Motor-driven integrated circuit board with heat dissipation function
By combining a suspended design with linear fan cooling, the easily disassembled motor drive integrated circuit board solves the problems of low heat dissipation efficiency and inconvenient disassembly and assembly, achieving efficient heat dissipation and convenient maintenance.
Patent Information
- Application Number
- CN202520270592.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing motor drive integrated circuit boards have low heat dissipation efficiency and are inconvenient to disassemble and assemble. Especially when running for a long time on an industrial automated production line, they are prone to overheating of the circuit board, which affects the normal operation of the equipment.
The circuit board, which features a suspended design, is supported by four mounting posts. Combined with three equidistant fans that blow air directly onto both sides of the circuit board, the heat is expelled from the heat dissipation vents through a straight path. The design of the mounting frame and clips facilitates easy disassembly and cleaning.
It improves heat dissipation efficiency, ensuring that heat on the circuit board surface dissipates quickly, and makes the disassembly and assembly process more convenient, reducing the need for tools and making it suitable for cleaning and maintenance in dusty environments.
Smart Images

Figure CN223786255U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of motor drive circuit board technology, and in particular to an integrated circuit board for motor drive with heat dissipation function. Background Technology
[0002] In modern electronic devices, motor-driven integrated circuit boards are widely used in various fields, such as industrial automation, communication equipment, and consumer electronics. As the performance of electronic devices continues to improve, the power density of integrated circuit boards is also gradually increasing, making heat dissipation a key factor affecting their performance and reliability. Good heat dissipation design can ensure that integrated circuit boards maintain a stable temperature during operation, extend their lifespan, and improve the overall performance of the equipment.
[0003] Existing integrated circuit boards for motor drives with heat dissipation functions typically employ traditional heat dissipation methods, such as attaching heat sinks to the circuit board surface to conduct heat away, or using fans for exhaust cooling and then dissipating the heat to the outside through pipes. In terms of installation structure, screws are generally used to secure the various components together.
[0004] In practical applications, existing motor-driven integrated circuit boards with heat dissipation functions suffer from low heat dissipation efficiency and inconvenient assembly and disassembly. For example, in industrial automated production lines, integrated circuit boards generate a large amount of heat during prolonged operation. Traditional heat dissipation methods have low efficiency, easily leading to excessively high circuit board temperatures and affecting the normal operation of the equipment. Traditional heat sinks and pipe cooling methods suffer from long heat conduction paths and limited heat dissipation effectiveness. Therefore, this art proposes a motor-driven integrated circuit board with heat dissipation function to solve the above problems. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides an integrated circuit board with heat dissipation function for motor drive, aiming to improve the problem of slow heat dissipation efficiency and difficulty in quickly removing heat from the surface of the circuit board in the prior art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a motor-driven integrated circuit board with heat dissipation function, comprising a mounting shell, a circuit board, and a disassembly assembly, wherein the circuit board is disposed inside the mounting shell, the disassembly assembly is disposed on the outer side of the mounting shell, four mounting posts are fixedly connected to the inner bottom wall of the mounting shell, and a cooling assembly is disposed on the inner side of the mounting shell, the cooling assembly being used for rapid heat dissipation of the circuit board.
[0007] The cooling component includes three fans. The mounting housing has three air inlets inside. The fans are installed at the inner end of the air inlets. A heat dissipation vent is provided on one side of the mounting housing. A mesh plate is installed inside the heat dissipation vent. Multiple protective blocks are fixedly connected inside the heat dissipation vent.
[0008] Furthermore, the four mounting posts are located at the four inner corners of the mounting housing, and the circuit board is placed on top of the four mounting posts.
[0009] Furthermore, holes are provided at all four corners of the circuit board, and the circuit board is mounted on the mounting post by screws passing through the holes.
[0010] Furthermore, the three fans are equidistant from each other, and the openings of the three air inlets gradually increase in the direction away from the fans.
[0011] Furthermore, the assembly / disassembly component includes a mounting frame, which is disposed on the outside of the mounting shell, and two mesh plates are fixedly connected to the inside of the mounting frame.
[0012] Furthermore, four positioning posts are fixedly connected to the outer side of the mounting frame, and four positioning holes are opened on the side of the mounting shell that is close to the mounting frame, with the outer side of the positioning posts engaging inside the positioning holes.
[0013] Furthermore, the outer sides of the mounting shell are fixedly connected with buckles, and the outer side of the positioning hole fits against the outer side of the mounting frame.
[0014] This utility model has the following beneficial effects:
[0015] 1. In this utility model, the circuit board is suspended in the air by four mounting posts, and three fans set at equal intervals blow air directly onto both sides of the circuit board from the air inlet. The heat is discharged from the heat dissipation port in a straight line. Compared with the traditional heat dissipation method of attaching to the surface of the circuit board to draw air and then dissipating it through pipes, it is more direct and has higher heat dissipation efficiency.
[0016] 2. In this utility model, the mounting frame is engaged with the positioning hole on the mounting shell by the positioning post and fixed with a buckle. When cleaning is required, the mounting frame can be pulled outward by bending the buckle so that the positioning post is pulled out of the positioning hole. Compared with the traditional screw fastening method, it is more convenient to disassemble without the need for other tools, and the mounting frame can be easily cleaned and dust removed. Attached Figure Description
[0017] Figure 1 This is a perspective view of an integrated circuit board with heat dissipation function driven by a motor, as proposed in this utility model.
[0018] Figure 2This is a schematic diagram of the internal structure of the mounting shell of an integrated circuit board with heat dissipation function for motor drive, as proposed in this utility model.
[0019] Figure 3 This is a schematic diagram of the mounting frame structure of an integrated circuit board with heat dissipation function driven by a motor, as proposed in this utility model.
[0020] Legend:
[0021] 1. Mounting shell; 2. Circuit board; 3. Mounting post; 4. Heat dissipation vent; 5. Protective block; 6. Mesh panel one; 7. Fan; 8. Air inlet; 9. Mounting frame; 10. Mesh panel two; 11. Positioning post; 12. Positioning hole; 13. Clip. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Reference Figures 1-3This utility model provides an embodiment of a motor-driven integrated circuit board with heat dissipation function, comprising a mounting shell 1, a circuit board 2, and a disassembly / removal assembly. The circuit board 2 is disposed inside the mounting shell 1, and the disassembly / removal assembly is disposed on the outer side of the mounting shell 1. Four mounting posts 3 are fixedly connected to the inner bottom wall of the mounting shell 1, which play a crucial supporting role. They are distributed at the four inner corners of the mounting shell 1, providing stable support for the circuit board 2. A cooling assembly is disposed inside the mounting shell 1 for rapid heat dissipation of the circuit board 2. The cooling assembly includes three fans 7, which are equidistantly arranged to evenly dissipate heat from the circuit board 2. Three air inlets 8 are opened inside the mounting shell 1, with the fans 7 installed at the inner end of the air inlets 8. The openings of the three air inlets 8 gradually widen away from the fans 7, which increases the air intake and improves the heat dissipation effect. A heat dissipation vent 4 is opened on one side of the inside of the mounting shell 1, and a mesh plate 6 is disposed inside the heat dissipation vent 4. The mesh plate 6 prevents foreign objects from entering the mounting shell 1 while not hindering heat dissipation. Multiple protective blocks 5 are fixedly connected inside the heat dissipation vent 4, further protecting the internal structure of the mounting shell 1. Holes are provided at each of the four corners of the circuit board 2. The circuit board 2 is mounted on the mounting posts 3 via screws through these holes, ensuring its secure fixation inside the mounting shell 1. Because the circuit board 2 is placed on top of the four mounting posts 3, it is suspended in mid-air, allowing it to be directly exposed to the airflow from the fan 7 on both sides. This rapidly dissipates heat from the surface of the circuit board 2, allowing it to pass through the mesh plate 6 in a straight line and exit through the heat dissipation vent 4. This heat dissipation method is significantly more direct and efficient than the traditional method of drawing air from the surface of the circuit board 2 and then dissipating it through pipes.
[0024] Specifically, the circuit board 2 is placed above the four mounting posts 3 inside the mounting housing 1. During this process, it is crucial to ensure that the four holes on the circuit board 2 correspond one-to-one with the positions of the mounting posts 3. This step guarantees that the circuit board 2 is accurately installed inside the mounting housing 1, laying the foundation for stable operation later. Then, screws are passed through the holes to tighten the circuit board 2 onto the mounting posts 3, firmly fixing the circuit board 2 inside the mounting housing 1 and preventing shaking or displacement during operation. At this point, the circuit board 2 is suspended in mid-air, supported by the four mounting posts 3. This suspended design has important functions. On one hand, it allows both sides of the circuit board 2 to be directly exposed to the airflow from the fans 7, increasing the heat dissipation area and improving the heat dissipation effect. On the other hand, the airflow around the suspended circuit board 2 is smoother, facilitating rapid heat dissipation. Next, the three fans 7 are activated, and the airflow generated by the fans 7 blows directly onto the surface of the circuit board 2. During this process, the heat on the surface of the circuit board 2 is quickly blown away, and the heat travels in a straight line through the mesh plate 6 and is then discharged from the heat dissipation vent 4. This heat dissipation method is significantly more direct than the traditional method of attaching a fan to the surface of circuit board 2 and then dissipating the heat through pipes. In the traditional method, heat must first be conducted through a heat sink and then discharged through pipes by a fan. This process involves a long heat conduction path, which can easily lead to heat accumulation and low heat dissipation efficiency. In contrast, the heat dissipation method of this device directly blows the airflow generated by fan 7 onto circuit board 2, allowing heat to be carried away quickly and achieving higher heat dissipation efficiency.
[0025] Reference Figures 1-3 The assembly and disassembly components include a mounting frame 9, which is located on the outside of the mounting housing 1. Two mesh panels 10 are fixedly connected to the inside of the mounting frame 9, preventing foreign objects from entering the air inlet 8 and damaging the fan 7. Four positioning posts 11 are fixedly connected to the outside of the mounting frame 9. Four positioning holes 12 are provided on the side of the mounting housing 1 adjacent to the mounting frame 9, with the outer sides of the positioning posts 11 engaging inside the positioning holes 12. Clips 13 are fixedly connected to both outer sides of the mounting housing 1, with the outer sides of the positioning holes 12 fitting against the outer sides of the mounting frame 9. When used for an extended period, the two elastic clips 13 can be pried open to release the restriction on the mounting frame 9, allowing the mounting frame 9 to be pulled outwards. The four positioning posts 11 will then be pulled out from inside the four positioning holes 12, enabling the two mounting frames 9 to be cleaned and dust removed. This assembly method is more convenient than traditional screw fastening, eliminating the need for additional tools during disassembly.
[0026] Specifically, the two mounting frames 9 serve to prevent foreign objects from entering the air intake 8 and damaging the fan 7. In actual use environments, dust, debris, and other foreign objects may enter the air intake 8, easily damaging the fan 7 and affecting heat dissipation. The mounting frames 9 effectively prevent this. When used for an extended period, the two elastic clips 13 can be pried open to release the mounting frames 9. The elastic design of the clips 13 makes operation more convenient; a gentle pry is all it takes. Then, the mounting frames 9 can be pulled outwards, during which the four positioning posts 11 will disengage from the four positioning holes 12. This design makes the disassembly of the mounting frames 9 very convenient, requiring no additional tools. This allows for the cleaning of the two mounting frames 9, removing dust. In dusty environments, the mounting frames 9 easily accumulate dust, which, if not cleaned in time, will affect the ventilation of the air intake 8, thus reducing heat dissipation efficiency. This convenient disassembly method allows for easy cleaning of the mounting frames 9, ensuring the normal operation of the cooling system.
[0027] Working principle: First, place the circuit board 2 inside the mounting shell 1 above the four mounting posts 3, so that the four holes on the circuit board 2 correspond one-to-one with the positions of the mounting posts 3. Then, screw the circuit board 2 through the holes and tighten it onto the mounting posts 3. Turning on the three fans 7 will blow air directly onto the surface of the circuit board 2. Since the circuit board 2 is supported by the four mounting posts 3 and is in a suspended state, both sides can be directly blown by the air from the fans 7, thereby quickly blowing away the heat on the surface of the circuit board 2. The heat is then discharged in a straight line through the mesh plate 6 and out of the heat dissipation vent 4. This heat dissipation method is significantly more direct and efficient than the traditional method of exhausting air onto the surface of the circuit board 2 and then discharging it through pipes.
[0028] In addition, the two mounting frames 9 can prevent foreign objects from entering the air inlet 8 and damaging the fan 7. When the usage time is too long, the two elastic buckles 13 can be pried open to release the restriction on the mounting frames 9. Then the mounting frames 9 can be pulled outward, and the four positioning pins 11 will be pulled out from the inside of the four positioning holes 12. This allows the two mounting frames 9 to be cleaned and the dust removed. This assembly method is more convenient than traditional screw fastening and does not require other tools to assist in disassembly.
[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A motor-driven integrated circuit board with heat dissipation function, comprising a mounting housing (1), a circuit board (2), and a disassembly assembly, characterized in that: The circuit board (2) is located inside the mounting shell (1), the disassembly and assembly assembly is located on the outside side of the mounting shell (1), four mounting posts (3) are fixedly connected to the inner bottom wall of the mounting shell (1), and a cooling assembly is provided on the inner side of the mounting shell (1). The cooling assembly is used to quickly dissipate heat from the circuit board (2). The cooling component includes three fans (7), and the mounting shell (1) has three air inlets (8) inside. The fans (7) are installed at the inner end of the air inlets (8). The mounting shell (1) has a heat dissipation vent (4) on one side inside. The heat dissipation vent (4) has a mesh plate (6) inside. The heat dissipation vent (4) has multiple protective blocks (5) fixedly connected inside.
2. The integrated circuit board with heat dissipation function for motor drive according to claim 1, characterized in that: The four mounting posts (3) are located at the four inner corners of the mounting housing (1), and the circuit board (2) is placed on top of the four mounting posts (3).
3. The integrated circuit board with heat dissipation function for motor drive according to claim 2, characterized in that: Holes are provided at all four corners of the circuit board (2), and the circuit board (2) is installed on the mounting post (3) by screws passing through the holes.
4. The integrated circuit board with heat dissipation function for motor drive according to claim 1, characterized in that: The three fans (7) are equidistant from each other, and the openings of the three air inlets (8) gradually increase in the direction away from the fans (7).
5. The integrated circuit board with heat dissipation function for motor drive according to claim 1, characterized in that: The assembly and disassembly assembly includes an installation frame (9), which is located on the outside of the installation shell (1), and two mesh plates (10) are fixedly connected to the inside of the installation frame (9).
6. The integrated circuit board with heat dissipation function for motor drive according to claim 5, characterized in that: Four positioning posts (11) are fixedly connected to the outside of the mounting frame (9). Four positioning holes (12) are opened on the side of the mounting shell (1) that is close to the mounting frame (9). The outside of the positioning posts (11) is engaged inside the positioning holes (12).
7. The integrated circuit board with heat dissipation function for motor drive according to claim 6, characterized in that: Both sides of the mounting shell (1) are fixedly connected with buckles (13), and the outer side of the positioning hole (12) fits against the outer side of the mounting frame (9).