Water-stain-free wafer soldering flux cleaning and drying device

Abstract

The utility model relates to a water-stain-free wafer scaling powder cleaning and drying device which comprises a material moving device, a material disc, a scaling powder cleaning machine, a vacuum processing mechanism, an oven, a heating plate and an electric control box. The electric cabinet is connected with the material moving device, the material moving device is located between the material disc and the scaling powder cleaning machine, and the scaling powder cleaning machine, the vacuum processing mechanism, the oven and the heating plate are located on the same side of the material moving device. The utility model has the advantages that: (1) by arranging the vacuum processing mechanism, water stains on the surface of the wafer are removed, and black spots on the surface of the wafer are reduced; (2) before the heating plate is used for drying, an oven is arranged for pre-baking, so that the effect of removing water mist on the surface of the wafer is further achieved, and the drying efficiency is also improved; and (3) enabling the wafer to sequentially flow on a cleaning station, a water stain removing station, a pre-drying station and a drying station by using a material moving device, so as to realize automatic and rapid cleaning of the wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a water-free wafer flux cleaning and drying device. Background Technology

[0002] Flux plays a crucial role in removing oxide layers and improving soldering quality during wafer soldering. However, residual flux can negatively impact wafer performance and reliability, necessitating thorough removal through a cleaning process. Generally, a specialized flux cleaning machine is used to remove residual flux from the wafer surface. During flux cleaning, high-pressure water splashes onto the inlet baffle plate. As the cleaned wafer is conveyed out of the cleaning equipment, water droplets from the baffle plate drip onto the wafer. During drying at the heating plate, small black spots and other contaminants form on the wafer surface, affecting wafer quality. Utility Model Content

[0003] The purpose of this invention is to provide a water-free wafer flux cleaning and drying device, which can improve the cleaning and drying effect of wafers.

[0004] To achieve the above-mentioned utility model objectives, this utility model provides a water-free wafer flux cleaning and drying device, including a transfer device, a material tray, a flux cleaning machine, a vacuum processing mechanism, an oven, a heating plate, and an electrical control box; the electrical control box is connected to the transfer device, the transfer device is located between the material tray and the flux cleaning machine, and the flux cleaning machine, the vacuum processing mechanism, the oven, and the heating plate are located on the same side of the transfer device.

[0005] As a further improvement of the utility model, the vacuum processing mechanism includes a vacuum pump and a vacuum chamber, the vacuum pump being connected to the vacuum chamber and the vacuum pump being connected to the electrical control box.

[0006] Furthermore, the flux cleaning machine and the vacuum treatment mechanism are each provided in more than one form.

[0007] Furthermore, a pressure sensor is installed inside the vacuum chamber, and the pressure sensor is connected to the electrical control box.

[0008] Furthermore, the electrical control box is connected to an alarm.

[0009] As a further improvement to the utility model, the oven is a semiconductor oven.

[0010] This invention discloses a water-stain-free wafer flux cleaning and drying device. The transfer device is a conventional robotic arm. The control box sends instructions to the transfer device according to a program. The transfer device first moves the wafers from the tray to a flux cleaning machine, which is an existing device with flux cleaning function, to clean the flux from the wafers. The transfer device then places the washed wafers into a vacuum treatment mechanism. In the vacuum environment, contaminants and water stains on the wafer surface gradually detach due to the diffusion of gas molecules. As the vacuum time increases, the contaminants and water stains on the wafer surface are gradually cleaned, thus completing the removal of water stains from the wafer surface. The transfer device then transfers the water-stain-free wafers to an oven for further baking to remove any remaining small amount of water mist from the wafer surface. Finally, the transfer device places the baked wafers on a heating plate for final drying.

[0011] The advantages of this water-stain-free wafer flux cleaning and drying device compared to existing technologies are as follows:

[0012] (1) By setting up a vacuum processing mechanism, water stains on the wafer surface are removed, reducing the formation of black spots on the wafer surface;

[0013] (2) Before drying the heating plate, set up an oven for pre-baking to further remove water mist from the wafer surface and improve drying efficiency.

[0014] (3) The wafer is transferred sequentially through the cleaning, dewatering, pre-drying and drying stations using a transfer device to achieve automated and rapid wafer cleaning. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a water-free wafer flux cleaning and drying device according to the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of a water-free wafer flux cleaning and drying device according to the present invention;

[0017] Figure 3 This is a schematic diagram of the air pressure control for the vacuum processing mechanism. Detailed Implementation

[0018] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0019] like Figure 1-2As shown, this utility model discloses a water-free wafer flux cleaning and drying device, including a material transfer device 1, a material tray 2, a flux cleaning machine 3, a vacuum processing mechanism 4, an oven 5, a heating plate 6, and an electrical control box 7. The electrical control box 7 is connected to the material transfer device 1, which is located between the material tray 2 and the flux cleaning machine 3. The flux cleaning machine 3, the vacuum processing mechanism 4, the oven 5, and the heating plate 6 are located on the same side of the material transfer device 1, which facilitates the orderly picking and dropping of materials by the material transfer device 1 in each device.

[0020] This invention discloses a water-stain-free wafer flux cleaning and drying device. The transfer device 1 is a conventional robotic arm. The control box 7 sends instructions to the transfer device 1 according to a program. The transfer device 1 first moves the wafer 8 from the tray 2 to the flux cleaning machine 3, which is an existing device with flux cleaning function, to clean the flux from the wafer 8. The transfer device 1 then places the washed wafer 8 into a vacuum treatment mechanism 4. In a vacuum environment, contaminants and water stains on the surface of the wafer 8 gradually detach due to the diffusion of gas molecules. As the vacuum time increases, the contaminants and water stains on the surface of the wafer 8 are gradually cleaned, thus completing the removal of water stains from the wafer surface. The transfer device 1 then transfers the water-stain-free wafer 8 to an oven 5 for further baking to remove any remaining small amount of water mist from the surface of the wafer 8. Finally, the transfer device 1 places the baked wafer 8 on a heating plate 6 for final drying.

[0021] like Figure 3 As shown, the vacuum processing mechanism 4 includes a vacuum pump 41 and a vacuum chamber 42. The vacuum pump 41 is connected to the vacuum chamber 42 and to the electrical control box 7. When the vacuum pump 41 receives a command from the electrical control box 7, it starts to pump the gas in the vacuum chamber 42 to a vacuum level of 0.5 to 1.5 MPa (megapascals), thus creating a certain vacuum environment.

[0022] The principle behind the vacuum processing unit 4 in removing water stains from wafer 8 primarily relies on the diffusion of gas molecules under vacuum conditions. Under normal atmospheric pressure, gas molecules are difficult to detach from the surface of an object due to air pressure. However, in a vacuum environment, the speed of gas molecules increases, and the frequency of collisions decreases. Therefore, contaminants and water stains on the surface of wafer 8 are more easily removed. After wafer 8 is placed in a vacuum environment for 40 minutes, the contaminants and water stains on its surface will gradually detach due to the diffusion of gas molecules and be sucked away by vacuum pump 41. As the vacuuming time continues, the contaminants and water stains on the surface of wafer 8 will be gradually cleaned. However, to ensure the effectiveness of water stain removal on the surface of wafer 8, wafer 8 needs to be placed in a vacuum environment for a relatively long time, resulting in a longer waiting time for subsequent wafer processing.

[0023] The flux cleaning machine 3 and the vacuum treatment mechanism 4 are set up in more than one way. The flux cleaning machine 3 and the vacuum treatment mechanism 4 are paired up one by one. The electrical control box 7 controls the transfer device 1 to place the wafer 8 after being washed by the flux cleaning machine 3 into the corresponding vacuum treatment mechanism 4 to remove water stains. Setting up multiple combinations of cleaning and water stain treatment can reduce the waiting time for subsequent drying and speed up the production line efficiency.

[0024] Before removing material from the vacuum processing unit 4, the vacuum pump 41 needs to be turned off, and the gas in the chamber needs to be refilled to restore normal pressure. This is to prevent excessive pressure difference between the inside and outside of the vacuum chamber 42, which could damage the wafer 8. A pressure sensor 43 is installed inside the vacuum chamber 42 and is connected to the electrical control box 7. The pressure sensor 43 monitors the pressure value inside the vacuum chamber 42 in real time, ensuring that the pressure difference between the inside and outside of the chamber is within a suitable range when the vacuum chamber 42 is opened before material removal, thus avoiding damage to the wafer 8. The electrical control box 7 is connected to an alarm 9. The pressure sensor 43 converts the sensed force signal into an electrical signal and transmits it to the electrical control box 7. When the pressure in the vacuum chamber 42 is not within the preset suitable range, the alarm 9 receives the instruction and sounds an alarm, reminding management personnel to handle the situation promptly. This reduces the product loss rate caused by inaccurate pressure difference control to a certain extent.

[0025] Oven 5 is preferably a semiconductor oven. Semiconductor ovens are high-precision and high-stability heat treatment equipment specifically designed for chip baking, packaging and curing. Its main function is to perform precise heat treatment on the wafer through processes such as preheating, heating, heat preservation and cooling, and further remove water mist from the surface of the wafer 8.

[0026] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A water-stain-free wafer flux cleaning and drying device, characterized in that, The device includes a material transfer device, a material tray, a flux cleaning machine, a vacuum treatment mechanism, an oven, a heating plate, and an electrical control box; the electrical control box is connected to the material transfer device, the material transfer device is located between the material tray and the flux cleaning machine, and the flux cleaning machine, the vacuum treatment mechanism, the oven, and the heating plate are located on the same side of the material transfer device.

2. The water-free wafer flux cleaning and drying device as described in claim 1, characterized in that, The vacuum processing mechanism includes a vacuum pump and a vacuum chamber, the vacuum pump being connected to the vacuum chamber and the vacuum pump being connected to the electrical control box.

3. The water-free wafer flux cleaning and drying device as described in claim 2, characterized in that, The flux cleaning machine and the vacuum treatment mechanism are each provided in more than one instance.

4. The water-free wafer flux cleaning and drying device as described in claim 2, characterized in that, A pressure sensor is installed inside the vacuum chamber, and the pressure sensor is connected to the electrical control box.

5. The water-free wafer flux cleaning and drying apparatus as described in claim 4, characterized in that, The electrical control box is connected to an alarm.

6. The water-free wafer flux cleaning and drying apparatus as described in claim 1, characterized in that, The oven is a semiconductor oven.

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