Wafer gluing equipment

Abstract

The utility model relates to the technical field of wafer gluing, and discloses wafer gluing equipment which comprises a collecting tank, a supporting frame is fixedly connected to the outer side of the collecting tank, a fixing assembly is connected to the inner top end of the supporting frame, a supporting column is fixedly connected to the inner bottom end of the collecting tank, and a recycling assembly is connected to the top of the supporting column. The recycling assembly comprises a motor, an output shaft of the motor is fixedly connected with a fixing plate, and the top of the fixing plate is fixedly connected with a workbench. Compared with the prior art, the wafer gluing device has the advantages that redundant glue on the edge of a wafer can be scraped and recovered, the glue is prevented from being wasted in unnecessary places, the redundant glue is effectively prevented from flowing around, and the recovery rate of the wafer gluing device is improved; according to the wafer gluing device, the wafer can be fixed while gluing is conducted, the wafer is prevented from flying out of the workbench due to centrifugal force or other accidental factors, and the safety of the wafer gluing device is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer coating technology, and in particular to a wafer coating equipment. Background Technology

[0002] Wafer coating is a critical process in semiconductor manufacturing, referring to the uniform application of photoresist (a special polymer material) onto the surface of a wafer. Photoresist plays a crucial role in subsequent photolithography processes, transferring circuit patterns from the photomask to the wafer. Therefore, the quality of the coating directly affects the manufacturing precision and performance of the chip. Existing wafer coating equipment cannot scrape off and recycle excess photoresist from the wafer edges, resulting in excess photoresist flowing everywhere, causing waste and low recovery rates. Furthermore, during coating, the wafer is susceptible to being ejected from the worktable due to centrifugal force or other unexpected factors, posing a safety risk. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer coating device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a wafer coating device, including a collection tank, a support frame fixedly connected to the outside of the collection tank, a fixing component connected to the top of the support frame, a support column fixedly connected to the bottom of the collection tank, and a recycling component connected to the top of the support column;

[0005] The recycling assembly includes a motor, the output shaft of which is fixedly connected to a fixed plate. A workbench is fixedly connected to the top of the fixed plate, and a scraper is slidably connected to the outside of the workbench. A rubber sleeve is fixedly fitted to one end of the scraper, and a fixed rod is fixedly connected to the bottom of the other end of the scraper. A fixed block is fixedly connected to one end of the fixed rod, and one end of the fixed block is fixedly connected to the inside of the collection tank.

[0006] As a further description of the above technical solution:

[0007] The fixing assembly includes a cylinder and a vacuum suction cup. The cylinder is fixedly connected to the top of the support frame. The output end of the cylinder passes through the support frame and is fixedly connected to a mounting plate. A spray nozzle is fixedly connected to the bottom of the mounting plate. The vacuum suction cup has an internal cavity and a through hole at its top. A vacuum pump is fixedly connected to the bottom of the workbench. A connecting pipe is fixedly connected to the suction port of the vacuum pump. One end of the connecting pipe passes through the workbench and is fixedly connected to the bottom of the vacuum suction cup.

[0008] As a further description of the above technical solution:

[0009] A glue box is fixedly connected to the top of the support frame, and a metering pump is fixedly connected to one side of the glue box.

[0010] As a further description of the above technical solution:

[0011] The metering pump has a feed pipe connected to its inlet, which is located inside the glue tank, and a discharge pipe fixedly connected to its outlet.

[0012] As a further description of the above technical solution:

[0013] One end of the discharge pipe is fixedly connected to one side of the glue spray head.

[0014] As a further description of the above technical solution:

[0015] A discharge pipe is fixedly connected to the outside of the collection tank, and a pipe cover is connected to one end of the discharge pipe.

[0016] As a further description of the above technical solution:

[0017] The diameter of the collection tank is larger than the diameter of the workbench.

[0018] This utility model has the following beneficial effects:

[0019] 1. In this utility model, the excess adhesive at the edge of the wafer can be scraped off and recycled through the recycling component, avoiding waste of adhesive in unnecessary places, effectively preventing excess adhesive from flowing everywhere, and improving the recycling rate of the wafer coating equipment.

[0020] 2. In this utility model, the wafer can be fixed at the same time as the adhesive is applied, preventing the wafer from flying off the worktable due to centrifugal force or other unexpected factors, thus improving the safety of the wafer coating equipment. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a wafer coating equipment proposed in this utility model;

[0022] Figure 2 This is a cross-sectional view of the overall structure of a wafer coating equipment proposed in this utility model;

[0023] Figure 3 This is a partial structural cross-sectional view of a wafer coating equipment proposed in this utility model;

[0024] Figure 4 This is a side view of a wafer coating device proposed in this utility model.

[0025] Legend:

[0026] 1. Collection trough; 2. Support column; 3. Recycling component; 4. Motor; 5. Fixing plate; 6. Workbench; 7. Scraper; 8. Rubber sleeve; 9. Fixing rod; 10. Fixing block; 11. Support frame; 12. Fixing component; 13. Cylinder; 14. Mounting plate; 16. Spray nozzle; 17. Vacuum suction cup; 18. Cavity; 19. Through hole; 20. Vacuum pump; 21. Connecting pipe; 22. Glue box; 23. Metering pump; 24. Discharge pipe; 25. Discharge pipe; 26. Pipe cover. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 1-4 An embodiment of this utility model is provided: a wafer coating device, including a collection tank 1, a support frame 11 fixedly connected to the outside of the collection tank 1, a fixing component 12 connected to the top of the support frame 11, a support column 2 fixedly connected to the bottom of the collection tank 1, and a recycling component 3 connected to the top of the support column 2.

[0029] The recycling component 3 includes a motor 4, the output shaft of the motor 4 is fixedly connected to a fixing plate 5, the top of the fixing plate 5 is fixedly connected to a workbench 6, a scraper 7 is slidably connected to the outside of the workbench 6, a rubber sleeve 8 is fixedly sleeved on one end of the scraper 7, a fixing rod 9 is fixedly connected to the bottom of the other end of the scraper 7, a fixing block 10 is fixedly connected to one end of the fixing rod 9, and one end of the fixing block 10 is fixedly connected to the inside of the collection tank 1.

[0030] The fixing assembly 12 includes a cylinder 13 and a vacuum suction cup 17. The cylinder 13 is fixedly connected to the top of the support frame 11. The output end of the cylinder 13 passes through the support frame 11 and is fixedly connected to a mounting plate 14. A spray nozzle 16 is fixedly connected to the bottom of the mounting plate 14. The vacuum suction cup 17 has a cavity 18 inside and a through hole 19 at the top. A vacuum pump 20 is fixedly connected to the bottom of the worktable 6. A connecting pipe 21 is fixedly connected to the suction port of the vacuum pump 20. One end of the connecting pipe 21 passes through the worktable 6 and is fixedly connected to the bottom of the vacuum suction cup 17. A glue tank 22 is fixedly connected to the top of the support frame 11. A metering pump 23 is fixedly connected to one side of the glue tank 22. The inlet of the metering pump 23 is connected to a feed pipe, which is located inside the glue tank 22. The outlet of the metering pump 23 is fixedly connected to a discharge pipe 24. One end of the discharge pipe 24 is fixedly connected to one side of the glue spray head 16. A discharge pipe 25 is fixedly connected to the outside of the collection tank 1. A pipe cap 26 is connected to the outside of one end of the discharge pipe 25 to prevent leakage when collecting glue and reduce waste. The diameter of the collection tank 1 is larger than the diameter of the workbench 6 for easy collection.

[0031] Working principle: The wafer is placed on the vacuum chuck 17, and the vacuum pump 20 is started. The vacuum pump 20 extracts the air from the cavity 18 through the connecting pipe 21, so that the vacuum chuck 17 can adsorb and fix the wafer, improving safety. Then, the cylinder 13 and the metering pump 23 are started. The cylinder 13 drives the mounting plate 14 to move downward. The mounting plate 14 drives the glue spraying head 16 to move downward to the appropriate position. Then, the metering pump 23 applies glue to the wafer through the discharge pipe 24 and the glue spraying head 16. Then, the motor 4 is started. The motor 4 drives the fixing plate 5 to rotate. The fixing plate 5 drives the worktable 6 to rotate. When the worktable 6 rotates, the wafer rotates through the vacuum chuck 17. When the wafer rotates, the scraper 7 scrapes off the glue on the edge of the wafer through the rubber sleeve 8 and makes the glue flow into the collection tank 1, thereby collecting the scraped glue and improving the recovery rate.

[0032] All electrical components mentioned in this article are electrically connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. To ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer coating apparatus, comprising a collection tank (1), characterized in that: A support frame (11) is fixedly connected to the outside of the collection tank (1), and a fixing component (12) is connected to the top of the support frame (11). A support column (2) is fixedly connected to the bottom of the collection tank (1), and a recycling component (3) is connected to the top of the support column (2). The recycling component (3) includes a motor (4), the output shaft of which is fixedly connected to a fixing plate (5), a workbench (6) is fixedly connected to the top of the fixing plate (5), a scraper (7) is slidably connected to the outside of the workbench (6), a rubber sleeve (8) is fixedly fitted to one end of the scraper (7), a fixing rod (9) is fixedly connected to the bottom of the other end of the scraper (7), a fixing block (10) is fixedly connected to one end of the fixing rod (9), and one end of the fixing block (10) is fixedly connected to the inside of the collection tank (1).

2. The wafer coating equipment according to claim 1, characterized in that: The fixing component (12) includes a cylinder (13) and a vacuum suction cup (17). The cylinder (13) is fixedly connected to the top of the support frame (11). The output end of the cylinder (13) passes through the support frame (11) and is fixedly connected to a mounting plate (14). A spray nozzle (16) is fixedly connected to the bottom of the mounting plate (14). A cavity (18) is opened inside the vacuum suction cup (17). A through hole (19) is opened at the top of the vacuum suction cup (17). A vacuum pump (20) is fixedly connected to the bottom of the workbench (6). A connecting pipe (21) is fixedly connected to the suction port of the vacuum pump (20). One end of the connecting pipe (21) passes through the workbench (6) and is fixedly connected to the bottom of the vacuum suction cup (17).

3. The wafer coating equipment according to claim 1, characterized in that: A glue box (22) is fixedly connected to the top of the support frame (11), and a metering pump (23) is fixedly connected to one side of the glue box (22).

4. The wafer coating equipment according to claim 3, characterized in that: The metering pump (23) is connected to a feed pipe at its inlet, which is located inside the glue tank (22). The metering pump (23) is also fixedly connected to a discharge pipe (24) at its outlet.

5. The wafer coating equipment according to claim 4, characterized in that: One end of the discharge pipe (24) is fixedly connected to one side of the spray nozzle (16).

6. The wafer coating equipment according to claim 1, characterized in that: A discharge pipe (25) is fixedly connected to the outside of the collection tank (1), and a pipe cap (26) is connected to one end of the discharge pipe (25).

7. The wafer coating equipment according to claim 1, characterized in that: The diameter of the collection tank (1) is larger than the diameter of the workbench (6).

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