Circuit board surface mounting device

Abstract

The utility model discloses a circuit board mounting device, which relates to the technical field of circuit board mounting and comprises a machine body, a processing groove is arranged in the middle of the machine body, a transmission assembly is arranged in the middle of the processing groove, a sucker is arranged at the bottom of the transmission assembly, and the sucker comprises a base and a cover plate. When the device is used, a negative pressure environment is formed in the cavity through the negative pressure pipe in a mode of externally connecting a vacuum pump, and a vacuum area is generated between the suction nozzle below and an element needing to be grabbed, so that enough suction force is generated to stably adsorb the element, and when an element with a small size is adsorbed, the element can be stably grabbed. The arc-shaped baffle is driven by the electric push rod to move along the arc-shaped sliding groove to block the corresponding through hole, so that negative pressure cannot be formed in the closed area, the suction nozzle in the area loses the corresponding adsorption capacity, and sealing of the corresponding through hole is canceled when an element with a large size is adsorbed. The suction cup can be used for sucking and pasting elements with different sizes, and the suction nozzle does not need to be replaced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board mounting technology, and in particular to a circuit board mounting device. Background Technology

[0002] A pick-and-place machine, also known as a surface mount system, is installed after a dispensing machine or screen printer in a production line. Users can select the appropriate nozzle according to the size of the circuit board to be mounted. The nozzle of the pick-and-place machine picks up the components to be mounted from the feeder through vacuum suction or mechanical clamping, and then moves the mounting head to accurately place the surface mount components on the pads of the printed circuit board.

[0003] However, in the existing technology, during the use of pick-and-place machines, due to the different circuit boards to be placed and the different sizes, shapes and weights of the components, it is necessary to change the corresponding nozzles. When changing the nozzle, the operator must stop the machine and change to a nozzle suitable for the current component size. This process is not only time-consuming, but also interrupts the continuity of the production process, resulting in a decrease in overall production efficiency. In addition, after each nozzle change, it may be necessary to recalibrate the machine parameters to ensure placement accuracy, which will further increase non-production time, thus having certain limitations. Utility Model Content

[0004] The purpose of this invention is to solve the problems existing in the technology of chip mounters. During use, different circuit boards need to be mounted, and the components to be mounted also have different sizes, shapes and weights. Therefore, it is necessary to change the corresponding nozzle. When changing the nozzle, the operator must stop the machine and change the nozzle to one suitable for the current component size. This process is not only time-consuming, but also interrupts the continuity of the production process, resulting in a decrease in overall production efficiency. Therefore, a circuit board mounting device is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a circuit board mounting device, comprising a body, a processing groove in the middle of the body, a transmission assembly in the middle of the processing groove, a suction cup at the bottom of the transmission assembly, the suction cup comprising a base and a cover plate, the cover plate being fixedly installed on the upper end of the base, negative pressure pipes being fixedly connected to both sides of the middle of the cover plate, the negative pressure pipes being connected to the base, a plurality of suction nozzles being evenly fixedly installed at the lower end of the negative pressure pipes, a plurality of partitions being evenly fixedly installed in the middle of the base, a cavity being formed between the plurality of partitions, a through hole being opened on one side of each of the plurality of partitions, an arc-shaped sliding groove being opened above and below the middle of one end of the through hole, an arc-shaped baffle being slidably engaged on the surface of the arc-shaped sliding groove, an electric push rod being fixedly installed on one side of each partition, the output end of the electric push rod being fixedly connected to the arc-shaped baffle, and the plurality of cavities being connected in series.

[0006] Preferably, the transmission assembly includes a hollow slide plate and an electric lead screw. The electric lead screw is threaded to one end of the hollow slide plate, the hollow slide plate is slidably engaged with one side of the upper end of the processing groove, and the electric lead screw is rotatably connected between the two sides of the upper end of the processing groove.

[0007] Preferably, a bottom fixing plate is fixedly installed at the lower end of the processing groove.

[0008] Preferably, a linear motor is slidably connected to the middle of the hollow sliding plate, and a cylinder is fixedly installed at the lower end of the linear motor, with one end of the cylinder being fixedly connected to a suction cup.

[0009] Preferably, one end of the processing groove is rotatably connected to a glass baffle via a hinge.

[0010] Preferably, a control box is fixedly installed in the middle of one end of the machine body, and a display screen is fixedly installed above the middle of one end of the machine body.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0012] 1. In this utility model, during use, an external vacuum pump is used to create a negative pressure environment inside the cavity through a negative pressure pipe, creating a vacuum area between the suction nozzle below and the component to be gripped. This generates sufficient suction force to stably adsorb the component. When adsorbing smaller components, an external device drives an electric push rod to move an arc-shaped baffle along an arc-shaped groove, thereby sealing the corresponding through hole. This prevents the formation of negative pressure in the sealed area inside the cavity, causing the suction nozzle in that area to lose its adsorption capacity. When adsorbing larger components, the sealing of the corresponding through hole can be removed. This suction cup can adsorb and attach components of different sizes without replacing the suction nozzle, making it more practical.

[0013] 2. In this utility model, the surface of the bottom fixing plate is provided with multiple grooves for placing the circuit board to be mounted, which facilitates the positioning of the operator and enables the device to be mounted manually. Attached Figure Description

[0014] Figure 1 This utility model provides a first three-dimensional structural schematic diagram of a circuit board mounting device;

[0015] Figure 2 This utility model provides a second three-dimensional structural schematic diagram of a circuit board mounting device;

[0016] Figure 3 This utility model provides a three-dimensional structural diagram of the transmission component of a circuit board mounting device;

[0017] Figure 4This utility model provides a schematic diagram of the internal structure of the base of a circuit board mounting device;

[0018] Figure 5 This utility model provides a schematic diagram of the cross-sectional structure of a suction cup for a circuit board mounting device.

[0019] Legend: 1. Machine body; 11. Display screen; 12. Control box; 13. Glass baffle; 14. Processing groove; 15. Bottom fixing plate; 16. Electric lead screw; 17. Hollow sliding plate; 18. Linear motor; 19. Cylinder; 20. Transmission assembly; 2. Suction cup; 21. Base; 22. Cover plate; 23. Negative pressure pipe; 24. Partition; 25. Cavity; 26. Suction nozzle; 27. Through hole; 28. Arc-shaped slide; 29. ​​Arc-shaped baffle; 30. Electric push rod. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Example 1, as Figure 1-5 As shown, this utility model provides a circuit board mounting device, including a body 1. A processing groove 14 is formed in the middle of the body 1. A transmission assembly 20 is provided in the middle of the processing groove 14. A suction cup 2 is provided at the bottom of the transmission assembly 20. The suction cup 2 includes a base 21 and a cover plate 22. The cover plate 22 is fixedly installed on the upper end of the base 21. Negative pressure pipes 23 are fixedly connected to both sides of the middle of the cover plate 22. The negative pressure pipes 23 are connected to the base 21. Multiple... A suction nozzle 26 and a base 21 are each uniformly fixedly installed with multiple partitions 24 in the middle. A cavity 25 is formed between the multiple partitions 24. A through hole 27 is opened on one side of each of the multiple partitions 24. An arc-shaped groove 28 is opened at the upper and lower parts of the middle of one end of the through hole 27. An arc-shaped baffle 29 is slidably engaged on the surface of the arc-shaped groove 28. An electric push rod 30 is fixedly installed on one side of each partition 24. The output end of the electric push rod 30 is fixedly connected to the arc-shaped baffle 29. The multiple cavities 25 are connected in series.

[0023] The specific settings and functions of this embodiment are described in detail below. During use, a negative pressure environment is created inside the cavity 25 by connecting an external vacuum pump through the negative pressure pipe 23. This creates a vacuum area between the suction nozzle 26 below and the component to be gripped, thereby generating sufficient suction to stably adsorb the component. When adsorbing smaller components, an external device drives the electric push rod 30 to move the arc-shaped baffle 29 along the arc-shaped slide groove 28, thereby blocking the corresponding through hole 27. Since the multiple cavities 25 are connected in series, the area inside the sealed cavity 25 cannot form a negative pressure, and the suction nozzle 26 in that area will lose its corresponding adsorption capacity. When adsorbing larger components, the sealing of the corresponding through hole 27 can be removed. This suction cup 2 can adsorb and attach components of different sizes, and the clamping range can be adjusted quickly, making it more practical.

[0024] Example 2, as Figure 1 , Figure 2 and Figure 3 As shown, the transmission assembly 20 includes a hollow slide plate 17 and an electric lead screw 16. The electric lead screw 16 is threaded to one end of the hollow slide plate 17. The hollow slide plate 17 is slidably engaged with one side of the upper end of the processing groove 14. The electric lead screw 16 is rotatably connected between the two sides of the upper end of the processing groove 14. A bottom fixing plate 15 is fixedly installed at the lower end of the processing groove 14. A linear motor 18 is slidably engaged in the middle of the hollow slide plate 17. A cylinder 19 is fixedly installed at the lower end of the linear motor 18. One end of the cylinder 19 is fixedly connected to the suction cup 2. A glass baffle 13 is rotatably connected to one end of the processing groove 14 via a hinge. A control box 12 is fixedly installed in the middle of one end of the machine body 1. A display screen 11 is fixedly installed above the middle of one end of the machine body 1.

[0025] The overall effect of this embodiment is that, during processing, the circuit board to be mounted is first placed into the groove opened in the bottom fixing plate 15, and then the glass baffle 13 is closed. The device is controlled by the control box 12. The transmission component 20, in conjunction with the linear motor 18 and the cylinder 19, can adjust the position of the lower suction cup 2, facilitating the mounting of circuit boards at different positions. The suction nozzle 26 below the suction cup 2 can be used to adsorb the component to be mounted. The suction cup 2, through an external vacuum pump and a negative pressure pipe 23, creates a negative pressure environment inside the cavity 25, so that the lower suction nozzle 26 and the component to be gripped are in close contact. The suction cup 2 creates an empty area, thus generating sufficient suction to stably adsorb components. When adsorbing smaller components, an external device drives the electric push rod 30 to move the arc-shaped baffle 29 along the arc-shaped slide groove 28, thereby blocking the corresponding through hole 27. Since the multiple cavities 25 are connected in series, the area inside the sealed cavity 25 cannot form a negative pressure, and the suction nozzle 26 in that area will lose its corresponding adsorption capacity. When adsorbing larger components, the sealing of the corresponding through hole 27 can be removed. This suction cup 2 can adsorb and attach components of different sizes without changing the suction nozzle, and has higher practicality.

[0026] The device's operation and working principle are as follows: During processing, the circuit board to be mounted is first placed into the groove in the bottom fixing plate 15. Then, the glass baffle 13 is closed. The device is controlled by the control box 12. The transmission component 20, in conjunction with the linear motor 18 and the cylinder 19, can adjust the position of the lower suction cup 2, facilitating the mounting of circuit boards at different positions. The suction nozzle 26 below the suction cup 2 can adsorb the component to be mounted. The suction cup 2, through an external vacuum pump and negative pressure pipe 23, creates a negative pressure environment inside the cavity 25, generating a vacuum area between the lower suction nozzle 26 and the component to be gripped, thereby producing sufficient... Sufficient suction force is used to stably adsorb components. When adsorbing smaller components, an external device drives the electric push rod 30 to move the arc-shaped baffle 29 along the arc-shaped slide groove 28, thereby blocking the corresponding through hole 27. Since the multiple cavities 25 are connected in series, the area inside the sealed cavity 25 cannot form a negative pressure, and the suction nozzle 26 in that area will lose its corresponding adsorption capacity. When adsorbing larger components, the sealing of the corresponding through hole 27 can be removed. This suction cup 2 can adsorb and attach components of different sizes without frequent nozzle replacement. It has short downtime and higher practicality.

[0027] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A circuit board patching device, comprising a body (1), a processing groove (14) is formed in the middle of the body (1), a transmission assembly (20) is arranged in the middle of the processing groove (14), and a suction cup (2) is arranged at the bottom of the transmission assembly (20), characterized in that: The suction cup (2) comprises a base (21) and a cover plate (22), the cover plate (22) is fixedly installed at the upper end of the base (21), negative pressure pipes (23) are fixedly communicated on both sides of the middle part of the cover plate (22), the negative pressure pipes (23) are communicated with the base (21), a plurality of suction nozzles (26) are fixedly installed at the lower end of the negative pressure pipe (23), a plurality of partition plates (24) are fixedly installed at the middle part of the base (21), cavities (25) are formed between the plurality of partition plates (24), a through hole (27) is formed on one side of the plurality of partition plates (24), arc-shaped sliding grooves (28) are formed on the upper and lower sides of the middle part of one end of the through hole (27), arc-shaped baffles (29) are slidably connected to the surfaces of the arc-shaped sliding grooves (28), electric push rods (30) are fixedly installed on one side of the partition plates (24), the output ends of the electric push rods (30) are fixedly connected with the arc-shaped baffles (29), and the cavities (25) are connected in series.

2. A circuit board paster according to claim 1, wherein: The transmission assembly (20) comprises a hollow sliding plate (17) and an electric screw rod (16), the electric screw rod (16) is threadedly connected with one end of the hollow sliding plate (17), the hollow sliding plate (17) is slidably connected with one side of the upper end of the machining groove (14), and the electric screw rod (16) is rotatably connected between the two sides of the upper end of the machining groove (14).

3. A circuit board paster according to claim 2, wherein: The lower end of the machining groove (14) is fixedly installed with a bottom fixed plate (15).

4. A circuit board taping device according to claim 3, wherein: The middle part of the hollow sliding plate (17) is slidably connected with a linear motor (18), the lower end of the linear motor (18) is fixedly installed with an air cylinder (19), and the air cylinder (19) is fixedly connected between one end and the suction cup (2).

5. The circuit board paster of claim 1, wherein: One end of the machining groove (14) is rotatably connected with a glass baffle (13) through a hinge.

6. The circuit board paster of claim 1, wherein: The middle part of one end of the fuselage (1) is fixedly installed with a control box (12), and the upper side of the middle part of one end of the fuselage (1) is fixedly installed with a display screen (11).

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