Wiring structure for wafer processing device and wafer processing device
By designing first and second wiring structures in the wafer processing unit, the problem of messy wires and pipes was solved, and the wiring of electrical and pneumatic control devices was uniformly organized, simplifying the equipment maintenance and repair process.
Patent Information
- Application Number
- CN202422704283.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-11-06
AI Technical Summary
Existing rotary wet scrubbing machines lack a dedicated wiring structure, resulting in messy wiring and air pipe layout, which makes equipment maintenance and repair inconvenient.
Design a wafer processing apparatus including first and second wiring structures, with pipelines for electrical and pneumatic control devices set in different areas of the apparatus, and unified planning and organization of the pipelines achieved through wiring channels and partitions.
It achieves unified organization of electrical and pneumatic control device pipelines, simplifies equipment maintenance and repair processes, and has a simple structure and reasonable layout.
Smart Images
Figure CN223775152U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a wiring structure for a wafer processing device and a wafer processing device. Background Technology
[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to create electronic components with specific electrical functions.
[0003] The SAT / SST rotary wet coating system is an integrated wet drying machine used in semiconductor wafer manufacturing. It can handle wet processes using solvents such as strong acids, strong alkalis, and organic solvents, and is suitable for most wet processes on 2-inch to 12-inch wafers.
[0004] As is well known, rotary jet wet scrubbing machines typically have many electrical and pneumatic control devices, which requires a large number of wires or pipes. Most existing rotary jet wet scrubbing machines do not have dedicated wiring structures for their wires and pipes, resulting in a messy layout that makes subsequent equipment maintenance and repair inconvenient. Utility Model Content
[0005] To address the related technical problems, the purpose of this utility model is to provide a wiring structure for a wafer processing apparatus to solve the problem of inconvenient wiring; in addition, this utility model also provides a wafer processing apparatus including the above-mentioned wiring structure for a wafer processing apparatus.
[0006] To achieve the above objectives, the embodiments of this utility model adopt the following technical solutions:
[0007] A wiring structure for a wafer processing apparatus includes a rack, a first assembly area, a second assembly area, and a third assembly area, wherein:
[0008] The first assembly area is located directly above the second assembly area, and the first assembly area is provided with a processing unit, which is configured to process the wafer according to a preset process.
[0009] The second assembly area is provided with at least a solvent supply unit, which is configured to provide the processing unit with solvent for the processing process.
[0010] The third assembly area is located on the back side of the first assembly area. The third assembly area is configured to install electronic control devices and / or pneumatic control devices. A first wiring structure is provided on the top of the first assembly area. Some of the pipelines of the electronic control devices and / or pneumatic control devices in the third assembly area are introduced into the first assembly area after passing through the first wiring structure.
[0011] A second wiring structure is provided on one side of the first assembly area, and the remaining pipelines of the electronic control devices and / or pneumatic control devices in the third assembly area are introduced into the second assembly area after passing through the second wiring structure.
[0012] The second wiring structure is also equipped with electrical control devices and / or pneumatic control devices. The pipelines of the electrical control devices and / or pneumatic control devices in the second wiring structure are introduced into the second assembly area after passing through the second wiring structure.
[0013] The first wiring structure includes a first wiring channel and a first partition. The first wiring channel is horizontally disposed on the top of the frame and perpendicular to the first partition. The first partition is disposed on the top of the third assembly area, and one end of the first partition is provided with a first wiring hole that connects the first wiring channel and the third assembly area.
[0014] The second wiring structure includes a second partition and a side plate. The second partition is located directly below the first wiring channel. A second wiring hole is provided at one end of the second partition near the first assembly area. The second partition is located on one side of the second partition. The second partition and the side plate are combined to form the second wiring channel.
[0015] A third partition is provided at the bottom of the third assembly area, and a third wire hole is provided at one end of the third partition near the second wiring structure.
[0016] A wafer processing apparatus includes the aforementioned wiring structure for a wafer processing apparatus.
[0017] The beneficial effects of this utility model are as follows: Compared with the prior art, the wiring structure for wafer processing equipment provided by this utility model has the following beneficial effects:
[0018] 1. By setting up a first wiring structure and a second wiring structure, the pipelines of the electrical and pneumatic control devices inside the device are uniformly organized and planned, which facilitates the maintenance and repair of the equipment.
[0019] 2. The second wiring structure allows for the installation of electrical and / or pneumatic control devices, as well as the organization of pipelines. The structure is simple and the layout is reasonable.
[0020] 3. By setting the first wire hole, the second wire hole and the third wire hole, the first assembly area, the second assembly area and the third assembly area are interconnected, which facilitates the arrangement of pipelines. Attached Figure Description
[0021] To more clearly illustrate and understand the technical solutions in the embodiments of this utility model, the accompanying drawings used in the background technology and embodiment description of this utility model will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of a wiring structure for a wafer processing device provided in an embodiment of the present invention;
[0023] Figure 2 This is a schematic diagram of a wiring structure for a wafer processing device provided in an embodiment of the present invention;
[0024] Figure 3 This is a schematic diagram of a wiring structure for a wafer processing device provided in an embodiment of the present invention. Detailed Implementation
[0025] The present invention will be further described in detail below with reference to the accompanying drawings.
[0026] To facilitate understanding of this utility model, a more complete description of it will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may be an intermediate component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of this utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0027] Please see Figures 1 to 3 As shown, this embodiment provides a wiring structure for a wafer processing device, which includes a rack 1, a first assembly area 2, a second assembly area 3, and a third assembly area 4, wherein:
[0028] The first assembly area 2 is located directly above the second assembly area 3. The first assembly area 2 is provided with a processing unit 5, which is configured to process the wafer according to a preset process.
[0029] The second assembly area 3 is provided with at least a solvent supply unit 6, which is configured to provide solvent for the processing unit 5 for the processing process.
[0030] The third assembly area 4 is located on the back side of the first assembly area 2. The third assembly area 4 is configured to install electronic control devices and / or pneumatic control devices. The top of the first assembly area 2 is provided with a first wiring structure 7. Some of the pipelines of the electronic control devices and / or pneumatic control devices in the third assembly area 4 are introduced into the first assembly area 2 after passing through the first wiring structure 7.
[0031] A second wiring structure 8 is provided on one side of the first assembly area 2. The remaining pipelines of the electrical control devices and / or pneumatic control devices in the third assembly area 4 are introduced into the second assembly area 3 after passing through the second wiring structure 8.
[0032] It can be seen that by setting up the first wiring structure 7 and the second wiring structure 8, the pipelines of the electrical control devices and pneumatic control devices inside the device are uniformly organized and planned, which facilitates the maintenance and repair of the equipment.
[0033] In one embodiment, the second wiring structure 8 is also equipped with electrical control devices and / or pneumatic control devices, and the pipelines of the electrical control devices and / or pneumatic control devices in the second wiring structure 8 are introduced into the second assembly area 3 after passing through the second wiring structure 8.
[0034] As can be seen, the second wiring structure 8 can be used to install electrical and / or pneumatic control devices, and can also be used to organize pipelines. The structure is simple and the layout is reasonable.
[0035] In one embodiment, the first wiring structure 7 includes a first wiring channel 70 and a first partition 71. The first wiring channel 70 is horizontally disposed on the top of the frame 1 and is vertically disposed on the first partition 71. The first partition 71 is disposed on the top of the third assembly area 4, and one end of the first partition 71 is provided with a first wiring hole 72 that connects the first wiring channel 70 and the third assembly area 4.
[0036] Specifically, the first partition 71 is provided with a receiving space that is connected to the first wire-threading channel 70.
[0037] As can be seen, the pipelines in the first assembly area 2 and the third assembly area 4 are organized through the first wiring channel 70 and the first partition 71, making them neat, aesthetically pleasing, and easy to maintain later.
[0038] In one embodiment, the second wiring structure 8 includes a second partition 80 and a side plate 81. The second partition 80 is disposed directly below the first wiring channel 70. A second wiring hole 82 is provided at one end of the second partition 80 near the first assembly area 2. The second partition 80 is disposed on one side. The second partition 80 and the side plate 81 are combined to form a second wiring channel 83.
[0039] Specifically, the second partition 80 is an L-shaped plate.
[0040] It is evident that the second wiring channel 83 enables the pipeline to be organized, with a simple structure and reasonable layout.
[0041] In one embodiment, a third partition 40 is provided at the bottom of the third assembly area 4, and a third wire hole 41 is provided at one end of the third partition 40 near the second wiring structure 8.
[0042] As can be seen, by setting the first wire hole 72, the second wire hole 82 and the third wire hole 41, the first assembly area 2, the second assembly area 3 and the third assembly area 4 are interconnected, which facilitates the arrangement of pipelines.
[0043] A wafer processing apparatus includes the aforementioned wiring structure for a wafer processing apparatus.
[0044] In the embodiments disclosed in this utility model, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments disclosed in this utility model according to the specific circumstances.
[0045] The above embodiments merely illustrate the basic principles and characteristics of this utility model. This utility model is not limited to the above examples. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A wiring structure for a wafer processing apparatus, characterized in that, The wiring structure for the wafer processing apparatus includes a rack, a first assembly area, a second assembly area, and a third assembly area, wherein: The first assembly area is located directly above the second assembly area, and the first assembly area is provided with a processing unit, which is configured to process the wafer according to a preset process. The second assembly area is provided with at least a solvent supply unit, which is configured to provide the processing unit with solvent for the processing process. The third assembly area is located on the back side of the first assembly area. The third assembly area is configured to install electronic control devices and / or pneumatic control devices. A first wiring structure is provided on the top of the first assembly area. Some of the pipelines of the electronic control devices and / or pneumatic control devices in the third assembly area are introduced into the first assembly area after passing through the first wiring structure. A second wiring structure is provided on one side of the first assembly area, and the remaining pipelines of the electronic control devices and / or pneumatic control devices in the third assembly area are introduced into the second assembly area after passing through the second wiring structure.
2. The wiring structure for a wafer processing apparatus according to claim 1, characterized in that, The second wiring structure is also equipped with electrical control devices and / or pneumatic control devices. The pipelines of the electrical control devices and / or pneumatic control devices in the second wiring structure are introduced into the second assembly area after passing through the second wiring structure.
3. The wiring structure for a wafer processing apparatus according to claim 1, characterized in that, The first wiring structure includes a first wiring channel and a first partition. The first wiring channel is horizontally disposed on the top of the frame and perpendicular to the first partition. The first partition is disposed on the top of the third assembly area, and one end of the first partition is provided with a first wiring hole that connects the first wiring channel and the third assembly area.
4. The wiring structure for a wafer processing apparatus according to claim 3, characterized in that, The second wiring structure includes a second partition and a side plate. The second partition is located directly below the first wiring channel. A second wiring hole is provided at one end of the second partition near the first assembly area. The second partition is located on one side of the second partition. The second partition and the side plate are combined to form the second wiring channel.
5. The wiring structure for a wafer processing apparatus according to claim 1, characterized in that, A third partition is provided at the bottom of the third assembly area, and a third wire hole is provided at one end of the third partition near the second wiring structure.
6. A wafer processing apparatus, characterized in that, The wafer processing apparatus includes a wiring structure for a wafer processing apparatus as described in any one of claims 1-5.