Mainboard structure beneficial to heat dissipation

Abstract

The utility model relates to a mainboard structure beneficial to heat dissipation, which belongs to the technical field of mainboard structures and comprises a mainboard body, positioning holes are arranged beside the edge of the mainboard body, a limiting ring is fixed at the bottom of the mainboard body, a clamping plate body is rotatably clamped on the outer wall of the limiting ring, and a limiting side plate is fixed at the bottom of the clamping plate body. An elbow shell is clamped between the limiting side plates in a sliding mode, one end of the elbow shell extends to the position above the mainboard body, a relay heat dissipation assembly is installed at one end of the elbow shell, an end heat dissipation mechanism is arranged on one side of the relay heat dissipation assembly and comprises a round head shell, and an air inlet strip hole is formed in the bottom of the round head shell; according to the mainboard structure, heat dissipation can be enhanced through the end heat dissipation mechanisms and the relay heat dissipation assemblies, the heat dissipation effect is improved, the number of the relay heat dissipation assemblies is adjusted according to requirements, the heat dissipation range can be expanded after a sealing plate is removed, hot air can be blown to the bottom of the mainboard body after heat is absorbed, and the mainboard structure is flexible and convenient to use.

Description

TECHNICAL FIELD

[0001] The utility model relates to the mainboard structure technical field especially relates to a mainboard structure beneficial to heat dissipation. BACKGROUND

[0002] The mainboard is one of the most basic components in the computer, and needs to provide mounting interfaces or slots for various hardware, such as graphics cards, sound cards, network cards and other hardware devices, and also includes some chipsets, which are responsible for communication with CPU, memory and graphics card and other devices, and also communicate with some hard disks, sound cards and USB interfaces. When providing electrical connections, the mainboard also needs to ensure the stability of the hardware, so some mainboards will improve the heat dissipation effect.

[0003] For example, the Chinese utility model patent file with application number 202323321018.5 provides a mainboard structure beneficial to heat dissipation, which includes a mainboard body, a first cooling mechanism installed at the top end of the mainboard body, a convenient installation mechanism fixedly installed on both sides of the mainboard body, and a second cooling mechanism fixedly installed at the bottom end of the mainboard body. The inside of the cooling shell is cooled by starting the cooling fan, and the water inside the water storage tank is transported by starting the water pump. The heat conduction block is cooled by the cooling water pipe, and after cooling is completed, it is transported to the cooling box for cooling. After cooling is completed, it is transported back to the water storage tank through the water pipe, and the cycle is repeated to improve the heat dissipation effect.

[0004] Although the above-mentioned file uses air cooling and water cooling simultaneously for double heat dissipation, the heat dissipation mechanisms are independent of each other, so the heat dissipation effect has no great progress, and in the second cooling mechanism, an external water storage tank is needed to store and cool the cooling liquid, which is more troublesome to use, and thus the utility model is proposed. UTILITY MODEL CONTENTS

[0005] To overcome the technical defects existing in the prior art, the utility model provides a mainboard structure beneficial to heat dissipation, which can enhance heat dissipation through the end heat dissipation mechanism and the relay heat dissipation assembly, increase the heat dissipation effect, adjust the number of relay heat dissipation assemblies according to the demand, expand the heat dissipation range by removing the closure plate, and blow hot air to the bottom of the mainboard body after absorbing heat, which is more flexible and convenient to use.

[0006] The utility model discloses a technical solution is: including mainboard body, is equipped with various function slots and some communication processing chip on the mainboard body, is equipped with positioning hole on the edge of the mainboard body, the bottom of the mainboard body is fixed with the limit ring, the outer wall of limit ring is rotatably connected with the clamping plate body, the bottom of clamping plate body is fixed with the limit side plate, the limit side plate between sliding joint has the elbow casing, the one end of elbow casing extends to the above of mainboard body, the one end of elbow casing is installed with relay heat dissipation subassembly, one side of relay heat dissipation subassembly is equipped with end heat dissipation mechanism, end heat dissipation mechanism includes round head casing, the bottom of round head casing is equipped with air inlet strip hole, the bottom of round head casing is installed with end heat dissipation fan, and end heat dissipation fan is used to introduce the air under round head casing into round head casing, and relay heat dissipation subassembly is used to push the airflow to continue to pressurize flow.

[0007] Preferably, in order to facilitate the installation position of the elbow casing, the lower end surface edge of the elbow casing is fixed with a sliding plate, the sliding plate is slidingly connected between the limit side plates, the elbow casing is fixed with a limit lug plate, the limit lug plate is provided with a limit hole, and the limit hole is provided with a limit bolt through a threaded mode.

[0008] Preferably, in order to facilitate the quick installation of the relay heat dissipation assembly, the upper end surface of the elbow casing is fixed with a docking mechanism, the docking mechanism includes fixed ear plates fixed on both sides of the elbow casing and a plug-in rod fixed on the inner wall of the elbow casing, one side of the relay heat dissipation assembly is also fixed with an auxiliary ear plate corresponding to the fixed ear plate, and the auxiliary ear plate and the fixed ear plate are fixed through a connecting bolt.

[0009] Preferably, in order to facilitate the airflow pressurization flow, the relay heat dissipation assembly includes an intermediate casing, a pump component is fixed to the top of the intermediate casing, and the exhaust port of the pump component faces the elbow casing.

[0010] Preferably, in order to facilitate the one-way pressurization flow of the airflow, a stop block is fixed to the bottom of the intermediate casing, the stop block is located on one side of the pump component, and the bottom of the stop block is provided with an inclined surface.

[0011] Preferably, in order to facilitate the expansion of the heat dissipation range, a sealing plate is slidingly connected to the bottom of the intermediate casing, the bottom of the intermediate casing is provided with an air inlet, and the sealing plate is located below the air inlet.

[0012] Preferably, in order to improve the space utilization, a support column is arranged above the positioning hole on the mainboard body, threaded holes are formed in both ends of the support column, and the support column is installed on the mainboard body through a positioning bolt.

[0013] The utility model discloses a beneficial effect is: this mainboard structure can be through end part heat dissipation mechanism and relay heat dissipation subassembly and strengthen heat dissipation, increase the heat dissipation effect, and can adjust the quantity of relay heat dissipation subassembly according to demand, and can expand the heat dissipation range in the removal closed board, and the position of end part heat dissipation mechanism and relay heat dissipation subassembly can be adjusted according to demand, and then the targeted heat dissipation treatment is carried out to some components of larger heat output, and after absorbing heat, can blow hot air to the bottom of mainboard body, and it is more flexible and convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the three -dimensional structure schematic diagram of the utility model.

[0015] Figure 2 It is the bottom structure schematic diagram of the utility model.

[0016] Figure 3 It is the limiting ring structure schematic diagram of the utility model.

[0017] Figure 4 It is the end part heat dissipation mechanism structure schematic diagram of the utility model.

[0018] Figure 5 It is the elbow casing structure schematic diagram of the utility model.

[0019] Figure 6 It is the relay heat dissipation subassembly structure schematic diagram of the utility model.

[0020] Figure 7 It is the pump air component structure schematic diagram of the utility model.

[0021] Figure 8 It is the stopper structure schematic diagram of the utility model.

[0022] Figure 9 It is the structure schematic diagram of the embodiment 2 of the utility model.

[0023] Mark explanation: in drawing: 1, mainboard body;101, limiting ring;102, clamping plate body;103, limiting side plate;2, elbow casing;201, sliding plate;202, limiting lug;203, limiting bolt;3, relay heat dissipation subassembly;301, intermediate casing;302, pump air component;303, stopper;304, closed board;4, end part heat dissipation mechanism;401, round head casing;402, air inlet strip hole;403, end part heat dissipation fan;5, butt joint mechanism;501, fixed lug plate;502, plug-in rod;503, auxiliary lug plate;504, connecting bolt. DETAILED DESCRIPTION

[0024] The utility model makes further explanation in combination with the drawings: Embodiment 1

[0025] As Figures 1-8 shown, the embodiment provides a mainboard structure beneficial to heat dissipation, comprising a mainboard body 1, the mainboard body 1 is provided with various functional slots and some communication processing chips, a positioning hole is provided beside the edge of the mainboard body 1, the bottom of the mainboard body 1 is fixed with a limiting ring 101, a clamping plate body 102 is rotatably clamped on the outer wall of the limiting ring 101, the bottom of the clamping plate body 102 is fixed with a limiting side plate 103, a bend shell 2 is slidingly clamped between the limiting side plates 103, one end of the bend shell 2 extends above the mainboard body 1, a relay heat dissipation assembly 3 is installed at one end of the bend shell 2, an end heat dissipation mechanism 4 is arranged on one side of the relay heat dissipation assembly 3, the end heat dissipation mechanism 4 comprises a round head shell 401, an air inlet strip hole 402 is formed in the bottom of the round head shell 401, an end heat dissipation fan 403 is installed at the bottom of the round head shell 401, the end heat dissipation fan 403 is used to introduce air below the round head shell 401 into the round head shell 401, and the relay heat dissipation assembly 3 is used to push the airflow to continue to increase the pressure and flow.

[0026] The lower end face edge of the bend shell 2 is fixed with a sliding plate 201, the sliding plate 201 is slidingly clamped between the limiting side plates 103, the bend shell 2 is fixed with a limiting lug plate 202, a limiting hole is formed in the limiting lug plate 202, a limiting bolt 203 is installed in the limiting hole in a threaded manner, so that the position of the bend shell 2 can be conveniently clamped and installed, a butt joint mechanism 5 is fixed at the upper end face of the bend shell 2, the butt joint mechanism 5 comprises fixed lug plates 501 fixed on both sides of the bend shell 2, and plug-in rods 502 fixed on the inner wall of the bend shell 2, an auxiliary lug plate 503 is fixed on one side of the relay heat dissipation assembly 3 corresponding to the fixed lug plates 501, the auxiliary lug plate 503 and the fixed lug plates 501 are installed and fixed by connecting bolts 504, so that the relay heat dissipation assembly 3 can be conveniently and quickly installed.

[0027] The relay heat dissipation assembly 3 comprises an intermediate shell 301, a pump air component 302 is fixed at the top in the intermediate shell 301, the exhaust port of the pump air component 302 faces the bend shell 2, so that the airflow can be conveniently pressurized and flowed, a stop block 303 is fixed at the bottom in the intermediate shell 301, the stop block 303 is located on one side of the pump air component 302, the bottom of the stop block 303 is provided with a beveled portion, so that the airflow can be conveniently one-way pressurized and flowed, a closing plate 304 is slidingly clamped at the bottom of the intermediate shell 301, an air inlet is formed at the bottom of the intermediate shell 301, the closing plate 304 is located below the air inlet, so that the heat dissipation range can be conveniently expanded. Embodiment 2

[0028] As Figure 9As shown, the double-layer mainboard is arranged in the embodiment, the supporting column is arranged above the positioning hole on the mainboard body 1, the threaded holes are arranged at the two ends of the supporting column, and the supporting column is installed on the mainboard body 1 through the positioning bolt, so that the space utilization rate is improved.

[0029] The mainboard structure can enhance heat dissipation through the end heat dissipation mechanism 4 and the relay heat dissipation assembly 3, increase the heat dissipation effect, adjust the number of the relay heat dissipation assembly 3 according to requirements, enlarge the heat dissipation range by removing the closing plate 304, and adjust the positions of the end heat dissipation mechanism 4 and the relay heat dissipation assembly 3 according to requirements, so as to perform targeted heat dissipation treatment on some components with large heat generation, and blow the hot air to the bottom of the mainboard body 1 after absorbing heat, which is more flexible and convenient to use.

[0030] In use, the number of the relay heat dissipation assembly 3 is adjusted according to requirements, and the electrical energy is provided for each electrical appliance, then the clamping plate body 102 is rotated to a suitable angle according to requirements, and the position is limited by the external bolt when necessary, then the elbow shell 2 is slidingly inserted between the limiting side plates 103, then the limiting bolt 203 is rotated to fix the positions of the elbow shell 2 and the clamping plate body 102, then the relay heat dissipation assembly 3 and the end heat dissipation mechanism 4 are installed in sequence, and when running, the hot air flow can be sucked into the round head shell 401, then passes through the intermediate shell 301 and is directionally converted by the elbow shell 2, so that the hot air flow can be discharged, and heat accumulation is avoided.

[0031] The basic principle, main features and advantages of the application are shown and described above, and those skilled in the art should understand that the application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principle of the application, and various changes and improvements can be made to the application without departing from the spirit and scope of the application, and these changes and improvements all fall within the scope of the application, and the scope of protection of the application is defined by the appended claims and their equivalents.

Claims

1. A mainboard structure facilitating heat dissipation, comprising a mainboard body (1), a positioning hole is arranged beside the edge of the mainboard body (1), characterized in that: The bottom of the mainboard body (1) is fixed with a limiting ring (101), the outer wall of the limiting ring (101) is rotatably connected with a clamping plate body (102), the bottom of the clamping plate body (102) is fixed with a limiting side plate (103), the limiting side plates (103) are slidably connected with an elbow shell (2), one end of the elbow shell (2) extends above the mainboard body (1), one end of the elbow shell (2) is provided with a relay heat dissipation assembly (3), one side of the relay heat dissipation assembly (3) is provided with an end heat dissipation mechanism (4), the end heat dissipation mechanism (4) comprises a round head shell (401), the bottom of the round head shell (401) is provided with an air inlet strip hole (402), and the bottom of the round head shell (401) is provided with an end heat dissipation fan (403).

2. The mainboard structure for heat dissipation according to claim 1, wherein: The lower end face edge of the elbow shell (2) is fixed with a sliding plate (201), the sliding plate (201) is slidably connected between the limiting side plates (103), the elbow shell (2) is fixed with a limiting lug plate (202), the limiting lug plate (202) is provided with a limiting hole, and the limiting hole is provided with a limiting bolt (203) in a threaded manner.

3. The mainboard structure of claim 2, wherein: The upper end face of the elbow shell (2) is fixed with a butt joint mechanism (5), the butt joint mechanism (5) comprises fixed ear plates (501) fixed on both sides of the elbow shell (2), and a plug-in rod (502) fixed on the inner wall of the elbow shell (2), one side of the relay heat dissipation assembly (3) is also provided with an auxiliary lug plate (503) corresponding to the fixed lug plate (501), and the auxiliary lug plate (503) and the fixed lug plate (501) are fixedly connected through a connecting bolt (504).

4. The mainboard structure according to claim 3, wherein: The relay heat dissipation assembly (3) comprises an intermediate shell (301), a pump component (302) is fixed at the top of the intermediate shell (301), and the exhaust port of the pump component (302) faces the elbow shell (2).

5. The mainboard structure of claim 4, wherein: The bottom of the intermediate shell (301) is fixed with a stop block (303), the stop block (303) is located on one side of the pump component (302), and the bottom of the stop block (303) is provided with an inclined surface.

6. The mainboard structure of claim 5, wherein: The bottom of the intermediate shell (301) is slidably connected with a closing plate (304), the bottom of the intermediate shell (301) is provided with an air inlet, and the closing plate (304) is located below the air inlet.

7. The mainboard structure of claim 1, wherein: The positioning hole of the mainboard body (1) is provided with a supporting column, threaded holes are formed in both ends of the supporting column, and the supporting column is installed on the mainboard body (1) through a positioning bolt.

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