Graphene infrared heating film

Abstract

The utility model discloses a graphene infrared heating film which comprises a graphene heating chip, a first conductive copper foil, a second conductive copper foil, a first insulating film, a second insulating film, a waterproof layer and a heat preservation layer. The graphene heating chip is provided with a front surface and a back surface which are arranged oppositely, and the first conductive copper foil and the second conductive copper foil cover the front surface and the back surface of the graphene heating chip respectively; the first insulating film covers the outer surface of the first conductive copper foil; the second insulating film covers the outer surface of the second conductive copper foil; the waterproof layer covers the outer surface of the second insulating film; the thermal insulation layer covers the outer surface of the waterproof layer; therefore, during continuous high-temperature heating, the heating device has the effects of high temperature resistance, water resistance and heat preservation, can be bent according to actual needs, and is convenient to store so as to meet use in multiple fields.

Description

Technical Field

[0001] This utility model relates to the field of heating film technology, and in particular to a graphene infrared heating film. Background Technology

[0002] Heating films are sheet-shaped electrical components specifically designed to convert electrical energy into heat energy. Due to their low cost, ease of use, convenient installation, and pollution-free operation, they are widely used in various heating applications, and there are many manufacturers and brands producing these heating elements. Heating substrates generally have a long lifespan, typically designed for over 5000 hours, and some far-infrared radiation heating elements can last for five heating seasons, thus their application range is becoming increasingly wide.

[0003] While existing heating films do have heating functions, their inherent material limitations mean they cannot withstand high temperatures, leading to damage. Therefore, existing heating films cannot provide high heating temperatures, resulting in poor functionality and limiting their applicability to various scenarios. Secondly, the lack of waterproof and heat-insulating structures makes them prone to water ingress. Furthermore, their material properties restrict their thinness and flexibility, hindering their versatility.

[0004] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a graphene infrared heating film. This film is designed with a graphene heating chip, a first conductive copper foil, a second conductive copper foil, a first insulating film, a second insulating film, a waterproof layer, and a heat insulation layer. This design enables the film to withstand continuous high-temperature heating while maintaining high-temperature resistance, waterproofing, and heat insulation. Furthermore, it can be bent according to actual needs for easy storage and to meet the requirements of various fields.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A graphene infrared heating film includes a graphene heating chip, a first conductive copper foil, a second conductive copper foil, a first insulating film, a second insulating film, a waterproof layer, and a heat insulation layer.

[0008] The graphene heating chip has a front and a back side arranged opposite to each other. The first conductive copper foil and the second conductive copper foil are respectively covered on the front and the back side of the graphene heating chip. The first insulating film is covered on the outer surface of the first conductive copper foil. The second insulating film is covered on the outer surface of the second conductive copper foil. The waterproof layer is covered on the outer surface of the second insulating film. The heat insulation layer is covered on the outer surface of the waterproof layer.

[0009] As a preferred embodiment, the first insulating film is coated onto the outer surface of the first conductive copper foil with a first silver paste electrode coating, which has excellent conductivity, good adhesion, and a simpler processing method.

[0010] As a preferred embodiment, the second insulating film is coated onto the outer surface of the second conductive copper foil by a second silver paste electrode coating, which has excellent conductivity, good adhesion, and a simpler processing method.

[0011] As a preferred embodiment, the first insulating film is made of PI, PET, or PTFE material.

[0012] As a preferred embodiment, the second insulating film is made of PI, PET, or PTFE material.

[0013] As a preferred embodiment, the waterproof layer is an adhesive aluminum foil. When the waterproof layer is attached to the outer surface of the second insulating film, it forms a sealed barrier layer that prevents water penetration and thus provides good waterproof performance.

[0014] As a preferred option, the insulation layer is made of rubber-plastic cotton, which provides good insulation performance.

[0015] As a preferred embodiment, the graphene heating chip is connected to two leads, which are exposed on the back of the graphene heating chip. The ends of the leads extend out of the second conductive copper foil, the second insulating film, the waterproof layer, and the heat insulation layer, respectively.

[0016] As a preferred embodiment, the thickness of the first insulating film and the second insulating film is 0.05-0.125 mm.

[0017] As a preferred embodiment, the thickness of the first conductive copper foil, the second conductive copper foil, the first silver paste electrode coating, and the second silver paste electrode coating is all 0.05 mm.

[0018] Compared with existing technologies, this utility model has significant advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly utilizes a graphene heating chip, which ensures that the graphene does not undergo compositional changes or thermal attenuation during continuous high-temperature heating, resulting in a long service life. Secondly, the design of the first and second conductive copper foils provides excellent conductivity and flexibility. Next, the design of the first and second insulating films provides outstanding high-temperature resistance. The waterproof layer, when attached to the outer surface of the second insulating film, forms a sealed barrier layer, preventing moisture penetration. Finally, the design of the insulation layer provides excellent heat preservation.

[0019] Finally, the graphene heating chip, the first conductive copper foil, the second conductive copper foil, the first insulating film, the second insulating film, the waterproof layer, and the heat insulation layer are all flexible, allowing them to be bent according to actual needs, making them easy to store and suitable for use in multiple fields.

[0020] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0021] Figure 1 This is a front view of an embodiment of the present utility model;

[0022] Figure 2 This is a cross-sectional view of an embodiment of the present utility model;

[0023] Figure 3 This is another cross-sectional view of an embodiment of the present utility model;

[0024] Figure 4 yes Figure 3 A magnified view of a portion of point A in the middle.

[0025] Explanation of reference numerals in the attached diagram:

[0026] 10. Graphene heating chip; 20. First conductive copper foil

[0027] 11. Lead wire

[0028] 30. Second conductive copper foil; 40. First insulating film

[0029] 50. Second insulating film; 60. Waterproof layer

[0030] 70. Insulation layer; 80. First silver paste electrode coating

[0031] 90. Second silver paste electrode coating. Detailed Implementation

[0032] Please refer to Figures 1 to 4 As shown, it illustrates the specific structure of an embodiment of the present invention.

[0033] In the description of this utility model, it should be noted that the directional terms such as "up", "down", "front", "back", "left", and "right" indicate the orientation and positional relationship based on the accompanying drawings or the orientation or positional relationship shown when wearing and using the device normally. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0034] A graphene infrared heating film includes a graphene heating chip 10, a first conductive copper foil 20, a second conductive copper foil 30, a first insulating film 40, a second insulating film 50, a waterproof layer 60, and a heat insulation layer 70.

[0035] The graphene heating chip 10 has a front side and a back side arranged opposite to each other. The first conductive copper foil 20 and the second conductive copper foil 30 are respectively covered on the front side and the back side of the graphene heating chip 10. Preferably, the graphene heating chip 10 is connected with two leads 11, which are exposed on the back side of the graphene heating chip 10. The ends of the leads 11 extend outside the second conductive copper foil 30, the second insulating film 50, the waterproof layer 60 and the heat insulation layer 70, respectively.

[0036] In this embodiment, the graphene heating chip 10 is made by mixing Teflon, graphene slurry, and conductive powder and then heating and pressing it into a single piece. This effectively improves the high-temperature resistance of the heating film itself, enabling it to provide higher temperatures to the outside, enhancing its functionality, and meeting more application scenarios. Alternatively, the graphene heating chip 10 can be made by mixing graphene slurry and conductive powder and then heating and pressing it into a single piece. Teflon layers are then coated on both the front and back sides of the graphene heating chip 10. The appropriate molding method can be selected according to actual needs.

[0037] For the Teflon, select Teflon powder with an appropriate particle size. Fineer particle size is preferred for uniform mixing; common particle sizes are between 10-50 micrometers. For graphene, select the type based on the required properties, such as graphene oxide or reduced graphene oxide, ensuring good dispersibility. Surface-modified or functionalized graphene products can be selected to improve compatibility in the mixture. For conductive powder, select appropriate conductive powders based on specific conductivity requirements, such as metal powders (e.g., silver powder, copper powder), carbon nanotubes, or conductive carbon black. Drying and pre-dispersing are performed before mixing. During drying, Teflon, graphene, and conductive powder are dried separately under appropriate temperature and conditions to remove moisture and other volatile impurities, preventing them from affecting the mixing effect or causing a decrease in material performance. During pre-dispersing, graphene and conductive powder are added separately to appropriate amounts of solvent and uniformly dispersed in the solvent using methods such as ultrasonic dispersion or mechanical stirring to form a stable dispersion or slurry. Alternatively, a melt blending method can be used; Teflon is heated to a molten state, and then graphene and conductive powder are added. The mixture is then carried out using equipment such as a high-speed stirrer or an extruder, so that the graphene and conductive powder are uniformly dispersed in the Teflon matrix. The appropriate mixing method can be selected according to actual needs, which will not be elaborated here.

[0038] The first insulating film 40 is coated on the outer surface of the first conductive copper foil 20; the second insulating film 50 is coated on the outer surface of the second conductive copper foil 30. Preferably, the first insulating film 40 is coated on the outer surface of the first conductive copper foil 20 by a first silver paste electrode coating 80, which has excellent conductivity, good adhesion, and simplifies the processing. Preferably, the first insulating film 40 is made of PI, PET, or PTFE material. Preferably, the thickness of the first insulating film 40 and the second insulating film 50 is 0.05-0.125 mm.

[0039] Preferably, the second insulating film 50 is coated on the outer surface of the second conductive copper foil 30 by a second silver paste electrode coating 90, which has excellent conductivity, good adhesion, and simplifies the processing. Preferably, the second insulating film 50 is made of PI, PET, or PTFE material. The first insulating film 40 and the second insulating film 50 may be made of the same or different materials, and the appropriate material can be selected according to actual needs. The waterproof layer 60 is coated on the outer surface of the second insulating film 50.

[0040] Preferably, the waterproof layer 60 is an adhesive aluminum foil. When the waterproof layer 60 is adhered to the outer surface of the second insulating film 50, it forms a sealed barrier layer, preventing moisture penetration and thus providing good waterproof performance. The thickness of the waterproof layer 60 is 0.075-0.085 mm.

[0041] Preferably, the thickness of the first conductive copper foil 20, the second conductive copper foil 30, the first silver paste electrode coating 80, and the second silver paste electrode coating 90 is all 0.05 mm.

[0042] The thermal insulation layer 70 is applied to the outer surface of the waterproof layer 60. Preferably, the thermal insulation layer 70 is made of rubber-plastic cotton, which provides good thermal insulation. The thickness of the thermal insulation layer 70 is 5 mm.

[0043] The key design features of this invention are: firstly, the use of a graphene heating chip ensures that the graphene does not undergo compositional changes or thermal decay during continuous high-temperature heating, resulting in a long service life; secondly, the design of the first and second conductive copper foils provides excellent conductivity and flexibility; thirdly, the design of the first and second insulating films provides outstanding high-temperature resistance; fourthly, the waterproof layer, when attached to the outer surface of the second insulating film, forms a sealed barrier to prevent moisture penetration; and finally, the design of the insulation layer ensures good heat preservation.

[0044] Finally, the graphene heating chip, the first conductive copper foil, the second conductive copper foil, the first insulating film, the second insulating film, the waterproof layer, and the heat insulation layer are all flexible, allowing them to be bent according to actual needs, making them easy to store and suitable for use in multiple fields.

[0045] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A graphene infrared heating film, characterized in that: It includes a graphene heating chip, a first conductive copper foil, a second conductive copper foil, a first insulating film, a second insulating film, a waterproof layer, and a heat insulation layer; The graphene heating chip has a front and a back side arranged opposite to each other. The first conductive copper foil and the second conductive copper foil are respectively covered on the front and the back side of the graphene heating chip. The first insulating film is covered on the outer surface of the first conductive copper foil. The second insulating film is covered on the outer surface of the second conductive copper foil. The waterproof layer is covered on the outer surface of the second insulating film. The heat insulation layer is covered on the outer surface of the waterproof layer.

2. The graphene infrared heating film according to claim 1, characterized in that: The first insulating film is coated on the outer surface of the first conductive copper foil by a first silver paste electrode coating.

3. The graphene infrared heating film according to claim 2, characterized in that: The second insulating film is coated on the outer surface of the second conductive copper foil by a second silver paste electrode coating.

4. The graphene infrared heating film according to claim 1, characterized in that: The first insulating film is made of PI, PET, or PTFE material.

5. The graphene infrared heating film according to claim 1, characterized in that: The second insulating film is made of PI, PET, or PTFE material.

6. The graphene infrared heating film according to claim 1, characterized in that: The waterproof layer is an adhesive-backed aluminum foil.

7. The graphene infrared heating film according to claim 1, characterized in that: The insulation layer is made of rubber and plastic cotton.

8. The graphene infrared heating film according to claim 1, characterized in that: The graphene heating chip is connected to two leads, which are exposed on the back of the graphene heating chip. The ends of the leads extend out of the second conductive copper foil, the second insulating film, the waterproof layer, and the heat insulation layer, respectively.

9. The graphene infrared heating film according to claim 4, characterized in that: The thickness of the first insulating film and the second insulating film is 0.05-0.125 mm.

10. The graphene infrared heating film according to claim 3, characterized in that: The thickness of the first conductive copper foil, the second conductive copper foil, the first silver paste electrode coating, and the second silver paste electrode coating is 0.05 mm.

Images