Water pump bottom cover liquid cooling structure

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a liquid cooling structure of a water pump bottom cover, which adopts cooling liquid in a pump to flow, reduces the temperature of a PCBA (Printed Circuit Board Assembly) and does not additionally increase power consumption. Comprising a water pump shell and a bottom cover, the water pump shell is connected with the bottom cover, a heat dissipation structure is arranged in the bottom cover, a wet area part is arranged in the water pump shell, a PCBA is connected to the bottom cover through screws, and heat is conducted to the bottom cover through heat dissipation glue in the middle of the PCBA.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of heat dissipation, in particular to a water pump bottom cover liquid cooling structure. BACKGROUND

[0002] The electric vehicle is green and environment-friendly, light and fast, and more and more consumers tend to choose the electric vehicle when going out for a short distance. The electric vehicle controller is one of the core components of the electric vehicle, which is used to control the start, stop, acceleration and deceleration of the electric vehicle, and is equivalent to the brain of the electric vehicle. The quality of the electric vehicle controller reflects the quality of the electric vehicle. For example, the electric vehicle controller and the electric vehicle disclosed in the prior art with the announcement number CN219981271U comprise a heat dissipation shell, a first circuit board, a second circuit board and a wiring seat. An installation cavity is formed in the heat dissipation shell. The first circuit board is arranged in the installation cavity. The first circuit board is provided with a pin, a capacitor and a power tube. The second circuit board is arranged in the installation cavity and is stacked with the first circuit board. The second circuit board is provided with a female connector matched with the pin. The wiring seat is arranged on the first circuit board. A plurality of conductive sheets are arranged on the wiring seat. One end of the conductive sheet is connected with the first circuit board. The other end of the conductive sheet is exposed on the wiring seat. However, the high temperature of the controller can easily affect the stability of the water pump and the service life of the components. SUMMARY

[0003] To solve the above technical problems, the utility model provides a water pump bottom cover liquid cooling structure which uses the cooling liquid in the pump to reduce the temperature of PCBA and does not need to increase the power consumption.

[0004] The water pump bottom cover liquid cooling structure comprises a water pump shell and a bottom cover. The water pump shell is connected with the bottom cover. The bottom cover is provided with a heat dissipation structure. The water pump shell is internally provided with a wet area. The PCBA is connected with the bottom cover through screws. The heat is conducted to the bottom cover through the heat dissipation glue. The cooling liquid in the wet area flows in the heat dissipation structure to control the temperature without increasing the power. The PCBA is connected with the bottom cover through screws. The bottom cover made of metal is in contact with the air to achieve better heat dissipation effect. The assembly is simple, firm and convenient for production and installation.

[0005] Preferably, the heat dissipation structure in the bottom cover is that a cooling water channel is arranged in the bottom cover. Cooling liquid inlet and outlet holes are arranged in the wet area of the water pump shell and are communicated with the cooling water channel. The cooling liquid in the wet area flows in the cooling water channel through the cooling liquid inlet and outlet holes to control the temperature without increasing the power.

[0006] Preferably, a sealing ring is arranged at the connection between the bottom cover and the wet area and is axially extruded to seal. The effect is reliable and durable and will not leak.

[0007] Preferably, a water path plug is installed at the tail end of the cooling water path; unscrewing the water path plug can open the cooling water path, facilitating cleaning of the interior thereof.

[0008] Compared with the prior art, the utility model has the advantages that: the cooling liquid in the wet area part flows in the heat dissipation structure to take away the temperature, without additional power, the PCBA is connected on the bottom cover through the screw, the bottom cover of metal material contacts with the air, better heat dissipation effect is achieved, simple assembly, firm fixation, convenient production and installation. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 It is the appearance structure schematic diagram of the utility model;

[0010] Figure 2 It is the structure schematic diagram of the cooling water path of the utility model;

[0011] Figure 3 It is the structure schematic diagram of the wet area part of the utility model;

[0012] Figure 4 It is the internal structure schematic diagram of the bottom cover of the utility model;

[0013] Figure 5 It is the cross section structure schematic diagram of the utility model;

[0014] Markings in the drawings: 1, water pump casing;2, bottom cover;3, cooling water path;4, water path plug;5, sealing ring;6, wet area part;7, cooling liquid inlet and outlet hole. DETAILED DESCRIPTION

[0015] In order to facilitate understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The utility model can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0016] As Figures 1 to 5 Shown, water pump casing 1 and bottom cover 2 are connected, and the water pump casing 1 has a wet area part 6 inside, and the PCBA is connected on the bottom cover 2 through the screw, and the heat is conducted to the bottom cover 2 through the heat dissipation glue in the middle, the bottom cover 2 is provided with a cooling water path 3 inside, the wet area part 6 of the water pump casing 1 is provided with a cooling liquid inlet and outlet hole 7 in communication with the cooling water path 3, the bottom cover 2 is provided with a sealing ring 5 at the connection with the wet area part 6, and the axial extrusion sealing is adopted, and the tail end of the cooling water path 3 is provided with a water path plug 4;

[0017] The PCBA is connected on the bottom cover 2 through screws, the bottom cover 2 made of metal material contacts with air, better heat dissipation effect is achieved, the cooling liquid in the wet area part 6 flows into the cooling water channel 3 through the cooling liquid inlet and outlet hole 7 to control temperature, power is not additionally increased, the cooling water channel 3 can be opened by unscrewing the water channel plug 4, and the inside is convenient to clean.

[0018] As shown in Figures 1 to 5 The utility model discloses a water pump bottom cover liquid cooling structure, when working, PCBA is connected on the bottom cover 2 through screws, heat is conducted to the bottom cover 2 through the heat dissipation gum in the middle, finally by cooling liquid flow control temperature, air carries away temperature, the bottom cover 2 back also can increase the heat dissipation effect by increasing the area mode.

[0019] The above only is the preferred implementation of the utility model, should point out, for ordinary technical personnel in this technical field, on the premise of not departing from the technical principle of the utility model, can also make a number of improvements and variations, these improvements and variations also should be regarded as the protection range of the utility model.

Claims

1. A water pump base cover liquid cooling structure characterized by comprising: Including water pump casing (1) and bottom cover (2), water pump casing (1) is connected with bottom cover (2), and bottom cover (2) has heat dissipation structure, water pump casing (1) has wet area part (6) inside, PCBA is connected on bottom cover (2) by screw, and heat is conducted to bottom cover (2) by heat dissipation glue in the middle;The heat dissipation structure in the bottom cover (2) is that the cooling water channel (3) is set in the bottom cover (2) inside, and the cooling liquid inlet and outlet hole (7) that is communicated with the cooling water channel (3) is set in the wet area part (6) of water pump casing (1).

2. The water pump base cover liquid cooling structure according to claim 1, wherein The bottom cover (2) is provided with a sealing ring (5) at the connecting position of the bottom cover (2) and the wet area part (6), and an axial extrusion sealing is adopted.

3. The water pump base cover liquid cooling structure of claim 1, wherein, The tail end of the cooling water channel (3) is provided with a water channel plug (4).

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