Light-emitting device

Abstract

The utility model relates to the technical field of light-emitting devices, and discloses a light-emitting device which comprises a device support, and a bowl-shaped cup is arranged on the front face of the device support. The bowl-shaped cup is filled with a packaging layer; a lens layer is arranged above a cup opening of the bowl-shaped cup, the lens layer is pressed on the packaging layer, and the lens layer is hemispherical; a concave ring is arranged at the edge of a cup opening of the bowl-shaped cup, and the packaging layer is filled in the concave ring; the top surface of the packaging layer protrudes out of the cup opening of the bowl-shaped cup to form a convex surface; or the top surface of the packaging layer is flush with the cup opening of the bowl-shaped cup; or the top surface of the packaging layer is recessed at the cup opening of the bowl-shaped cup to form a concave surface. According to the utility model, the laminated structure of the packaging layer and the lens layer is arranged, the thickness of the lens layer can be controlled by controlling the dispensing amount of the lens layer, the light-emitting angle and the light-emitting brightness of the device are further controlled, and a better display effect is realized while the structural consistency and stability of the device are improved.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting device technology, and in particular to a light-emitting device. Background Technology

[0002] Currently, in certain specific display scenarios, such as streetlights, billboards, and product booths, high brightness is required to highlight the display effect. Since the application environment is mostly outdoors, higher structural consistency and stability are required. However, conventional LEDs have a relatively single light emission angle, which cannot focus the overall brightness on a certain area. Therefore, the brightness is insufficient and cannot be adjusted, resulting in poor adaptability. They also lack structural stability design and cannot meet the brightness and stability requirements of specific display scenarios, resulting in poor display effects. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a light-emitting device with an encapsulation layer and a lens layer stacked on a bowl-shaped cup on the front of the device support. The encapsulation layer fills the concave ring at the edge of the bowl-shaped cup. The thickness of the lens layer can be controlled by controlling the amount of adhesive applied to the lens layer, thereby controlling the light emission angle and brightness of the device. While improving the consistency and stability of the device structure, it can adapt to specific display scenarios with different light emission requirements and achieve better display effects.

[0004] This utility model provides a light-emitting device, which includes a device support and a bowl-shaped cup is provided on the front side of the device support;

[0005] The bowl-shaped cup is filled with an encapsulation layer;

[0006] A lens layer is provided above the rim of the bowl-shaped cup, and the lens layer is pressed onto the encapsulation layer. The lens layer is hemispherical.

[0007] The rim of the bowl-shaped cup is provided with a concave ring, and the encapsulation layer is filled in the concave ring;

[0008] The top surface of the encapsulation layer protrudes from the rim of the bowl-shaped cup to form a convex surface;

[0009] Or the top surface of the encapsulation layer is flush with the rim of the bowl-shaped cup;

[0010] Alternatively, the top surface of the encapsulation layer may be recessed into the rim of the bowl-shaped cup to form a concave surface.

[0011] Furthermore, the center point of the top surface of the encapsulation layer is aligned vertically with the center point of the cup rim plane of the bowl-shaped cup.

[0012] Furthermore, the height from the center point of the top surface of the encapsulation layer to the bottom of the bowl-shaped cup is... The vertical height from the rim of the bowl-shaped cup to the bottom of the bowl-shaped cup is , and The relationship is: .

[0013] Furthermore, the encapsulation layer is made of epoxy resin or silicone.

[0014] The lens layer is made of epoxy resin or silicone.

[0015] Furthermore, the viscosity of the lens layer material is greater than that of the encapsulation layer material.

[0016] Furthermore, the vertical height from the highest point of the top surface of the lens layer to the bottom surface of the lens layer The range of values ​​for is: 0 < <1000um.

[0017] Furthermore, ink is provided between the rim of the bowl-shaped cup and the edge of the device support.

[0018] Furthermore, the bottom of the bowl-shaped cup is provided with a light-emitting chip, which is arranged in a straight line or in a triangular pattern.

[0019] Furthermore, the spacing between any two adjacent light-emitting chips can range from 40um to 55um.

[0020] This invention provides a light-emitting device with an encapsulation layer and a lens layer stacked on a bowl-shaped cup on the front of the device support. The top surface of the encapsulation layer is convex, planar, or concave. The thickness of the lens layer (i.e., the vertical distance from the highest point of the top surface of the lens layer to the bottom surface of the lens layer) can be controlled by adjusting the amount of adhesive applied to the lens layer, thereby controlling the light emission angle and brightness of the device to adapt to specific display scenarios with different light emission requirements and achieve better display effects. A concave ring is provided at the edge of the bowl-shaped cup and filled with the encapsulation layer to improve the bonding force between the encapsulation layer and the bowl-shaped cup, enhancing the consistency and stability of the device. Ink is applied between the rim of the bowl-shaped cup and the edge of the device support to prevent adhesive overflow and improve the consistency of the device. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1This is a schematic diagram of the light-emitting device structure in an embodiment of this utility model;

[0023] Figure 2 This is a cross-sectional schematic diagram of the light-emitting device structure in an embodiment of this utility model;

[0024] Figure 3 This is a top view schematic diagram of the light-emitting device structure in an embodiment of this utility model. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] In this invention, it should be understood that terms such as “comprising” or “having” are intended to indicate the presence of features, figures, steps, actions, components, portions or combinations thereof disclosed in this specification, and are not intended to exclude the possibility of the presence or addition of one or more other features, figures, steps, actions, components, portions or combinations thereof.

[0027] It should also be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] This utility model embodiment provides a light-emitting device, the light-emitting device includes a device support, and a bowl-shaped cup is provided on the front side of the device support;

[0029] The bowl-shaped cup is filled with an encapsulation layer;

[0030] A lens layer is provided above the rim of the bowl-shaped cup, and the lens layer is pressed onto the encapsulation layer. The lens layer is hemispherical.

[0031] The rim of the bowl-shaped cup is provided with a concave ring, and the encapsulation layer is filled in the concave ring;

[0032] The top surface of the encapsulation layer protrudes from the rim of the bowl-shaped cup to form a convex surface;

[0033] Or the top surface of the encapsulation layer is flush with the rim of the bowl-shaped cup;

[0034] Alternatively, the top surface of the encapsulation layer may be recessed into the rim of the bowl-shaped cup to form a concave surface.

[0035] In one optional implementation of this embodiment, such as Figure 1As shown, Figure 1 A schematic diagram of the structure of the light-emitting device in an embodiment of the present invention is shown. The light-emitting device includes a device support 1, and a bowl-shaped cup 2 is provided on the front side of the device support 1.

[0036] Specifically, the bowl-shaped cup 2 has a cup-shaped structure that is wider at the top and narrower at the bottom, with an opening on the top surface, and is located in the central area of ​​the front side of the device support 1.

[0037] In an optional implementation of this embodiment, the bowl-shaped cup 2 is filled with an encapsulation layer 3.

[0038] Specifically, such as Figure 2 As shown, Figure 2 A cross-sectional schematic diagram of the light-emitting device structure in an embodiment of the present invention is shown. The wall space inside the bowl-shaped cup 2 is completely filled with encapsulating adhesive, forming an encapsulation layer 3.

[0039] Furthermore, the top surface of the encapsulation layer protrudes from the rim of the bowl-shaped cup to form a convex surface;

[0040] Or the top surface of the encapsulation layer is flush with the rim of the bowl-shaped cup;

[0041] Alternatively, the top surface of the encapsulation layer may be recessed into the rim of the bowl-shaped cup to form a concave surface.

[0042] Specifically, the top surface of the encapsulation layer can be set as a convex surface, a flat surface, or a concave surface according to actual design requirements. In this embodiment, the top surface of the encapsulation layer 3 protrudes from the plane where the mouth of the bowl-shaped cup 2 is located, forming a micro-convex surface.

[0043] Furthermore, the encapsulation layer 3 is formed based on a dispensing process, by dispensing adhesive into the cavity space inside the bowl-shaped cup 2, and then hardening it to form the encapsulation layer 3.

[0044] In an optional implementation of this embodiment, the center point of the top surface of the encapsulation layer 3 is aligned vertically with the center point of the cup rim plane of the bowl-shaped cup 2.

[0045] Specifically, the center point of the convex, flat, or concave surface formed by the top surface of the encapsulation layer 3 is located directly above or below the center point of the cup rim plane of the bowl-shaped cup 2, or coincides with the center point of the cup rim plane of the bowl-shaped cup 2.

[0046] In an optional implementation of this embodiment, the height from the center point of the top surface of the encapsulation layer 3 to the bottom of the bowl-shaped cup 2 is... The vertical height from the rim of the bowl-shaped cup 2 to the bottom of the bowl-shaped cup 2 is , and The relationship is: .

[0047] Specifically, here and The amount of adhesive dispensed to form the encapsulation layer 3 is controlled by adjusting the amount of adhesive dispensed. The amount of adhesive applied to form the two bowl-shaped cups and the deep flat cups is... 105%-110%, that is When using dispensing amount When the encapsulation layer 3 is formed by dispensing adhesive, the height from the highest point of the top surface of the encapsulation layer 3 to the bottom of the bowl-shaped cup 2 is... To determine the amount of adhesive used The height of the encapsulation body of the bowl-shaped cup 2 is the vertical height from the rim of the bowl-shaped cup 2 to the bottom of the bowl-shaped cup 2. 105%-110%, that is .

[0048] Specifically, in this embodiment, the amount of adhesive dispensed to form the encapsulation layer 3 is... It is 1.5ul.

[0049] Here, by setting the amount of adhesive applied to the encapsulation layer 3, the top surface of the encapsulation layer 3 can be made to form a slightly convex, planar, or slightly concave structure, thereby optimizing the focusing of the device's light emission, optimizing the light emission angle, and improving the light emission quality.

[0050] In an optional implementation of this embodiment, a lens layer 4 is provided above the rim of the bowl-shaped cup 2, and the lens layer 4 is pressed onto the encapsulation layer 3. The lens layer 4 is hemispherical.

[0051] Specifically, a lens layer 4 is provided above the rim of the bowl-shaped cup 2, the bottom surface of the lens layer 4 is pressed against the top surface of the encapsulation layer 3, and the lens layer 4 is hemispherical.

[0052] In an optional implementation of this embodiment, the vertical height from the highest point of the top surface of the lens layer to the bottom surface of the lens layer is... The range of values ​​for is: 0 < <1000um.

[0053] Specifically, the lens layer 4 is formed using a dispensing process. Adhesive is dispensed onto the top surface of the encapsulation layer 3, and after curing, the lens layer 4 is formed. The thickness of the lens layer 4 is the vertical distance from the highest point of its top surface to its bottom surface. With the amount of adhesive applied to the lens layer 4 It increases with the increase of [something].

[0054] More importantly, in this embodiment, the high The possible values ​​are 302um, 409um, 459um, 548um, 645um, 692um, 807um, and 870um, which are determined according to the actual design requirements.

[0055] Furthermore, considering that the precise brightness and light emission angle requirements still vary in different display scenarios with high brightness requirements, this embodiment can control the amount of adhesive applied to form the lens layer 4. This allows for the control of the thickness of the lens layer 4, ultimately controlling the changes in the brightness and light emission angle of the device caused by the lens layer 4.

[0056] When the amount of adhesive applied to the lens layer 4 When the thickness is greater, the thickness of the lens layer 4, that is, the vertical height from the highest point of the top surface of the lens layer 4 to the bottom surface of the lens layer 4, is increased. The larger the size, the brighter the device and the narrower the light emission angle.

[0057] Specifically, compared with conventional light-emitting devices without a lens layer, this embodiment tests the light emission performance of light-emitting devices with lens layers formed by dispensing 1.2ul, 1.4ul, 1.6ul, 1.8ul, 2.0ul, 2.2ul, 2.4ul, and 2.6ul of adhesive. The test conditions include: a test current of RGB = 15mA-8mA-5mA, a light emission angle range of 45°-100°, and a brightness range of 800mcd ≤ brightness R ≤ 1200 mcd, 1200mcd ≤ brightness G ≤ 2400 mcd, and 150mcd ≤ brightness B ≤ 280mcd.

[0058] The test results are shown in Table 1:

[0059] Table 1

[0060] Test current: RGB = 15-8-5mA

[0061]

[0062] In conventional light-emitting devices without a formed lens layer, the brightness is a baseline value, and the light emission angle of the red, green, and blue light-emitting chips is 110°.

[0063] When the amount of adhesive used to form the lens layer 4 At 1.2ul, the height The brightness of the red light chip R is 162% of the original brightness and the light emission angle is 94°, while the brightness of the green light chip G is 138% of the original brightness and the light emission angle is 93°. The brightness of the blue light chip B is 126% of the original brightness and the light emission angle is 91°.

[0064] When the amount of adhesive used to form the lens layer 4 At 1.4ul, the height The brightness of the red light chip R is 158% of the original brightness, and the light emission angle is 85°. The brightness of the green light chip G is 157% of the original brightness, and the light emission angle is 83°. The brightness of the blue light chip B is 141% of the original brightness, and the light emission angle is 84°.

[0065] When the amount of adhesive used to form the lens layer 4 At 1.6ul, the height The brightness of the red light chip R is 184% of the original brightness, and the light emission angle is 77°. The brightness of the green light chip G is 165% of the original brightness, and the light emission angle is 79°. The brightness of the blue light chip B is 148% of the original brightness, and the light emission angle is 78°.

[0066] When the amount of adhesive used to form the lens layer 4 At 1.8ul, the height The brightness of the red light chip R is 181.8% of the original brightness, with a light emission angle of 74°. The brightness of the green light chip G is 178% of the original brightness, with a light emission angle of 71°. The brightness of the blue light chip B is 145.2% of the original brightness, with a light emission angle of 79°.

[0067] When the amount of adhesive used to form the lens layer 4 At 2.0ul, the height The brightness of the red light chip R is 193.3% of the original brightness, and the light emission angle is 66°. The brightness of the green light chip G is 193.3% of the original brightness, and the light emission angle is 64°. The brightness of the blue light chip B is 160.2% of the original brightness, and the light emission angle is 73°.

[0068] When the amount of adhesive used to form the lens layer 4 At 2.2ul, the height The brightness of the red light chip R is 203.5% of the original brightness, and the light emission angle is 64°. The brightness of the green light chip G is 216.9% of the original brightness, and the light emission angle is 60°. The brightness of the blue light chip B is 172.8% of the original brightness, and the light emission angle is 70°.

[0069] When the amount of adhesive used to form the lens layer 4 At 2.4ul, the height The brightness of the red light chip R is 213.3% of the original brightness, and the light emission angle is 57°. The brightness of the green light chip G is 233.3% of the original brightness, and the light emission angle is 53°. The brightness of the blue light chip B is 191.3% of the original brightness, and the light emission angle is 66°.

[0070] When the amount of adhesive used to form the lens layer 4 At 2.6ul, the height The brightness of the red light chip R is 216.9% of the original brightness, with a light emission angle of 52°. The brightness of the green light chip G is 257% of the original brightness, with a light emission angle of 48°. The brightness of the blue light chip B is 205.3% of the original brightness, with a light emission angle of 65°.

[0071] Therefore, it can be seen that by controlling the amount of adhesive applied to form the lens layer 4... It can achieve different brightness levels and light emission angles to adapt to the needs of different application scenarios and effectively improve the display effect.

[0072] In an optional implementation of this embodiment, the encapsulation layer 3 is made of epoxy resin or silicone.

[0073] The lens layer 4 is made of epoxy resin or silicone.

[0074] Furthermore, the viscosity of the material of the lens layer 4 is greater than that of the material of the encapsulation layer 3.

[0075] Specifically, the viscosity of the epoxy resin in the lens layer 4 is 1.5-2 times that of the epoxy resin in the encapsulation layer 3, and the viscosity of the epoxy resin in the lens layer 4 is approximately 4000-5000 mPa·s.

[0076] Considering the need to form a stacked structure of encapsulation layer 3 and lens layer 4, which are not integrally formed, and that lens layer 4 is not formed within the cup of bowl-shaped cup 2 as encapsulation layer 3, it is necessary to ensure that the viscosity of the epoxy resin material of the later-formed lens layer 4 is greater than that of the epoxy resin material of the earlier-formed encapsulation layer 3. This is to ensure that the lens layer 4 can be quickly hardened and formed on the encapsulation layer 3, thereby improving structural consistency.

[0077] In an optional implementation of this embodiment, the rim of the bowl-shaped cup 2 is provided with a concave ring 5, and the encapsulation layer 3 fills the concave ring 5.

[0078] Specifically, such as Figure 2 and Figure 3 As shown, Figure 3 A top view schematic diagram of the light-emitting device structure in an embodiment of this utility model is shown. Figure 3 The lens layer 4 and the encapsulation layer 3 are hidden in the middle. A concave ring 5 is provided at the edge of the circular mouth of the bowl-shaped cup 2. The concave ring 5 surrounds the mouth of the bowl-shaped cup 2, and the encapsulation layer 3 fills the concave ring 5.

[0079] An indentation ring is set here, and the encapsulation layer is filled in the indentation ring, which can further improve the bonding force between the encapsulation layer and the bowl-shaped cup, and enhance the consistency and stability of the device structure.

[0080] In an optional implementation manner of this embodiment, an ink 6 is provided between the cup mouth of the bowl-shaped cup 2 and the edge of the device bracket 1.

[0081] Specifically, as Figure 3 shown, the shaded area is the set ink 6. The ink 6 is used to prevent the encapsulation layer 3 and the lens layer 4 from overflowing and creeping, and at the same time improve the contrast of the device and the consistency of the device structure.

[0082] In an optional implementation manner of this embodiment, a light-emitting chip 7 is provided at the bottom of the bowl-shaped cup 2, and the light-emitting chips 7 are arranged in a "one" shape or a "pin" shape.

[0083] Specifically, in this embodiment, a total of three light-emitting chips 7 are provided, including a red light chip, a blue light chip and a green light chip, and the three light-emitting chips 7 are arranged in a "one" shape.

[0084] Furthermore, the value range of the distance between any two adjacent light-emitting chips 7 is 40um - 55um.

[0085] Specifically, the value here can be one of 40um, 45um, 50um, 55um, which is determined according to the actual design requirements. Here, the distance between adjacent light-emitting chips 7 needs to be limited so that the light-emitting effect of the light-emitting chips 7 can cooperate with the lens layer 4 to achieve a better light-emitting effect.

[0086] Moreover, the light-emitting chip 7 is a flip-chip, and the light-emitting chip 7 is connected to the pad provided on the bottom of the bowl-shaped cup 2 based on a copper wire or a gold wire with a diameter of 20um - 23um.

[0087] In summary, by setting the encapsulation layer to protect the light-emitting chips and pads in the bowl-shaped cup, and setting the lens layer to control the light-emitting brightness and light-emitting angle of the light-emitting chips, it can adapt to specific display scenarios with different light-emitting requirements and achieve a better display effect.

[0088] In summary, this utility model embodiment provides a light-emitting device. A stacked structure of an encapsulation layer and a lens layer is provided on a bowl-shaped cup on the front side of the device support. The top surface of the encapsulation layer is convex, planar, or concave. The thickness of the lens layer can be controlled by adjusting the amount of adhesive applied to it, thereby controlling the light emission angle and brightness of the device to adapt to specific display scenarios with different light emission requirements and achieve better display effects. A concave ring is provided at the edge of the bowl-shaped cup and filled with the encapsulation layer to improve the bonding force between the encapsulation layer and the bowl-shaped cup, enhancing the consistency and stability of the device. Ink is applied between the rim of the bowl-shaped cup and the edge of the device support to prevent adhesive overflow and improve the consistency of the device.

[0089] The above provides a detailed description of a light-emitting device provided by the embodiments of this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A light emitting device, characterized by, The light-emitting device comprises a device support, a bowl-shaped cup is arranged on the front surface of the device support; The bowl-shaped cup is filled with an encapsulation layer; A lens layer is arranged above the cup opening of the bowl-shaped cup, the lens layer is pressed on the encapsulation layer, and the lens layer is in a semispherical shape; A concave ring is arranged on the cup opening edge of the bowl-shaped cup, and the encapsulation layer is filled in the concave ring; The top surface of the encapsulation layer is convex to form a convex surface at the cup opening of the bowl-shaped cup; Or the top surface of the encapsulation layer is flush with the cup opening of the bowl-shaped cup; Or the top surface of the encapsulation layer is concave to form a concave surface at the cup opening of the bowl-shaped cup.

2. The light emitting device of claim 1, wherein, The center point of the top surface of the encapsulation layer is aligned with the center point of the cup opening plane of the bowl-shaped cup in the vertical direction.

3. The light emitting device of claim 1, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The height from the center point of the top surface of the encapsulation layer to the cup bottom of the bowl cup is The vertical height from the cup opening of the bowl cup to the cup bottom of the bowl cup is , The relationship between and is: .

4. The light emitting device of claim 1, wherein, The material of the encapsulation layer is epoxy resin or silica gel; The material of the lens layer is epoxy resin or silica gel.

5. The light emitting device of claim 1, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The viscosity of the material of the lens layer is greater than that of the material of the encapsulation layer.

6. The light emitting device of claim 1, wherein, vertical height of the top surface of the lens layer to the bottom surface of the lens layer The value range of the vertical height of the top surface of the lens layer to the bottom surface of the lens layer is: 0 < H < 1000 um. The value range of the vertical height of the top surface of the lens layer to the bottom surface of the lens layer is: 0 < H < 100 7. The light emitting device of claim 1, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. Ink is arranged between the cup opening of the bowl-shaped cup and the edge of the device support.

8. The light emitting device of claim 1, wherein, The bottom of the bowl-shaped cup is provided with light-emitting chips, and the light-emitting chips are arranged in a "one" shape or a "product" shape.

9. The light emitting device of claim 8, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The interval of any two adjacent light-emitting chips ranges from 40um to 55um.

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