Structured light and DTOF fused three-dimensional imaging device and terminal equipment

Abstract

The utility model discloses a structured light and DTOF fused three-dimensional imaging device and terminal equipment, the imaging device comprises a mainboard, a projection module, a receiving module, a processing chip and an interface module, the projection module projects a first optical signal to a target object in a structured light emission mode, and projects a second optical signal to the target object in a DTOF emission mode; the receiving module performs image acquisition on the reflected light of the first optical signal and performs photon detection and timing on the reflected light of the second optical signal; all projectors in the projection module and all receivers in the receiving module are located on the first surface of the main board, are electrically connected with the main board and are arranged in a linear shape or a cross shape. The processing chip is arranged on the first surface or the second surface of the mainboard and is electrically connected with the mainboard; the interface module is arranged on the first surface or the second surface of the mainboard and is electrically connected with the mainboard. Therefore, according to the three-dimensional imaging device provided by the utility model, each projector and each receiver are integrated on the mainboard, the size is small, the integration level is high, and the cost is low.

Description

Technical Field

[0001] This utility model relates to the field of three-dimensional imaging technology, and in particular to a three-dimensional imaging device and terminal equipment that integrates structured light and DTOF. Background Technology

[0002] In the field of 3D imaging, 3D structured light modules are typically used to measure the imaging information of objects at close range, while DTOF modules are typically used to measure the depth information of objects at medium to long range. Combining the advantages of these two different approaches usually enables accurate 3D imaging of targets across all scenarios, both at close and medium to long ranges.

[0003] However, in existing typical fusion solutions of structured light and DTOF technologies, the projection module of the 3D structured light module, the infrared camera module, the projection module of the DTOF module, and the camera module are generally fixed as four independent modules on the structural support and connected to the motherboard through board-to-board connectors. Such structures are large in size, complex to assemble, and have high material and assembly costs. Utility Model Content

[0004] This invention provides a three-dimensional imaging device and terminal equipment that integrates structured light and DTOF, in order to solve the problems of large size, complex assembly, and high material and assembly costs of three-dimensional imaging devices in related technologies.

[0005] To address the aforementioned problems, this utility model proposes a three-dimensional imaging device that fuses structured light and DTOF, comprising:

[0006] The motherboard includes a first surface and a second surface that are positioned relative to each other.

[0007] The projection module has a structured light emission mode and a DTOF emission mode. In the structured light emission mode, it is used to project a first light signal onto a target object, and in the DTOF emission mode, it is used to project a second light signal onto the target object. The first light signal includes a first structured light, and the second light signal includes a second structured light or a second floodlight.

[0008] The receiving module is used to acquire an image of the reflected light from the first optical signal projected onto the target object, and also to perform photon detection and timing on the reflected light from the second optical signal projected onto the target object;

[0009] The projection module includes a first projector for projecting the first structured light and a second projector for projecting the second floodlight, or the projection module includes a first projector for projecting the first structured light and the second structured light, or a first projector for projecting the first structured light and the second floodlight, and the receiving module includes a first receiver for image acquisition of the reflected light of the first structured light after being projected onto the target object and a second receiver for photon detection and timing of the reflected light of the second structured light or the second floodlight after being projected onto the target object; or the projection module includes a first projector for projecting the first structured light and a second projector for projecting the second floodlight, and the receiving module includes a second receiver for image acquisition of the reflected light of the first structured light after being projected onto the target object and photon detection and timing of the reflected light of the second floodlight after being projected onto the target object.

[0010] Each projector in the projection module and each receiver in the receiving module are located on the first surface and electrically connected with the mainboard and arranged in a linear or cross shape.

[0011] A processing chip is configured to provide driving signals to the projection module and the receiving module and process image information or depth information of the target object, and is arranged on the first surface or the second surface and electrically connected with the mainboard.

[0012] An interface module is configured to at least provide power supply and data transmission channel for the mainboard, and is arranged on the first surface or the second surface and electrically connected with the mainboard.

[0013] Optionally, the first projector includes a structured light projection unit, and the structured light projection unit includes a first light source and a light modulation element.

[0014] The first light source is configured to emit infrared band light.

[0015] The light modulation element is located on the light emitting side of the first light source and is configured to modulate the emitted light of the first light source to correspondingly project the first structured light or the second structured light, and the light modulation element includes one or more of a metasurface lens optical element, a collimating and diffractive integrated optical element, or a combination of a collimating mirror and a diffractive optical element.

[0016] Optionally, the first projector further includes a first floodlight projection unit, and the first floodlight projection unit includes a second light source and the light modulation element, the second light source is configured to emit infrared band light, and the light modulation element is configured to modulate the emitted light of the second light source to correspondingly project the first floodlight or the second floodlight.

[0017] The first projector further comprises a heightening block, the heightening block being configured to heighten the first light source or the second light source so as to have a height difference between the light emitting surface of the first light source and the light emitting surface of the second light source, and to electrically connect the heightened light source with the main board.

[0018] Optionally, the first projector further comprises a first floodlight projection unit, the first floodlight projection unit comprising a second light source and a first light homogenizing element, the first floodlight projection unit being separately arranged from the structured light projection unit, the second light source being configured to emit infrared band light, and the first light homogenizing element being configured to modulate the emitted light of the second light source so as to correspondingly project the first floodlight or the second floodlight.

[0019] Optionally, the projection module further has an illumination light supplementing mode, in the illumination light supplementing mode, the projection module is configured to project a first floodlight to the target object; and the receiving module is configured to collect an image of the reflected light of the first floodlight projected to the target object.

[0020] Optionally, when the three-dimensional imaging device comprises a first receiver, the first receiver comprises an infrared camera unit, the infrared camera unit comprising a first imaging chip, a first imaging lens and a first light filtering assembly, the first imaging lens and the first light filtering assembly being respectively located on a light receiving path of the first imaging chip.

[0021] The first imaging lens is one or a combination of the metasurface lens, the diffractive lens and the refractive lens, the first imaging chip is a CMOS chip or a CCD chip, and the first light filtering assembly is an infrared narrowband filter or an electrochromic filter.

[0022] Optionally, when the three-dimensional imaging device comprises the second projector, the second projector comprises a second floodlight projection unit, the second floodlight projection unit comprising a third light source and a second light homogenizing element, the third light source being configured to emit infrared band light, and the second light homogenizing element being configured to modulate the emitted light of the third light source so as to correspondingly project the second floodlight.

[0023] Optionally, the second receiver comprises a DTOF camera unit, the DTOF camera unit comprising a second imaging chip, a second imaging lens and a second light filtering assembly, the second imaging lens and the second light filtering assembly being respectively located on a light receiving path of the second imaging chip.

[0024] The second imaging lens is one or a combination of the metasurface lens, the diffractive lens and the refractive lens, the second imaging chip is a SPAD chip or a SIPM chip, and the second light filtering assembly is an infrared narrowband filter.

[0025] Optionally, an environmental sensor and / or a proximity sensor are further included, disposed on the first surface or the second surface, and electrically connected with the mainboard.

[0026] Optionally, when the projection module includes the first projector for projecting the first structured light and the second structured light, in the structured light emission mode, the processing chip is configured to control the first projector to project a first pulsed light signal as the first structured light, and in the DTOF emission mode, the processing chip is configured to control the first projector to project a second pulsed light signal as the second structured light, the frequency of the first pulsed light signal is less than or equal to the frequency of the second pulsed light signal, and the pulse width of the first pulsed light signal is greater than or equal to the pulse width of the second pulsed light signal.

[0027] To solve the above problems, the utility model embodiment proposes a terminal device, including the three dimensional imaging device of the structured light and DTOF fusion of any embodiment of the utility model.

[0028] According to the three dimensional imaging device and terminal device of the structured light and DTOF fusion provided by the utility model embodiment, the imaging device includes a mainboard, a projection module, a receiving module, a processing chip and an interface module, wherein the projection module is used for projecting a first light signal to a target object in a structured light emission mode, and is used for projecting a second light signal to the target object in a DTOF emission mode; the receiving module is used for image acquisition of reflected light of the first light signal projected to the target object, and is also used for photon detection and timing of reflected light of the second light signal projected to the target object; each projector in the projection module and each receiver in the receiving module are located on the first surface of the mainboard, and are electrically connected with the mainboard, and are arranged in a linear or cross shape; the processing chip is used for providing a driving signal to the projection module and the receiving module, and processing image information or depth information of the target object, and is disposed on the first surface or the second surface of the mainboard, and is electrically connected with the mainboard; the interface module is used for at least power supply and data transmission channel for the mainboard, and is disposed on the first surface or the second surface of the mainboard, and is electrically connected with the mainboard. Therefore, the three dimensional imaging device provided by the utility model integrates each projector and receiver on the mainboard, has small volume, high integration degree and low cost.

[0029] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the utility model, nor is it used to limit the scope of the utility model. Other features of the utility model will become easy to understand through the following description. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the following embodiment description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the premise of not paying creative effort.

[0031] Figure 1 is a plane structure schematic diagram of a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0032] Figure 2 is a structure schematic diagram of a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0033] Figure 3 is a plane structure schematic diagram of another three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0034] Figure 4 is a structure schematic diagram of another three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0035] Figure 5 is a structure schematic diagram of a 3D structural light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0036] Figure 6 is a structure schematic diagram of another 3D structural light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0037] Figure 7 is a structure schematic diagram of still another 3D structural light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0038] Figure 8 is a structure schematic diagram of still another 3D structural light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0039] Figure 9 is a structure schematic diagram of a DTOF module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0040] Figure 10 is a structure schematic diagram of still another 3D structural light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application;

[0041] Figure 11is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model;

[0042] Figure 12 is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model;

[0043] Figure 13 is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model;

[0044] Figure 14 is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model;

[0045] Figure 15 is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model;

[0046] Figure 16 is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model;

[0047] Figure 17 is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model;

[0048] Figure 18 is another kind of 3D structured light module structure schematic diagram of the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model. DETAILED DESCRIPTION

[0049] In order to make the person skilled in the art better understand the utility model scheme, below will combine the drawings in the embodiment of the utility model, the technical scheme in the embodiment of the utility model is described clearly and completely, obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor should belong to the scope of the utility model protection.

[0050] It should be noted that the specification and claims of the utility model and the above-mentioned terms "first", "second" and the like in the drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be exchanged under appropriate circumstances, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein.

[0051] In order to reduce the volume of the three-dimensional imaging device, increase the integration of the three-dimensional imaging device, the utility model discloses a kind of three-dimensional imaging devices of structural light and DTOF fusion, the device includes: mainboard, projection module, receiving module, processing chip and interface module, wherein, mainboard includes oppositely arranged first surface and second surface;Projection module has structural light emission mode and DTOF emission mode, in structural light emission mode, for projecting first light signal to target object, in DTOF emission mode, for projecting second light signal to target object;First light signal includes first structural light, and second light signal includes second structural light or second floodlight;Receiving module is used for the image acquisition of the reflection light of first light signal projection to target object, also for the photon detection and timing of the reflection light of second light signal projection to target object;And each projector in projection module and each receiver in receiving module are located on the first surface, and are electrically connected with mainboard, according to linear or cross-shaped arrangement;Processing chip is used to provide driving signal to projection module and receiving module, and processes the image information or depth information of target object, is set on the first surface or second surface, and is electrically connected with mainboard;Interface module is used to at least power supply and provide data transmission channel for mainboard, is set on the first surface or second surface, and is electrically connected with mainboard.

[0052] It can be understood that mainboard can be PCB circuit board. Projection module is located on the first surface of mainboard, and is electrically connected with mainboard. Projection module can project first light signal, i.e. first structural light, and second light signal, i.e. second structural light or second floodlight. Wherein, structural light is structural light pattern with certain characteristic information, which can contain one or more of pseudo-random speckle, stripe, two-dimensional code and the like. Floodlight is generally uniform floodlight. Receiving module is located on the first surface of mainboard, and is electrically connected with mainboard. Receiving module can perform image acquisition on the reflection light of first light signal projection to target object, and perform photon detection and timing on the reflection light of second light signal projection to target object.

[0053] Since the device has structural light emission mode and DTOF emission mode simultaneously, and in structural light emission mode, it can realize high-precision three-dimensional imaging within near distance, and in DTOF emission mode, it can realize ordinary-precision three-dimensional imaging within middle and far distance. Furthermore, the three-dimensional imaging device can realize high-precision three-dimensional imaging within near distance and ordinary-precision three-dimensional imaging within middle and far distance simultaneously, realizing the fusion of structural light and DTOF technology. It meets the application in near distance and middle and far distance full scene.

[0054] Specifically, the projection module includes a first projector for projecting the first structured light and a second projector for projecting the second flood light, or the projection module includes a first projector for projecting the first structured light and the second structured light, or the projection module includes a first projector for projecting the first structured light and the second flood light, and the receiving module includes a first receiver for image acquisition of the reflected light after the first structured light is projected to the target object and a second receiver for photon detection and timing of the reflected light after the second structured light or the second flood light is projected to the target object; or the projection module includes a first projector for projecting the first structured light and a second projector for projecting the second flood light, and the receiving module includes a second receiver for image acquisition of the reflected light after the first structured light is projected to the target object and photon detection and timing of the reflected light after the second flood light is projected to the target object. Each projector in the projection module and each receiver in the receiving module are located on the first surface and electrically connected with the main board, and are arranged in a linear or cross shape, which is conducive to the high integration of the three-dimensional imaging device.

[0055] That is, the projection module includes a first projector for projecting the first structured light and a second projector for projecting the second flood light, and the receiving module includes a first receiver for image acquisition of the reflected light after the first structured light is projected to the target object and a second receiver for photon detection and timing of the reflected light after the second flood light is projected to the target object.

[0056] Or, the projection module includes a first projector for projecting the first structured light and the second structured light, and the receiving module includes a first receiver for image acquisition of the reflected light after the first structured light is projected to the target object and a second receiver for photon detection and timing of the reflected light after the second structured light is projected to the target object.

[0057] Or, the projection module includes a first projector for projecting the first structured light and the second flood light, and the receiving module includes a first receiver for image acquisition of the reflected light after the first structured light is projected to the target object and a second receiver for photon detection and timing of the reflected light after the second flood light is projected to the target object.

[0058] Or, the projection module includes a first projector for projecting the first structured light and a second projector for projecting the second flood light, and the receiving module includes a second receiver for image acquisition of the reflected light after the first structured light is projected to the target object and photon detection and timing of the reflected light after the second flood light is projected to the target object.

[0059] In one embodiment, the processing chip and the interface module can be located on the second surface of the mainboard to increase the integration of the entire device. The processing chip is fixed on the mainboard by welding and electrically connected to the mainboard. The interface module, which can be a MIPI interface, a USB interface, a TypeC interface, a DC socket, an RJ45 network port, etc., is used to provide power supply and data transmission channel for the mainboard. The interface module is also fixed on the mainboard by welding and electrically connected to the mainboard.

[0060] In another embodiment, the processing chip can be located on the first surface of the mainboard, and the interface module can be located on the second surface of the mainboard, or the processing chip can be located on the second surface of the mainboard, and the interface module can be located on the first surface of the mainboard, or the processing chip and the interface module can be located on the first surface of the mainboard. In the actual processing process, the size of the mainboard, the size of each module, etc. can be matched and designed accordingly.

[0061] Thus, a three-dimensional imaging device with small volume, high integration and low cost is obtained, and the miniaturization design of the terminal equipment using the three-dimensional imaging device is realized. In the device, the projection module and the receiving module have multiple implementation schemes in the structured light transmission mode and the DTOF transmission mode, meeting the application of multiple scenes. The projection module and the receiving module will be described in detail in the specific embodiments. The mainboard, the processing chip and the interface module have repeated parts, which will not be repeated in the specific embodiments.

[0062] Embodiment one

[0063] In this embodiment, the three-dimensional imaging device includes a first projector that projects a first structured light, a second projector that projects a second floodlight, a second receiver that receives reflected light of the second floodlight, and a first receiver that receives reflected light of the first structured light. Further, if the first projector also projects a first floodlight, the first receiver also receives reflected light of the first floodlight.

[0064] Specifically, Figure 1 is a plane structure schematic diagram of a three-dimensional imaging device of a structured light and DTOF fusion according to an embodiment of the present application. Figure 2 is a structure schematic diagram of a three-dimensional imaging device of a structured light and DTOF fusion according to an embodiment of the present application. Figure 3 is a plane structure schematic diagram of another three-dimensional imaging device of a structured light and DTOF fusion according to an embodiment of the present application.

[0065] Figure 4 is a structure schematic diagram of another three-dimensional imaging device of a structured light and DTOF fusion according to an embodiment of the present application.

[0066] As Figures 1 to 4As shown, the device includes a mainboard 105, a projection module, a receiving module, a processing chip 106 and an interface module 107. Among them, the projection module includes a first projector 101 for projecting a first structured light and a second projector 102 for projecting a second floodlight, and the receiving module includes a first receiver 104 for image acquisition of the reflected light after the first structured light is projected to the target object and a second receiver 103 for photon detection and timing of the reflected light after the second floodlight is projected to the target object.

[0067] As shown in Figure 1 and Figure 2 , the first projector 101, the second projector 102, the second receiver 103 and the first receiver 104 are arranged in a cross shape and directly attached to the mainboard 105 Figure 1 and Figure 2 The arrangement order in and

[0068] The positions of the first projector 101 and the first receiver 104 can be interchanged, and the positions of the second projector 102 and the second receiver 103 can also be interchanged), that is, the mainboard 105 of the first projector 101, the second projector 102, the second receiver 103 and the first receiver 104 shares a substrate, and adopts a cross-shaped common substrate design. Therefore, it is not necessary to design independent circuit boards on the first projector 101, the second projector 102, the second receiver 103 and the first receiver 104, so that each part forms an independently designed module, and it is not necessary to use a connector to realize the connection of the mainboard 105 and each device, thereby reducing the use of materials, simplifying the structural complexity of the three-dimensional imaging device, making the three-dimensional imaging device easier to manufacture and produce, improving the integration of the three-dimensional imaging device, and reducing the volume of the three-dimensional imaging device, thereby helping to realize a three-dimensional imaging device with small volume, high integration and low cost of the fusion of structured light and DTOF technology, and realizing the miniaturization design of the terminal equipment using the three-dimensional imaging device. In addition, the baseline length between the first projector 101 and the first receiver 104, and the baseline length between the second projector 101 and the second receiver 104 can be adjusted according to actual needs, and the two modules do not affect each other, which can further improve the integration of the three-dimensional imaging device. Figure 3 Figure 4 As shown in Figure 3 and Figure 4The arrangement order is only as an example, and actually the positions of the first projector 101 and the first receiver 104 can be interchanged, and the positions of the second projector 102 and the second receiver 103 can also be interchanged, that is, the main plate 105 of the first projector 101, the second projector 102, the second receiver 103 and the first receiver 104 shares one substrate, and a linear common substrate design is adopted. The embodiment also reduces the use of materials, simplifies the structural complexity of the three-dimensional imaging device, makes the three-dimensional imaging device more easy to manufacture and produce, improves the integration of the three-dimensional imaging device, and reduces the volume of the three-dimensional imaging device, thereby helping to realize a three-dimensional imaging device of structural light and DTOF technology fusion with small volume, high integration and low cost, and realizing the miniaturization design of a terminal device using the three-dimensional imaging device.

[0069] The first projector 101 and the first receiver 104 form a 3D structural light module.

[0070] In this embodiment, Figure 5 is a structural diagram of a 3D structural light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application. Figure 6 is a structural diagram of another 3D structural light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the present application.

[0071] As shown in Figure 5 and Figure 6 , the first projector 101 includes a structural light projection unit, and the structural light projection unit includes a first light source 1011 and a light modulation element 1015; the first light source 1011 is used to emit infrared band light; the light modulation element 1015 is located on the light emitting side of the first light source 1011 and is used to modulate the emitted light of the first light source 1011 to correspondingly project the first structural light; the light modulation element 1015 includes one or more of a metasurface lens optical element, a collimating and diffractive integrated optical element or a collimating mirror and a diffractive optical element combination.

[0072] It can be understood that the first light source 1011 in the first projector 101 is a laser light source, the negative pole of the laser light source is bonded to the main plate 105 through conductive glue, and the positive pole is electrically connected to the main plate 105 through a metal wire (not shown in the figure); or both the positive pole and the negative pole are soldered to the main plate 105 through soldering tin (not shown in the figure). The collimating and diffractive integrated optical element in the first projector 101 is fixed in the mounting groove of the lens barrel 1016 through low-flowability glue (as shown in Figure 5 ), and the lens barrel 1016 is fixed on the main plate 105 through glue; or the collimating mirror lens is fixed on the lens barrel 1016, and the diffractive optical element is fixed on the stepped surface of the lens barrel 1016 (as shown in Figure 6As shown).

[0073] Figure 7 It is another kind of 3D structured light module structure diagram in the three-dimensional imaging device of structural light and DTOF fusion. Figure 8 It is another kind of 3D structured light module structure diagram in the three-dimensional imaging device of structural light and DTOF fusion.

[0074] With reference to Figures 5 to 8 When the three-dimensional imaging device includes the first receiver 104, the first receiver 104 includes an infrared camera unit, the infrared camera unit includes a first imaging chip 1041, a first imaging lens 1043 and a first light filtering assembly 1042, the first imaging lens 1043 and the first light filtering assembly 1042 are located on the light receiving path of the first imaging chip 1041 respectively; the first imaging lens 1043 is one or a combination of several of the super surface lens, the diffractive lens and the refractive lens, the first imaging chip 1041 is a CMOS chip or a CCD chip, and the first light filtering assembly 1042 is an infrared narrowband filter or an electrochromic filter.

[0075] It can be understood that the first receiver 104 further includes a first containing piece 1044, which can be a support or a base or a lens barrel, for carrying and containing the first imaging chip 1041, the first imaging lens 1043 and the first light filtering assembly 1042. The first imaging chip 1041 can be a CMOS chip (complementary metal oxide semiconductor) or a CCD chip (charge coupled device). Alternatively, the first imaging chip 1041 can be a CSP packaged chip, the lower surface of the first imaging chip 1041 has a tin ball, which is welded on the mainboard 105 by soldering; or a COB packaged chip, the lower surface of the first imaging chip 1041 is adhered to the mainboard 105 by red glue, and the upper surface thereof is electrically connected to the mainboard 105 by a metal wire. The first imaging chip 1041 is electrically connected to the first projector 101 through the mainboard 105.

[0076] The first imaging lens 1043 can adopt a general imaging lens. Alternatively, as shown in Figure 5 The first imaging lens 1043 can be a threaded lens, the lens barrel is fixed in the first containing piece 1044 (base) by threads, and the first containing piece 1044 (base) is fixed on the mainboard 105 by glue. Alternatively, as shown in Figure 7 The first imaging lens 1043 can also be an integrated lens structure, the lens barrel is fixed on the first containing piece 1044 (support) or the mainboard 105 by AA glue. Alternatively, as shown in Figure 6 And Figure 8As shown, the first imaging lens 1043 can also adopt a super surface lens, a diffractive lens, a refractive lens or any mixed form of the above lenses, and is fixed in the first accommodating member 1044 (lens barrel). Among them, the super surface lens produces a sudden phase by introducing a surface sub-wavelength size unit structure based on the generalized Snell's law, so that the two-dimensional planar structure of the super surface has special electromagnetic properties, and can realize flexible regulation of the amplitude, phase and polarization of the incident light, and has strong light field manipulation ability. The super surface lens generally forms a microstructure surface with a plurality of sub-wavelength size units arranged in a certain rule on a high transmittance substrate such as quartz, SiO2, polymer material and PC; by defining the light field distribution and light field information (amplitude and polarization information) of the input field and output field, the phase distribution of the super surface at different positions can be obtained, and the structure distribution of the microstructure surface can be calculated through the phase distribution and the material selection of the super surface substrate and the microstructure surface.

[0077] The first filter assembly 1042 is used to cut off non-effective light, so that the expected light beam passes through the filter assembly to form an image on the first imaging chip 1041, so as to achieve the effect of resisting environmental light interference and obtain the expected imaging image. The first filter assembly 1042 can adopt an infrared narrow-band filter or an electrochromic filter. Optionally, as shown in Figure 5 As shown, the first filter assembly 1042 can be integrated in the lens barrel of the first imaging lens 1043, the lens barrel is fixed in the first accommodating member 1044 (base) through threads, and the first accommodating member 1044 (base) is fixed on the mainboard 105 through glue; optionally, as shown in Figure 7 and Figure 8 As shown, the first filter assembly 1042 can also be directly fixed in the first accommodating member 1044 (bracket), and the bracket is fixed on the mainboard 105 through glue. Optionally, as shown in Figure 6 As shown, when the imaging lens 1043 adopts a super surface lens, the first filter assembly 1042 can also adopt a filter film plated on the upper surface or lower surface of the super lens microstructure, and the first imaging lens 1043 integrated with imaging function and filter light filtering function is used, and the first imaging lens 1043 is fixed on the stepped surface of the first accommodating member 1044 (lens barrel).

[0078] Therefore, the first projector 101 in the 3D structured light module projects the first structured light, and the first receiver 104 receives the reflected light of the target object after being irradiated by the first structured light, so as to collect the image information of the target object.

[0079] Figure 9 It is a structure schematic view of a DTOF module in a structured light and DTOF fusion three-dimensional imaging device provided by the embodiment of the present application. Referring to Figure 9As shown, when the three-dimensional imaging device includes the second projector 102, the second projector 102 includes a second floodlight projection unit, the second floodlight projection unit including a third light source 1021 and a second homogenizing element 1022, the third light source 1021 being configured to emit infrared band light, and the second homogenizing element 1022 being configured to modulate the light emitted by the third light source 1021 to correspondingly project a second floodlight.

[0080] It can be understood that the third light source 1021 is configured to emit infrared band light, and can be a VCSEL (vertical cavity surface emitting laser), an EEL (edge emitting laser), an HCSEL (horizontal cavity surface emitting laser), or the like. The second homogenizing element 1022 can be a diffusion sheet or a lens. The third light source 1021 emits a laser beam away from the main board 105, and the second homogenizing element 1022 is located on the light beam path of the third light source 1021 and is configured to shape and homogenize the laser beam. At this time, the second floodlight projection unit can realize the function of projecting a rectangular or circular floodlight with a certain required field of view angle. The third light source 1021 and the second homogenizing element 1022 can be packaged on a ceramic substrate or a circuit board made of other materials. The lower surface of the package has a positive electrode and a negative electrode, and the lower surface is soldered to the main board 105 by soldering.

[0081] Continuing to refer to Figure 9 , the second receiver 103 includes a DTOF camera unit, the DTOF camera unit including a second imaging chip 1031, a second imaging lens 1033, and a second filter assembly 1032, the second imaging lens 1033 and the second filter assembly 1032 being respectively located on a light receiving path of the second imaging chip 1031. The second imaging lens 1033 is one or a combination of a metasurface lens, a diffractive lens, and a refractive lens. The second imaging chip 1031 is an SPAD chip or an SIPM chip. The second filter assembly 1032 is an infrared narrowband filter.

[0082] It can be understood that the second imaging chip 1031 is an SPAD imaging chip or an SiPM imaging chip, which is composed of an SPAD area array (single photon avalanche diode) or an SiPM area array (silicon photomultiplier), and a TDC circuit (time-to-digital converter). Alternatively, the second imaging chip 1031 can be a CSP packaged chip, which has tin balls on the lower surface and is soldered to the main board 105 by soldering. Alternatively, the second imaging chip 1031 can be a COB packaged chip, which is adhered to the main board 105 by red glue on the lower surface and is electrically connected to the main board 105 by metal wires on the upper surface. The second imaging chip 1031 is electrically connected to the second projector 102 through the main board 105.

[0083] The second imaging lens 1033 can be composed of one or more lenses, and the lens material can be glass or resin, which is used to focus the light beam on the imaging path. First, the second imaging lens 1033 can be a general imaging lens, which is optional. As shown in Figure 9 the second imaging lens 1033 can be a threaded lens, the lens barrel is fixed in the second accommodating member 1034 (base) by threads, and the second accommodating member 1034 (base) is fixed on the mainboard 105 by glue; alternatively, the second imaging lens 1033 can also be an integrated lens structure (not shown in the figure), and the lens barrel is fixed on the second accommodating member 1034 (bracket) or the mainboard 105 by AA glue. Secondly, the second imaging lens 1033 can also be an ultra-surface lens, a diffractive lens, a refractive lens or any combination of the above lenses, which is fixed in the second accommodating member 1034 (lens barrel) (not shown in the figure).

[0084] The second filter assembly 1032 can be an infrared narrow-band filter, which is used to cut off non-effective light and let the expected light beam pass through the second filter assembly 1032 to the second imaging chip 1031, achieving the effect of resisting environmental light interference. As shown in Figure 9 the second filter assembly 1032 can be integrated in the lens barrel of the second imaging lens 1033, and the lens barrel is fixed in the second accommodating member 1034 (base) by threads, and the base is fixed on the mainboard 105 by glue; alternatively, it can also be directly fixed in the second accommodating member 1034 (bracket), and the bracket 1034 is fixed on the mainboard 105 by glue (not shown in the figure). In addition, when the second imaging lens 1033 adopts an ultra-surface lens, the second filter assembly 1032 can also adopt a filter film, which is coated on the upper surface or lower surface of the ultra-lens microstructure. The second imaging lens 1033 with integrated imaging function and filter function is used, and the second imaging lens 1033 is fixed on the stepped surface of the second accommodating member 1034 (lens barrel) (not shown in the figure).

[0085] Therefore, the third light source 1021 of the second projector 102 emits a light beam, and at the same time triggers the TDC of the second receiver 103 to work, and generates uniform floodlight through the second light homogenizing element 1022 and emits to the target object. The reflected light signal of the target object is focused by the second imaging lens 1033 of the second receiver 103, and then emitted to the second imaging chip 1031 after passing through the second filter assembly 1032. After the reflected light signal is received by the SPAD pixel in the second imaging chip 1031, the SPAD pixel generates avalanche current, and the avalanche signal is output to the TDC, and the avalanche signal triggers the TDC to stop working. The time difference between the emission of the light beam of the third light source 1021 of the second projector 102 and the reception of the light beam by the SPAD pixel in the second imaging chip 1031 of the second receiver 103 is directly measured by the above-mentioned single-photon detection technology, that is, the time difference is measured. By emitting and receiving the light signal multiple times in a very short time, the recorded flight time can be calculated to obtain the depth information of the imaging target.

[0086] Further, in the first embodiment, the three-dimensional imaging device includes the first projector 101 (including the structured light projection unit), the first receiver 104, the second projector 102 and the second receiver 103, and the four devices are arranged in a cross shape or a linear shape on the mainboard 105. The first structured light projected by the first projector 101 irradiates the target object, the first receiver 104 receives the reflected light of the target object to the first structured light, the second projector 102 projects the second floodlight to irradiate the target object, and the second receiver 103 receives the reflected light of the target object to the second floodlight.

[0087] Optionally, the first floodlight projection unit can also be included in the first projector 101, and the first floodlight projection unit is used for projecting the first floodlight to adapt to the illumination light compensation mode of the three-dimensional imaging device. In the illumination light compensation mode, the first floodlight is used for projecting to the target object; and the receiving module is used for image acquisition of the reflected light of the first floodlight projected to the target object.

[0088] That is, after the first floodlight irradiates the target object by the first floodlight projection unit, the first receiver 101 can perform image acquisition on the reflected light of the first floodlight projected to the target object.

[0089] In the first projector 101, the second light source 1012 in the first floodlight projection unit and the first light source 1011 in the structured light projection unit have different positional relationships, which will be described in detail below.

[0090] Figure 10 is another structure diagram of a 3D structured light module in a structured light and DTOF fusion three-dimensional imaging device according to an embodiment of the present application. Figure 11It is another kind of 3D structured light module structure diagram in the three-dimensional imaging device of structure light and DTOF fusion provided by the embodiment of the utility model. As shown in the figure Figure 10 And Figure 11 As shown, the first projector 101 further comprises a first floodlight projection unit, the first floodlight projection unit comprises a second light source 1012 and a light modulation element, the second light source 1012 is used to emit infrared band light, and the light modulation element is used to modulate the emitted light of the second light source 1012 to correspondingly project the first floodlight; the first projector 101 further comprises a heightening block 1014, the heightening block 1014 is used to heighten the first light source 1011 or the second light source 1012, so that the light emitting surface of the first light source 1011 and the light emitting surface of the second light source 1012 have a height difference, and is also used to electrically connect the light source after heightening with the mainboard 105.

[0091] Specifically, continuing to refer to Figure 10 And Figure 11 The structured light projection unit and the first floodlight projection unit of the first projector 101 are integrated in the same projector. The first projector 101 comprises a first light source 1011, a second light source 1012 and a heightening block 1014, the first light source 1011 and the second light source 1012 emit light alternately and share a light modulation element 1015.

[0092] The first light source 1011 is used to emit infrared band light, and specifically can be a VCSEL (vertical cavity surface emitting laser), an EEL (edge emitting laser), an HCSEL (horizontal cavity surface emitting laser) and the like. The first light source 1011 comprises a positive electrode and a negative electrode, in the direction perpendicular to the mainboard 105, the positive electrode is located on the side away from the mainboard 105 of the negative electrode, the negative electrode is bonded on the mainboard 105 through conductive glue, and the positive electrode is electrically connected with the mainboard through a metal wire, or the positive electrode and the negative electrode are both located on the side of the first light source 1011 facing the mainboard 105 and are welded with the mainboard 105 through soldering. The conductive property of the conductive glue can form conduction between the negative electrode of the first light source 1011 and the mainboard 105, and the conductive glue can be conductive silver glue, copper powder conductive glue, nickel-carbon conductive glue and silver-copper conductive glue and the like having adhesive property and conductive property. The metal wire can be a copper wire, an aluminum wire, a gold wire and the like having good conductive property. The second light source 1012 is used to emit infrared band light, and specifically can be a light emitting diode or a laser light source. The second light source 1012 can be packaged on a ceramic substrate or a circuit board of other material, and the lower surface of the package body has a positive electrode and a negative electrode, and the lower surface is welded on the mainboard 105 through soldering.

[0093] The cushion block 1014 can be a printed circuit board (PCB), a ceramic substrate or a metal conductive block in general. The cushion block 1014 can be placed below the first light source 1011 or below the second light source 1012 (in the figure, the cushion block is placed below the second light source 1012). One aspect of the function of the cushion block 1014 is to elevate the light source, so that the light emitting surface of one light source has a certain height difference with the light emitting surface of the other light source. In the embodiment, the height difference makes the light emitting surface of the first light source 1011 located at the focal plane of the collimating mirror or the collimating and diffractive integrated optical element, and the light emitting surface of the second light source 1012 located at the virtual focal plane of the collimating mirror or the collimating and diffractive integrated optical element. Another aspect of the function of the cushion block 1014 is to electrically connect the light source to the main board. If the cushion block 1014 is not a metal cushion block, the side surface of the cushion block 1014 close to the second light source 1012 is provided with a first conductive sheet and a second conductive sheet, the side surface of the cushion block 1014 close to the main board 105 is provided with a third conductive sheet and a fourth conductive sheet, the first conductive sheet is electrically connected to the third conductive sheet, and the second conductive sheet is electrically connected to the fourth conductive sheet; the side surface of the second light source 1012 facing the cushion block 1014 is provided with a positive electrode and a negative electrode, and the positive electrode and the negative electrode are respectively electrically connected to the first conductive sheet and the second conductive sheet; the cushion block 1014 is electrically connected to the main board 105 through the third conductive sheet and the fourth conductive sheet (not shown in the figure).

[0094] The light adjusting element 1015 is located on the light emitting side of the light source, which can be a collimating and diffractive integrated optical element as shown in the figure, which can be a metasurface lens or a Figure 10 Figure 11 ​The collimating mirror and the diffractive optical element can also be a reasonable combination of the three possible optical elements. The first light source 1011 projects structured light to the imaging target after passing through the light adjusting element 1015. The second light source 1012 projects uniform floodlight to the imaging target after passing through the light adjusting element 1015. Optionally, the light adjusting element 1015 can be a collimating-diffractive integrated optical element, including a microstructure surface integrating the functions of collimation and diffraction, a substrate, which can be glass (such as quartz) or plastic (such as PC, PMMA, etc.), which can be realized by integrating a collimating microstructure surface and a diffractive microstructure surface on a piece of optical element, or using a microstructure surface to realize the collimation and diffraction functions as described above, such as a grating microstructure surface designed based on the diffraction principle, or a metasurface microstructure surface designed based on the generalized Snell's principle. The collimating-diffractive integrated optical element is fixed in the mounting groove of the lens barrel 1016 by low-flowability glue, and the lens barrel 1016 is fixed on the main board 105 by glue. Optionally, the light adjusting element 1015 can be a collimating mirror and a diffractive optical element. The collimating mirror can be composed of one or more lens pieces, and the lens pieces are fixed on the lens barrel 1016, and the diffractive optical element is fixed on the stepped surface of the lens barrel 1016. The light emitted by the laser light source is collimated into a parallel light beam after passing through the collimating mirror, and the parallel light beam is diffracted into structured light with certain characteristic information by the diffractive optical element.

[0095] In this embodiment, the structured light projection unit and the first floodlight projection unit are further integrated in one projector, further simplifying the complexity of the 3D structured light module, making it easier to manufacture and produce, and facilitating small integration. At the same time, the collimating-diffractive integrated optical element can be used to realize the collimation function of the collimating mirror and the diffraction replication function of the diffractive optical element, and by integrating the collimation and diffraction replication functions on a piece of optical element, one collimating lens is reduced, and the material cost and assembly difficulty are further reduced.

[0096] Figure 12 is another structure diagram of a 3D structured light module in a three-dimensional imaging device for fusing structured light and DTOF according to an embodiment of the utility model. As shown in Figure 12As shown, the first projector 101 comprises a structured light projection unit and a first flood light projection unit, which can be integrated in the same lens barrel 1016, at this time, the structured light projection unit and the first flood light projection unit share one light adjusting element. The light adjusting element is located on the light emitting side of the light source in the structured light projection unit and the first flood light projection unit, and is used to modulate the emitted light of the light source in the structured light projection unit and the first flood light projection unit respectively, so as to correspondingly project the flood light and the structured light. The lens barrel 1016 has two mounting grooves, namely a first mounting groove 10161 and a second mounting groove 10162, and two metal terminals, namely a first metal terminal 10163 and a second metal terminal 10164. The collimating mirror diffractive optical element 1015 is fixed on the first mounting groove 10161 by low-flowability glue, and the first flood light projection unit is fixed on the second mounting groove 10162 by low-temperature curing conductive glue. The lower surface of the first flood light projection unit has a positive electrode and a negative electrode, which are connected with different metal terminals through conductive glue respectively. The upper end surface of the first metal terminal 10163 and the second metal terminal 10164 is flush with the slotted surface of the second mounting groove 10162, and the lower end surface of the first metal terminal 10163 and the second metal terminal 10164 protrudes from the lower surface of the second mounting groove 10162, and is electrically connected to the main board 105 by means of soldering or conductive glue connection. The first metal terminal 10163 and the second metal terminal 10164 are inlaid in the lens barrel 1016 by in-mold injection process. In this embodiment, the lens barrel 1016 and the metal terminal are integrally processed and formed by in-mold injection process, and then the structured light projection unit and the first flood light projection unit are combined in the same lens barrel 1016, which further simplifies the complexity of the 3D structured light module, is easy to manufacture and produce, and is convenient for small integration.

[0097] Figure 13 is another structural diagram of a 3D structured light module in a three-dimensional imaging device of structural light and DTOF fusion according to an embodiment of the utility model. As shown, Figure 13 the first projector 101 further comprises a first flood light projection unit, the first flood light projection unit comprises a second light source 1012 and a first light uniformity element 10122, the first flood light projection unit is separately arranged with the structured light projection unit, the second light source 1012 is used to emit infrared waveband light, and the first light uniformity element 10122 is used to modulate the emitted light of the second light source 1012 to correspondingly project the first flood light.

[0098] That is, in this embodiment, the structured light projection unit and the first floodlight projection unit can also be divided into two independent units. Among them, the first floodlight projection unit at least includes a second light source 1012 which emits infrared band light. At this time, the first floodlight projection unit can include a light-emitting diode 10121 which emits a light beam in a direction away from the main board 105, and a first light homogenizing element 10122, i.e. a lens, which is located on the light beam path emitted by the light-emitting diode 10121 and is used to expand the field of view of the light-emitting diode 10121; or the first floodlight projection unit can include a laser light source 10121 and a first light homogenizing element 10122, and the first light homogenizing element 10122 can be a diffusion sheet, the laser light source 10121 emits a laser beam in a direction away from the main board 105, and the first light homogenizing element 10122 is located on the light beam path emitted by the laser light source and is used to shape and homogenize the laser beam. At this time, the first floodlight projection unit can realize the function of projecting a rectangular or circular floodlight with a certain required field of view size. The light-emitting diode 10121 and the first light homogenizing element 10122, or the laser light source 10121 and the first light homogenizing element 10122, can be packaged on a ceramic substrate or a circuit board made of other materials, and the lower surface of the package has a positive electrode and a negative electrode, which are soldered to the main board 105.

[0099] Optionally, Figure 14 is another structure diagram of a 3D structured light module in a three-dimensional imaging device for fusing structured light and DTOF according to an embodiment of the present application. As shown in the figure, Figure 14 The three-dimensional imaging device further includes an ambient light sensor 1017 and / or a proximity sensor 1018, which are arranged on the first surface or the second surface and are electrically connected to the main board 105.

[0100] Among them, in the three-dimensional imaging device, the ambient light sensor 1017 is used to detect the illumination of the environment and sense whether the illumination of the surrounding environment is lower than a certain threshold value. Generally, the setting range of the threshold value is 5-100 Lux. When the ambient light illumination rises or falls, other modules can be selectively controlled to respond, such as controlling the first floodlight projection unit to turn on and project uniform floodlight to the target object only when the ambient light illumination is lower than the above-mentioned threshold value. The proximity sensor 1018 is used to sense whether there is a target object within the working distance range of the 3D structured light module, and generates a trigger signal when the target object approaches. Other modules can selectively respond according to the trigger signal.

[0101] Embodiment two

[0102] In this embodiment, the three-dimensional imaging device comprises a first projector for projecting the first structured light and the second structured light, a second receiver for receiving the reflected light of the second structured light, and a first receiver for receiving the reflected light of the first structured light. Further, if the first projector also projects the first floodlight, the first receiver also receives the reflected light of the first floodlight. Further, if the first projector does not project the second structured light, but projects the second floodlight, the second receiver also receives the reflected light of the second floodlight.

[0103] Specifically, Figure 15 is another planar structure schematic diagram of a three-dimensional imaging device of structured light and DTOF fusion according to an embodiment of the present application. Figure 16 is a structural schematic diagram of a three-dimensional imaging device of structured light and DTOF fusion according to an embodiment of the present application.

[0104] As Figure 15 and Figure 16 shown, the device comprises a mainboard 105, a projection module, a receiving module, a processing chip 106 and an interface module 107. Among them, the projection module comprises a first projector 101 for projecting the first structured light and the second structured light, and the receiving module comprises a first receiver 104 for image acquisition of the reflected light after the first structured light is projected to the target object and a second receiver 103 for photon detection and timing of the reflected light after the second structured light is projected to the target object.

[0105] Among them, the first projector 101 comprises a structured light projection unit, and the structured light projection unit comprises a first light source 1011 and a light modulation element 1015; the first light source 1011 is used for emitting infrared waveband light; the light modulation element 1015 is located on the light emitting side of the first light source 1011, and is used for modulating the emitted light of the first light source 1011 to correspondingly project the first structured light or the second structured light; the light modulation element 1015 comprises one or more of a metasurface lens optical element, a collimating and diffractive integrated optical element, or a collimating mirror and a diffractive optical element combination optical element.

[0106] When the projection module comprises the first projector 101 for projecting the first structured light and the second structured light, in the structured light emission mode, the processing chip 106 is used for controlling the first projector 101 to project the first pulse light signal as the first structured light, and in the DTOF emission mode, the processing chip 106 is used for controlling the first projector 101 to project the second pulse light signal as the second structured light, the frequency of the first pulse light signal is less than or equal to the frequency of the second pulse light signal, and the pulse width of the first pulse light signal is greater than or equal to the pulse width of the second pulse light signal.

[0107] Compared with the first embodiment, the present embodiment also adopts the common substrate design, but omits the second projector 102 and only retains the first projector 101 which is used for both the structured light function and the DTOF function. At this time, the first projector 101 has two working modes: a structured light projection mode and a DTOF emission mode, and the two modes share the same light source working area and emission light path; the difference lies in the driving pulse, wherein the structured light projection mode corresponds to a low-frequency wide pulse, i.e., the first structured light, and the frequency is usually lower than 120 Hz and the pulse width is greater than 0.1 ms; the DTOF emission mode corresponds to a high-frequency narrow pulse, i.e., the second structured light, and the frequency is usually between 1 MHz and 100 MHz and the pulse width is less than 0.1 ms.

[0108] Alternatively, the projection module includes the first projector 101 for projecting the first structured light and the second flood light, and the receiving module includes the first receiver 104 for image acquisition of the reflected light after the first structured light is projected onto the target object and the second receiver 103 for photon detection and timing of the reflected light after the second flood light is projected onto the target object.

[0109] The first projector 101 further includes a first flood light projection unit, and the first flood light projection unit includes a second light source 1012 and a light adjusting element. The second light source 1012 is used for emitting infrared band light, and the light adjusting element is used for modulating the emitted light of the second light source 1012 to correspondingly project the second flood light. The first projector 101 further includes a height-raising block 1014 which is used for raising the first light source 1011 or the second light source 1012 so that there is a height difference between the light emitting surface of the first light source 1011 and the light emitting surface of the second light source 1012, and is also used for electrically connecting the raised light source and the main board 105. Alternatively, the first projector 101 further includes a first flood light projection unit, and the first flood light projection unit includes a second light source 1012 and a first light homogenizing element 10122. The first flood light projection unit and the structured light projection unit are separately arranged, the second light source 1012 is used for emitting infrared band light, and the first light homogenizing element 10122 is used for modulating the emitted light of the second light source 1012 to correspondingly project the second flood light.

[0110] That is, the first projector 101 also includes at least a structured light projection unit and can further include a first flood light projection unit. If the first projector 101 only includes the structured light projection unit, the structured light is used for light compensation in the DTOF emission mode, i.e., the second structured light is projected; if the first projector 101 further includes the first flood light projection unit, the flood light is used for light compensation in the DTOF emission mode, i.e., the second flood light is projected.

[0111] The three-dimensional imaging device can control the first projector 101 to select different working modes through the processing chip 106, give the first projector 101 different driving signals according to different working modes, and control the first receiver 104 to receive signals when the first projector 101 is in a structured light projection mode, so as to realize a structured light function; when the first projector 101 is in a DTOF emission mode, control the second receiver 103 to receive signals, so as to realize a DTOF function.

[0112] The embodiment omits the second projector 102, can further reduce the use of materials, simplify the structural complexity of the three-dimensional imaging device, make the three-dimensional imaging device easier to manufacture and produce, improve the integration of the three-dimensional imaging device, and reduce the volume of the three-dimensional imaging device.

[0113] The related structures of the first receiver 104 and the second receiver 103 are described in detail in Embodiment One, and will not be repeated here.

[0114] In addition, when the projection module includes the first floodlight projection unit, the illumination light supplementing mode in Embodiment One is also provided, in which the first floodlight projection unit is used to project the first floodlight to the target object; and the receiving module is used to collect images of the reflected light of the first floodlight projected to the target object.

[0115] In addition, the environment sensor and / or the proximity sensor in Embodiment One can be applied to this embodiment, and specific reference can be made to the description in Embodiment One.

[0116] Embodiment Three

[0117] In this embodiment, the three-dimensional imaging device includes a first projector that projects a first structured light, a second projector that projects a second floodlight, and a second receiver that receives reflected light of the first structured light and reflected light of the second floodlight. Further, if the first projector also projects the first floodlight, the second receiver also receives reflected light of the first floodlight.

[0118] Specifically, Figure 17 is another planar structure schematic diagram of a three-dimensional imaging device fusing structured light and DTOF according to an embodiment of the utility model. Figure 18 is a structural schematic diagram of a three-dimensional imaging device fusing structured light and DTOF according to an embodiment of the utility model.

[0119] As Figure 17 and Figure 18As shown in the figure, the device comprises a main board 105, a projection module, a receiving module, a processing chip 106 and an interface module 107. The projection module comprises a first projector 101 for projecting a first structured light and a second projector 102 for projecting a second floodlight, and the receiving module comprises a second receiver 103 for image acquisition of the reflected light after the first structured light is projected onto a target object and photon detection and timing of the reflected light after the second floodlight is projected onto the target object.

[0120] Compared with the first embodiment, the first projector 101 and the second projector 102 can refer to the description in the first embodiment, which will not be repeated here. In this embodiment, a common substrate design is also adopted, but the first receiver 104 is omitted, and only the second receiver 103 is retained, which is used for both structured light function and DTOF function. At this time, the second receiver 103 has two working modes: structured light receiving mode and DTOF receiving mode. Since the second receiver 103 contains a SPAD imaging chip or a SiPM imaging chip, it has SPAD pixels, so in the structured light receiving mode, the SPAD pixel photon statistical data can be converted into a grayscale image, thereby obtaining the IR image information of the imaging target.

[0121] The three-dimensional imaging device can control the second receiver 103 to select different working modes through the processing chip 106. When the second receiver 103 is in the structured light receiving mode, the first projector 101 also comprises at least a structured light projection unit, and can also comprise a first floodlight projection unit; the processing chip 106 controls the first projector 101 to project the first structured light or the first floodlight to the target object, and the reflected light signal is collected by the SPAD pixels in the imaging chip 1031 of the second receiver 103 to obtain the light signal of the imaging target, and the depth value is obtained through triangulation, thereby obtaining the IR image information with feature information, and realizing the structured light function.

[0122] When the second receiver 103 is in the DTOF receiving mode, the second projector 102 is controlled to emit a light signal, i.e. to project the second floodlight, and the SPAD pixels in the second imaging chip 1031 generate avalanche signals after receiving the light signal, and the time of flight is directly measured through single-photon detection technology, and the light signal is emitted and received multiple times in a very short time, and the recorded time of flight is calculated to obtain the depth information of the imaging target, thereby realizing the DTOF function.

[0123] In this embodiment, the first receiver 104 is omitted, which can further reduce the use of materials, simplify the structural complexity of the three-dimensional imaging device, make the three-dimensional imaging device easier to manufacture and produce, improve the integration of the three-dimensional imaging device, and reduce the volume of the three-dimensional imaging device.

[0124] The three-dimensional imaging device with the fusion of the structured light and the DTOF technology can obtain high-precision image information of an imaging target in a short distance range (for example, within 1m) through the 3D structured light technology, and obtain ordinary-precision depth information in a long distance range (for example, 1-10m) through the DTOF technology. Next, the two kinds of information are fully fused through depth map processing, depth map fusion and the like algorithms to form a complete depth map output or depth information output. Thus, the three-dimensional imaging device with the fusion of the structured light and the DTOF technology provided by the embodiment can realize high-precision three-dimensional imaging in a near distance, and can also realize ordinary-precision three-dimensional imaging in a middle or long distance, and simultaneously meets the functions of identity authentication, face modeling in a near distance scene, space positioning in a middle or long distance scene and the like, and meets the application in a full scene.

[0125] The utility model embodiment further provides a terminal device, including the three-dimensional imaging device of the utility model any embodiment of structured light and DTOF fusion.

[0126] The three-dimensional imaging device and the terminal device with the fusion of the structured light and the DTOF technology provided by the embodiment of the utility model, the imaging device includes a mainboard, a projection module, a receiving module, a processing chip and an interface module, wherein the projection module is used for projecting a first light signal to a target object in a structured light emission mode, and is used for projecting a second light signal to the target object in a DTOF emission mode; the receiving module is used for image acquisition on reflected light of the first light signal projected to the target object, and is also used for photon detection and timing on reflected light of the second light signal projected to the target object; each projector in the projection module and each receiver in the receiving module are located on the first surface of the mainboard, and are electrically connected with the mainboard and arranged in a linear or cross shape; the processing chip is used for providing a driving signal to the projection module and the receiving module, and processing image information or depth information of the target object, and is arranged on the first surface or the second surface of the mainboard and electrically connected with the mainboard; the interface module is used for at least power supply and data transmission channel for the mainboard, and is arranged on the first surface or the second surface of the mainboard and electrically connected with the mainboard. Thus, the three-dimensional imaging device provided by the utility model integrates each projector and receiver on the mainboard, and has small volume, high integration and low cost.

[0127] The above detailed description does not constitute a limitation on the protection scope of the utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A three-dimensional imaging device fusing structured light and DTOF, characterized in that, The application relates to a depth camera, which comprises a main board, a projection module, a receiving module and a processing chip. The main board comprises a first surface and a second surface arranged oppositely. The projection module has a structured light emission mode and a DTOF emission mode, wherein the structured light emission mode is used for projecting a first light signal to a target object, and the DTOF emission mode is used for projecting a second light signal to the target object; the first light signal comprises first structured light, and the second light signal comprises second structured light or second flood light. The receiving module is used for image acquisition of reflected light of the first light signal projected to the target object, and is also used for photon detection and timing of reflected light of the second light signal projected to the target object. The projection module comprises a first projector used for projecting the first structured light and a second projector used for projecting the second flood light, or the projection module comprises a first projector used for projecting the first structured light and the second structured light, or a first projector used for projecting the first structured light and the second flood light, and the receiving module comprises a first receiver used for image acquisition of reflected light of the first structured light projected to the target object and a second receiver used for photon detection and timing of reflected light of the second structured light or the second flood light projected to the target object; or the projection module comprises a first projector used for projecting the first structured light and a second projector used for projecting the second flood light, and the receiving module comprises a second receiver used for image acquisition of reflected light of the first structured light projected to the target object and photon detection and timing of reflected light of the second flood light projected to the target object. Each projector in the projection module and each receiver in the receiving module are located on the first surface and are electrically connected with the main board and arranged in a linear or cross shape. The processing chip is used for providing driving signals to the projection module and the receiving module, processing image information or depth information of the target object, and is arranged on the first surface or the second surface and is electrically connected with the main board. The interface module is used for at least powering and providing a data transmission channel for the main board, is arranged on the first surface or the second surface and is electrically connected with the main board.

2. The structured light and DTOF fusion three-dimensional imaging device according to claim 1, characterized in that, The first projector comprises a structured light projection unit, the structured light projection unit comprises a first light source and a light modulation element. The first light source is used for emitting infrared band light. The light modulation element is located on the light emitting side of the first light source and is used for modulating the emitted light of the first light source to correspondingly project the first structured light or the second structured light; the light modulation element comprises one or more of an ultrathin surface lens optical element, a collimating and diffractive integrated optical element or a collimating mirror and a diffractive optical element combination. 3.The structured light and DTOF fusion three-dimensional imaging device according to claim 2, characterized in that, The first projector further comprises a first flood light projection unit, the first flood light projection unit comprises a second light source and the light modulation element, the second light source is used for emitting infrared band light, and the light modulation element is used for modulating the emitted light of the second light source to correspondingly project the first flood light or the second flood light. The first projector further comprises a heightening block, which is used for heightening the first light source or the second light source, so that there is a height difference between the light emitting surface of the first light source and the light emitting surface of the second light source, and is also used for electrically connecting the heightened light source with the main board. 4.The structured light and DTOF fusion three-dimensional imaging device according to claim 2, characterized in that, The first projector further comprises a first floodlight projection unit, which comprises a second light source and a first light uniformization element, the first floodlight projection unit is separately arranged from the structured light projection unit, the second light source is used for emitting infrared waveband light, and the first light uniformization element is used for modulating the emitted light of the second light source to correspondingly project the first floodlight or the second floodlight. 5.The structured light and DTOF fusion three-dimensional imaging device according to claim 3 or 4, characterized in that, The projection module further has an illumination light supplementing mode, in which the first floodlight is projected to the target object; and the receiving module is used for image acquisition on the reflected light of the first floodlight projected to the target object. 6.The structured light and DTOF fusion three-dimensional imaging device according to claim 1, characterized in that, When the three-dimensional imaging device comprises a first receiver, the first receiver comprises an infrared camera unit, the infrared camera unit comprises a first imaging chip, a first imaging lens and a first light filtering assembly, and the first imaging lens and the first light filtering assembly are respectively located on a light receiving path of the first imaging chip. The first imaging lens is one or a combination of a metasurface lens, a diffractive lens and a refractive lens, the first imaging chip is a CMOS chip or a CCD chip, and the first light filtering assembly is an infrared narrowband filter or an electrochromic filter. 7.The structured light and DTOF fusion three-dimensional imaging apparatus according to claim 1, characterized in that, When the three-dimensional imaging device comprises the second projector, the second projector comprises a second floodlight projection unit, the second floodlight projection unit comprises a third light source and a second light uniformization element, the third light source is used for emitting infrared waveband light, and the second light uniformization element is used for modulating the emitted light of the third light source to correspondingly project the second floodlight. 8.The structured light and DTOF fusion three-dimensional imaging apparatus according to claim 1, wherein, The second receiver comprises a DTOF camera unit, the DTOF camera unit comprises a second imaging chip, a second imaging lens and a second light filtering assembly, and the second imaging lens and the second light filtering assembly are respectively located on a light receiving path of the second imaging chip. The second imaging lens is one or a combination of a metasurface lens, a diffractive lens and a refractive lens, the second imaging chip is a SPAD chip or a SIPM chip, and the second light filtering assembly is an infrared narrowband filter. 9.The structured light and DTOF fusion three-dimensional imaging apparatus according to claim 1, characterized in that, An environmental sensor and / or a proximity sensor are further included, which are arranged on the first surface or the second surface and are electrically connected with the main board.

10. The structured light and DTOF fusion three-dimensional imaging device according to claim 1, characterized in that, When the projection module comprises the first projector used for projecting the first structured light and the second structured light, in the structured light emission mode, the processing chip is used for controlling the first projector to project a first pulse light signal as the first structured light, and in the DTOF emission mode, the processing chip is used for controlling the first projector to project a second pulse light signal as the second structured light, the frequency of the first pulse light signal is less than or equal to the frequency of the second pulse light signal, and the pulse width of the first pulse light signal is greater than or equal to the pulse width of the second pulse light signal.

11. A terminal device, comprising: A three-dimensional imaging device fusing structured light and DTOF as claimed in any one of claims 1-10.

Images