the required cooling speed. Therefore, a cooling component with a higher heat dissipation rate is needed to cool the domain controllers. Utility Model Content

[0003] This application provides a heat dissipation component, a domain controller, and a vehicle, which improves the heat dissipation rate of the heat dissipation component to at least partially solve the above-mentioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of this application, a heat dissipation component is provided, comprising:

[0005] Thermal conductive components are used to absorb the heat generated by the device to be cooled.

[0006] A vortex tube is used to draw in gas at a first temperature and to output gas at a second temperature to the heat-conducting element, the second temperature being lower than the first temperature.

[0007] Optionally, the heat dissipation assembly further includes a piping assembly, which is connected to the vortex tube, and the vortex tube outputs gas at the second temperature to the heat-conducting element through the piping assembly.

[0008] Optionally, the number of heat-conducting elements is at least two, the pipeline assembly includes a main pipe and at least two branch pipes, the main pipe is connected to the vortex tube, and each of the branch pipes is connected to the main pipe to divert the gas at the second temperature in the main pipe, and one heat-conducting element is correspondingly provided with at least one of the branch pipes.

[0009] According to a second aspect of this application, a domain controller is provided, including the aforementioned heat dissipation component.

[0010] Optionally, the domain controller further includes a housing, the housing including a heat dissipation boss and a body connected to each other, the heat dissipation boss having a mounting cavity formed therein, the heat dissipation boss having an air inlet communicating with the mounting cavity, the heat-conducting element being disposed in the mounting cavity, and the branch pipe communicating with the air inlet to allow gas at the second temperature to flow into the mounting cavity.

[0011] Optionally, the heat dissipation protrusion is further provided with an air outlet that communicates with the mounting cavity. The inner wall of the mounting cavity is spaced apart from the heat-conducting component to form a heat dissipation air channel. The heat dissipation air channel is respectively connected to the air inlet and the air outlet.

[0012] Optionally, the heat-conducting element includes fins, the extension direction of which is intersected with the flow direction of the gas in the heat dissipation channel.

[0013] Optionally, the heat-conducting component further includes a heat-conducting pillar, and the fins are disposed on the outer side of the heat-conducting pillar; the inner wall of the mounting cavity is spaced apart from the end of the fins away from the heat-conducting pillar to form the heat dissipation channel.

[0014] Optionally, the fins extend in a spiral shape along the axial direction of the heat-conducting pillar.

[0015] Optionally, in a cross-section perpendicular to the axial direction of the heat-conducting column, the inner wall of the mounting cavity is circular; or the inner wall of the mounting cavity is square.

[0016] Optionally, the heat dissipation boss includes a first boss and a plurality of second bosses, the main pipe is connected to the first boss, and each second boss is connected to the first boss through the branch pipe; the number of heat-conducting elements located on the first boss is greater than the number located on the second bosses.

[0017] Optionally, the heat-conducting component further includes a mounting portion; the mounting portion is disposed at at least one end of the heat-conducting column, the fins extend to the mounting portion and are connected to the mounting portion, and the mounting portion is used to connect with the heat dissipation boss.

[0018] Optionally, the mounting portion is disc-shaped and protrudes radially outward from the outer side of the heat-conducting column.

[0019] Optionally, the mounting portion includes a first mounting portion and a second mounting portion, the first mounting portion and the second mounting portion being disposed at both ends of the heat-conducting column, the first mounting portion being disposed within the mounting cavity, and the second mounting portion being exposed to the mounting cavity.

[0020] Optionally, the heat dissipation assembly further includes an air compressor for supplying compressed gas at the first temperature to the vortex tube.

[0021] Optionally, the heat dissipation assembly further includes a controller configured to control the speed of the air compressor according to the power of the domain controller, such that the speed of the air compressor increases as the power of the domain controller increases and / or decreases as the power of the domain controller decreases.

[0022] According to a third aspect of this application, a vehicle is also provided, including the aforementioned heat dissipation assembly or domain controller.

[0023] In the heat dissipation assembly of this application embodiment, the vortex tube is used to draw in gas at a first temperature and output gas at a second temperature to the heat dissipation component. The second temperature is lower than the first temperature, resulting in a lower temperature of the gas surrounding the heat dissipation component and a larger temperature difference between the heat dissipation component and the surrounding gas. This allows the heat dissipation component to transfer heat to the gas at the second temperature more quickly. The heat dissipation component is used to absorb heat, which can be the heat generated by the device to be cooled. This allows the heat dissipation component to transfer the heat generated by the device to be cooled to the gas at the second temperature more quickly, thus improving the heat dissipation rate of the heat dissipation assembly.

[0024] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0027] Figure 1 This is a schematic block diagram of the vehicle structure provided in an exemplary embodiment of this disclosure;

[0028] Figure 2 This is a first-view exploded view of the heat dissipation assembly provided in an exemplary embodiment of this disclosure;

[0029] Figure 3 This is a first-view assembly diagram of the heat dissipation assembly provided in an exemplary embodiment of this disclosure;

[0030] Figure 4 This is a front view schematic diagram of the heat dissipation component provided in an exemplary embodiment of this disclosure;

[0031] Figure 5 This is a cross-sectional schematic diagram of the heat dissipation component provided in an exemplary embodiment of this disclosure;

[0032] Figure 6 yes Figure 5 Enlarged view of section A;

[0033] Figure 7This is a second-view assembly schematic diagram of the heat dissipation assembly provided in an exemplary embodiment of this disclosure;

[0034] Figure 8 This is a second-view exploded view of the heat dissipation assembly provided in an exemplary embodiment of this disclosure;

[0035] Figure 9 yes Figure 8 Enlarged view of section B.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1000, vehicles;

[0038] 100. Domain controller;

[0039] 10. Heat dissipation components;

[0040] 11. Heat-conducting component; 111. Heat-conducting column; 112. Fin; 113. Mounting part; 1131. First mounting part; 1132. Second mounting part; 1133. Mounting hole;

[0041] 12. Vortex tube;

[0042] 13. Controller;

[0043] 14. Piping components; 141. Main pipe; 142. Branch pipe; 143. Vent pipe; 144. Connecting pipe;

[0044] 15. Air compressor;

[0045] 20. Shell;

[0046] 21. Body; 211. Receiving cavity;

[0047] 22. Heat dissipation boss; 221. Mounting cavity; 222. Heat dissipation duct; 223. First boss; 224. Second boss. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0049] This application provides a heat dissipation assembly, a domain controller, and a vehicle.

[0050] Please refer to Figure 1The vehicle 1000 provided in this application includes the aforementioned heat dissipation component 10 or domain controller 100. The vehicle 1000 in this application can be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this disclosure does not specifically limit it.

[0051] When the vehicle 1000 is equipped with a domain controller 100, the heat dissipation assembly 10 can dissipate heat for the domain controller 100, as detailed below. The heat dissipation assembly 10 can also dissipate heat for other controllers 13 or components to be cooled in the vehicle 1000, such as the engine control unit (ECU) or transmission control unit (TCU) controllers 13 of the vehicle 1000.

[0052] This application provides a domain controller 100, including the heat dissipation component 10 described above.

[0053] The domain controller in the embodiments of this application can be a power domain controller, chassis domain controller, or body domain controller, etc.

[0054] Please refer to Figure 2 The heat dissipation assembly 10 provided in the embodiments of this application includes a heat-conducting element 11 and a vortex tube 12. The heat-conducting element 11 is used to absorb heat generated by the component to be cooled. The vortex tube 12 is used to draw in gas at a first temperature and to output gas at a second temperature to the heat-conducting element 11, the second temperature being lower than the first temperature. It is readily understood that the gas at the second temperature is a low-temperature gas relative to the gas at the first temperature.

[0055] The heat-conducting element 11 is used to absorb heat, and can absorb the heat of the device to be cooled (such as the chip of the controller 13) onto itself. The heat-conducting element 11 can dissipate heat by exchanging heat with the surrounding gas, thereby cooling the device to be cooled. For example, in some embodiments, the heat-conducting element 11 can be a heat sink.

[0056] The vortex tube 12, also known as the Rank-Helsch vortex tube, can separate a single compressed gas flow into two streams with different temperatures: one cold air and the other hot air. In other words, a vortex tube is a structure that can separate compressed air into cold and hot air. The working principle of the vortex tube 12 can be understood based on the Rankine vortex theory. The specific structure of the vortex tube 12 is not limited, as long as it can output gas at a lower temperature.

[0057] In some examples, a vortex tube may include structures such as a nozzle, a vortex chamber, an orifice plate, a cold-end duct, and a hot-end regulating valve. The nozzle guides compressed gas into the vortex chamber and accelerates the gas to near-sonic speeds. The vortex chamber, located in the center of the vortex tube, is where the gas undergoes intense rotation. The orifice plate, positioned between the vortex chamber and the cold-end duct, helps control and adjust the ratio of cold gas flow. The cold-end duct is used to exit the cooled gas flow. The hot-end regulating valve, installed at the hot-end outlet, allows the user to adjust the ratio and temperature of the hot and cold gas flows as needed.

[0058] exist Figure 2 In the illustrated embodiment, hot air is discharged from the right side of the vortex tube 12, while cold air is output from the left side and enters the main pipe 141 to supply the heat-conducting element 11. In some embodiments, the cold air ejected from the vortex tube 12 may also bypass the main pipe 141 and be directly sprayed onto the heat-conducting element 11.

[0059] The heat dissipation component 10 of this application embodiment can also be applied to electronic devices such as audio equipment, but for ease of description, the following description will use a domain controller 100 as an example.

[0060] The gas at the first temperature is compressed external gas. In some embodiments, a passive air intake method can be adopted. For example, when the heat dissipation component 10 is used in the vehicle 1000, the air intake of the vortex tube 12 can be oriented towards the direction of travel of the vehicle 1000, so that the vortex tube 12 passively intakes air during the movement of the vehicle 1000.

[0061] The vortex tube 12 draws in gas at a first temperature and outputs gas at a second temperature to the heat-conducting element 11. The second temperature is lower than the first temperature, resulting in a lower temperature of the gas surrounding the heat-conducting element 11 and a larger temperature difference between the heat-conducting element 11 and the surrounding gas. According to thermodynamic theory, the greater the temperature difference between a solid and the surrounding gas, the faster the solid transfers heat to the gas. Therefore, outputting gas at the second temperature to the heat-conducting element 11 allows it to transfer heat to the gas more quickly. This enables the heat-conducting element 11 to transfer the heat generated by the device to be cooled to the gas at the second temperature more rapidly, improving the heat dissipation rate of the heat dissipation assembly 10.

[0062] Please refer to Figure 2 and Figure 3 Optionally, the heat dissipation assembly 10 further includes a pipe assembly 14 connected to the vortex tube 12, through which the vortex tube 12 outputs gas at a second temperature to the heat conductor 11.

[0063] The piping assembly 14 includes at least one pipe, which allows the piping assembly 14 to change the direction of the cold air flow, facilitating the layout of the heat dissipation assembly 10. This allows for more flexible arrangement of the relative positions of the vortex tube 12 and the heat conductor 11. The heat conductor 11 does not need to be directly opposite the cold air outlet of the vortex tube 12, but can be guided by the piping assembly 14 to ensure that the second-temperature gas blown out by the vortex tube 12 is provided to the heat conductor 11.

[0064] In addition, the arrangement of the piping assembly 14 can prevent the gas at the second temperature provided by the vortex tube 12 from losing its cooling capacity into the air during transportation, thus ensuring that the temperature of the gas supplied to the heat-conducting component 11 is low.

[0065] Please refer to Figure 2 and Figure 3 Optionally, the number of heat-conducting elements 11 is at least two, and the pipeline assembly 14 includes a main pipe 141 and at least two branch pipes 142. The main pipe 141 is connected to the vortex tube 12, and each branch pipe 142 is connected to the main pipe 141 to divert the gas at the second temperature in the main pipe 141. A heat-conducting element 11 is correspondingly provided with at least one branch pipe 142.

[0066] Such a vortex tube 12 can provide (output) gas at a second temperature to at least two heat-conducting components 11. Multiple heat-conducting components 11 can dissipate heat for different heat-dissipating devices or different heat-generating parts of the same heat-dissipating device, thus enriching the application scenarios of the heat dissipation component 10.

[0067] Branch pipe 142 can be directly connected to main pipe 141. In one example, one end of main pipe 141 is connected to one interface of multi-port pipe, and the remaining interfaces of multi-port pipe are connected to different branch pipes 142 respectively, so that main pipe 141 can be connected to at least two branch pipes 142 and deliver gas at the second temperature to different branch pipes 142 to provide gas at the second temperature for different heat conductors 11.

[0068] In addition, since branch pipe 142 is used for diversion, branch pipe 142 can directly lead from main pipe 141 to different heat conduction components 11, thereby reducing the total distance from main pipe 141 to each heat conduction component 11. That is, the total path of cold air being delivered to different heat conduction components 11 is shorter, avoiding the loss of cold energy during the delivery process and improving the heat dissipation rate of heat dissipation component 10.

[0069] Furthermore, since the environment along the transport path of the gas at the second temperature received by different heat-conducting components 11 is more similar, the airflow delivered to each heat-conducting component 11 can be more uniform.

[0070] This application provides a domain controller 100, including the heat dissipation component 10 described above.

[0071] The domain controller in the embodiments of this application can be a power domain controller, chassis domain controller, or body domain controller, etc.

[0072] Please refer to Figure 4 and Figure 7 Optionally, the domain controller further includes a housing 20, which includes a body 21 and a heat dissipation boss 22. The housing 20 includes the heat dissipation boss 22 and the body 21 connected to each other. A mounting cavity 221 is formed in the heat dissipation boss 22. An air inlet communicating with the mounting cavity 221 is provided on the heat dissipation boss 22. The heat-conducting element 11 is disposed in the mounting cavity 221. The branch pipe 142 is connected to the air inlet so that gas at the second temperature flows into the mounting cavity 221.

[0073] In some examples, a receiving cavity 211 may be formed inside the body 21, and a heat dissipation boss 22 may be provided inside the receiving cavity 211.

[0074] The housing 20 can be the housing 20 of the domain controller 100 or the housing 20 of other electronic components. The body 21 of the housing 20 is the wall forming the receiving cavity 211. The housing 20 can be a cover, side wall, bottom wall, or other part of the enclosure of the electronic components (including the domain controller 100). The receiving cavity 211 houses the working devices (e.g., chips) within the electronic components. These working devices generate heat but need to be maintained within a certain temperature range to operate normally. Therefore, the heat dissipation assembly 10 can dissipate heat from the working devices within the receiving cavity 211 to maintain them within their operating temperature range.

[0075] The heat dissipation boss 22 can directly contact the aforementioned working device so that the heat-conducting component 11 can absorb the heat from the working device. Alternatively, it can be thermally connected to the working device through a structure with good thermal conductivity, such as a heat-conducting plate or thermally conductive adhesive, so that the heat-conducting component 11 can absorb the heat from the working device. The heat dissipation boss 22 itself can also have good thermal conductivity, so all working devices that have a thermally conductive relationship with the heat dissipation boss 22 can receive heat dissipation from the heat dissipation boss 22.

[0076] The mounting cavity 221 inside the heat dissipation boss 22 is connected to the branch pipe 142, so that the gas at the second temperature can be transported to the mounting cavity 221 through the branch pipe 142. At the same time, the heat-conducting element 11 is set in the mounting cavity 221, so the heat-conducting element 11 can receive the gas at the second temperature.

[0077] It is evident that the gas at the second temperature can be concentrated around the heat-conducting component 11 within the mounting cavity 221, and is less likely to dissipate into other parts of the receiving cavity 211, thus ensuring cooling efficiency.

[0078] Please refer to Figure 5 and Figure 6Optionally, the heat dissipation protrusion is further provided with an air outlet communicating with the mounting cavity 221. The inner wall of the mounting cavity 221 is spaced apart from the heat-conducting element 11 to form a heat dissipation air channel 222, which is respectively connected to the air inlet and the air outlet. Thus, the heat dissipation air channel 222 can be used to circulate gas at a second temperature.

[0079] The heat dissipation duct 222 can be considered as the portion of the mounting cavity 221 not occupied by the heat-conducting element 11. This portion is spaced apart from the heat-conducting element 11 to form the heat dissipation duct 222. Gas at a second temperature can flow in the heat dissipation duct 222, thus carrying away the heat from the heat-conducting element 11 through gas flow. Alternatively, the second-temperature gas flowing in the heat dissipation duct 222 ensures that the heat-conducting element 11 is always in a low-temperature airflow, and the temperature of the gas surrounding the heat-conducting element 11 does not rise due to the absorption of heat from the heat-conducting element 11, maintaining a high temperature difference between the heat-conducting element 11 and the surrounding gas, thereby improving the heat dissipation rate of the heat dissipation assembly 10.

[0080] Please refer to Figure 8 and Figure 9 Optionally, the heat-conducting element 11 includes fins 112, the extension direction of which is intersected with the flow direction of the gas in the heat dissipation channel 222.

[0081] Please refer to Figure 8 and Figure 9 Optionally, the heat-conducting component 11 further includes a heat-conducting pillar 111, and the fins 112 are disposed on the outer side of the heat-conducting pillar 111; the inner wall of the mounting cavity 221 is spaced apart from the end of the fins 112 away from the heat-conducting pillar 111 to form the heat dissipation channel 222.

[0082] In some embodiments, the heat-conducting element 11 may include a columnar heat-conducting column 111 and fins 112. The fins 112 may be disposed radially outside the heat-conducting column 111. The inner wall of the mounting cavity 221 and the fins 112 are spaced apart radially from the heat-conducting column 111 to form a heat dissipation channel 222.

[0083] The heat-conducting pillar 111 can absorb the heat from the heat-generating device and transfer the heat to the fins 112. This makes the overall heat dissipation area of ​​the heat-conducting component 11 (the sum of the surface areas of the heat-conducting pillar 111 and the fins 112) larger, thus improving the heat dissipation efficiency of the heat dissipation assembly 10.

[0084] The heat-conducting pillar 111 is a high-strength structure that can be used for installation. The heat-conducting pillar 111 can be directly connected to the inner wall of the mounting cavity 221 or directly connected to the device to be cooled. The fins 112 are structures used to increase the heat dissipation area. They do not need to bear loads, and they do not need to be connected to the inner wall of the mounting cavity 221 or contact the device to be cooled.

[0085] The fins 112 can also disturb the gas at the second temperature as it flows through the heat dissipation channel 222, making the heat exchange between the gas at the second temperature and the heat conductor 11 more complete and improving the heat dissipation efficiency of the heat dissipation assembly 10.

[0086] The fin 112 can be an extension of the surface of the heat-conducting pillar 111, which can increase the heat dissipation area. The cross-sectional shape of the fin 112 can be square, trapezoidal, triangular, etc.

[0087] Please refer to Figure 9 Optionally, the fins 112 extend in a spiral shape along the axial direction of the heat-conducting column 111.

[0088] In some examples, the fins 112 extend axially along the heat-conducting pillar 111 and are inclined radially towards the heat-conducting pillar 111.

[0089] This makes the fins 112 have a spiral fin shape, causing the flowing gas at the second temperature to generate turbulence on the surface of the fins 112. This makes the fins 112 more capable of turbulentizing the gas at the second temperature, and at the same time guides the gas at the second temperature to form a secondary flow along the axial direction of the heat-conducting column 111. All of the above effects help the gas at the second temperature to carry away the heat from the surface of the fins 112, thereby increasing the heat dissipation rate of the heat dissipation assembly 10.

[0090] Please refer to Figure 5 and Figure 6 Optionally, the heat dissipation duct 222 is configured to allow gas at a second temperature to flow circumferentially along the heat-conducting column 111.

[0091] In this way, the general trend of the gas flow at the second temperature is basically along the circumference of the heat-conducting column 111, and the flow direction of the gas at the second temperature is also basically perpendicular to the surface of the fin 112. In this way, the gas at the second temperature can easily have a transmission velocity along the normal direction of the fin surface 112 due to the obstruction of the fin 112, thereby forming turbulence. The stirring effect of the turbulence is strong, which makes it easier for the cold air to carry away the heat from the surface of the fin 112, thereby increasing the heat dissipation rate of the heat dissipation component 10.

[0092] Please refer to Figure 6 Optionally, in the axial section of the vertical heat-conducting column 111, the inner wall of the mounting cavity 221 is circular or square.

[0093] The inner wall of the mounting cavity 221 is circular, which can match the cylindrical surface of the heat-conducting column 111. This allows the inner wall of the mounting cavity 221 to be closer to the heat-conducting column 111, forming a heat dissipation channel 222 with a smaller cross-sectional area (cross section perpendicular to the airflow direction). This ensures the flow rate of the gas during the flow process at the second temperature, which is conducive to the formation of turbulence and increases the heat dissipation rate of the heat dissipation component 10. Figure 6 The implementation shown is in Figure 6 The two heat dissipation protrusions 22 at the top are the circular heat dissipation protrusions 22 mentioned above.

[0094] The inner wall of the mounting cavity 221 is square, allowing it to accommodate more heat-conducting components 11, or to form a larger heat dissipation channel 222 with a larger cross-sectional area (section perpendicular to the airflow direction). This reduces the obstruction of airflow by the heat dissipation channel 222, increasing the number of heat-conducting components 11 to improve the heat dissipation rate or reducing obstruction to airflow to alleviate pipeline pressure. Figure 6 The implementation shown is in Figure 6 The two heat dissipation protrusions 22 below are the square heat dissipation protrusions 22 mentioned above.

[0095] In an embodiment of the same heat dissipation assembly 10, when there are multiple heat dissipation protrusions 22, the different heat dissipation protrusions 22 can be circular and square in cross-section perpendicular to the axial direction of the heat-conducting column 111, respectively. Different heat dissipation protrusions 22 can be arranged in different positions to adapt to the operation of the heat dissipation assembly 10. For example, for... Figure 6 In the embodiment shown, the first protrusion 223 is square because the second temperature gas at the first protrusion 223 has the lowest temperature and the largest flow rate, requiring a large cross-sectional area heat dissipation channel 222; the second protrusion 224, which is far from the first protrusion 223, is circular to ensure the flow rate of the second temperature gas and improve the heat dissipation rate; the second protrusion 224, which is far from the first protrusion 223, can also be square to reduce the obstruction to the second temperature gas and ensure a sufficient flow of the second temperature gas.

[0096] The dimensions of the heat dissipation boss 22 and the heat conduction component 11 can be set to be relatively small so that the heat dissipation air passage 222 in the heat dissipation boss 22 meets the microchannel structure characteristics, thereby increasing the convective heat transfer coefficient and improving the heat dissipation rate of the heat dissipation component 10.

[0097] Please refer to Figure 6 and Figure 7 Optionally, the heat dissipation boss 22 includes a first boss 223 and a plurality of second bosses 224. The main pipe 141 is connected to the first boss 223, and each second boss 224 is connected to the first boss 223 through the branch pipe 142. The number of heat-conducting elements located on the first boss 223 is greater than the number located on the second bosses 224.

[0098] In some examples, the main pipe 141 can be inserted through the body 21 and communicate with the first boss 223, and the first boss 223 can be communicated with the second boss 224 through the branch pipe 142.

[0099] The gas at the second temperature directly enters the first protrusion 223, which can achieve the highest cooling rate. This allows for the dissipation of heat from critical components or components with the highest heat generation rate, ensuring the normal operation of the domain controller 100. Furthermore, the main pipe 141 is directly connected to the first protrusion 223, avoiding heat loss during transmission.

[0100] The number of heat-conducting elements located on the first boss 223 is greater than the number of heat-conducting elements located on the second boss 224. In other words, the area where the first boss 223 is located can absorb more heat generated by the device to be cooled.

[0101] The first boss 223 is connected to the second boss 224 through the branch pipe 142. This is equivalent to allowing the first boss 223 to divert the gas at the second temperature. Since the heat-conducting element 11 in the first boss 223 can stir the gas at the second temperature, the gas at the second temperature can be evenly distributed to various parts of the first boss 223, thus improving the uniformity of the flow rate in different branch pipes 142.

[0102] Please refer to Figure 2 and Figure 4 Optionally, the piping assembly 14 further includes an exhaust pipe 143, which communicates with the branch pipe 142 and / or the heat dissipation boss 22. The exhaust pipe 143 communicates with the outside of the receiving cavity 211.

[0103] After the gas at the second temperature exchanges heat with the heat-conducting component 11, it is called exhaust gas at a higher temperature. Therefore, the exhaust pipe 143, which is connected to the branch pipe 142 and / or the heat dissipation boss 22, can discharge the exhaust gas to the outside. Since the exhaust gas is discharged to the outside, the gas temperature around the heat-conducting component 11 can be kept low, thereby improving the cooling effect of the heat dissipation component 10.

[0104] exist Figure 2 and Figure 4 In the illustrated embodiment, the exhaust pipe 143 is connected to the branch pipe 142. Therefore, the gas at the second temperature enters the receiving cavity 211 from the first boss 223, enters each of the second bosses 224 through the branch pipe 142, and then exits the receiving cavity 211 through the exhaust pipe 143. In some other embodiments, the exhaust pipe 143 may also be directly connected to the heat dissipation boss 22, so that the waste gas in the heat dissipation boss 22 can be directly discharged into the receiving cavity 211.

[0105] Please refer to Figure 6 Optionally, at least two heat-conducting elements 11 are provided inside a heat dissipation boss 22.

[0106] Increasing the number of heat-conducting elements 11 within a heat dissipation boss 22 can improve the heat dissipation rate of a heat dissipation boss 22, enabling heat dissipation for critical components to be cooled (or components with the highest heat generation rate), thereby improving the adaptability of the heat dissipation device.

[0107] Please refer to Figure 9 Optionally, the heat-conducting component 11 further includes a mounting portion 113; the mounting portion 113 is disposed at at least one end of the heat-conducting column 111, the fins 112 extend to the mounting portion 113 and are connected to the mounting portion, and the mounting portion 113 is used to connect with the heat dissipation boss 22.

[0108] The heat-conducting column 111 is used to absorb the heat of the device to be cooled and exchange heat with the gas at the second temperature to cool the device. Therefore, the radial side area of ​​the heat-conducting column 111 is large, which can quickly exchange heat with the gas at the second temperature. The mounting part 113 is set at the end of the heat-conducting column 111, which helps to expose the side of the heat-conducting column 111, thereby improving the heat dissipation rate of the heat dissipation assembly 10.

[0109] In some embodiments, the mounting part 113 may be a snap-fit ​​and snap-fit ​​connected to the heat dissipation boss 22.

[0110] Please refer to Figure 9 Optionally, the mounting part 113 is disc-shaped and protrudes radially outward from the outer side of the heat-conducting column 111.

[0111] The mounting portion 113 protrudes radially outward from the heat-conducting pillar 111. Simultaneously, the side of the mounting portion 113 facing away from the heat-conducting pillar 111 can abut against the inner wall of the mounting cavity 221, mounting the heat-conducting component 11 onto the wall of the heat-dissipating boss 22. This increases the mounting area between the mounting portion 113 and the heat-dissipating boss 22, thereby improving the stability of the heat-conducting component 11's installation. The mounting portion 113 can be welded, bonded, screwed, or riveted to the heat-dissipating boss 22.

[0112] Please refer to Figure 9 Optionally, the mounting part 113 is provided with a mounting hole 1133 that extends through the mounting part 113 along the axial direction of the heat-conducting column 111.

[0113] Mounting hole 1133 allows bolts or rivets to pass through, and can also be used as a welding hole or a potting hole to absorb solder or adhesive, thereby improving the installation strength between the heat-conducting component 11 and the heat dissipation boss 22.

[0114] Please refer to Figure 9 Optionally, the mounting part 113 includes a first mounting part 1131 and a second mounting part 1132, which are respectively disposed at both ends of the heat-conducting column 111. The first mounting part 1131 is disposed in the mounting cavity 221, and the second mounting part is exposed to the mounting cavity 221.

[0115] In some examples, the second mounting part 1132 may pass through the boss to expose the receiving cavity 211.

[0116] The first mounting portion 1131 allows the heat-conducting element 11 to be more stably mounted within the mounting cavity 221. The second mounting portion 1132 is exposed to the receiving cavity 211. The side of the second mounting portion 1132 opposite to the heat-conducting column 111 can be thermally connected to the device to be cooled (e.g., directly abutting or connected through the heat-conducting device), thereby increasing the contact area between the heat-conducting element 11 and the device to be cooled, increasing the heat transfer rate of the device to the heat-conducting column 111, and thus increasing the heat dissipation rate of the heat dissipation assembly 10.

[0117] The second mounting part 1132 can also be used to fix the heat-conducting component 11. In one example, please refer to... Figure 4 The second mounting part 1132 and the hole wall that mates with the heat dissipation boss 22 can be connected to each other. For example, the second mounting part 1132 mates with the hole (clearance fit, transition fit or interference fit). The second mounting part 1132 can also be bonded or welded to the hole wall.

[0118] The heat-conducting component 11 can also be machined separately and assembled into the heat dissipation boss 22, which reduces the process requirements and manufacturing cost of manufacturing the heat-conducting component 11, and makes replacement more convenient.

[0119] Please refer to Figure 2 Optionally, the heat dissipation assembly 10 also includes an air compressor 15 for supplying compressed gas at a first temperature to the vortex tube 12.

[0120] In this way, the heat dissipation component 10 can be supplied with compressed gas at a first temperature to the vortex tube 12 by an independent air compressor 15, thereby increasing the air output of the vortex tube 12 and improving the heat dissipation capacity of the heat dissipation component 10. The air compressor 15 can be connected to the vortex tube 12 through the connecting pipe 144, or it can be directly connected to the vortex tube 12.

[0121] Please refer to Figure 1 Optionally, the heat dissipation assembly 10 is applied to the domain controller 100. The heat dissipation assembly 10 also includes a controller 13, which is configured to control the speed of the air compressor 15 according to the power of the domain controller 100, such that the speed of the air compressor 15 increases as the power of the domain controller 100 increases and / or decreases as the power of the domain controller 100 decreases.

[0122] The power of the domain controller 100 is positively correlated with the heat generation rate of the domain controller 100. Therefore, when the power of the controller 13 increases, the controller 13 controls the air compressor 15 to increase the speed of the air compressor 15, so as to provide more gas at the second temperature to the heat conduction component 11, thereby improving the heat dissipation rate of the domain controller 100 and meeting the heat dissipation needs of the domain controller 100 when operating at high power.

[0123] When the power of the domain controller 100 decreases, the controller 13 reduces the speed of the air compressor 15 to reduce the energy consumption of the heat dissipation component 10.

[0124] In one example, controller 13 can control air compressor 15 in the following way:

[0125] When the domain controller 100 operates under peak power conditions, it generates a large amount of heat. The controller 13 controls the air compressor 15 to operate at a high speed range to ensure that the vortex tube 12 can generate a sufficient amount of gas at the second temperature. When the gas at the second temperature is evenly blown onto the heat conduction element 11, the large temperature difference increases the convective heat transfer capacity and enhances the heat dissipation capacity. When the domain controller 100 operates under medium power conditions, the controller 13 controls the air compressor 15 to operate within the normal speed range to ensure sufficient gas flow at the second temperature. When the domain controller 100 operates under low power conditions, the controller 13 controls the air compressor 15 to operate within the low speed range to ensure sufficient cooling capacity while minimizing system energy consumption. The controller 13 can adjust the speed of the air compressor 15 according to the different heat loads of the domain controller 100, thereby adjusting the flow rate and temperature of the gas at the second temperature to ensure a large temperature difference between the gas at the second temperature and the heat conduction element 11, resulting in good heat dissipation of the heat dissipation component 10.

[0126] Due to the working principle of the vortex tube 12, the performance indicators such as the flow rate, temperature and pressure of the gas output at the second temperature of the vortex tube 12 can be directly adjusted by adjusting the speed of the air compressor 15, thereby changing the working state of the vortex tube 12 to meet the heat dissipation requirements of the domain controller 100.

[0127] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0128] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0129] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0130] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A heat dissipating assembly, characterized by, The heat dissipation assembly comprises: a heat conducting member for absorbing heat generated by a device to be cooled; a vortex tube for sucking in gas at a first temperature and outputting gas at a second temperature lower than the first temperature to the heat conducting member.

2. The heat dissipation assembly of claim 1, wherein, The heat dissipation assembly further comprises a pipeline assembly in communication with the vortex tube, and the vortex tube outputs the gas at the second temperature to the heat conducting member through the pipeline assembly.

3. The heat dissipation assembly of claim 2, wherein, The number of the heat conducting members is at least two, and the pipeline assembly comprises a main pipe and at least two branch pipes, the main pipe being in communication with the vortex tube, and each branch pipe being in communication with the main pipe for distributing the gas at the second temperature in the main pipe, and one heat conducting member being arranged corresponding to at least one branch pipe.

4. A domain controller, characterized by The heat dissipation assembly comprises any one of claims 1 to 3.

5. The domain controller of claim 4, wherein, The domain controller further comprises a housing comprising a heat dissipation boss and a body connected to each other, the heat dissipation boss being formed with a mounting cavity, the heat dissipation boss being provided with an air inlet in communication with the mounting cavity, and the heat conducting member being arranged in the mounting cavity, and the branch pipe being in communication with the air inlet so as to make the gas at the second temperature flow into the mounting cavity.

6. The domain controller of claim 5, wherein, The heat dissipation boss is further provided with an air outlet in communication with the mounting cavity, and the inner wall of the mounting cavity is spaced apart from the heat conducting member to form a heat dissipation air channel, and the heat dissipation air channel is in communication with the air inlet and the air outlet respectively.

7. The domain controller of claim 6, wherein, The heat conducting member comprises fins, and the extending direction of the fins is crosswise arranged to the flow direction of the gas in the heat dissipation air channel.

8. The domain controller of claim 7, wherein, The heat conducting member further comprises a heat conducting column, and the fins are arranged on the outer side of the heat conducting column, and the inner wall of the mounting cavity is spaced apart from one end of the fins away from the heat conducting column to form the heat dissipation air channel.

9. The domain controller of claim 8, wherein, The fins extend spirally along the axial direction of the heat conducting column.

10. The domain controller of claim 8, wherein, In the cross section perpendicular to the axial direction of the heat conducting column, the inner side wall of the mounting cavity is circular; or The inner side wall of the mounting cavity is square.

11. The domain controller of claim 6, wherein, The heat dissipation boss comprises a first boss and a plurality of second bosses, the main pipe is in communication with the first boss, each second boss is in communication with the first boss through a branch pipe, and the number of the heat conducting members arranged in the first boss is greater than the number of the second bosses.

12. The domain controller of claim 8, wherein, The heat conducting member further comprises a mounting portion, the mounting portion is arranged at least one end of the heat conducting column, the fins extend to the mounting portion and are connected with the mounting portion, and the mounting portion is used for connecting with the heat dissipation boss.

13. The domain controller of claim 12, wherein, The mounting portion is disc-shaped and protrudes outwardly along the radial direction of the heat conducting column.

14. The domain controller of claim 13, wherein, The mounting portion comprises a first mounting portion and a second mounting portion, the first mounting portion and the second mounting portion are arranged at both ends of the heat conducting column, the first mounting portion is arranged in the mounting cavity, and the second mounting portion is exposed to the mounting cavity.

15. The domain controller of any one of claims 4 to 14, wherein, The heat dissipation assembly further comprises an air compressor for providing compressed gas at the first temperature to the vortex tube.

16. The domain controller of claim 15, wherein, The heat dissipation assembly further comprises a controller configured to control a rotational speed of the air compressor as a function of a power of the domain controller, such that the rotational speed of the air compressor is increased with an increase in the power of the domain controller and / or the rotational speed of the air compressor is decreased with a decrease in the power of the domain controller.

17. A vehicle characterized by comprising: A heat dissipation assembly according to any one of claims 1 to 3 or a domain controller according to any one of claims 4 to 16.

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