LED support, LED lamp bead and electronic equipment

Abstract

The utility model provides an LED support, LED bead and electronic equipment, the LED support comprises a substrate, a sapphire layer and a BT layer, one side of the substrate is provided with a metal coating, one side of the substrate facing the metal coating is connected with the sapphire layer, the sapphire layer wraps the metal coating, one side of the sapphire layer back to the substrate is connected with the BT layer and a plurality of LED chips, the BT layer is provided with an accommodating groove, and the BT layer is provided with a plurality of LED chips. The containing groove penetrates through the BT layer, the LED chips are all located in the containing groove, a bonding pad and a box dam are arranged on the face, back to the sapphire layer, of the BT layer, and the box dam wraps the bonding pad. The sapphire layer is arranged, the metal coating is coated by using the characteristic of high corrosion resistance of sapphire, so that the advantage of improving the air tightness of the metal coating is achieved, and the reflectivity of the metal coating can be effectively prevented from being reduced due to oxidation, vulcanization and moisture by adopting a simple and easy-to-process structure; a lamp bead prepared by the LED support has the advantages of being easy to process, good in lighting effect and high in reliability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an LED bracket, LED beads, and electronic equipment. Background Technology

[0002] With the development of LED technology, LEDs are widely used in various fields. Since the usage environment varies in different fields, the reliability of LEDs is of paramount importance.

[0003] To improve luminous efficacy, LED chips commonly employ metal plating to increase the reflectivity of the substrate surface. However, in environments with high temperatures, humidity, or corrosive gases, the substrate plating is easily corroded, leading to a decrease in product brightness. Therefore, the airtightness of the LED bracket and package directly affects the product's performance and reliability.

[0004] Existing LED brackets typically use a bracket cup combined with fluorescent adhesive for encapsulation. However, the main component of fluorescent adhesive is silicone, which has pores on its surface. Gaseous water, corrosive gases, etc., can enter the functional area through the pores of the fluorescent adhesive or the gaps in the bracket, easily leading to corrosion of the electroplated metal layer. Improving the airtightness of the bracket and encapsulation usually involves changing the number of bracket layers, the bonding method of the pads, and the detailed structure. The processing is relatively complex, and there is a lack of specificity in improving airtightness. The protection efficiency of the electroplated metal layer is low, which can easily affect the reflective performance of the substrate surface. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an LED bracket, LED beads and electronic equipment, which aims to solve the problem of the lack of targeted protection for the airtightness of metal coatings in the prior art.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0007] An LED support includes a substrate, a sapphire layer, and a BT layer. A metal plating layer is disposed on one side of the substrate. The sapphire layer is connected to the side of the substrate facing the metal plating layer and covers the metal plating layer. The BT layer and a plurality of LED chips are connected to the side of the sapphire layer facing away from the substrate. A receiving groove is formed on the BT layer, the receiving groove penetrates the BT layer, and the plurality of LED chips are located in the receiving groove. A pad and a dam are disposed on the side of the BT layer facing away from the sapphire layer, and the dam covers the side of the pad facing away from the BT layer.

[0008] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting the sapphire layer and utilizing the strong corrosion resistance of sapphire to cover the metal coating, the airtightness of the metal coating is improved. The simple and easy-to-process structure can effectively prevent the metal coating from losing reflectivity due to oxidation, sulfidation, and moisture, thus preventing the product's lamp bead luminous efficiency from deteriorating. At the same time, the packaging process does not need to be changed, the sapphire layer has good light transmission performance, and the lamp beads made by the LED bracket have the advantages of easy processing, good luminous efficiency, and high reliability.

[0009] Furthermore, the size of the sapphire layer is adapted to the size of the substrate.

[0010] Furthermore, the LED chip is provided with a plurality of leads, the end of which is away from the LED chip and connected to the pad or an adjacent LED chip.

[0011] Furthermore, the projection of the dam onto the BT layer is annular, and the dam encloses and forms a receiving cavity.

[0012] Furthermore, fluorescent colloid is disposed in both the receiving groove and the receiving cavity, and the fluorescent colloid covers a plurality of the LED chips and a plurality of the leads.

[0013] Furthermore, the pad includes a first sub-pad and a second sub-pad, both of which are semi-circular in shape.

[0014] An LED light bead includes an LED bracket as described in the above technical solution.

[0015] An electronic device includes LED beads as described in the above technical solution. Attached Figure Description

[0016] Figure 1 This is a partial structural diagram of the LED bracket in an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram of the LED bracket in an embodiment of the present invention;

[0018] Explanation of key component symbols:

[0019]

[0020]

[0021] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0022] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0023] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] Please see Figure 1 and Figure 2 The LED bracket in this embodiment of the present invention includes a substrate 100, a sapphire layer 200, and a BT layer 300. A metal plating layer is disposed on one side of the substrate 100. The sapphire layer 200 is connected to the side of the substrate 100 facing the metal plating layer. The sapphire layer 200 covers the metal plating layer, and the size of the sapphire layer 200 is adapted to the size of the substrate 100. Preferably, the sapphire layer 200 is cut according to the size of the substrate 100 and bonded to the substrate 100 with adhesive. Understandably, the metal plating layer on the surface of the substrate 100 is relatively thin, serving to reflect light and improve light brightness. The sapphire layer 200 has strong corrosion resistance and high light transmittance. When covering the substrate 100, it ensures the high reflectivity of the metal plating layer. Simultaneously, it improves the airtightness of the metal plating layer, effectively protecting it and preventing corrosion and reduced reflectivity caused by external moisture and corrosive gases.

[0026] The sapphire layer 200, facing away from the substrate 100, is connected to the BT layer 300 and a plurality of LED chips 210. A receiving groove 301 is formed on the BT layer 300, and the receiving groove 301 penetrates the BT layer 300. The plurality of LED chips 210 are all located in the receiving groove 301. A pad 310 and a dam 400 are provided on the side of the BT layer 300 facing away from the sapphire layer 200. The dam 400 covers the side of the pad 310 facing away from the BT layer 300. A plurality of leads 220 are provided on the LED chip 210. The end of the lead 220 away from the LED chip 210 is connected to the pad 310 or an adjacent LED chip 210. Preferably, the receiving groove 301 is formed by making a circular through hole on the BT layer 300, the BT layer 300 is pressed onto the sapphire layer 200, and the dam 400 is formed by covering the solder pad 310 with dam adhesive and baking to cure, so as to obtain a bowl-shaped structure.

[0027] The pad 310 includes a first sub-pad and a second sub-pad, both of which are semi-circular. The projection of the dam 400 onto the BT layer 300 is annular, and the dam 400 encloses a receiving cavity 401. Phosphor colloid 500 is disposed within both the receiving groove 301 and the receiving cavity 401. The phosphor colloid 500 encapsulates several LED chips 210 and several leads 220. Preferably, the phosphor colloid 500 is formed by adding the phosphor colloid to the functional area of ​​the cup and baking and curing it. It is understood that the process of forming the phosphor colloid encapsulation is consistent with existing technologies, is simple and low-cost, and does not increase production processing steps. The LED beads prepared by the LED bracket have the advantages of easy processing, good luminous efficiency, high airtightness, and high reliability.

[0028] This utility model embodiment also provides an LED lamp bead, which includes the LED bracket as described in the above embodiment.

[0029] This utility model embodiment also provides an electronic device, which includes LED beads as described in the above embodiments.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An LED holder, characterized by, The LED support comprises a substrate, a sapphire layer and a BT layer, one side of the substrate is provided with a metal plating layer, the side of the substrate facing the metal plating layer is connected with the sapphire layer, the sapphire layer covers the metal plating layer, the side of the sapphire layer away from the substrate is connected with the BT layer and a plurality of LED chips, the BT layer is provided with a receiving groove, the receiving groove penetrates through the BT layer, the plurality of LED chips are located in the receiving groove, the side of the BT layer away from the sapphire layer is provided with a solder pad and a dam, the dam covers the side of the solder pad away from the BT layer.

2. The LED support of claim 1, wherein, The size of the sapphire layer is adapted to the size of the substrate.

3. The LED support of claim 1, wherein, A plurality of lead wires are arranged on the LED chip, one end of the lead wire away from the LED chip is connected with the solder pad or the adjacent LED chip.

4. The LED support of claim 3, wherein, The projection of the dam on the BT layer is annular, and the dam forms a receiving cavity.

5. The LED support of claim 4, wherein, The receiving groove and the receiving cavity are both provided with fluorescent colloids, and the fluorescent colloids cover the plurality of LED chips and the plurality of lead wires.

6. The LED support of claim 5, wherein, The solder pad comprises a first sub-solder pad and a second sub-solder pad, and the first solder pad and the second solder pad are both in the shape of a half circular ring.

7. An LED lamp bead, characterized in that, The LED support comprises the LED support according to any one of claims 1-6.

8. An electronic device, comprising: The LED lamp bead comprises the LED support according to claim 7.

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