Storage backboard interface welding quality rapid detection device

By designing a rapid testing device for the welding quality of the storage backplane interface, and using a voltage divider circuit to detect voltage changes, the problem of high testing cost and low efficiency in small-scale production was solved. This achieved efficient and low-cost welding quality testing, ensuring the reliability and stability of the circuit connection.

CN223784477UActive Publication Date: 2026-01-09MAICUN INFORMATION TECH SHANGHAI
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Patent Information

Application Number
CN202423002948.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2026-01-09
Estimated Expiration
2034-12-05

AI Technical Summary

Technical Problem

Existing technologies are costly and inefficient in detecting the welding quality of storage backplane interfaces during small-scale production or pilot production, making it difficult to meet cost-effectiveness requirements.

Method used

A rapid testing device for the welding quality of storage backplane interfaces was designed. It utilizes a microcontroller ADC interface, pull-up resistors, and parallel resistors to form a voltage divider circuit. The welding quality is judged by detecting voltage changes, including voltage changes in the direct connection circuit, GND interface, and power supply path, thus achieving rapid and non-destructive testing.

Benefits of technology

It reduces testing costs, significantly improves testing efficiency, ensures the reliability and stability of welding quality, simplifies the testing process, and reduces the risk of circuit failures caused by poor welding.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of industrial detection, and discloses a storage backboard interface welding quality rapid detection device which is composed of a disk end interface test card, a storage backboard to be detected and a host end interface test card. According to the utility model, through the welding processing quality detection of the storage connector, the pin connection welding and pseudo welding, and the function normality of the logic control chip are the contents needing to be detected in an emphasized manner, for the path of direct connection of the connector on the PCB, the connection path of the series resistor is ingeniously constructed, and the voltage change on the path is detected, so that the reliability of the circuit is improved. When the pin of the connector is subjected to pseudo soldering, the voltage of the source end test point is close to or equal to the source voltage; and if continuous welding occurs, the voltage of the source end test point is smaller than the expected voltage, and for a GND path or a power supply path, the voltage is detected by constructing a connecting path of parallel resistors so as to judge whether pseudo welding exists or not.
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Description

TECHNICAL FIELD

[0001] The utility model relates to industrial detection technical field more specifically, the utility model relates to a kind of storage backplate interface welding quality rapid detection device. BACKGROUND

[0002] A kind of storage backplate interface welding quality rapid detection device, advanced detection technology and intelligent algorithm are integrated, can be quickly, non-destructively assess welding quality.The device is applicable to each scale storage backplate production test, especially in trial production or small-scale production, can greatly reduce test cost, improve efficiency.Its accurate and efficient detection capability, ensure the reliability and stability of storage backplate interface welding quality.Storage backplate is the core component in electronic equipment, integrated hard disk connector, host interface, PCB board and logic control chip etc.Key components, in production test stage, although ICT probe test is widely used due to its high accuracy and comprehensiveness, to ensure the quality and performance of storage backplate, but this method needs high test equipment and customized test fixture, which is not ideal for cost-effectiveness for small-scale production or trial production stage. SUMMARY

[0003] In order to overcome the deficiencies of the prior art, the utility model provides a kind of storage backplate interface welding quality rapid detection device, with the advantage of rapid detection of storage backplate interface welding quality.

[0004] To achieve the above object, the utility model provides the following technical scheme: a kind of storage backplate interface welding quality rapid detection device, the rapid detection device is composed of disc end interface test card, the storage backplate to be measured and host end interface test card.

[0005] As a preferred technical scheme of the utility model, the disc end interface test card direct connection passageway interface test part is composed of single-chip microcomputer ADC1 interface, 1K pull-up resistor, 9 100 ohm series resistors located in host end.

[0006] As a preferred technical scheme of the utility model, the GND interface test part of the disc end interface test card is composed of single-chip microcomputer ADC2 interface, 1K pull-up resistor and 10K parallel resistor.

[0007] As a preferred technical scheme of the utility model, the power passageway interface test part of the disc end interface test card is composed of single-chip microcomputer IO interface, field effect transistor of level conversion.

[0008] As a preferred technical scheme of the utility model, the GND interface test part of the host end interface test card is composed of single-chip microcomputer ADC1 interface, 1K pull-up resistor and 10K parallel resistor.

[0009] Compared with the prior art, the storage connector welding processing quality detection has the following beneficial effects:

[0010] The utility model discloses a welding processing quality detection device for storage backboard interface, which comprises a disc end interface test card, a to-be-tested storage backboard and a host end interface test card. BRIEF DESCRIPTION OF DRAWINGS

[0011] Fig. 1 It is a detection flowchart of the utility model.

[0012] Fig. 2 It is a disc end interface test card of the utility model.

[0013] Fig. 3 It is a host end interface test card of the utility model. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0015] As shown in Figs. 1 to 3 The utility model provides a kind of storage backboard interface welding quality rapid detection device, and the rapid detection device is composed of disc end interface test card, to-be-tested storage backboard and host end interface test card.

[0016] The disc end interface test card direct connection path interface test part is composed of single-chip microcomputer ADC1 interface, 1K pull-up resistance, 9 100 ohm series resistors located in host end.

[0017] In the circuit test, a 1K ohm pull-up resistor is connected with 9 100 ohm series resistors on the host end test card to form a direct path, and a voltage dividing circuit is formed at test point ①. This design ingeniously uses the resistance voltage dividing principle to make the welding quality at any position on the path reflected by the voltage change of test point ①. Once there is a virtual welding or continuous welding quality problem on the path, the voltage of test point ① will deviate from the expected value, thus accurately indicating the welding defects and ensuring the reliability and stability of the circuit connection.

[0018] The circuit test design uses a 1K ohm pull-up resistor and 9 100 ohm series resistors to form a voltage dividing circuit. By monitoring the voltage of test point ①, the welding quality at any position on the path can be sensitively reflected. This design simplifies the test process, improves detection accuracy, ensures the reliability and stability of the circuit connection, and reduces maintenance costs.

[0019] The GND interface test part of the disk end interface test card is composed of the ADC2 interface of the single-chip microcomputer, a 1K pull-up resistor, and a 10K parallel resistor.

[0020] In the circuit test, a 1K ohm pull-up resistor and a 10K ohm resistor connected in parallel to the GND pin form a voltage dividing circuit with the single-chip microcomputer ADC input point ②. This design can sensitively reflect the welding quality of the GND pin. Once there is a virtual welding on any GND pin, the voltage of test point ② will deviate from the expected value, thus accurately indicating the welding defects and ensuring the reliability of the circuit connection.

[0021] This voltage dividing circuit design ingeniously uses a 1K ohm pull-up resistor and a 10K ohm resistor connected in parallel to the GND pin to achieve precise voltage division at the single-chip microcomputer ADC input point ②. This design can sensitively detect the welding quality of the GND pin, ensuring the reliability of the circuit connection. Once there is a virtual welding, an alarm will be triggered, effectively reducing the risk of circuit failure caused by poor welding.

[0022] The power path interface test part of the disk end interface test card is composed of the IO interface of the single-chip microcomputer and the MOSFET for level conversion.

[0023] When there is a virtual welding on the power interface, the IO interface test point ③ of the single-chip microcomputer will abnormally present a high level state, which is inconsistent with the normal expectation. This change can effectively indicate the welding quality problem. At the same time, the host end interface test card can also verify and confirm the reliability of the welding connection through its test function.

[0024] When there is a virtual welding on the power interface, the IO interface test point ③ of the single-chip microcomputer will abnormally present a high level state, which is inconsistent with the normal expectation. This change can effectively indicate the welding quality problem. At the same time, the host end interface test card can also verify and confirm the reliability of the welding connection through its test function.

[0025] The GND interface test section of the host interface test card consists of the ADC1 interface of the microcontroller, a 1K pull-up resistor, and a 10K parallel resistor.

[0026] In circuit testing, a 1K ohm pull-up resistor and a 10K ohm resistor connected in parallel to the GND pin were used to construct a voltage divider circuit at the microcontroller's ADC input point ④. This design can accurately reflect the soldering status of the GND pin. Once there is a cold solder joint on the GND pin, the voltage at test point ④ will deviate from the preset value, thus quickly revealing the soldering defect and ensuring high reliability of the circuit connection.

[0027] In circuit testing, a voltage divider circuit formed at the microcontroller's ADC input point ④ using a 1K ohm pull-up resistor and a 10K ohm resistor connected in parallel to the GND pin not only achieves precise voltage division but also sensitively monitors the soldering status of the GND pin. If a cold solder joint appears on the GND pin, the voltage at test point ④ immediately deviates from the preset value, quickly revealing the soldering defect. This effectively ensures high reliability of the circuit connection and reduces the risk of circuit failure due to poor soldering.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rapid testing device for the welding quality of a storage backplane interface, characterized in that: The rapid testing device includes a disk-side interface test card, a backplane of the storage under test, and a host-side interface test card. The direct-connection interface test section of the disk-end interface test card consists of a microcontroller ADC1 interface, a 1K pull-up resistor, and nine 100-ohm series resistors located on the host side. The GND interface test section of the disk-end interface test card consists of the ADC2 interface of the microcontroller, a 1K pull-up resistor, and a 10K parallel resistor. The power path interface test section of the disk-end interface test card consists of a microcontroller I / O interface and a field-effect transistor for level conversion. The GND interface test section of the host-side interface test card consists of the ADC1 interface of the microcontroller, a 1K pull-up resistor, and a 10K parallel resistor.