Heat dissipation component and PCB module
By installing heat dissipation components on the circuit board and using clamping parts to fix and align the heat dissipation main body with the heat source device, the problem of heat accumulation caused by the increased component density on the circuit board is solved, achieving efficient heat dissipation and flexibility in component layout.
Patent Information
- Application Number
- CN202423127848.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-17
AI Technical Summary
The increased component density on circuit boards leads to heat accumulation problems, especially on double-sided PCBs where it is difficult to install heat sinks, particularly in areas with dense components where it is hard to find space to fix the heat sink.
A heat dissipation component is provided, including a heat dissipation body and a clamping part. It is installed on a PCB by clamping, and the heat dissipation component is fixed on the PCB by the clamping part. The heat dissipation body spans the PCB and is aligned with the heat source device, so that heat dissipation can be achieved without screw fixation.
It effectively dissipates heat from the circuit board, improves the heat dissipation efficiency of the circuit board, increases the utilization rate of the component mounting area, and is suitable for double-sided layout of multiple electronic components.
Smart Images
Figure CN223786235U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present disclosure generally relate to the field of circuit boards, and more particularly, to heat dissipation of circuit boards. BACKGROUND
[0002] With the rapid development of electronic technology, the density of components on a circuit board such as a PCB (Printed Circuit Board) is exponentially increasing, and the signal transmission speed is faster, which leads to more serious heat accumulation problems. If the heat is not dissipated in time, the device will continue to heat up, the components will fail due to overheating, and the reliability of the electronic device will decrease.
[0003] In the case of low density of components on the circuit board or small amount of heat, the heat can be dissipated by the PCB itself or by optimizing the layout of the components. With the increasing density of components on the circuit board, for components with a large amount of heat, a heat sink can be added to the circuit board for heat dissipation. However, in conventional technology, due to the limited available area of the circuit board, and with the increasing density of components and layout restrictions, it is difficult to design additional space on the circuit board for placing or mounting a heat sink, especially for a PCB with a double-sided layout of multiple electronic components, it is even difficult to find additional space for mounting screws for fixing the heat sink in the component-dense area. CONTENT OF THE INVENTION
[0004] The purpose of the present application is to solve or eliminate at least one of the above and other problems and defects in the prior art.
[0005] According to embodiments of the present disclosure, a heat dissipation member is provided for mounting on a PCB to dissipate heat from a heat source component on the PCB, the PCB having first and second surfaces opposite in a thickness direction; the heat dissipation member comprising: a heat dissipation main body portion configured to extend across the PCB to be positioned to at least partially face one of the first and second surfaces of the PCB; and two clamping portions respectively extending from opposite sides of the heat dissipation main body portion and configured to be adapted to be clamped on the PCB to mount the heat dissipation member on the PCB.
[0006] In some embodiments, the heat source component can be mounted on the first surface, and at least a portion of the heat dissipation main body portion can be adapted to be positioned to face the second surface and aligned with the heat source component in the thickness direction.
[0007] In some embodiments, the heat dissipation main body portion can include: an intermediate section adapted to be positioned in contact with or adjacent to an area of the second surface aligned with the heat source device in the thickness direction; and two arms respectively extending from opposite sides of the intermediate section to corresponding clamping portions.
[0008] In some embodiments, the intermediate section can have a flat surface facing the second surface, and each arm can have a U-shaped or V-shaped profile extending from the intermediate section and opening toward the second surface to define a device-avoiding space between the arm and the second surface.
[0009] In some embodiments, the heat dissipation main body portion as a whole can have a W-shaped profile and have a maximum width greater than the width of the PCB.
[0010] In some embodiments, each arm can be formed with one or more air through holes.
[0011] In some embodiments, at least one of the two arms can be formed with a first positioning structure adapted to cooperate with a corresponding second positioning structure on the PCB to position the heat dissipation member relative to the PCB.
[0012] In some embodiments, one of the first and second positioning structures can be a positioning rib or protrusion, and the other can be a groove or opening.
[0013] In some embodiments, each clamping portion can be configured to abut against the first surface of the PCB so as to clamp the PCB between the clamping portion and the heat dissipation main body portion.
[0014] In some embodiments, each clamping portion can have a U-shaped or V-shaped profile extending from the heat dissipation main body portion and opening toward the first surface of the PCB, and an end surface of a free arm thereof is adapted to abut against the first surface.
[0015] In some embodiments, each clamping portion can be adapted to be hooked on a side of the PCB.
[0016] In some embodiments, each clamping portion can have a U-shaped or V-shaped profile adapted to extend from the heat dissipation main body portion to allow a side of the PCB to be inserted into an opening of the U-shaped or V-shaped profile.
[0017] In some embodiments, a heat-conductive adhesive adapted to be adhered to the PCB can be provided on a portion of the heat dissipation main body portion.
[0018] In some embodiments, the heat dissipation member can be an integral member formed from a metal sheet by a stamping process.
[0019] In another aspect of the present disclosure, there is also provided a PCB module including: a PCB having first and second surfaces opposite in a thickness direction, a heat source device mounted on at least one of the first and second surfaces; and the heat dissipation member described in any of the embodiments of the present disclosure mounted on the PCB in the form of a clip such that at least a portion of the heat dissipation member is aligned with the heat source device in the thickness direction.
[0020] In some embodiments, the PCB can be a double-sided PCB having electronic devices mounted on both the first and second surfaces, and the heat source device can include a power device.
[0021] Other objects and advantages of the present disclosure will become apparent and more fully understood from the following detailed description, taken in conjunction with the accompanying drawings, wherein: BRIEF DESCRIPTION OF DRAWINGS
[0022] These and / or other aspects, features and advantages of the present disclosure will become apparent and more fully understood from the following description, taken in conjunction with the accompanying drawings, in which:
[0023] Figure 1 is a side perspective view illustrating a structure of a heat dissipation member according to an exemplary embodiment of the present disclosure;
[0024] Figure 2 is a side view illustrating a structure of a heat dissipation member according to an exemplary embodiment of the present disclosure;
[0025] Figure 3 is a perspective view illustrating a PCB module mounted with a heat dissipation member according to an exemplary embodiment of the present disclosure;
[0026] Figure 4 is another perspective view illustrating a PCB module mounted with a heat dissipation member according to an exemplary embodiment of the present disclosure;
[0027] Figure 5 is a perspective view illustrating a portion of a PCB according to an exemplary embodiment of the present disclosure;
[0028] Figure 6 is a perspective view illustrating a structure of a heat dissipation member according to an exemplary embodiment of the present disclosure; and
[0029] Figure 7 schematically illustrates an example of a mounting process of a heat dissipation member on a PCB according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION
[0030] Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the present specification, the same or similar components are designated by the same or similar reference numerals. The following description of the various embodiments of the present disclosure with reference to the accompanying drawings is intended to explain the general principles of the present disclosure and is not intended to restrict the present disclosure.
[0031] Furthermore, in the detailed description of embodiments herein, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present disclosure. However, it will be apparent to one skilled in the art that one or more embodiments can be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the present disclosure.
[0032] In the following detailed description of embodiments, directional terms such as "front", "rear", "upper", "lower", "left", "right", "upper", and "lower", "inner", "outer", and the like are defined with reference to the accompanying drawings. The shape and position of the components are not limited by these terms, and can be adjusted according to the actual application.
[0033] In addition, the terms used herein are used to describe exemplary embodiments, and are not intended to limit and / or restrict the present disclosure. Unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms. In the present disclosure, "include", "contain", "have", and similar terms are used to enumerate features, numbers, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more of the features, numbers, steps, operations, elements, components, or combinations thereof.
[0034] Although the terms "first", "second", and the like can be used herein to describe various different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present disclosure, a first element can be referred to as a second element, and a second element can be referred to as a first element. The term "and / or" includes a plurality of combinations of the associated items or any one of the plurality of associated items.
[0035] It will be understood that, in this document, when an element is referred to as being "connected" or "coupled" to another element, the element can be directly connected or coupled to the other element or an intervening element can be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, no intervening element is present. Other words used to describe the relationship between elements, such as "between" and "directly between", "adjacent" and "directly adjacent", and the like, should be understood in a similar manner.
[0036] Embodiments of the present disclosure provide a heat dissipation member 100 for mounting on a circuit board (e.g., a PCB) for dissipating heat generated by a heat source device 10 on the PCB 1. In the illustrated embodiment, the PCB 1 has a first surface 11 and a second surface 12 opposite in the thickness direction Z thereof, and the heat source device 10 is mounted on the first surface 11. The heat source device 10 may, for example, include a power device such as a high-power electronic device used in the field of new energy, the field of transportation, the field of industrial automation, etc., but the present disclosure is not limited thereto. Although the heat source device 10 is shown as a single component in the illustrated embodiment, it can be or include a plurality of components arranged within a region. In some embodiments, a plurality of electronic devices including the heat source device 10 are mounted on at least one of the first and second surfaces of the PCB (only the heat source device 10 is shown in the figure), for example, the PCB can be a double-sided PCB having electronic devices arranged on both surfaces, which has a larger wiring area and design flexibility, higher wiring density and electrical performance, is suitable for complex circuit design, and can be applied to the field of electronic communication, industrial control system, automotive electronics, medical equipment, consumer electronics, LED lighting, etc.
[0037] In the illustrated embodiment, as shown in Figures 1-4 and Figures 6-7 , the provided heat dissipation member 100 includes a heat dissipation main body portion 110 and two clamping portions 120. The heat dissipation main body portion 110 can extend across the PCB 1, for example, in the width direction X or the length direction Y of the PCB 1. For example, the heat dissipation main body portion 110 can have a maximum width greater than the width of the PCB 1 to straddle the PCB 1 in the width direction X.
[0038] The heat dissipation main body portion 110 can be positioned to at least partially face one of the first surface 11 and the second surface 12 of the PCB 1, or to at least face or align with a region of the surface of the PCB 1 on which the heat source device is arranged in the thickness direction Z, so that heat generated by the heat source device 10 on the PCB 1 itself or its surface can be conducted to the heat dissipation main body portion 110 to be dissipated, thereby reducing the temperature of the heat source device. In the illustrated embodiment, at least a portion or a majority of the heat dissipation main body portion 110 is positioned to face the second surface of the PCB 1 and can be at least partially aligned or aligned with the heat source device 10 in the thickness direction Z. In other embodiments, the heat dissipation main body portion can also be positioned to at least face the first surface of the PCB or face the heat source device on the PCB in the thickness direction.
[0039] The two clamping portions 120 of the heat dissipation member 100 respectively extend from opposite sides of the heat dissipation main portion 110, and can be clamped or held in a clip manner on the PCB 1, so that the heat dissipation member 100 can be installed on the PCB 1 to dissipate heat from the PCB itself or its heat source device. Therefore, in the embodiments of the present disclosure, a heat dissipation member in the form of a clip is provided, which can be clamped or held on the PCB like a clip, without the need to set a fixing component such as a screw on the PCB, especially in the component mounting area of the PCB, to install the heat dissipation member, i.e. without the need for screw fixation or without the need to reserve space on the PCB for installing the screw.
[0040] In the embodiments as shown in Figures 1-4 and Figures 6-7 , the heat dissipation main portion 110 includes a middle section 111 and two arms 112 respectively extending from opposite sides of the middle section 111 to the corresponding clamping portions 120. The middle section 111 can be positioned to contact or be adjacent to the area of the second surface 12 aligned with the heat source device 10 in the thickness direction Z. For example, the middle section 111 can have a flat surface facing the second surface 12 of the PCB 1 or a surface shape matching the area.
[0041] Exemplarily, the middle section 111 can directly contact the area of the second surface 12 aligned with the heat source device 10 in the thickness direction Z, or there is a thermally conductive material (such as a thermally conductive adhesive) 20 (see Figure 7 ) between the middle section 111 and the area, or adjacent to each other in the manner of air gap, which can be appropriately selected or the size of the air gap can be appropriately set to ensure that heat from the PCB itself or its heat source device can be conducted to the middle section 111. The thermally conductive adhesive 20 can be provided on a part of the heat dissipation member, such as on the middle section 111, the arm 112 or the clamping portion 120, for adhering to the surface or side of the PCB 1.
[0042] In some embodiments of the present disclosure, as shown in Figures 1-4 and Figures 6-7As shown, each of the arms 112 can have a generally U-shaped or V-shaped profile extending from the middle section 111 and opening towards the second surface 12 of the PCB 1 to define a device-avoiding space 101 between the arms 112 and the second surface 12 when the heat dissipation member 100 is mounted onto the PCB 1, so that various devices mounted on the second surface of the PCB can be avoided. As an example, the heat dissipation body 110 as a whole can have a generally W-shaped profile, with the middle section 111 protruding towards the PCB 1 to contact or be more adjacent to the second surface 12 when the heat dissipation member 100 is mounted onto the PCB 1 to better receive heat from the PCB itself or its heat source devices, while the arms 112 in a concave shape (e.g. U-shaped or V-shaped) can avoid various devices mounted on the second surface of the PCB, and the formed device-avoiding space 101 is conducive to the airflow flowing over the surface of the PCB, further improving the heat dissipation effect. It can be understood that in the present disclosure, the shape or profile of the body of the heat dissipation member for heat dissipation is not particularly limited, for example, in other embodiments not shown, the heat dissipation body as a whole can have a generally U-shaped profile, with the bottom part of the U-shaped profile being generally flat to face or be adjacent to the surface of the PCB.
[0043] In some embodiments, one or more air through holes can be formed on the heat dissipation member 110 to improve the heat dissipation effect. For example, as shown in Figure 1 、 Figure 3 、 Figure 4 and Figure 6 , in the arms 112, for example, in the portions where the arms 112 are continuous with the middle section 111 and / or the portions where the arms 112 are continuous with the clamping portions 120, air through holes 113, 114 can be formed, and air through holes 123 can also be formed in the clamping portions 120.
[0044] In some embodiments, as shown in Figures 1-4 and Figure 7 , each of the clamping portions 120 can be configured to abut against the first surface 11 of the PCB 1, so that the PCB 1 can be clamped between the clamping portions 120 and the heat dissipation body 110, whereby the heat dissipation member 100 can be mounted or held in the form of a clip (detachably) on the PCB. As an example, each of the clamping portions 120 can extend from the heat dissipation body 110 and be bent to form a generally U-shaped or V-shaped profile, for example, having a connecting arm portion 122 extending from the heat dissipation body 110 and an opposite free arm 121. When the heat dissipation member 100 is mounted onto the PCB 1, the U-shaped or V-shaped profile of the clamping portion 120 opens towards the first surface 11 of the PCB 1, so that the end surface of the free arm 121 thereof can abut against the first surface 11, for example, at a position close to the edge of the first surface 11 or the side of the PCB 1, so as to avoid the device mounting area of the PCB.
[0045] In other embodiments, each clamping portion can also be configured in the form of a hook to be able to hook on the side of the PCB in the width or length direction. For example, each clamping portion can have a substantially U-shaped or V-shaped profile adapted to extend from the heat dissipation main body portion to allow the side of the PCB to be inserted into the opening of the U-shaped or V-shaped profile of the clamping portion, thereby achieving the fixed retention of the heat dissipation member relative to the PCB and the less or lower protruding height of the portion of the heat dissipation member protruding on the first surface of the PCB, avoiding affecting the installation of the PCB on the device.
[0046] In some embodiments, as shown in Figures 2-7 A first positioning structure 115 can be formed on at least one of the arms 112, which is adapted to cooperate with a corresponding second positioning structure 15 on the PCB 1 to position the heat dissipation member 100 relative to the PCB 1. Exemplarily, one of the first and second positioning structures can be a positioning rib or protrusion, and the other can be a groove or opening. For example, as shown, the first positioning structure 115 in the form of a positioning rib can be configured to have a substantially L-shaped profile extending from the arm 112 or from the side of the clamping portion 120 to be inserted into the groove or opening formed in the side or side of the PCB to prevent the heat dissipation member from moving or sliding relative to the PCB.
[0047] In some examples, the heat dissipation member 100 can be formed of a heat-conducting material, for example, an integral member formed by a punching, bending or the like process from a metal plate material (such as a copper or stainless steel plate material) in the form of a long strip, which is simple in structure and easy to install.
[0048] Figure 7An example of the mounting process of the heat dissipation member on the PCB is schematically shown. Firstly, the PCB 1 can be placed obliquely relative to the heat dissipation member 100 or the heat dissipation member 100 can be placed obliquely relative to the PCB 1, so that one side of the PCB 1 (e.g. in the width direction) is positioned in the space defined by one of the arms 112 of the heat dissipation member 100, with the first surface 11 of the heat source device 10 mounted thereon facing away from the heat dissipation body 110, at this time the intermediate section 111 with or without the heat dissipation adhesive 20 can be abutted against the second surface 12 of the PCB 1, and the other side of the PCB 1 (e.g. in the width direction) can be abutted against the clamping portion 120 of the heat dissipation member 100. Subsequently, the other arm 112 of the heat dissipation member 100 can be pulled or pushed by an external force to deform or deflect outwardly (e.g. in the width direction) and the corresponding clamping portion to allow the other side of the PCB 1 to enter the space defined by the other arm 112 of the heat dissipation member 100. Subsequently, by moving (e.g. rotating) the PCB 1 relative to the heat dissipation member 100 or moving (e.g. rotating) the heat dissipation member 100 relative to the PCB 1, the majority of the heat dissipation body 110 of the heat dissipation member 100, especially the intermediate section 111, can be substantially parallel to the second surface 12 of the PCB 1. During this period, the first positioning structure 115 in the form of positioning ribs can be inserted into the second positioning structure 15 in the form of grooves on the side wall of the PCB 1 to guide such movement. Finally, the external force is removed, the other arm 112 of the heat dissipation member 100 can restore the original shape by its own elasticity, thereby the PCB 1 can be held between the two arms 112 of the heat dissipation member 100, and the clamping portion 120 can abut against the PCB 1, so that the heat dissipation member 100 can be clamped on the PCB 1 like a clip, thus no screws are needed to fix the heat dissipation member, and the utilization of the surface area of the PCB for mounting components is improved.
[0049] Embodiments of the present disclosure also provide a PCB module comprising a PCB and such a clip-form heat dissipation member mounted thereon.
[0050] Although the present disclosure has been described with reference to the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplarily illustrate the preferred embodiments of the present disclosure, and cannot be understood as a limitation of the present disclosure. The dimensional proportions in the drawings are merely schematic, and cannot be understood as a limitation of the present disclosure.
[0051] Although some embodiments of the general concept of the present disclosure have been illustrated and described, it will be appreciated by those skilled in the art that changes or substitutions can be made to these embodiments without departing from the principles and spirit of the general concept of the present disclosure, and the scope of the present disclosure is defined by the claims and their equivalents.
Claims
1. A heat dissipating member (100) for mounting on a PCB (1) to dissipate heat from a heat source device (10) on the PCB, the PCB having a first surface (11) and a second surface (12) opposite in a thickness direction (Z), characterized in that, The heat dissipation member comprises: a heat dissipation body portion (110) configured to extend across the PCB to be positioned to at least partially face one of the first surface and the second surface of the PCB; and two clamping portions (120) respectively extending from opposite sides of the heat dissipation body portion and configured to be clamped on the PCB to mount the heat dissipation member on the PCB.
2. The heat dissipation member according to claim 1, wherein the heat source device is mounted on the first surface, at least a portion of the heat dissipation body portion is adapted to be positioned to face the second surface and to be aligned with the heat source device in the thickness direction.
3. The heat dissipating member according to claim 2, characterized by The heat dissipation body portion comprises: an intermediate section (111) adapted to be positioned to contact or be adjacent to a region of the second surface aligned with the heat source device in the thickness direction; and two arms (112) respectively extending from opposite sides of the intermediate section to the corresponding clamping portions.
4. The heat dissipation member according to claim 3, wherein the intermediate section has a flat surface facing the second surface, and each arm has a U-shaped or V-shaped profile extending from the intermediate section and opening towards the second surface to define a device-avoiding space (101) between the arm and the second surface.
5. The heat dissipating member according to claim 4, wherein The heat dissipation body portion has a W-shaped profile as a whole and has a maximum width greater than the width of the PCB.
6. The heat dissipation member according to claim 4, wherein each arm is formed with one or more air through holes (113, 114).
7. The heat dissipating member according to claim 3, wherein A first positioning structure (115) is formed on at least one of the two arms, which is adapted to cooperate with a corresponding second positioning structure (15) on the PCB to position the heat dissipation member relative to the PCB.
8. The heat dissipating member according to claim 7, wherein One of the first positioning structure and the second positioning structure is a positioning rib or protrusion, and the other is a groove or opening.
9. The heat dissipating member according to any one of claims 2 to 8, characterized by, Each clamping portion is configured to abut against the first surface of the PCB so as to clamp the PCB between the clamping portion and the heat dissipation body portion.
10. The heat dissipating member according to claim 9, wherein Each clamping portion has a U-shaped or V-shaped profile extending from the heat dissipation body portion and opening towards the first surface of the PCB, and an end surface of a free arm (121) thereof is adapted to abut against the first surface.
11. The heat dissipating member according to any one of claims 1 to 8, characterized by, Each clamping portion is adapted to be hooked on a side portion of the PCB.
12. The heat dissipating member according to claim 11, wherein Each clamping portion has a U-shaped or V-shaped profile adapted to extend from the heat dissipation body portion to allow a side portion of the PCB to be inserted into an opening of the U-shaped or V-shaped profile.
13. The heat dissipating member according to any one of claims 1 to 8, 10 and 12, characterized by, A thermally conductive adhesive (20) adapted to adhere to the PCB is provided on a portion of the heat dissipation body portion.
14. The heat dissipating member according to any one of claims 1 to 8, 10 and 12, characterized by, The heat dissipation member is an integral member formed by a stamping process from a metal sheet.
15. A PCB module, characterized by The PCB module comprises: a PCB (1) having first and second surfaces (11, 12) opposite in a thickness direction (Z), at least one of which is mounted with a heat source device (10); and The heat dissipating member according to any one of claims 1 to 13, which is mounted on the PCB in the form of a clip so that at least a portion of the heat dissipating member is aligned with the heat source device in the thickness direction.
16. The PCB module according to claim 15, wherein the PCB is a double-sided PCB on which electronic devices are mounted on both the first surface and the second surface, and the heat source device includes a power device.