Semiconductor workpiece drying device

Abstract

The embodiment of the utility model provides a semiconductor workpiece drying device, and relates to the technical field of semiconductor workpiece processing. The semiconductor workpiece drying device comprises a groove body, a groove cover, a supporting assembly and an abutting assembly, the groove body is provided with a containing cavity used for containing a flower basket, and the containing cavity is communicated with an air extractor; the groove cover is hinged to the groove body and located at the open end of the containing cavity so as to be used for rotating to seal the containing cavity. The supporting assembly is arranged on the groove body and located at the bottom of the containing cavity so as to be used for bearing a flower basket loaded with wafers. The abutting assembly is arranged on the supporting assembly, and when the flower basket is placed on the supporting assembly, the wafer is jacked up by the abutting assembly and is separated from the bottom of the flower basket. The drying device provided by the utility model comprises the drying container, a nozzle and an air extractor, wherein the nozzle is connected with an external air source. According to the utility model, the drying effect of the wafer can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor workpiece processing technology, and more specifically, to a semiconductor workpiece drying device. Background Technology

[0002] Wafer cleaning and drying is a critical step in the semiconductor manufacturing process, used to remove contaminants from the wafer surface to improve the electrical performance and reliability of the chip.

[0003] The inventors discovered that, currently, when drying wafers, a basket containing several wafers is usually placed in a drying device, and the device dries the wafers. However, the drying effect at the connection between the wafers and the basket is not good. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor workpiece drying apparatus that can improve the drying effect of wafers.

[0005] The embodiments of this utility model can be implemented as follows:

[0006] In a first aspect, this utility model provides a semiconductor workpiece drying apparatus, comprising:

[0007] The trough has a receiving cavity for placing a flower basket, the receiving cavity being connected to an air extraction device;

[0008] A groove cover is hinged to the groove body and located at the opening end of the receiving cavity, for rotation to close the receiving cavity;

[0009] A support assembly is disposed on the groove and located at the bottom of the receiving cavity for supporting a basket loaded with wafers;

[0010] A drying assembly, disposed within the tank, is used to dry the wafers within the basket;

[0011] A supporting component is disposed in the groove. When the basket is placed on the supporting component, the wafer is lifted by the supporting component and detached from the basket.

[0012] In an optional embodiment, the abutting components are disposed on opposite sides of the support components, and the top of the abutting components has an inclined abutting surface that abuts against the wafer. When the basket is placed on the support components, the wafer is lifted by the abutting surface until it is detached from the basket and abutted between the two abutting surfaces.

[0013] In an optional embodiment, the abutment component has a strip-shaped hole extending in a vertical direction, and the abutment component is connected to the support component via a connector passing through the strip-shaped hole.

[0014] In an optional embodiment, the support assembly comprises a connecting plate, a base plate and a base, the connecting plate is arranged on the inner wall of the two opposite grooves, the base plate is arranged on the connecting plate, a gap is left between the base plate and the bottom wall of the groove, the base is arranged on the base plate and used for carrying the flower basket, and the abutting assembly is arranged on the base.

[0015] In an optional embodiment, the support assembly further comprises a first limiting piece and a second limiting piece, the first limiting piece and the second limiting piece are arranged on the base, the first limiting piece is used for limiting the flower basket in a first direction, and the second limiting piece is used for limiting the flower basket in a second direction, wherein the first direction and the second direction are perpendicular to each other in the horizontal direction.

[0016] In an optional embodiment, the bottom wall of the groove is provided with a discharge port communicating with the accommodating cavity, and the air extraction device communicates with the accommodating cavity through the discharge port.

[0017] In an optional embodiment, the groove is provided with a driving piece connected with the groove cover, and the driving piece is used to drive the groove cover to rotate to be close to or away from the groove.

[0018] In an optional embodiment, the groove cover and the groove are both provided with a detection piece, and the detection piece is used to detect the position information of the groove cover to determine whether the groove cover is close to or away from the groove.

[0019] In a second aspect, the utility model provides a kind of semiconductor workpiece drying device, comprising:

[0020] Groove, with the accommodating cavity for placing flower basket, the accommodating cavity is communicated with air extraction device;

[0021] Groove cover, hingedly arranged on the groove and located at the opening end of the accommodating cavity, to rotate to close the accommodating cavity;

[0022] Support assembly, arranged in the groove and located at the bottom of the accommodating cavity, to carry the flower basket loaded with wafer;

[0023] Drying assembly, arranged in the groove, for drying wafer in the flower basket;

[0024] Wherein, the drying assembly comprises nozzle communicated with external air source, and the nozzle sprays drying gas towards the wafer and flower basket connection.

[0025] In an optional embodiment, the nozzle comprises at least a first group of nozzles and a second group of nozzles, the first group of nozzles is arranged on the tank cover for outputting dry air flow from top to bottom, and the second group of nozzles is arranged on the tank sidewall for outputting dry air flow to the connection between the wafer and the basket in a horizontal direction.

[0026] The semiconductor workpiece drying device provided by the embodiment of the utility model has the advantages of:

[0027] By arranging the supporting assembly, the resisting assembly and the drying assembly in the tank body, placing the basket loaded with the wafers to be dried on the supporting assembly, and driving the tank cover to rotate to close the containing cavity, the wafers are lifted by the resisting assembly to be separated from the basket, so that the wafers and the basket are not in contact, the drying assembly can dry the connection between the wafers and the basket, and the drying effect of the wafers is improved.

[0028] In addition, in another embodiment, a plurality of nozzles are arranged and communicate with the external air source, and the nozzles all output dry air to the connection between the wafers and the basket, so that the connection between the wafers and the basket is dried, and the drying effect of the wafers is improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment, and it should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can be obtained without creative labor on the basis of the drawings.

[0030] Figure 1 It is a structure schematic view of the wafer not being lifted in the semiconductor workpiece drying device in the embodiment of the utility model.

[0031] Figure 2 It is a structure schematic view of the wafer being lifted in the semiconductor workpiece drying device in the embodiment of the utility model.

[0032] Figure 3 It is a structure schematic view of the supporting assembly in the semiconductor workpiece drying device provided by the embodiment of the utility model.

[0033] Figure 4 It is a structure schematic view of the resisting assembly in the semiconductor workpiece drying device provided by the embodiment of the utility model.

[0034] Figure 5 It is an external structure schematic view of the semiconductor workpiece drying device provided by the embodiment of the utility model.

[0035] Icon: 100 - groove body; 110 - accommodating cavity; 120 - discharge port; 200 - groove cover; 300 - support assembly; 310 - connecting plate; 320 - base plate; 330 - base; 340 - first limiting piece; 350 - second limiting piece; 400 - abutting assembly; 410 - abutting surface; 420 - strip-shaped hole; 500 - driving piece; 600 - detecting piece; 700 - nozzle; 710 - first group of nozzles; 720 - second group of nozzles; 800 - air extraction device. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0038] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0039] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present application is usually placed, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application.

[0040] In addition, if the terms "first", "second" and the like appear, they are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0041] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.

[0042] In the manufacturing process of semiconductor workpieces, wafers will go through various processing procedures such as photolithography, etching, deposition, etc. These procedures will leave various contaminants on the wafer surface, including particulate impurities (such as dust, photoresist fragments, etc.), organic contaminants (photoresist, chemical reagents, etc.), metal ions, etc. These contaminants can cause serious problems such as chip performance degradation, short circuit, short circuit, etc. Therefore, in order to remove the particulate impurities, organic contaminants and eliminate metal ion contamination on the wafer surface, the wafer needs to be cleaned and processed. After the wafer is cleaned, it also needs to be dried to avoid the natural evaporation of water (or other cleaning liquid) on the wafer surface, which can cause the re-deposition of impurities dissolved in the water on the wafer surface, forming water stains or water marks. This water stain or water mark may contain metal ions or other impurity particles, which can contaminate the wafer surface and cause poor wafer cleaning effect.

[0043] At present, when drying the wafer, the basket loaded with several wafers is usually placed in the drying container, and the wafer surface is dried by using the drying assembly, so as to realize the drying of multiple wafers at one time and improve the drying efficiency. When the basket is placed in the drying device, as shown in the prior art, Figure 1 As shown in the prior art, at the contact between the wafer and the basket, the wafer and the basket are in a state of adhesion, and the drying assembly often cannot completely dry the connection between the wafer and the basket, resulting in poor drying effect of the wafer.

[0044] In view of the above technical problems, the utility model provides a semiconductor workpiece drying device, so that when the basket is placed in the drying device, the wafer in the basket is separated from the basket, and there is no contact between the wafer and the basket, so that the wafer surface can be dried conveniently, and the drying effect of the wafer is improved.

[0045] The overall structure, working principle and technical effects of the semiconductor workpiece drying device provided by the utility model will be described in detail below through embodiments and in combination with the drawings.

[0046] Please refer to Figure 2 and Figure 3The utility model provides a semiconductor workpiece drying device, be applied to semiconductor workpiece drying device, including groove 100, groove cover 200, support subassembly 300, drying subassembly and resist holding assembly 400, the accommodation cavity 110 for placing flower basket has in groove 100, in this embodiment, groove 100 sets up as the hollow rectangular box body of upper end opening, the accommodation cavity 110 is communicated with the external exhaust device 800, to the liquid in the accommodation cavity 110 and with liquid gas exhaust. The opening end of groove cover 200 and the accommodation cavity 110 of groove 100 adapts, and groove cover 200 is hingedly set up on groove 100 and is located the opening end of accommodation cavity 110, so that groove cover 200 can rotate to be close to or away from groove 100, so as to close or open the accommodation cavity 110. Support subassembly 300 sets up on groove 100 and is located the bottom of accommodation cavity 110, and support subassembly 300 is used for carrying the flower basket of wafer support loading. Resist holding assembly 400 sets up in groove 100, when flower basket places on support subassembly 300, wafer is lifted by resist holding assembly 400 to separate flower basket, and then the wafer of being lifted is dried through drying subassembly. It can be understood that, in this embodiment, drying subassembly is used to connect with external gas source, to transport nitrogen gas to the accommodation cavity 110, and the wafer is swept and dried. In other embodiments, drying subassembly can also be other forms of drying mode, for example, infrared heating etc., and the specific form structure of drying subassembly is not limited here.

[0047] By setting support subassembly 300 and resist holding assembly 400 in groove 100, the flower basket loaded with wafer to be dried is placed on support subassembly 300, drive groove cover 200 to rotate to close accommodation cavity 110, at this time, wafer is lifted by resist holding assembly 400 to separate flower basket, so that wafer and flower basket are not in contact, and the wafer of being lifted is dried through drying subassembly, improve the drying effect of wafer.

[0048] Please refer to Figure 2 In order to facilitate liquid, liquid gas or particle impurities etc. in wafer blowing and drying are discharged from groove 100 in time, the discharge port 120 that communicates with the accommodation cavity 110 is set up in the bottom wall of groove 100, and the exhaust device 800 is communicated with the accommodation cavity 110 through the discharge port 120. When wafer is swept and dried, the exhaust device 800 continuously works, and continuously sucks in groove 100.

[0049] Please refer to Figure 2 And Figure 3In some optional embodiments, the support assembly 300 comprises the connecting plates 310, the base plate 320 and the base 330. The connecting plates 310 are installed on the inner walls of the two opposite slots 100. The two ends of the base plate 320 are respectively located on the two connecting plates 310, and the base plate 320 is connected with the connecting plates 310. By arranging the connecting plates 310 on the inner walls of the two opposite slots 100, a gap is left between the support assembly and the bottom wall of the slot 100, which facilitates the gas circulation when the air exhaust device 800 exhausts the accommodation cavity 110, and improves the blowing and drying effect of the wafer. The base 330 is arranged on the base plate 320, and the base 330 is used for supporting and bearing the flower basket. The support assembly 400 is arranged on the base 330.

[0050] Further, in order to improve the gas circulation effect in the slot 100, the base plate 320 comprises two long plate bodies, and the two base plates 320 are distributed at the two ends of the connecting plate 310. The base 330 is in the shape of a mouth, and the inside of the base 330 is hollow. The discharge port 120 is located directly below the base 330. When the flower basket is placed on the base 330, the bottom of the flower basket is opposite to the discharge port 120, which facilitates the liquid on the wafer to be discharged out of the slot 100.

[0051] Please refer to Figure 2 and Figure 3 In some optional embodiments, the support assembly 300 further comprises the first limiting member 340 and the second limiting member 350. The first limiting member 340 and the second limiting member 350 are arranged on the base 330. When the flower basket is placed on the base 330, the first limiting member 340 is used for limiting the flower basket in the first direction, and the second limiting member 350 is used for limiting the flower basket in the second direction. The first direction and the second direction are perpendicular to each other in the horizontal direction. In this embodiment, the first direction and the second direction are respectively consistent with the length direction and the width direction of the slot 100. The first limiting member 340 comprises the first limiting block, and the two ends of the first limiting block in the first direction of the base 330 are arranged. The second limiting member 350 comprises the second limiting block, and the two ends of the second limiting block in the second direction of the base 330 are arranged. When the flower basket is placed on the base 330, the four side edges of the flower basket are respectively abutted with the first limiting block and the second limiting block, so as to realize the effect of limiting the flower basket in the horizontal direction when the flower basket is placed on the base 330.

[0052] Please refer to Figure 2 and Figure 3In some optional embodiments, two holding assemblies 400 are arranged on the opposite sides of the base 330, and the holding assemblies 400 are provided with holding surfaces 410 on the top thereof for holding the wafer, and the holding surfaces 410 are arranged in a slope manner to form a space between the two holding assemblies 400 for supporting the wafer. When the flower basket is placed on the base 330, the wafer is held between the two holding surfaces 410, and the wafer is lifted by the holding surfaces 410 to be separated from the flower basket. By arranging the holding surfaces 410 in a slope manner, the wafer is held between the two holding assemblies 400, so that the contact area between the holding assembly 400 and the wafer is reduced while the stable supporting force is provided for the wafer, and thus the pollution of the wafer by the holding assembly is reduced. It should be noted that, in the embodiment, the width of the holding assembly 400 in the first direction is matched with the width of the flower basket, so that when the flower basket is placed in the groove, all the wafers in the flower basket can be lifted by the holding assembly 400.

[0053] Please refer to Figure 3 and Figure 4 In some optional embodiments, the holding assembly 400 is provided with a strip-shaped hole 420 extending in the vertical direction, and the holding assembly 400 is connected with the base 330 through a connecting member penetrating through the strip-shaped hole 420. The connecting member can be a connecting structure such as a screw or a bolt. Further, the height of the holding assembly 400 can be adjusted by adjusting the position of the holding assembly 400 in the vertical direction and fixing the connecting member. On the one hand, the height of the holding assembly 400 can be adjusted to adapt to the error of the wafer size, and on the other hand, the holding assembly 400 can be applied to wafers of different sizes, thereby improving the compatibility and application range of the holding assembly 400.

[0054] Please refer to Figure 5 In some optional embodiments, a driving member 500 is arranged on the groove 100 and connected with the groove cover 200, and the driving member 500 is used to drive the groove cover 200 to rotate to be close to or away from the groove 100. When the detecting member 600 detects that the groove cover 200 is buckled on the groove 100, the drying assembly starts to dry the wafer, and the air suction device 800 starts to work. In the embodiment, the driving member 500 is a pneumatic cylinder, the cylinder body of the pneumatic cylinder is hinged to the outer wall of the groove 100, and the piston rod of the pneumatic cylinder extends vertically upward and is connected with a connecting rod arranged on the groove 100.

[0055] Please refer to Figure 5 Further, the detecting member 600 is arranged on the groove cover 200 and the groove 100, and the detecting member 600 is used to detect whether the groove cover 200 is close to or away from the groove 100. In the embodiment, the detecting member 600 is a magnetic induction sensor, and in other embodiments, the detecting member 600 can also be a photoelectric sensor, a Hall sensor, a microswitch or other structures that can detect the opening and closing of the groove cover 200, and the specific structure of the detecting member 600 is not limited in the utility model.

[0056] In some optional embodiments, referring to Figure 1 The utility model also provides a semiconductor drying device. The semiconductor drying device provided by the embodiment comprises the groove body 100, the groove cover 200, the supporting assembly 300 and the drying assembly, wherein the drying assembly comprises a nozzle 700 connected with an external air source, the nozzle 700 is arranged in the groove body 100, and the nozzle 700 sprays drying gas towards the connection between the wafer and the basket so as to blow and dry the wafer in the groove body 100.

[0057] In some optional embodiments, referring to Figure 1 The nozzle 700 comprises at least a first group of nozzles 710 and a second group of nozzles 720, the first group of nozzles 710 is arranged on the groove cover 200 and located on the side of the groove cover 200 facing the groove body 100, so that when the groove cover 200 is buckled on the groove body 100, the first group of nozzles 710 is used to spray drying gas from top to bottom to blow and dry the wafer in the groove body 100. The second group of nozzles 720 is arranged on the inner side wall of the groove body 100 and used to spray drying gas in the horizontal direction towards the wafer to blow and dry the wafer. By arranging the first group of nozzles 710 and the second group of nozzles 720, the wafer in the groove body 100 is blown and dried in multiple directions, and the drying effect of the wafer is improved.

[0058] In some optional embodiments, referring to Figure 1 And Figure 2 In some optional embodiments, the above two embodiments can be combined, that is, the semiconductor workpiece drying device is provided with the resisting assembly 400 to lift the wafer and make the wafer and the basket contactless, and is also provided with the first group of nozzles 710 and the second group of nozzles 720 to spray and blow the lifted wafer, so as to further improve the drying effect of the wafer.

[0059] In summary, the implementation principle of the semiconductor workpiece drying device provided by the utility model is that: the supporting assembly 300 and the resisting assembly 400 are arranged in the groove body 100, when the basket is placed on the supporting assembly 300, the resisting assembly 400 resists and lifts the wafer to make the wafer and the basket contactless, and the wafer is dried by the drying assembly, so as to improve the drying effect of the wafer.

[0060] The above is only a specific implementation manner of the utility model, but the protection scope of the utility model is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.

Claims

1. A semiconductor workpiece drying apparatus, characterized by, The application relates to a wafer drying device, which comprises the following components: a groove body, which has a containing cavity for placing a wafer basket, and is communicated with a gas suction device; a groove cover, which is hingedly arranged on the groove body and is located at the opening end of the containing cavity, and is used for rotating to close the containing cavity; a supporting assembly, which is arranged in the groove body and is located at the bottom of the containing cavity, and is used for carrying the wafer basket loaded with wafers; a drying assembly, which is arranged in the groove body, and is used for drying the wafers in the wafer basket; a supporting assembly, which is arranged in the groove body, and is used for supporting the wafers and separating the wafers from the wafer basket when the wafer basket is placed on the supporting assembly.

2. The semiconductor workpiece drying apparatus of claim 1, wherein, The supporting assembly is arranged on the opposite sides of the supporting assembly, the top of the supporting assembly is provided with a supporting surface with an inclined surface for supporting the wafers, and the wafers are lifted by the supporting surface to separate from the wafer basket and are supported between the two supporting surfaces when the wafer basket is placed on the supporting assembly.

3. The semiconductor workpiece drying apparatus of claim 2, wherein, The supporting assembly has a strip-shaped hole extending in the vertical direction, and the supporting assembly is connected with the supporting assembly through a connecting piece penetrating through the strip-shaped hole.

4. The semiconductor workpiece drying apparatus of claim 1, wherein, The supporting assembly comprises a connecting plate, a base plate and a base, the connecting plate is arranged on the two opposite inner walls of the groove body, the base plate is connected and arranged on the connecting plate, a gap is left between the base plate and the bottom wall of the groove body, the base is arranged on the base plate and is used for carrying the wafer basket, and the supporting assembly is arranged on the base.

5. The semiconductor workpiece drying apparatus of claim 4, wherein, The supporting assembly further comprises a first limiting piece and a second limiting piece, the first limiting piece and the second limiting piece are arranged on the base, the first limiting piece is used for limiting the wafer basket in a first direction, and the second limiting piece is used for limiting the wafer basket in a second direction, wherein the first direction and the second direction are perpendicular to each other in the horizontal direction.

6. The semiconductor workpiece drying apparatus of claim 1, wherein, The bottom wall of the groove body is provided with a discharge port communicated with the containing cavity, and the gas suction device is communicated with the containing cavity through the discharge port.

7. The semiconductor workpiece drying apparatus of claim 1, wherein, The groove body is provided with a driving piece connected with the groove cover, and the driving piece is used for driving the groove cover to rotate to be close to or away from the groove body.

8. The semiconductor workpiece drying apparatus of claim 1, wherein, The groove cover and the groove body are both provided with a detection piece, the detection piece is used for detecting the position information of the groove cover, and the close-to or away-from information of the groove cover to the groove body is determined.

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