Wafer transmission platform

Abstract

The utility model provides a wafer transmission platform which comprises a process cabin part, one side of the process cabin part is fixedly connected with a sealing mechanism, and one side of the sealing mechanism is fixedly connected with a transmission mechanism. The sealing mechanism comprises a first shell, the lower end of the first shell is an inclined plane, the inclined plane is attached to the inclined plane of the process cabin, a sealing plate is arranged in the first shell, and an air cylinder is fixedly connected to the upper end of the first shell; the conveying device comprises a second shell, a sliding block is slidably arranged in the second shell, a manipulator is fixedly connected to one side of the sliding block, a cylinder is fixedly connected to the upper end of the sliding block, a driving motor is fixedly connected to the lower end of the second shell, and a push rod is fixedly connected to the output end of the driving motor. A groove hole is formed in the middle of the push rod, and the cylinder is matched in the groove hole. The device has the advantages of being simple in structure and easy to produce and overhaul.

Description

TECHNICAL FIELD

[0001] The present application relates to wafer transmission technology field, especially to a wafer transmission platform. BACKGROUND

[0002] Etching, it is a semiconductor manufacturing process, microelectronic IC manufacturing process and micro-nano manufacturing process a quite important step. Etching is a process of selectively removing unwanted material from the surface of a silicon wafer by chemical or physical methods, and the basic goal is to correctly copy the mask pattern on the coated silicon wafer.

[0003] The transmission mechanism is installed on one side of the process cabin, and the process cabin is transmitted to the wafer, so that the wafer can be quickly etched. The structure of the transmission mechanism is complex, which is not suitable for small-scale enterprises. In addition, in order to ensure the sealing of the process cabin, a sealing structure is arranged between the transmission mechanism and the process cabin. However, the existing sealing structure is associated with the process cabin, which is not convenient for disassembly, maintenance and replacement. SUMMARY

[0004] In order to solve the above problems, the present application discloses a wafer transmission platform, which comprises a process cabin, one side of the process cabin is fixedly connected with a sealing mechanism, one side of the sealing mechanism is fixedly connected with a transmission mechanism, and a channel passing through the sealing mechanism is arranged between the process cabin and the transmission mechanism. The wafer is placed in the transmission mechanism and sent into the process cabin through the channel, and finally the sealing mechanism acts to seal and isolate the process cabin and the transmission mechanism.

[0005] The sealing mechanism comprises a first housing, the lower end of the first housing is a slope, and the slope is attached to the slope of the process cabin, the inside of the first housing is provided with a sealing plate, the upper end of the first housing is fixedly connected with a gas cylinder, the output end of the gas cylinder is fixedly connected with the sealing plate, and the sealing plate is attached to the slope of the process cabin under the pushing of the gas cylinder. The sealing plate and the gas cylinder are arranged opposite to the slope of the process cabin, which ensures that the sealing plate is opposite to the clamping pressure and ensures the sealing property. At the same time, the inclined arrangement of the sealing mechanism simplifies the maintenance and replacement.

[0006] The transmission mechanism comprises a second housing, a sliding block is slidably arranged in the second housing, a mechanical hand is fixedly connected to one side of the sliding block, a cylinder is fixedly connected to the upper end of the sliding block, a driving motor is fixedly connected to the lower end of the second housing, the output end of the driving motor extends to the inside of the second housing, a push rod is fixedly connected to the output end of the driving motor, a slot hole is formed in the middle of the push rod, and the cylinder is fitted in the slot hole. The wafer is placed on the mechanical arm, and then the driving motor is started. The push rod rotates and pushes the sliding block to move, and the wafer is pushed into the inside of the process cabin. Relatively, in the process of rotating the push rod, the cylinder is slidably arranged in the slot hole.

[0007] Preferably, the upper end of the first shell is fixedly connected with a mounting plate, the upper end of the mounting plate is fixedly connected with a connecting sleeve, and the cylinder is fixedly connected to the upper end of the connecting sleeve. The first shell is provided through the upper and lower ends, and the mounting plate seals the upper end of the first shell, that is, when the mounting plate is removed, the sealing plate can be removed.

[0008] Preferably, the inner wall of the connecting sleeve is provided with a connecting rod, one end of the connecting rod is fixedly connected with the sealing plate, and the other end is fixedly connected with the output end of the cylinder.

[0009] Preferably, a metal bellows is sleeved on the outer side of the connecting rod, one end of the metal bellows is fixedly connected to the protruding ring provided on the side wall of the connecting rod, the other end of the metal bellows is fixedly connected with a mounting ring, and the mounting ring is fixedly connected to the mounting plate. The metal bellows plays a sealing role.

[0010] Preferably, the second shell is provided with a sliding rail inside, and a sliding block is slidingly fitted on the sliding rail. The sliding rail is provided to improve the sliding effect of the sliding block.

[0011] The beneficial effects of the present application are as follows:

[0012] 1. When the sealing mechanism is damaged, only the mounting plate needs to be disassembled to open and replace, and the cylinder also only needs to be directly disassembled and replaced, without the need to disassemble the process cabin and the conveying mechanism. In addition, the sealing plate is provided obliquely, and the connecting rod, the metal bellows and the like ensure the sealable consumption.

[0013] 2. The conveying mechanism is simple in structure and easy to produce and manufacture. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a perspective view of the present application;

[0015] Figure 2 is a perspective view of the process cabin of the present application;

[0016] Figure 3 is a bottom view of the sealing mechanism of the present application;

[0017] Figure 4 is a sectional view of the present application;

[0018] Figure 5 is Figure 4 is an enlarged view of A in FIG. 4.

[0019] LIST OF REFERENCE NUMBERS:

[0020] 1. process cabin; 2. sealing mechanism; 3. conveying mechanism;

[0021] 21, first housing; 22, sealing plate; 23, mounting plate; 24, air cylinder; 25, connecting sleeve; 26, metal bellows; 27, connecting rod; 31, second housing; 32, drive motor; 33, push rod; 34, mechanical hand; 35, sliding block. DETAILED DESCRIPTION

[0022] The present application will be further clarified by the following examples, which should be considered as merely illustrative of the present application and not in limitation of the present application's scope. It should be understood that the words "front," "back," "left," "right," "upper," and "lower" described below refer to the directions in the drawings. The words "inner" and "outer" refer to the directions toward or away from the geometric center of a particular component.

[0023] As shown in Figures 1 to 5 A wafer transmission platform, comprising a process cabin 1, the process cabin 1 is a cuboid structure as a whole, and is internally provided with a process cabin chamber, one side of the process cabin 1 is fixedly connected with a sealing mechanism 2, one side of the sealing mechanism 2 is fixedly connected with a transmission mechanism 3, and a channel is provided between the process cabin 1 and the transmission mechanism 3 through the sealing mechanism 2. In use, the wafer is placed in the transmission mechanism 3, and then pushed into the process cabin 1.

[0024] The sealing mechanism 2 comprises a first housing 21, the lower end of the first housing 21 is a slope, and the slope is fitted on the slope of the process cabin 1, that is, the sealing mechanism 2 is in an inclined posture as a whole, the inside of the first housing 21 is provided with a sealing plate 22, the upper end of the first housing 21 is fixedly connected with an air cylinder 24, the output end of the air cylinder 24 is fixedly connected with the sealing plate 22, and under the pushing of the air cylinder 24, the sealing plate 22 is abutted on the slope of the process cabin 1. When the sealing mechanism 2 is in action, the sealing plate 22 is close to or away from the workpiece cabin 1 under the action of the air cylinder 24, thereby realizing the opening and closing of the channel. The inclined arrangement is conducive to the sealing of the sealing plate 22 abutting on the process cabin 1, and at the same time, the inclined arrangement is conducive to the disassembly and replacement of parts.

[0025] The transmission mechanism 3 comprises a second housing 31, the second housing 31 is a cuboid component with an open upper end, a sliding block 35 is slidably arranged in the inside of the second housing 31, the sliding block 35 is fixedly connected with a mechanical hand 34 on one side, the upper end of the sliding block 35 is fixedly connected with a cylinder, the lower end of the second housing 31 is fixedly connected with a drive motor 32, the output end of the drive motor 32 extends to the inside of the second housing 31, and a dynamic seal such as a magnetic fluid seal is arranged between the output end of the drive motor 32 and the second housing 31, the output end of the drive motor 32 is fixedly connected with a push rod 33, the push rod 33 is provided with a slot hole in the middle, and the cylinder is fitted in the slot hole.

[0026] When the transmission mechanism 3 works, the wafer is placed on the mechanical hand 34, then the driving motor 32 is started, the push rod 33 rotates, the sliding block 35 is moved by the cylinder, and the wafer is sent into the process cabin piece 1.

[0027] The upper end of the first shell 21 is fixedly connected with a mounting plate 23, the mounting plate 23 blocks the upper end of the first shell 21, the upper end of the mounting plate 23 is fixedly connected with a connecting sleeve 25, and the cylinder 24 is fixedly connected to the upper end of the connecting sleeve 25.

[0028] The inner wall of the connecting sleeve 25 is provided with a connecting rod 27, one end of the connecting rod 27 is fixedly connected with the sealing plate 22, and the other end is fixedly connected with the output end of the cylinder 24. The connecting rod 27 indirectly connects the sealing plate 22 and the cylinder 24.

[0029] The outer side of the connecting rod 27 is sleeved with a metal bellow 26, one end of the metal bellow 26 is fixedly connected to a protruding ring arranged on the side wall of the connecting rod 27, that is, the metal bellow 26 and the connecting rod 27 are sealed at this end, the other end of the metal bellow 26 is fixedly connected with a mounting ring, and this end is also sealed, and the mounting ring is fixedly connected to the mounting plate 23. The metal bellow 26 is arranged to ensure sealing during the movement of the connecting rod 27.

[0030] That is, the wafer is placed in the second shell 31, then the second shell 31 is vacuumized, the vacuum degree between the second shell 31 and the process cabin piece 1 is the same, then the cylinder 24 is actuated, the sealing plate 22 is away from the process cabin piece 1, then the driving motor 32 is actuated to push the wafer into the process cabin piece 1, the mechanical hand 34 is reset, and the cylinder is actuated again, the sealing plate 22 is blocked to realize sealing.

[0031] The second shell 31 is provided with a sliding rail, and the sliding block 35 is slidingly fitted on the sliding rail, and the sliding rail ensures smooth sliding of the sliding block 35.

[0032] The technical means disclosed in the scheme of the present application is not limited to the technical means disclosed in the above-mentioned embodiments, and also includes the technical solutions composed of any combination of the above technical features.

Claims

1. A wafer transport platform, characterized in that, The process compartment (1) is fixedly connected to a sealing mechanism (2) on one side, and a transmission mechanism (3) is fixedly connected to one side of the sealing mechanism (2). A channel passing through the sealing mechanism (2) is provided between the process compartment (1) and the transmission mechanism (3). The sealing mechanism (2) includes a first housing (21), the lower end of the first housing (21) is an inclined surface, and the inclined surface is attached to the inclined surface of the process compartment (1). A sealing plate (22) is provided inside the first housing (21). A cylinder (24) is fixedly connected to the upper end of the first housing (21). The output end of the cylinder (24) is fixedly connected to the sealing plate (22), and under the push of the cylinder (24), the sealing plate (22) is attached to the inclined surface of the process compartment (1). The transmission mechanism (3) includes a second housing (31), a slider (35) is slidably arranged inside the second housing (31), a robot arm (34) is fixedly connected to one side of the slider (35), a cylinder is fixedly connected to the upper end of the slider (35), a drive motor (32) is fixedly connected to the lower end of the second housing (31), the output end of the drive motor (32) extends through into the interior of the second housing (31), a push rod (33) is fixedly connected to the output end of the drive motor (32), a slot is provided in the middle of the push rod (33), and the cylinder fits in the slot.

2. The wafer transport platform according to claim 1, characterized in that: The upper end of the first housing (21) is fixedly connected to a mounting plate (23), the upper end of the mounting plate (23) is fixedly connected to a connecting sleeve (25), and the cylinder (24) is fixedly connected to the upper end of the connecting sleeve (25).

3. The wafer transport platform according to claim 2, characterized in that: The inner wall of the connecting sleeve (25) is provided with a connecting rod (27), one end of the connecting rod (27) is fixedly connected to the sealing plate (22), and the other end is fixedly connected to the output end of the cylinder (24).

4. A wafer transport platform according to claim 3, characterized in that: A metal bellows (26) is sleeved on the outside of the connecting rod (27). One end of the metal bellows (26) is fixedly connected to a pre-set convex ring on the side wall of the connecting rod (27). The other end of the metal bellows (26) is fixedly connected to an installation ring, and the installation ring is fixedly connected to the mounting plate (23).

5. A wafer transport platform according to claim 1, characterized in that: The second housing (31) has a slide rail inside, and the slider (35) slides on the slide rail.

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