Semiconductor chip cutting device

Abstract

The utility model discloses a semiconductor chip cutting device which comprises a workbench, a negative pressure dust collection assembly and a negative pressure positioning assembly. The negative pressure dust collecting assembly comprises an assembling table, an assembling avoiding groove is formed in the upper portion of the assembling table, a dust collecting ring is fixedly assembled in the assembling avoiding groove, a pair of partition plates is fixedly assembled in the assembling table, the pair of partition plates and the assembling table are matched to form an exhaust cavity and a pair of purifying and filtering cavities, and exhaust fans are fixedly assembled in the pair of partition plates. The negative pressure positioning assembly comprises a positioning disc, the positioning disc is hollow, and a plurality of evenly-distributed adsorption positioning holes are formed in the upper portion of the positioning disc. According to the semiconductor chip cutting device disclosed by the utility model, the negative pressure dust collection assembly and the negative pressure positioning assembly are arranged, so that chips generated in the semiconductor chip cutting process can be effectively adsorbed, and the reliability of collecting and cleaning the chips generated in the semiconductor chip cutting process by the semiconductor chip cutting device is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor chip cutting technology, and specifically relates to a semiconductor chip cutting device. Background Technology

[0002] A semiconductor chip is an electronic component made of semiconductor materials. Semiconductor chips can achieve certain functions by etching and wiring on semiconductor materials. By being integrated on a silicon wafer, they are small in size and powerful in function, and are often used in computers and other electronic devices.

[0003] Semiconductor chip dicing equipment is a type of device used for dicing semiconductor chips. Chinese utility model patent CN218849429U discloses a semiconductor chip dicing device. This application includes a body, a gantry frame mounted on the top of the body, a dicing device mounted on the gantry frame, a support platform mounted on the top of the body, a top groove with an air intake fan installed inside the top groove, and an inner groove inside the support platform. In this invention, when the air intake fan is turned on, it draws outside air into the inner groove, increasing the air pressure inside the inner groove. Under the action of air pressure, the first connecting plate moves outward, causing the rotating block to rotate, which in turn causes the two clamping plates to move closer together, thus clamping and fixing the semiconductor chip. This facilitates the fixing of semiconductor chips of different sizes and improves dicing efficiency.

[0004] As described in the specification and accompanying drawings, this application uses an air suction fan to adsorb and fix the semiconductor chip during use, and collects and guides the debris generated during the cutting process by airflow along the fan. However, in practical applications, when the semiconductor chip obstructs the air suction fan, the debris generated during the cutting process cannot be collected, resulting in poor debris removal efficiency of the semiconductor chip cutting device.

[0005] Therefore, in order to address the aforementioned technical problems, it is necessary to provide a semiconductor chip dicing apparatus.

[0006] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0007] The purpose of this invention is to provide a semiconductor chip cutting device that can improve the reliability of collecting debris generated during the semiconductor chip cutting process.

[0008] To achieve the above objectives, a specific embodiment of the present invention provides a semiconductor chip cutting device, including: a worktable, a negative pressure dust collection component, and a negative pressure positioning component.

[0009] The negative pressure dust collection component is fixedly mounted above the workbench. The negative pressure dust collection component includes an assembly platform, which is fixedly mounted above the workbench. An assembly clearance groove is provided above the assembly platform, and a dust collection ring is fixedly mounted in the assembly clearance groove. The dust collection ring is hollow, and multiple evenly distributed negative pressure dust collection holes are provided on the inner wall of the dust collection ring. A pair of partitions are fixedly mounted inside the assembly platform. The pair of partitions cooperate with the assembly platform to form an exhaust chamber and a pair of purification and filtration chambers. An exhaust fan is fixedly mounted inside each pair of partitions, and the exhaust chamber and the purification and filtration chamber are connected through the exhaust fan.

[0010] The negative pressure positioning component is fixedly mounted on the top of the workbench. The negative pressure positioning component includes a positioning disk, which is fixedly mounted in the assembly clearance groove. The positioning disk is hollow, and multiple evenly distributed adsorption positioning holes are opened on the top of the positioning disk.

[0011] In one or more embodiments of this utility model, the bottom of the assembly table is integrally formed with a base plate, and a plurality of evenly distributed assembly bolts are fixedly connected between the base plate and the worktable. The assembly table is fixedly assembled above the worktable by the cooperation of the base plate and the assembly bolts.

[0012] In one or more embodiments of this utility model, a pair of vent holes are provided at the bottom of the dust collection ring and above the mounting clearance groove, and the dust collection ring is connected to the purification filter chamber through the vent holes. This facilitates the flow of debris generated on the positioning plate along the negative pressure dust collection holes and vent holes into the purification filter chamber, thereby facilitating the collection and filtration of the debris generated during cutting.

[0013] In one or more embodiments of this utility model, a pair of exhaust screens are fixedly mounted on the outer side of the assembly table, and the exhaust screens are connected to the exhaust chamber. The pair of exhaust screens facilitate the removal of filtered and purified air from the exhaust chamber.

[0014] In one or more embodiments of this utility model, a dust collection box is slidably mounted inside each pair of the purification filter chambers. The dust collection box serves to limit the assembly of the dust filter and the adsorption filter, and at the same time, facilitates the cleaning of the debris filtered out of the debris purification filter chamber by disassembling and assembling the dust collection box. A disassembly handle is fixedly connected to one end of the dust collection box located outside the purification filter chamber. The dust collection box can be easily disassembled and cleaned by applying force to the disassembly handle.

[0015] In one or more embodiments of this utility model, a dust filter and an adsorption filter are fixedly assembled inside the dust collection box. The dust filter separates and separates debris from the dust-laden air collected in the purification filtration chamber. The adsorption filter adsorbs and purifies the dust-laden air in the purification filtration chamber. A mesh frame is fixedly assembled on the outer side of both the dust filter and the adsorption filter, and the mesh frame is inserted into the dust collection box. The mesh frame serves to assemble and fix the dust filter and the adsorption filter.

[0016] In one or more embodiments of this utility model, a plurality of sealing blocks are inserted and assembled above the positioning disk, and the plurality of sealing blocks are all inserted and assembled within the adsorption positioning holes. By sealing the adsorption positioning holes with the sealing blocks, the positioning disk can perform negative pressure positioning of semiconductor chips of different sizes. The upper surfaces of the plurality of sealing blocks are all at the same level as the upper surface of the positioning disk. This reduces the gap between the semiconductor chip and the surface of the positioning disk under the action of the sealing blocks, thereby preventing the semiconductor chip from failing to be adsorbed under negative pressure and ensuring the stability of negative pressure positioning of the semiconductor chip.

[0017] In one or more embodiments of this utility model, an air extraction pipe is fixedly connected to the lower part of the positioning disk. The air extraction pipe is arranged in the exhaust chamber and is connected to the positioning disk. The air extraction pipe serves to connect the positioning disk and the exhaust fan, facilitating the extraction of air from the positioning disk, thereby facilitating negative pressure positioning of the semiconductor chip placed on the positioning disk.

[0018] In one or more embodiments of this utility model, an exhaust fan is fixedly connected to one end of the exhaust pipe located outside the exhaust chamber. By controlling the operation of the exhaust fan, air is extracted from the positioning plate, thereby facilitating negative pressure positioning of the semiconductor chip placed on the positioning plate.

[0019] Compared with the prior art, the semiconductor chip cutting device disclosed in this utility model can effectively adsorb and treat the debris generated during the semiconductor chip cutting process by setting a negative pressure dust collection component and a negative pressure positioning component, thereby improving the reliability of the semiconductor chip cutting device in collecting and cleaning the debris generated during the semiconductor chip cutting process. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1This is a perspective view of a semiconductor chip cutting device according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 Schematic diagram of the structure at point A in the middle;

[0023] Figure 3 This is a front sectional view of a semiconductor chip cutting apparatus according to an embodiment of the present invention;

[0024] Figure 4 for Figure 3 Schematic diagram of the structure at point B;

[0025] Figure 5 This is a side sectional view of a semiconductor chip cutting apparatus according to an embodiment of the present invention;

[0026] Figure 6 for Figure 5 Schematic diagram of the structure at point C.

[0027] Explanation of key figure labels:

[0028] 1-Workbench, 2-Negative pressure dust collection assembly, 201-Assembly table, 202-Dust collection ring, 203-Negative pressure dust collection hole, 204-Partition plate, 205-Exhaust chamber, 206-Purification filter chamber, 207-Exhaust fan, 208-Base plate, 209-Assembly bolt, 210-Exhaust screen, 211-Dust collection box, 212-Disassembly handle, 213-Dust filter screen, 214-Adsorption filter screen, 215-Wire mesh frame, 3-Negative pressure positioning assembly, 301-Positioning plate, 302-Sealing block, 303-Exhaust pipe, 304-Exhaust fan. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0030] like Figures 1 to 6 As shown, a semiconductor chip cutting device according to one embodiment of the present invention includes: a worktable 1, a negative pressure dust collection component 2, and a negative pressure positioning component 3.

[0031] like Figures 1 to 4As shown, the negative pressure dust collection assembly 2 is fixedly mounted above the workbench 1. The negative pressure dust collection assembly 2 includes an assembly table 201, which is fixedly mounted above the workbench 1. The assembly table 201 serves to limit the assembly of the dust collection ring 202 and the positioning plate 301.

[0032] like Figures 1 to 2 As shown, the bottom of the assembly table 201 is integrally formed with a base plate 208, and a plurality of evenly distributed assembly bolts 209 are fixedly connected between the base plate 208 and the worktable 1. The assembly table 201 is fixedly assembled on the worktable 1 by the cooperation of the base plate 208 and the assembly bolts 209.

[0033] Specifically, an assembly clearance groove is provided above the assembly table 201. The assembly clearance groove provides assembly clearance space for the dust collection ring 202 and the positioning plate 301.

[0034] like Figures 1 to 4 As shown, a dust collection ring 202 is fixedly installed inside the assembly clearance groove. The dust collection ring 202 is hollow. Multiple evenly distributed negative pressure dust collection holes 203 are formed on the inner wall of the dust collection ring 202. This facilitates the collection and processing of debris generated during semiconductor chip cutting within the assembly clearance groove through the communication between the negative pressure dust collection holes 203 and the dust collection ring 202.

[0035] like Figures 3 to 4 As shown, a pair of vent holes are provided at the bottom of the dust collection ring 202 and above the mounting clearance groove. The dust collection ring 202 is connected to the purification filter chamber 206 through the vent holes. This facilitates the flow of debris generated on the positioning plate 301 along the negative pressure dust collection hole 203 and the vent holes into the purification filter chamber 206, thereby facilitating the collection and filtration of the debris generated during cutting.

[0036] like Figures 3 to 6 As shown, a pair of partitions 204 are fixedly installed inside the assembly table 201. The pair of partitions 204 cooperate with the assembly table 201 to form an exhaust chamber 205 and a pair of purification filter chambers 206. The pair of purification filter chambers 206 collect and guide the semiconductor chip cutting debris collected in the dust collection ring 202. The filtered dust-laden air is discharged through the exhaust chamber 205.

[0037] like Figures 3 to 6 As shown, each of the pair of partitions 204 is fixedly equipped with an exhaust fan 207, and the exhaust chamber 205 and the purification filter chamber 206 are connected through the exhaust fan 207. By controlling the operation of the exhaust fan 207, air is drawn from the purification filter chamber 206, thereby facilitating the formation of the negative pressure required for dust collection in the purification filter chamber 206, ensuring the stability of collecting semiconductor chip cutting debris in the assembly clearance slot.

[0038] like Figures 3 to 6As shown, a pair of exhaust screens 210 are fixedly mounted on the outer side of the assembly table 201, and the exhaust screens 210 are connected to the exhaust chamber 205. The pair of exhaust screens 210 are used to exhaust the filtered and purified air in the exhaust chamber 205, thereby facilitating the exhaust of the air in the purification filter chamber 206.

[0039] like Figures 3 to 4 As shown, a dust collection box 211 is slidably installed in each of the pair of purification filter chambers 206. The dust collection box 211 serves to limit the assembly of the dust filter screen 213 and the adsorption filter screen 214, and at the same time, it facilitates the cleaning of the debris filtered out in the debris purification filter chamber 206 by disassembling and assembling the dust collection box 211.

[0040] like Figures 1 to 2 As shown, a disassembly handle 212 is fixedly connected to one end of the dust collection box 211 located outside the purification filter chamber 206. The dust collection box 211 can be easily disassembled and cleaned by applying force to the disassembly handle 212.

[0041] like Figures 3 to 4 As shown, a dust collection box 211 is fixedly equipped with a dust filter 213 and an adsorption filter 214. The dust filter 213 filters and separates debris from the dust-laden air collected in the purification filtration chamber 206. The adsorption filter 214 adsorbs and purifies the dust-laden air in the purification filtration chamber 206. A mesh frame 215 is fixedly installed on the outer side of both the dust filter 213 and the adsorption filter 214, and the mesh frame 215 is inserted into the dust collection box 211. The mesh frame 215 serves to assemble and fix the dust filter 213 and the adsorption filter 214.

[0042] like Figures 3 to 6 As shown, the negative pressure positioning component 3 is fixedly mounted above the worktable 1. The negative pressure positioning component 3 includes a positioning disk 301, which is fixedly mounted in the assembly clearance groove. The positioning disk 301 supports and limits the semiconductor chip.

[0043] Specifically, the positioning disk 301 is hollow, and multiple evenly distributed adsorption positioning holes are opened on the top of the positioning disk 301. By extracting the air from the positioning disk 301, the semiconductor chip placed on the positioning disk 301 is adsorbed and fixed through the adsorption positioning holes.

[0044] like Figures 5 to 6 As shown, multiple sealing blocks 302 are inserted and assembled on the top of the positioning disk 301, and the multiple sealing blocks 302 are all inserted and assembled in the adsorption positioning hole. By sealing the adsorption positioning hole with the sealing blocks 302, the positioning disk 301 can perform negative pressure positioning on semiconductor chips of different sizes.

[0045] Specifically, the upper surfaces of the multiple sealing blocks 302 are all at the same level as the upper surface of the positioning disk 301. This reduces the gap between the semiconductor chip and the surface of the positioning disk 301 under the action of the sealing blocks 302, thereby preventing the semiconductor chip from failing to be attracted by negative pressure and ensuring the stability of negative pressure positioning of the semiconductor chip.

[0046] like Figures 5 to 6 As shown, an air extraction pipe 303 is fixedly connected to the lower part of the positioning disk 301. The air extraction pipe 303 is arranged in the exhaust chamber 205 and is connected to the positioning disk 301. The air extraction pipe 303 serves to connect the positioning disk 301 and the exhaust fan 304, facilitating the extraction of air from the positioning disk 301, thereby facilitating negative pressure positioning of the semiconductor chip placed on the positioning disk 301.

[0047] like Figure 1 As shown, an exhaust fan 304 is fixedly connected to one end of the exhaust pipe 303 outside the exhaust chamber 205. By controlling the operation of the exhaust fan 304, air is extracted from the positioning disk 301, thereby facilitating negative pressure positioning of the semiconductor chip placed on the positioning disk 301.

[0048] In practical use, depending on the specific size of the semiconductor chip, the sealing block 302 can be used to seal the adsorption positioning holes on the positioning disk 301 that are not covered by the semiconductor chip. Then, the semiconductor chip can be placed on top of the positioning disk 301, and the air inside the positioning disk 301 can be extracted by controlling the operation of the exhaust fan 304, thereby performing negative pressure positioning of the semiconductor chip placed on the positioning disk 301 through multiple adsorption positioning holes.

[0049] During the semiconductor chip cutting process, the air in the purification filter chamber 206 can be extracted by controlling the operation of the exhaust fan 207. This continuous extraction of air from the purification filter chamber 206 causes debris from the assembly clearance groove to be collected into the purification filter chamber 206 via the negative pressure dust collection hole 203 and the ventilation hole. Furthermore, after being filtered and adsorbed by the dust filter screen 213 and the adsorption filter screen 214, the debris is discharged along the exhaust chamber 205 and the exhaust screen 210, ensuring the stability of the collection and processing of semiconductor chip debris.

[0050] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0051] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor chip dicing apparatus, characterized in that, include: Workbench; A negative pressure dust collection assembly is fixedly mounted above the workbench. The negative pressure dust collection assembly includes an assembly platform, which is fixedly mounted above the workbench. An assembly clearance groove is provided above the assembly platform, and a dust collection ring is fixedly mounted in the assembly clearance groove. The dust collection ring is hollow, and multiple evenly distributed negative pressure dust collection holes are provided on the inner wall of the dust collection ring. A pair of partitions are fixedly mounted inside the assembly platform. The pair of partitions cooperate with the assembly platform to form an exhaust chamber and a pair of purification and filtration chambers. An exhaust fan is fixedly mounted inside each pair of partitions, and the exhaust chamber and the purification and filtration chamber are connected through the exhaust fan. A negative pressure positioning component is fixedly mounted on the top of the workbench. The negative pressure positioning component includes a positioning disk, which is fixedly mounted in the assembly clearance groove. The positioning disk is hollow, and multiple evenly distributed adsorption positioning holes are opened on the top of the positioning disk.

2. The semiconductor chip dicing apparatus according to claim 1, characterized in that, The bottom of the assembly table is integrally formed with a base plate, and the base plate is fixedly connected to the workbench with a number of evenly distributed assembly bolts.

3. The semiconductor chip dicing apparatus according to claim 1, characterized in that, A pair of vent holes are provided at the bottom of the dust collection ring and above the mounting clearance groove. The dust collection ring is connected to the purification filter chamber through the vent holes.

4. The semiconductor chip dicing apparatus according to claim 1, characterized in that, A pair of exhaust screens are fixedly mounted on the outer side of the assembly table, and the exhaust screens are connected to the exhaust chamber.

5. A semiconductor chip dicing apparatus according to claim 1, characterized in that, Each of the two purification filter chambers is slidably fitted with a dust collection box, and the end of the dust collection box located outside the purification filter chamber is fixedly connected with a disassembly handle.

6. A semiconductor chip dicing apparatus according to claim 5, characterized in that, The dust collection box is fixedly equipped with a dust filter and an adsorption filter. Both the dust filter and the adsorption filter are fixedly equipped with a mesh frame on their outer sides, and the mesh frame is inserted into the dust collection box.

7. The semiconductor chip dicing apparatus according to claim 1, characterized in that, Multiple sealing blocks are inserted and assembled on the upper part of the positioning disk. The multiple sealing blocks are inserted and assembled in the adsorption positioning hole, and the upper surface of the multiple sealing blocks is at the same level as the upper surface of the positioning disk.

8. A semiconductor chip dicing apparatus according to claim 1, characterized in that, An air extraction pipe is fixedly connected to the bottom of the positioning plate. The air extraction pipe is laid in the exhaust chamber and is connected to the positioning plate.

9. A semiconductor chip dicing apparatus according to claim 8, characterized in that, A blower is fixedly connected to one end of the exhaust pipe located outside the exhaust chamber.

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