Direct cooling module, system and laser heat dissipation unit

Abstract

The utility model discloses a direct cooling module and system and a laser heat dissipation module, and relates to the technical field of laser welding cooling, in particular to the direct cooling module and system comprising a uniform temperature plate, the uniform temperature plate is attached to a direct cooling plate of a refrigerating system, and the uniform temperature plate and the direct cooling plate are detachably and fixedly connected; a mounting position is arranged on the surface of one side, far away from the direct cooling plate, of the uniform temperature plate, and is used for contact heat conduction of a heat source part; according to the direct cooling module, the system and the laser heat dissipation module, the uniform temperature plate which can be separated from the direct cooling plate is arranged to serve as a mounting carrier of the multiple sets of heat source components, heat of the heat source components is conducted to the direct cooling plate through the uniform temperature plate for cooling and heat dissipation, and when the heat source components are mounted or maintained, the uniform temperature plate can be separated from the direct cooling plate; on the premise that the posture of the laser heat dissipation unit is not changed, the vapor chamber can be in a horizontal state, and installation and maintenance of heat source components are facilitated.

Description

Technical Field

[0001] This utility model relates to the field of laser welding cooling technology, and more specifically, to a direct cooling module, system and laser heat dissipation unit. Background Technology

[0002] With the deepening development of the laser handheld welding industry, cooling and temperature control applications are becoming increasingly widespread; and the welding industry is currently in a stage of continuous technological development, requiring constant product improvement.

[0003] like Figure 1 and Figure 2 As shown, in the assembly of the handheld welding laser generator pump and other optical components (heat source component 2) and the refrigerant direct cooling cold plate module (cooling system 12), the connection between the pump and other optical components and the cold plate (direct cooling plate 1) is usually arranged vertically on the side of the unit, and is installed and heated by direct bonding and application of thermal grease. In addition, an installation groove 11 for accommodating the fiber optic disc is provided on the cold plate.

[0004] The existing technology has at least the following problems:

[0005] When installing optical components such as pumps, the assembly is inconvenient because the straight cooling plate 1 on the side of the unit is arranged vertically.

[0006] If the unit is laid down so that the direct cooling plate 1 is placed horizontally to facilitate the installation of pumps and other optical components, it will damage the refrigeration compressor, because the refrigeration compressor cannot be in a laid-down state for a long time.

[0007] Furthermore, the adhesive on the fiber optic disc in the mounting slot 11 cannot be laid flat to cure, resulting in weak bonding. Also, the unit cannot be laid down during maintenance of optical components such as pumps, causing inconvenience in maintenance.

[0008] In summary, how to solve the problem of difficult installation and maintenance of heat source components caused by the inability to lay down existing laser heat dissipation units is a problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0009] In view of this, the purpose of this utility model is to provide a direct cooling module, which uses a heat spreader plate that can be separated from the direct cooling plate as a mounting carrier for several groups of heat source components. The heat of the heat source components is conducted to the direct cooling plate through the heat spreader plate for cooling and heat dissipation. When installing or maintaining the heat source components, the heat spreader plate can be separated from the direct cooling plate. Without changing the posture of the laser heat dissipation unit, the heat spreader plate can be kept in a horizontal state, which facilitates the installation and maintenance of the heat source components.

[0010] Another objective of this invention is to provide a direct cooling system including the aforementioned direct cooling module, which can solve the same technical problem.

[0011] Another objective of this invention is to provide a laser heat dissipation unit that includes the aforementioned direct cooling module, which can solve the same technical problem.

[0012] To achieve the above objectives, this utility model provides the following technical solution:

[0013] A direct cooling module includes a heat spreader plate, which is used to be attached to the direct cooling plate of a refrigeration system, and the heat spreader plate and the direct cooling plate are detachably connected.

[0014] The surface of the heat spreader away from the direct cooling plate is provided with a mounting position, which is used for contact heat conduction of the heat source component.

[0015] Preferably, the surface of the heat spreader is provided with mounting holes, and bolts for connecting to the direct cooling plate are provided in the mounting holes.

[0016] Preferably, a detachable snap-fit ​​mechanism is provided between the heat spreader and the direct cooling plate to ensure that the heat spreader and the direct cooling plate are tightly fitted and fixed.

[0017] Preferably, the surface of the heat spreader used to connect with the direct cooling plate is a contact surface, and the contact surface is provided with a thermally conductive silicon sheet.

[0018] Preferably, the mounting position includes a mounting plane and a mounting groove on the surface of the heat exchange plate;

[0019] The heat source component is fitted and fixed to the mounting plane, and the mounting groove is used to fix and install the resonant cavity optical fiber.

[0020] Preferably, the mounting surface is provided with threaded holes for connecting bolts that connect and mount the heat source component.

[0021] A direct cooling system includes a direct cooling module as described in any one of the above and a direct cooling plate of a refrigeration system, wherein the direct cooling plate is detachably connected to the heat spreader.

[0022] A laser heat dissipation unit includes a chassis and the aforementioned direct cooling system.

[0023] Preferably, it also includes a chassis and the refrigeration system, the refrigeration system being disposed inside the chassis, and the direct cooling plate of the refrigeration system being vertically disposed on the outer side wall of the chassis.

[0024] Preferably, the outer wall of the chassis is provided with threaded holes or connecting clips for connecting the heat exchange plate.

[0025] Preferably, the heat exchange pipes of the refrigeration system are arranged in close contact with the surface of the direct cooling plate away from the heat exchange plate, or the heat exchange pipes are arranged inside the direct cooling plate.

[0026] The direct cooling module provided by this utility model has at least the following advantages compared with the prior art:

[0027] 1. Add a design for a heat spreader plate that can be separated from the direct cooling plate. The heat spreader plate is used as a direct mounting and fixing position for the heat source components. During the installation and maintenance of the heat source components, the heat spreader plate can be separated from the direct cooling plate and placed horizontally, which facilitates the installation and maintenance of the heat source components and will not cause damage to the heat dissipation unit due to the heat source components being tilted during installation and maintenance.

[0028] 2. By setting up a heat spreader, the heat source components can be homogenized, avoiding the problem of reduced heat exchange efficiency caused by the concentration of heat sources on the surface of the direct cooling plate. This further improves the heat dissipation performance of the heat source components and also solves the problem of large temperature fluctuations of the heat source components caused by excessive local temperature differences on the surface of the direct cooling plate, thereby extending the service life of the heat source components.

[0029] The direct cooling system provided by this utility model includes the above-mentioned direct cooling module and has the same beneficial effects.

[0030] The laser heat dissipation unit provided by this utility model includes the above-mentioned direct cooling system and has the same beneficial effects. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of a laser heat dissipation unit design in the existing technology;

[0033] Figure 2 This is a cross-sectional view of a laser heat dissipation unit in the prior art;

[0034] Figure 3 This is a schematic diagram of the structure of the specific direct cooling module provided by this utility model;

[0035] Figure 4 Provided by this utility model Figure 3 Enlarged view of point A in the middle;

[0036] Figure 5Exploded views of the components of the specific laser heat dissipation unit provided by this utility model;

[0037] Figure 6 This is an exploded view of the parts of the specific direct cooling module provided by this utility model.

[0038] Figures 1-6 middle:

[0039] 1. Direct cooling plate; 11. Mounting slot; 12. Refrigeration system;

[0040] 2. Heat source components;

[0041] 3. Thermally conductive silicon wafer;

[0042] 4. Temperature distribution plate. Detailed Implementation

[0043] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0044] The core of this utility model is to provide a direct cooling module. By setting a heat spreader plate that can be separated from the direct cooling plate as a mounting carrier for several groups of heat source components, the heat of the heat source components is conducted to the direct cooling plate through the heat spreader plate for cooling and heat dissipation. When installing or maintaining the heat source components, the heat spreader plate can be separated from the direct cooling plate. Without changing the posture of the laser heat dissipation unit, the heat spreader plate can be kept in a horizontal state, which facilitates the installation and maintenance of the heat source components.

[0045] Another core aspect of this invention is to provide a direct cooling system including the aforementioned direct cooling module, which can solve the same technical problem.

[0046] Another core aspect of this invention is to provide a laser heat dissipation unit that includes the aforementioned direct cooling system, which can solve the same technical problem.

[0047] Please refer to Figures 3-6 A direct cooling module includes a heat spreader 4, which is used to fit with the direct cooling plate 1 of the refrigeration system 12, and the heat spreader 4 and the direct cooling plate 1 are detachably connected.

[0048] The surface of the heat spreader 4 away from the direct cooling plate 1 is provided with a mounting position, which is used for contact heat conduction of the heat source component 2.

[0049] The heat exchanger 4 and the direct cooling plate 1 are set as separate heat exchangers. The heat exchanger 4 serves as the mounting carrier for the heat source component 2 and exchanges heat with the direct cooling plate 1. During the installation and maintenance of the heat source component 2, the heat exchanger 4 can be separated from the direct cooling plate 1, so that the heat exchanger 4 can set its own placement posture according to the installation and maintenance requirements of the heat source component 2, without being restricted by the posture of the refrigeration system 12 and the direct cooling plate 1.

[0050] Meanwhile, by using a heat spreader plate 4 as the mounting carrier for several heat source components 2, the heat inside the heat source component 2 can be quickly distributed on the heat spreader plate 4, and the heat can be quickly exchanged with the direct cooling plate 1 through the heat spreader plate 4. This avoids excessive local temperature differences on the heat source component 2, the heat spreader plate 4 and the direct cooling plate 1, thereby reducing the temperature fluctuation of the heat source component 2 and improving the service life of the heat source component 2.

[0051] In some embodiments, the surface of the heat exchange plate 4 is provided with mounting holes, and bolts for connecting to the direct cooling plate 1 are provided in the mounting holes;

[0052] Mounting holes are provided on the surface of the heat exchange plate 4, and threaded holes are provided at corresponding positions on the direct cooling plate 1. During assembly, the bolts are passed through the mounting holes and connected to the threaded holes on the direct cooling plate 1, thereby pressing the heat exchange plate 4 onto the direct cooling plate 1, so that the heat exchange plate 4 and the direct cooling plate 1 are tightly fitted, which helps the heat exchange between the two.

[0053] In some embodiments, a detachable snap-fit ​​mechanism is provided between the heat exchange plate 4 and the direct cooling plate 1 to make the heat exchange plate 4 and the direct cooling plate 1 fit tightly together and be fixed.

[0054] By setting a detachable snap-fit ​​mechanism between the heat exchange plate 4 and the direct cooling plate 1, the heat exchange plate 4 can be tightly attached to the direct cooling plate 1 under the action of the snap-fit ​​mechanism to exchange heat. When the heat source component 2 needs to be installed or maintained, the snap-fit ​​mechanism is released, so that the heat exchange plate 4 can be separated from the direct cooling plate 1.

[0055] The aforementioned buckle mechanism is preferably a snap fastener or a magnetic snap fastener, which can ensure that the heat exchange plate 4 and the direct cooling plate 1 are tightly fitted and relatively fixed.

[0056] In some embodiments, the surface of the heat spreader 4 used to connect with the direct cooling plate 1 is a contact surface, and the contact surface is provided with a thermally conductive silicon wafer 3.

[0057] like Figure 4 As shown, a thermally conductive silicon sheet 3 is placed between the heat exchange plate 4 and the direct cooling plate 1 to fill the gap between the contact surfaces of the heat exchange plate 4 and the direct cooling plate 1, thereby achieving better heat transfer efficiency between the two.

[0058] Meanwhile, using thermally conductive silicon wafer 3 as the filling medium between the heat spreader 4 and the direct cooling plate 1 can compensate for the problem of reduced thermal conductivity caused by poor flatness of the contact surface between the two. Therefore, the scheme of using thermally conductive silicon wafer 3 as the filling medium can reduce the flatness requirements of the contact surface between the heat spreader 4 and the direct cooling plate 1. That is, in the production process, only the flatness of one side of the heat spreader 4 and the direct cooling plate 1 needs to be guaranteed, which helps to reduce the processing difficulty of the heat spreader 4 and the direct cooling plate 1, thereby reducing the processing cost.

[0059] The above-mentioned method of filling the thermally conductive silicon wafer 3 is to directly apply the thermally conductive silicon wafer 3 to the working surface of the direct cooling plate 1, and then install the heat exchange plate 4. In some embodiments, thermally conductive silicone is filled into the contact surface between the heat exchange plate 4 and the direct cooling plate 1, and after it is squeezed and flattened, it solidifies to form the thermally conductive silicon wafer 3, which also falls within the protection scope of this application.

[0060] In some embodiments, the mounting position includes a mounting plane and a mounting groove 11 on the surface of the heat exchange plate 4;

[0061] The heat source component 2 is fitted and fixed to the mounting plane, and the mounting groove 11 is used to fix and install the resonant cavity optical fiber.

[0062] like Figure 5 As shown, the surface of the heat exchange plate 4 away from the direct cooling plate 1 has good flatness, that is, it is set as the mounting plane for contact installation and fixation of the heat source component 2. Through good contact between the heat source component 2 and the heat exchange plate 4, the heat exchange efficiency of the two is guaranteed.

[0063] Meanwhile, an installation groove 11 is set on the surface of the heat spreader 4, the resonant cavity fiber disk is placed in the installation groove 11 and fixed with adhesive, thereby fixing the resonant cavity fiber to the heat spreader 4.

[0064] In summary, the optical fiber and other heat source components 2 in the optical path system are fixed to the heat spreader 4, while the cooling system 12 and the direct cooling plate 1 are fixed to the laser heat dissipation unit. That is, the optical path system and the cooling system are two systems that can be separated independently. When they are working, the heat spreader 4 and the direct cooling plate 1 can be assembled. When installing and maintaining, the heat spreader 4 and the direct cooling plate 1 can be separated. The whole system is quite flexible, and the maintenance will not affect each other.

[0065] In some embodiments, a threaded hole is provided on the mounting surface for connecting bolts that connect and mount the heat source component 2.

[0066] like Figure 6 As shown, several sets of threaded holes are provided in the mounting plane for fixing the heat source component 2 with bolts, so that the heating surface of the heat source component 2 can be tightly attached to the heat spreader plate 4 to ensure heat exchange efficiency; similarly, the method of fixing the heat source component 2 to the surface of the heat spreader plate 4 by adhesive or clips is also within the scope of protection of this application.

[0067] In addition to the direct cooling modules disclosed in the above embodiments, this utility model also provides a direct cooling system including the above-mentioned direct cooling modules.

[0068] In addition to the direct cooling modules and systems disclosed in the above embodiments, such as Figure 3 and Figure 5 As shown, this utility model also provides a laser heat dissipation unit including a chassis and the above-mentioned direct cooling system.

[0069] In some embodiments, the laser heat dissipation unit further includes a chassis and a cooling system 12, the cooling system 12 being disposed inside the chassis, and the direct cooling plate 1 of the cooling system 12 being vertically disposed on the outer side wall of the chassis.

[0070] like Figure 5 As shown, the refrigeration system 12 is integrated into the chassis, and the direct cooling plate 1 is used as a vertical side wall of the chassis, which effectively improves the space utilization. The working surface of the direct cooling plate 1 is set on the outer wall of the chassis, which facilitates the installation and fixing of the direct cooling module.

[0071] In some embodiments, the outer wall of the chassis is provided with threaded holes or connecting clips for connecting the heat spreader 4;

[0072] During the manufacturing of the laser heat dissipation unit, the direct cooling plate 1 is fixedly arranged relative to the chassis, and threaded holes or connecting buckles are provided on the chassis around the direct cooling plate 1 so that the heat spreader 4 can be fixedly connected to the chassis by bolts or buckles, and after the heat spreader 4 is connected to the chassis, it can fit in close contact with the direct cooling plate 1 to conduct heat.

[0073] In some embodiments, the heat exchange pipes of the refrigeration system 12 are arranged in contact with the surface of the direct cooling plate 1 away from the heat exchange plate 4, or the heat exchange pipes are arranged inside the direct cooling plate 1.

[0074] When designing a laser heat dissipation unit, the cooling system 12 is fixed inside the chassis, and the direct cooling plate 1 is connected to the cooling system 12 through heat exchange pipes. Heat is transferred by the flow of the medium in the pipes. Heat exchange occurs between the direct cooling plate 1 and the heat exchange pipes. The heat exchange pipes are either attached to the surface of the direct cooling plate 1 away from the heat spreader 4 or arranged in the interlayer of the direct cooling plate 1. Both of these arrangements fall within the scope of protection of this application.

[0075] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0076] The direct cooling module, system, and laser heat dissipation unit provided by this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make several improvements and modifications to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A direct cooling module, characterized in that, Includes a temperature distribution plate (4), which is used to fit with the direct cooling plate (1) of the refrigeration system (12), and the temperature distribution plate (4) and the direct cooling plate (1) are detachably connected; The surface of the heat spreader (4) away from the direct cooling plate (1) is provided with a mounting position, which is used for heat conduction through contact with the heat source component (2).

2. The direct cooling module according to claim 1, characterized in that, The surface of the heat exchange plate (4) is provided with mounting holes, and bolts for connecting to the direct cooling plate (1) are provided in the mounting holes.

3. The direct cooling module according to claim 1, characterized in that, A detachable snap-fit ​​mechanism is provided between the heat exchange plate (4) and the direct cooling plate (1) to make the heat exchange plate (4) and the direct cooling plate (1) fit tightly and fix each other.

4. The direct cooling module according to claim 1, characterized in that, The surface of the heat spreader (4) used to connect with the direct cooling plate (1) is the contact surface, and the contact surface is provided with a thermally conductive silicon wafer (3).

5. The direct-cooling module according to any one of claims 1-4, characterized in that, The mounting position includes a mounting plane and a mounting groove (11) on the surface of the temperature equalization plate (4); The heat source component (2) is attached to and fixed to the mounting plane, and the mounting groove (11) is used to fix and install the resonant cavity optical fiber.

6. The direct cooling module according to claim 5, characterized in that, The mounting surface is provided with threaded holes for connecting bolts to install the heat source component (2).

7. A direct cooling system, characterized in that, The direct cooling plate (1) of the direct cooling module and the refrigeration system (12) according to any one of claims 1-6 is detachably connected to the heat spreader (4).

8. A laser heat dissipation unit, characterized in that, Includes the chassis and the direct cooling system as described in claim 7; The refrigeration system (12) is located inside the chassis, and the direct cooling plate (1) of the refrigeration system (12) is vertically arranged on the outer side wall of the chassis.

9. The laser heat dissipation unit according to claim 8, characterized in that, The outer wall of the chassis is provided with threaded holes or connecting buckles for connecting the heat exchange plate (4).

10. The laser heat dissipation unit according to claim 8, characterized in that, The heat exchange pipe of the refrigeration system (12) is arranged in close contact with the surface of the direct cooling plate (1) away from the heat equalization plate (4), or the heat exchange pipe is arranged inside the direct cooling plate (1).

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