Spin coating mechanism capable of rotating at high speed

Abstract

The utility model relates to the technical field of spin-coating equipment, and particularly discloses a high-speed rotating spin-coating mechanism which comprises a coating component, a recycling component and a displacement component, the recycling component is positioned below the coating component, and the coating component is fixedly connected to an output end above the displacement component; the coating assembly comprises a wafer, a wafer carrying disc, a check ring, a vacuum guide hole and a support. The wafer carrying disc guides vacuum to the upper end face of the wafer carrying disc through the vacuum guide hole. According to the utility model, the equipment can lift up and down, when the wafer carrying disc rises to a high position, the wafer carrying disc is higher than the check ring, so that the manipulator can feed and discharge conveniently, the manipulator and the check ring are prevented from interfering with each other, the distance between the wafer and the discharge port of the blanking mechanism is short, and the coating effect is good; when the wafer carrying disc descends to a low position, the wafer carrying disc is lower than the check ring, and paint splashed by centrifugal force during spin coating can be blocked by the check ring, so that the paint is prevented from splashing to other parts of equipment outside the check ring to pollute and damage the equipment.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of spin coating equipment, specifically relates to a high -speed rotation's spin coating mechanism. BACKGROUND

[0002] Spin coating equipment is a kind of coating device using rotation centrifugal force to form thin and uniform coating, is widely used in liquid, colloid's film forming property test and surface coating process.

[0003] The existing technology still has the following to be improved place: the optimal height of spin coating equipment is different when feeding, gluing, spin coating, needs to move wafer to different height to realize, and the wafer position of spin coating equipment on the market is basically fixed, cannot satisfy above-mentioned demand, needs wafer carrier to adsorb wafer firmly when the equipment high-speed rotates, the equipment on the market is difficult to do vacuum can be from the outside to wafer carrier, and not affected by the wafer carrier needing to lift and rotate, simultaneously, excess adhesive is easy to splash to the other parts of equipment when spin coating, produces pollution to equipment, makes production efficiency decline. UTILITY MODEL CONTENT

[0004] To solve the above-mentioned problems in the prior art, the utility model provides a high -speed rotation's spin coating mechanism, equipment can be realized to carry out up and down lift movement, wafer carrier is higher than baffle when wafer carrier is lifted to high place, it is convenient for manipulator to feed and discharge, avoids the mutual interference of manipulator and baffle, wafer is close to the discharge port of feeding mechanism, and coating effect is good;Wafer carrier is lower than baffle when wafer carrier is lowered to low place, and the coating splashed by centrifugal force when spin coating can be blocked by baffle, avoid coating splashing to other parts of equipment outside baffle, make equipment pollution and damage.

[0005] The purpose of the utility model can be realized by the following technical schemes:

[0006] A high -speed rotation's spin coating mechanism, including coating assembly, recovery component and displacement component, the recovery component is located below the coating assembly, and the coating assembly is fixedly connected to the output end above the displacement component;

[0007] The coating assembly includes wafer, wafer carrier, baffle, vacuum guide hole and support, the wafer carrier is guided to the upper end surface of wafer carrier by the vacuum guide hole, so that wafer carrier adsorbs wafer on the upper end surface of wafer carrier, and the baffle is fixedly connected to the upper surface of support.

[0008] Preferably, the recovery assembly comprises an exhaust port, a vacuum generator and a recovery pipe interface, the exhaust port is fixedly connected below the support, the vacuum generator is fixedly connected below the support, the interface of the vacuum generator is connected to positive pressure, vacuum is generated, the vacuum is connected to the cavity formed by the wafer carrier and the support, and the function is to provide power for the residual adhesive suction, and the wafer and the wafer carrier are located on the inner side of the baffle ring.

[0009] Preferably, the displacement assembly comprises a rotary motor and a linear motor mechanism, the rotary motor is fixedly connected to the upper output end of the linear motor mechanism, and the wafer carrier is fixedly connected to the upper output end of the rotary motor.

[0010] Preferably, the recovery pipe interface is provided with a plurality of.

[0011] Preferably, a plurality of recovery pipe interfaces are fixedly connected to the outer side below the support, and a plurality of recovery pipe interfaces are uniformly distributed in the circumferential direction.

[0012] Preferably, the vacuum guide hole is located at the output end of the rotary motor, and the vacuum guide hole is a ventilation channel formed by the cooperation of the output shaft and the peripheral sleeve of the rotary motor.

[0013] Preferably, the vacuum guide hole is composed of a plurality of interconnected holes and grooves, vacuum enters from the vacuum guide hole, and finally reaches the surface of the wafer carrier, so as to suck the wafer without being affected by rotation and lifting.

[0014] Preferably, the linear motor mechanism is internally provided with a lead screw and a lead screw nut.

[0015] The beneficial effects of the utility model are:

[0016] (1) By setting the coating assembly, the technical effect achieved is that the wafer carrier guides the vacuum to the upper end surface of the wafer carrier through the vacuum guide hole, so that the wafer carrier adsorbs the wafer on the upper end surface of the wafer carrier, and the wafer is firmly adsorbed on the wafer carrier.

[0017] (2) By setting the recovery assembly, the technical effect achieved is that the baffle ring can block the excess adhesive in the spin coating process for subsequent recovery, the recovery pipe interface is provided with a plurality of recovery pipe interfaces, and the plurality of recovery pipe interfaces are fixedly connected below the support, so as to facilitate the recovery of excess adhesive in each direction.

[0018] (3) through the setting displacement assembly, the technical effect that can be reached is that the rotary motor is fixedly connected below the wafer carrier, it is convenient to control the wafer carrier to drive wafer to spin coating, the motor mechanism of linear motion is internally provided with screw rod and screw rod nut, the motor mechanism of linear motion rotates, drives the screw rod inside the motor mechanism of linear motion to rotate, converts into the linear motion of screw rod nut inside the motor mechanism of linear motion, it is convenient to drive rotary motor, wafer carrier and wafer to move up and down along Z axle direction, when receiving material, the height difference between the wafer of equipment and the feeding opening of feeding equipment is reduced, so that the adhesive can be placed in the center position of wafer, improve production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to facilitate the understanding of those skilled in the art, the present application will be further described below with reference to the accompanying drawings.

[0020] Fig. 1 It is a perspective view of the present application;

[0021] Fig. 2 It is a left view of the present application;

[0022] Fig. 3 It is a right view of the present application;

[0023] Main element symbol explanation:

[0024] In the drawing: 1, wafer;2, wafer carrier;3, baffle ring;4, air outlet;5, vacuum generator;6, recovery pipe interface;7, vacuum guide hole;8, rotary motor;9, motor mechanism of linear motion;10, support. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application;Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments;Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the present application.

[0026] In the description of the present application, it should be explained that the terms "up", "down", "inside", "outside", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawing, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present application, it is necessary to explain that, unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be understood broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium, or can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0028] With reference to Figs. 1-3 The utility model discloses a kind of spin coating mechanisms of high speed rotation, including coating assembly, recovery component and displacement component, recovery component is located below coating assembly, coating assembly is fixedly connected in the output end above displacement component, coating assembly is load, is carried on displacement component;

[0029] Coating assembly includes wafer 1, wafer carrier tray 2, baffle ring 3, vacuum guide hole 7 and support 10, wafer carrier tray 2 is guided to the upper end surface of wafer carrier tray 2 by vacuum guide hole 7, so that wafer carrier tray 2 adsorbs wafer 1 on the upper end surface of wafer carrier tray 2, facilitate wafer 1 firmly adsorbed on wafer carrier tray 2, baffle ring 3 is fixedly connected to the upper surface of support 10.

[0030] With reference to Figs. 1-3 Recovery component includes air outlet 4, vacuum generator 5 and recovery pipe interface 6, the air outlet 4 is fixedly connected below the support 10, vacuum generator 5 is fixedly connected below support 10, the interface of vacuum generator 5 is connected to positive pressure, generates vacuum, vacuum is led to the cavity formed by wafer carrier tray 2 and support 10, and the role is to provide power for residual glue suction, wafer 1 and wafer carrier tray 2 are located inside baffle ring 3, cover plate is provided on baffle ring 3 in the embodiment, baffle ring 3 facilitates the excess adhesive in spin coating process to be blocked to carry out subsequent recovery, cover plate prevents adhesive from being thrown out in spin coating process;Multiple recovery pipe interfaces 6 are provided;Multiple recovery pipe interfaces 6 are fixedly connected to the outside below support 10, and multiple recovery pipe interfaces 6 are evenly distributed in circumference, to facilitate the recovery of excess adhesive in each direction.

[0031] With reference to Figs. 1-3The displacement assembly comprises a rotary motor 8 and a linear motor mechanism 9, the rotary motor 8 is fixedly connected to the upper output end of the linear motor mechanism 9, the wafer carrier 2 is fixedly connected to the upper output end of the rotary motor 8, and the wafer 1 is conveniently controlled to be spin-coated by the wafer carrier 2; the vacuum guide hole 7 is located at the output end of the rotary motor 8, and the vacuum guide hole 7 is a gas passage formed by the output shaft of the rotary motor 8 and the peripheral shaft sleeve; the vacuum guide hole 7 is composed of holes and grooves in communication with each other, vacuum enters from the vacuum guide hole 7 and finally reaches the disc surface of the wafer carrier 2, so that the wafer 1 is sucked and is not affected by rotation and lifting; the linear motor mechanism 9 is internally provided with a lead screw and a lead screw nut, the linear motor mechanism 9 rotates, drives the lead screw in the linear motor mechanism 9 to rotate, is converted into the linear motion of the lead screw nut in the linear motor mechanism 9, and conveniently drives the rotary motor 8, the wafer carrier 2 and the wafer 1 to move up and down along the Z-axis direction, so that the height difference between the wafer 1 of the equipment and the feeding opening of the feeding equipment is reduced when receiving material, the adhesive can be placed at the center position of the wafer 1, and the production efficiency is improved.

[0032] The working principle and use process of the utility model are as follows: when the equipment is receiving material, the linear motor mechanism 9 is controlled, the linear motor mechanism 9 rotates, drives the lead screw in the linear motor mechanism 9 to rotate, is converted into the linear motion of the lead screw nut in the linear motor mechanism 9, drives the rotary motor 8, the wafer carrier 2 and the wafer 1 to move upwards along the Z-axis direction to a suitable receiving position, at this time, the wafer 1 is lifted to above the baffle 3 and the cover plate, and the feeding equipment places the adhesive at the center position of the wafer 1.

[0033] When the equipment is spin-coating, the wafer 1 is lowered to below the baffle 3 and the cover plate by controlling the linear motor mechanism 9, and the wafer carrier 2 and the wafer 1 are controlled to rotate at high speed by the rotary motor 8, a strong centrifugal force is provided by high-speed rotation, the adhesive spreads from the center of the wafer 1 to the periphery, is uniformly laid on the surface of the wafer 1, and residual adhesive is blocked by the baffle 3.

[0034] The vacuum generator 5 is started, a strong suction force is provided, and residual adhesive is sucked to the recycling pipe interface 6 for recycling.

[0035] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form, although the utility model has been disclosed as above with a preferred embodiment, however, is not used to limit the utility model, any person skilled in the art, within the scope of the technical scheme of the utility model, can make some changes or modifications to the equivalent embodiments of equivalent changes disclosed above, but as long as it does not deviate from the technical scheme of the utility model, according to the technical essence of the utility model, any modification, equivalent change and modification of the above embodiment, still belongs to the scope of the technical scheme of the utility model.

Claims

1. A high-speed rotating spin coating mechanism, characterized in that: It includes a coating component, a recovery component, and a displacement component, wherein the recovery component is located below the coating component, and the coating component is fixedly connected to the output end above the displacement component; The coating assembly includes a wafer (1), a wafer carrier (2), a retaining ring (3), a vacuum guide hole (7), and a support (10). The wafer carrier (2) guides vacuum to the upper surface of the wafer carrier (2) through the vacuum guide hole (7), so that the wafer carrier (2) adsorbs the wafer (1) onto the upper surface of the wafer carrier (2). The retaining ring (3) is fixedly connected to the upper surface of the support (10).

2. The high-speed rotating spin coating mechanism according to claim 1, characterized in that: The recycling assembly includes an exhaust port (4), a vacuum generator (5), and a recycling pipe interface (6). The exhaust port (4) is fixedly connected to the bottom of the bracket (10). The vacuum generator (5) is fixedly connected to the bottom of the bracket (10). The interface of the vacuum generator (5) is connected to positive pressure to generate a vacuum. The vacuum flows into the cavity formed by the wafer carrier (2) and the bracket (10) to provide power for suction of residual adhesive. The wafer (1) and the wafer carrier (2) are located inside the retaining ring (3).

3. The high-speed rotating spin coating mechanism according to claim 1, characterized in that: The displacement component includes a rotary motor (8) and a linear motion motor mechanism (9). The rotary motor (8) is fixedly connected to the upper output end of the linear motion motor mechanism (9), and the wafer carrier (2) is fixedly connected to the upper output end of the rotary motor (8).

4. The high-speed rotating spin coating mechanism according to claim 2, characterized in that: The recycling tube interface (6) is provided with multiple interfaces.

5. The high-speed rotating spin coating mechanism according to claim 4, characterized in that: Multiple recycling tube interfaces (6) are fixedly connected to the outer side of the bracket (10) and are evenly distributed circumferentially.

6. The high-speed rotating spin coating mechanism according to claim 1, characterized in that: The vacuum guide hole (7) is located at the output end of the rotary motor (8). The vacuum guide hole (7) is a ventilation channel formed by the output shaft of the rotary motor (8) and the outer bushing.

7. A high-speed rotating spin coating mechanism according to claim 6, characterized in that: The vacuum guide hole (7) is composed of interconnected holes and grooves. Vacuum enters from the vacuum guide hole (7) and eventually reaches the surface of the wafer carrier (2), thereby holding the wafer (1) in place and preventing it from being affected by rotation and lifting.

8. The high-speed rotating spin coating mechanism according to claim 3, characterized in that: The linear motion motor mechanism (9) is equipped with a lead screw and a lead screw nut.

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