Fuel steam pressure sensor and automobile
By using a ceramic substrate integrated chip and a sealing layer for protection in the fuel vapor pressure sensor, the problems of difficult and costly sensor packaging are solved, and a low-cost, high-performance fuel vapor pressure sensor is realized.
Patent Information
- Application Number
- CN202423291658.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing fuel pressure sensors involve laying out multiple chips and circuit modules on a PCB board, which increases packaging difficulty and cost.
By using ceramic substrate integrated chips, the circuit modules are concentrated on the ceramic substrate and combined with the PCB board through the surface mount pads of the ceramic substrate, reducing packaging costs. At the same time, plastic covers and sealing adhesive layers are used for protection.
It reduces packaging costs, improves the sealing performance and protection capabilities of the sensor, ensures the long-term stability and robustness of the sensitive chip, and simplifies the manufacturing process.
Smart Images
Figure CN223783791U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of automobile fuel systems, and relates to a fuel vapor pressure sensor and an automobile. BACKGROUND
[0002] With the development of the automobile industry, people's demand and use of automobiles are gradually irreplaceable.
[0003] At present, the installation position of the fuel pressure sensor is mainly on the integrated fuel tank or on the external pipeline or carbon tank, and the working principle is that when the pressure in the monitoring system changes, the sensor collects the pressure signal and converts it into a voltage type signal input to the ECU, and the ECU determines whether there is a leak in the entire system; the structure of the fuel pressure sensor on the market is that the pressure-sensitive chip and the conditioning chip are integrated on the PCBA.
[0004] However, in the above-mentioned fuel pressure sensor, multiple chips and circuit modules need to be arranged on the PCB board to realize its function, which also increases the packaging difficulty of the sensor and the packaging cost. CONTENT OF THE UTILITY MODEL
[0005] The application aims to provide a fuel vapor pressure sensor and an automobile, which solve the technical problem that the packaging difficulty of the sensor is increased and the packaging cost is high due to the arrangement of multiple chips and circuit modules on the PCB board in the prior art.
[0006] To achieve the above-mentioned purpose and other related purposes, the first aspect of the application provides a fuel vapor pressure sensor. The fuel vapor pressure sensor comprises: a shell, the shell comprising: a main shell, a left interface, a right interface and a front interface, the left interface and the right interface being arranged on the two sides of the main shell respectively, and the front interface being arranged at the front end of the main shell, the left interface and the right interface and the main shell forming a first communication cavity, and the front interface and the main shell forming a second communication cavity; an upper cover, the upper cover being sealedly connected with the main shell through a first sealing glue layer, and a containing space being formed between the upper cover and the inside of the main shell; an integrated module, the integrated module being arranged at the bottom of the containing space and connected with the main shell through a second sealing glue layer; and a PCB board, the PCB board being arranged in the containing space and connected with the integrated module and arranged on the upper part of the integrated chip.
[0007] In some embodiments of the first aspect of the application, the integrated module comprises: a pressure chip and a calibration chip, and a ceramic substrate; the pressure chip and the calibration chip are arranged on the ceramic substrate with the ceramic substrate as a carrier.
[0008] In some embodiments of the first aspect of the present application, the integrated module further comprises a plastic cover; the plastic cover is arranged on the ceramic substrate to protect the pressure chip and the calibration chip and the sensing element on the ceramic substrate.
[0009] In some embodiments of the first aspect of the present application, the sensing element comprises a MEMS wafer and an ASIC wafer; the MEMS wafer and the ASIC wafer are communicatively connected by ultrasonic wire bonding.
[0010] In some embodiments of the first aspect of the present application, the plastic cover is provided with air holes for injecting a sensing element protection glue into a cavity formed by the plastic cover and the ceramic substrate through the air holes, and for allowing the sensing element to communicate with the atmosphere.
[0011] In some embodiments of the first aspect of the present application, the ceramic substrate is provided with a patch pad and a signal transmission line; the sensing element and the pressure chip and the calibration chip are communicatively connected to the PCB board through the patch pad and the signal transmission line.
[0012] In some embodiments of the first aspect of the present application, the left interface and the right interface are both tubular knurl structures; the main housing is inserted with the fuel pipeline through the left interface and the right interface.
[0013] In some embodiments of the first aspect of the present application, the front interface is provided with a plurality of metal pins to electrically connect the sensor with the fuel system.
[0014] In some embodiments of the first aspect of the present application, the sensor further comprises a waterproof and breathable membrane and a protective cover; the upper cover is provided with a convex structure, and the convex structure is provided with a breathable hole; the waterproof and breathable membrane is arranged on the breathable hole of the convex structure to allow the upper cover to separate water molecules from gas molecules; the protective cover is arranged on the upper layer of the waterproof and breathable membrane, and the protective cover is connected to the convex structure in interference fit.
[0015] To achieve the above object and other related objects, the second aspect of the present application provides an automobile. The automobile comprises the fuel vapor pressure sensor of any one of the first aspect of the present application; the fuel vapor pressure sensor is arranged in the fuel inlet and outlet pipeline of the automobile.
[0016] As described above, the fuel vapor pressure sensor and the automobile of the present application have the following beneficial effects:
[0017] First, the integrated chip of the present application uses ceramic as the base material, greatly improving the output voltage function of the sensor and the robustness of long-term use in fuel medium, and the ceramic has excellent medium compatibility and mechanical stability, which can ensure the long-term stability of the output function of the sensitive chip.
[0018] Second, to realize the strong protection function of the sensor, the integrated chip plastic shell of the fuel vapor pressure sensor of the present application is filled with glue inside, and after the PCB circuit board is pasted with all components, three waterproof glues are sprayed, and waterproof glue can be applied to the part near the pin of the sensor shell to prevent the electrical interface (including the metal pin part) of the shell from being eroded by external water vapor and causing damage to the signal transmission line.
[0019] Third, the integrated module of the present application uses low-cost small module integration packaging, integrates all sensitive components on the ceramic substrate to form an integrated chip, and draws signals out to the patch pad through several lines printed on the ceramic. The patch pad and the patch pad of the PCB are combined by soldering. From the manufacturing point of view, the cost of packaging is greatly reduced, and integrated manufacturing is becoming simpler and simpler, saving labor time and reducing the cost of manual intervention.
[0020] Fourth, the fuel vapor sensor of the present application improves the application of low-permeability sealing glue to the ceramic substrate through the shell glue storage groove, greatly improving the sealing performance of the sensor. The key core chip of the fuel vapor pressure sensor of the present application uses domestic chip development. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 An explosion schematic diagram showing the overall structure of the fuel vapor pressure sensor according to the embodiments of the present application.
[0022] Figure 2 A structure schematic diagram showing the shell according to the embodiments of the present application.
[0023] Figure 3 A structure schematic diagram showing the integrated module according to the embodiments of the present application.
[0024] Figure 4 A structure schematic diagram showing the upper cover according to the embodiments of the present application.
[0025] ELEMENT NUMBER EXPLANATION
[0026] 10 Fuel vapor pressure sensor 1 Protective cover 2 Waterproof air-permeable membrane 3 Upper cover 31 Convex structure 32 Air-permeable hole 4 First sealant layer 5 PCB board 6 Integrated module 61 Ceramic substrate 62 Plastic cover 63 Patch pad 64 Air hole 7 Second sealant layer 8 Housing 81 Main housing 82 Left interface 83 Right interface 84 Front interface DETAILED DESCRIPTION
[0027] Following, specific, concrete examples will be used to illustrate the embodiments of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the disclosure of the specification. The present application can also be implemented or applied by means of other different specific embodiments, and various modifications or changes can be made to the details in the specification without departing from the spirit of the present application. It should be noted that the following examples and features in the examples can be combined with each other without conflict.
[0028] It should be noted that the diagrams provided in the following examples only illustrate the basic concept of the present application in a schematic manner, and only the components related to the present application are shown in the diagrams, not the number, shape and size of the components when actually implemented. The actual implementation of each component may be a random change, and the component layout pattern may be more complex.
[0029] In the embodiments of the present application, "first", "second", etc. are used to distinguish the same or similar items with basically the same function and effect. For example, the first sealant layer and the second sealant layer are only used to distinguish the sealant layers at different positions on the same fuel vapor pressure sensor, and do not limit the sequence. Those skilled in the art can understand that "first", "second", etc. do not limit the number and execution order, and "first", "second", etc. also do not necessarily mean different.
[0030] The following embodiments of the present application provide a fuel vapor pressure sensor and a vehicle. By using an integrated chip with ceramic as the base material, different circuit modules are concentrated on the integrated chip, and then the patch pad of the ceramic base material is tinned and combined with the patch pad of the PCB board, which greatly reduces the packaging cost, and solves the technical problems of increasing sensor packaging difficulty and high packaging cost caused by layout and arrangement of multiple chips and circuit modules on the PCB board in the prior art.
[0031] The principles and implementation modes of a fuel vapor pressure sensor and a vehicle according to the embodiments will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can understand the fuel vapor pressure sensor and the vehicle according to the embodiments without creative labor.
[0032] Please refer to Figure 1 , which shows an exploded schematic diagram of the overall structure of the fuel vapor pressure sensor according to the embodiments of the present application. As shown in Figure 1 , the fuel vapor pressure sensor 10 includes a housing, an upper cover, an integrated module, and a PCB board.
[0033] Specifically, the shell 8 is connected with the upper cover 3 through the first sealing glue layer 4, and a containing space is formed between the shell 8 and the upper cover 3, the integrated module 6 is arranged at the bottom of the containing space, and the integrated module 6 is connected with the shell 8 through the second sealing glue layer 7; the PCB board 5 is arranged in the containing space and connected with the integrated module 6 and arranged on the upper portion of the integrated module 6.
[0034] In the embodiment, the shell 8 and the upper cover 3 are bonded together through the first sealing glue layer 4, so that the waterproof and dustproof and medium protection capability of the fuel vapor pressure sensor can be enhanced.
[0035] In some implementations, the shell 8 includes a main shell 81, a left interface 82, a right interface 83 and a front interface 84.
[0036] Please refer to Figure 2 , which shows a structural schematic diagram of the shell according to the embodiment. As shown in Figure 2 , the shell 8 includes a main shell 81, a left interface 82, a right interface 83 and a front interface 84, the left interface 82 and the right interface 83 are arranged on the two sides of the main shell 81 respectively, the front interface 84 is arranged at the front end of the main shell 81, the left interface 82, the right interface 83 and the main shell 81 form a first communication cavity, and the front interface 84 and the main shell 81 form a second communication cavity.
[0037] Specifically, the main shell 81 is connected with the upper cover 3 through the first sealing glue layer 4, and the integrated module 6 is connected with the main shell 81 through the second sealing glue layer 7.
[0038] In the embodiment, the left interface 82 and the right interface 83 are both tubular and knobby structures, and the main shell 81 is combined and fastened with the fuel pipeline through the left interface 82 and the right interface 83.
[0039] In the embodiment, a plurality of metal pins are arranged on the front interface 84, and the main shell 81 is electrically connected with the fuel system through the front interface 84. Preferably, in the embodiment, three metal pins are arranged on the front interface 84.
[0040] It should be noted that the specific number of metal pins electrically connected with the fuel system is not limited, and can be set according to the actual interface.
[0041] In some implementations, the integrated module 6 includes a pressure chip and a calibration chip, a ceramic substrate 61 and a plastic cover 62.
[0042] Please refer to Figure 3, shows the structural schematic diagram of the integrated module described in the present application. As shown in Figure 3 The integrated module 6 comprises a pressure chip and a calibration chip (not shown in the figure), a ceramic substrate 61 and a plastic cover 62.
[0043] Specifically, the pressure chip and the calibration chip are arranged on the ceramic substrate 61 with the ceramic substrate 61 as a carrier, and the plastic cover 62 is arranged on the ceramic substrate 61 to place the pressure chip and the calibration chip in the cavity formed by the plastic cover 62 and the ceramic substrate 61, thereby protecting the pressure chip, the calibration chip and the sensitive element (not shown in the figure) on the ceramic substrate 61.
[0044] In the present embodiment, the pressure chip, the calibration chip, the ceramic substrate 61 and the plastic cover 62 constitute the integrated module 6, i.e. an integrated chip, which further comprises circuit modules such as force-electricity conversion circuit, power supply circuit, sensor sampling circuit, signal amplification circuit, signal processing circuit, compensation circuit, filter circuit, alarm circuit and voltage protection circuit, etc.
[0045] In the present embodiment, the sensitive element comprises a MEMS wafer and an ASIC wafer, which are communicatively connected through ultrasonic wire bonding, and the intermetallic bonding is realized by ultrasonic vibration and slight mechanical pressure.
[0046] Specifically, the MEMS wafer and the ASIC wafer are respectively used for pressure signal conversion and processed signal processing.
[0047] The fuel vapor pressure sensors required to be used are also different according to the pressure range of different automobile fuel systems. They are mainly divided into low-pressure fuel vapor sensors and high-pressure fuel vapor sensors. The common pressure range of low-pressure fuel systems is, for example, -3.75kPa G-1.25kPa G and -3.75kPa G-3.5kPa G; the range of pressure of extended-range fuel vehicles is high pressure system, and the common pressure range is, for example, -20kPa G-40kPa G and -14.3kPa G-60kPa G.
[0048] The pressure function of the fuel vapor pressure sensor in the embodiment adopts MEMS microelectronic mechanical system chip technology, and the pressure range interval can cover-20-60kPa G. In the embodiment, the MEMS chip and the ASIC chip are arranged on the integrated module, four equivalent high-precision semiconductor force-sensitive resistors are directly engraved at the maximum stress surface of the semiconductor silicon wafer, a Wheatstone measurement bridge is formed, when the external pressure acts on the stress surface, the values of two resistors in the bridge increase, and the values of two resistors decrease, so that the unbalanced voltage output of the Wheatstone bridge changes linearly with the measured pressure, the MEMS chip is excited by the voltage of the ASIC chip, and after receiving the signal of the MEMS chip, amplification, signal conversion, operation processing and filtering are performed, and finally an effective direct current signal is output.
[0049] In the embodiment, as shown in Figure 3 , the ceramic substrate 61 is provided with a patch pad 63 and a signal transmission line (not shown in the figure), and the patch pad 63 is arranged at the four sides of the ceramic substrate 61 and is connected to the patch pad 63 arranged on the PCB 5 by soldering, so that the sensitive element, the pressure chip and the calibration chip are connected in communication with the PCB 5 through the patch pad 63 and the signal transmission line.
[0050] In the embodiment, in addition to the integrated module 6 connected to the PCB 5 through the patch pad 63, some discrete devices such as capacitors, resistors and TVS tubes are arranged on the PCB 5, which are mainly used to filter the signals processed by the chip again and filter out the EMC clutter interference from the outside.
[0051] In the embodiment, as shown in Figure 3 , the plastic cover 62 is provided with two air holes 64, so that the sensitive element protection glue can be injected into the cavity formed by the plastic cover 62 and the ceramic substrate 61 through the air holes 64, and the sensitive element can communicate with the atmosphere through the air holes 64 and sense the change of pressure in real time. Not only can the protection performance of the sensitive element be enhanced, but also the sensitive element can sense the change of external pressure in real time.
[0052] In some implementations, the fuel vapor pressure sensor 10 further comprises a waterproof and breathable film 2 and a protective cover 1.
[0053] Please refer to Figure 4 , which shows a structure schematic diagram of the upper cover according to the embodiment. As shown in Figure 4 , the upper cover 3 comprises a convex structure 31 and a breathable hole 32.
[0054] Specifically, the convex structure 31 is arranged at one end of the upper surface of the upper cover 3, and the air permeable hole 32 is located on the convex structure 31, so that the upper cover 3 can permeate gas molecules.
[0055] As shown in Figure 1 and Figure 4 The waterproof and air permeable film 2 is arranged on the air permeable hole 32 of the convex structure 31, so that the upper cover 3 can isolate water molecules from gas molecules. The protective cover 1 is connected with the convex structure 31 in an interference fit to clamp the waterproof and air permeable film 2 on the air permeable hole 32, so as to protect the waterproof and air permeable film 2 from being damaged by dirt or corrosive media from the outside.
[0056] It should be noted that interference fit is a fitting method in mechanical design, which means that the size of one part (usually a shaft) is slightly larger than the size of another part (usually a hole), so that the two parts need to be assembled with external force. Once the assembly is completed, the connection between the two parts is very tight and usually cannot be easily separated.
[0057] In some implementations, the application also provides an automobile, which comprises the fuel vapor pressure sensor 10 of any embodiment of the application. The fuel vapor pressure sensor 10 is arranged in the inlet and outlet fuel pipelines of the automobile, so as to provide accurate fuel vapor change information for the system while sealing the pipeline, help the system to make OBD diagnosis, and assist the control system to control the fuel emission standard of the vehicle within a reasonable standard range.
[0058] In summary, the application provides a fuel vapor pressure sensor and an automobile. The integrated chip of the application uses ceramic as the base material, which greatly improves the output voltage function of the sensor and the robustness of long-term use in fuel medium. The ceramic has excellent medium compatibility and mechanical stability, which can ensure the long-term stability of the output function of the sensitive chip. The integrated chip of the fuel vapor pressure sensor of the application is protected by glue filling in the plastic shell. After the PCB circuit board is pasted with all components, three waterproof glues are sprayed. The waterproof glue can be applied to the part near the pin of the sensor shell to prevent the electrical interface (including the metal pin part) of the shell from being eroded by external water vapor and causing damage to the signal transmission line, thereby improving the protection function of the fuel vapor sensor. Therefore, the application effectively overcomes the shortcomings of the prior art and has high industrial utilization value.
[0059] The description of the corresponding flow or structure of each of the above figures has its own emphasis. The parts not described in detail in a certain flow or structure can be referred to the related description of other flows or structures.
[0060] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.
Claims
1. A fuel vapor pressure sensor, characterized in that, The sensor includes: The housing includes a main housing, a left interface, a right interface, and a front interface. The left interface and the right interface are respectively disposed on both sides of the main housing, and the front interface is disposed at the front end of the main housing. The left interface, the right interface, and the main housing form a first communicating cavity, and the front interface and the main housing form a second communicating cavity. The upper cover is sealed to the main housing through a first sealing layer, and an accommodating space is formed between the upper cover and the interior of the main housing; An integrated module is disposed at the bottom of the accommodating space and is connected to the main housing through a second sealing layer; A PCB board is disposed within the accommodating space and is connected to the integrated module and disposed on the upper part of the integrated module.
2. The fuel vapor pressure sensor according to claim 1, characterized in that, The integrated module includes: a pressure chip and a calibration chip, and a ceramic substrate; The pressure chip and the calibration chip are disposed on the ceramic substrate using the ceramic substrate as a carrier.
3. The fuel vapor pressure sensor according to claim 2, characterized in that, The integrated module also includes a plastic cover; The plastic cover is disposed on the ceramic substrate to protect the pressure chip, the calibration chip, and the sensitive element on the ceramic substrate.
4. The fuel vapor pressure sensor according to claim 3, characterized in that, The sensing element includes: a MEMS wafer and an ASIC wafer; The MEMS wafer and the ASIC wafer are connected by ultrasonic wire bonding.
5. The fuel vapor pressure sensor according to claim 3, characterized in that, The plastic cover has vent holes for injecting protective adhesive for the sensitive element into the cavity formed by the plastic cover and the ceramic substrate, and for allowing the sensitive element to communicate with the atmosphere.
6. The fuel vapor pressure sensor according to claim 3, characterized in that, The ceramic substrate is provided with surface mount pads and signal transmission lines. The sensitive element, the pressure chip, and the calibration chip are communicatively connected to the PCB board through the surface mount pads and the signal transmission lines.
7. The fuel vapor pressure sensor according to claim 1, characterized in that, Both the left and right interfaces are tubular bamboo-like structures, and the main housing is connected to the fuel line through the left and right interfaces.
8. The fuel vapor pressure sensor according to claim 1, characterized in that, The front interface is provided with multiple metal pins, and the main housing is electrically connected to the fuel system through the front interface.
9. The fuel vapor pressure sensor according to claim 1, characterized in that, The sensor also includes: a waterproof and breathable membrane and a protective cover; the upper cover is provided with a convex structure, and the convex structure is provided with vent holes; The waterproof and breathable membrane is disposed on the vent holes of the convex structure so that the top cover can allow air molecules to pass through while isolating water molecules. The protective cover is disposed on the upper layer of the waterproof and breathable membrane, and the protective cover is interference-fitted with the convex structure.
10. A car, characterized in that, Includes a fuel vapor pressure sensor as described in any one of claims 1-9, wherein the fuel vapor pressure sensor is disposed in the fuel inlet and outlet fuel lines of the vehicle.