Vehicle-mounted core gateway chip anti-interference structure and vehicle-mounted core gateway chip

Abstract

The utility model relates to a vehicle-mounted core gateway chip anti-interference structure and a vehicle-mounted core gateway chip. The vehicle-mounted core gateway chip anti-interference structure comprises a circuit board, a controller chip, a plurality of peripheral interfaces, a plurality of power supply chips and a plurality of inductors, the plurality of power supply chips respectively supply power to the plurality of peripheral interfaces and the controller chip; the circuit board comprises a first surface and a second surface, the first surface is a primary backflow surface, and the second surface is a secondary backflow surface; the controller chip and the plurality of peripheral interfaces are arranged on the first surface, and the plurality of power supply chips and the plurality of inductors are arranged on the second surface. In the embodiment of the invention, the controller chip is arranged on the first surface, namely the primary backflow surface, so that the stability and the electrical performance of the heavier core element are ensured, and a large number of power supply chips and inductors are arranged on the second surface, namely the secondary backflow surface, so that electromagnetic radiation of the power supply chips and the inductors is prevented from interfering with the controller chip on the other surface; and the working stability of each component on the circuit board is ensured.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to an anti-interference structure for an automotive core gateway chip and an automotive core gateway chip. Background Technology

[0002] In the design of printed circuit boards (PCBs), especially those using double-sided reflow soldering, the placement of components is crucial to electrical performance and product reliability. As the integration of electronic products continues to increase, designers must comprehensively consider electrical performance and component weight to effectively arrange components within the limited PCB space.

[0003] In the prior art, controller circuit boards with controller chips as the core usually arrange power supply chips around the controller chip to improve electrical performance and signal transmission efficiency. However, power supply chips usually generate strong electromagnetic radiation, which may interfere with the controller chip and its surrounding sensitive circuits, affecting the stability and performance of the system. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides an anti-interference structure for an in-vehicle core gateway chip and an in-vehicle core gateway chip.

[0005] In a first aspect, embodiments of this application disclose an anti-interference structure for an on-board core gateway chip, including a circuit board, a controller chip, multiple peripheral interfaces, multiple power chips, and multiple inductors; the multiple power chips provide power to the multiple peripheral interfaces and the controller chip respectively;

[0006] The circuit board includes a first side and a second side. The first side is the primary return surface, and the second side is the secondary return surface. The controller chip and multiple peripheral interfaces are located on the first side, and multiple power chips and multiple inductors are located on the second side.

[0007] In some possible embodiments, a first housing is also included, the first housing being made of a conductive material;

[0008] The first housing is disposed on the second side of the circuit board to shield the components on the second side from electromagnetic interference.

[0009] In some possible embodiments, a shielding metal ring is also provided on the second surface, the shielding metal ring is provided along the edge of the second surface, and the first housing is connected to the second surface through the shielding metal ring.

[0010] In some possible embodiments, a folded edge is provided at the edge where the first housing connects to the shielding metal ring.

[0011] In some possible embodiments, the first housing is configured to be fully enclosed.

[0012] In some possible embodiments, a plurality of heat dissipation protrusions are provided on the inner wall of the first housing;

[0013] The positions of the multiple heat dissipation protrusions correspond to the positions of the multiple power chips and multiple inductors, and the heights of the multiple heat dissipation protrusions correspond to the heights of the multiple power chips and multiple inductors.

[0014] In some possible embodiments, thermal pads are provided between the ends of the multiple heat dissipation bosses and the multiple power chips and multiple inductors.

[0015] In some possible embodiments, the second surface is also provided with a plurality of heat dissipation metal plates and a plurality of heat dissipation through holes, which are connected to the first housing through a plurality of heat dissipation bosses and thermal pads.

[0016] In some possible embodiments, a second housing is also included, which is made of a non-conductive material; the second housing is disposed on the first surface of the circuit board to protect the components on the first surface;

[0017] The second housing is equipped with a main heat sink, the position of which corresponds to the controller chip, and a thermal pad is provided between the main heat sink and the controller chip.

[0018] Secondly, embodiments of this application disclose an in-vehicle core gateway chip, including an anti-interference structure for an in-vehicle core gateway chip comprising any one of the above-mentioned features.

[0019] The technical solution provided in this application has the following technical effects:

[0020] The anti-interference structure of the vehicle-mounted core gateway chip in this application embodiment includes a circuit board, a controller chip, multiple peripheral interfaces, multiple power chips, and multiple inductors. The multiple power chips supply power to the multiple peripheral interfaces and the controller chip respectively. The circuit board includes a first side and a second side, the first side being a primary return current side and the second side being a secondary return current side. The controller chip and multiple peripheral interfaces are disposed on the first side, and the multiple power chips and multiple inductors are disposed on the second side. In this embodiment, the controller chip is disposed on the first side, i.e., the primary return current side, to ensure the stability and electrical performance of the heavier core component. The numerous power chips and inductors are arranged on the second side, i.e., the secondary return current side, to avoid electromagnetic radiation interference from the power chips and inductors to the controller chip on the other side, thus ensuring the operational stability of all components on the circuit board. Attached Figure Description

[0021] To more clearly illustrate the technical solutions and advantages in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 1 ;

[0023] Figure 2 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 2 ;

[0024] Figure 3 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 3 ;

[0025] Figure 4 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 4 .

[0026] Figure label:

[0027] 1. Circuit board; 11. First side; 12. Second side; 13. Shielding metal ring;

[0028] 2. Controller chip;

[0029] 3. Power supply chip;

[0030] 4. Inductance;

[0031] 5. First housing; 51. Heat dissipation boss; 52. Thermal pad;

[0032] 6. Second housing; 61. Main radiator. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0034] It should be noted that the term "an embodiment" or "embodiment" in the specification of the embodiments of this application refers to a specific feature, structure, or characteristic that can be included in at least one implementation of this application. It should be understood that in the specification, claims, and accompanying drawings of the embodiments of this application, the terms "upper," "lower," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, in the description of this embodiment, unless otherwise stated, "a plurality of" means two or more. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, or product that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0035] It should be understood that when a device or component is referred to as being "on," "adjacent to," or "connected to" other devices or components, it may be directly on, adjacent to, or connected to other devices or components, or there may be intervening devices or components. Conversely, when a device or component is referred to as being "directly on," "directly adjacent to," or "directly connected to" other devices or components, there are no intervening devices or components. It should be understood that although the terms first, second, third, etc., may be used to describe various components, areas, layers, and / or parts, these components, areas, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one component, area, layer, or part from another component, area, layer, or part. Therefore, without departing from the teachings of this application, the first component, area, layer, or part discussed below may be referred to as the second component, area, layer, or part. And the discussion of the second component, area, layer, or part does not imply that the first component, area, layer, or part necessarily exists in this application.

[0036] To make the objectives, technical solutions, and advantages disclosed in the embodiments of this application clearer, the embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the embodiments of this application and are not intended to limit the embodiments of this application.

[0037] This application provides an anti-interference structure for an in-vehicle core gateway chip. Figure 1 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 1 (First page) Figure 2 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 2 (Second page) as Figure 1-2 As shown, the anti-interference structure of the vehicle-mounted core gateway chip includes a circuit board 1, a controller chip 2, multiple peripheral interfaces, multiple power chips 3, and multiple inductors 4. The multiple power chips 3 provide power to the multiple peripheral interfaces and the controller chip 2, respectively.

[0038] In one possible embodiment, the anti-interference structure of the vehicle core gateway chip also includes a multi-core processor chip for parallel processing of complex tasks, improving computational efficiency. Multiple peripheral interfaces can support vehicle communication protocols such as Controller Area Network (CAN), Local Interconnect Network (LIN), and Automotive Ethernet to connect multiple controllers within the vehicle. They also provide peripheral interfaces such as Serial Peripheral Interface (SPI), Inter-Integrated Circuit (I2C), Universal Asynchronous Receiver-Transmitter (UART), and Peripheral Component Interconnect Express (PCIe) for expanding functional modules or interacting with external devices.

[0039] The aforementioned chips and various peripheral interfaces may require different operating voltages (such as 1.2V, 1.8V, 3.3V, etc.), thus requiring a wide variety and quantity of power supplies.

[0040] In one possible embodiment, the components on the circuit board 1 are soldered using a reflow soldering process. The circuit board 1 includes a first side 11 and a second side 12. The first side 11 is the first reflow side, which is the side on which the components are first soldered in the reflow soldering process, and serves as the front side of the circuit board 1. The second side 12 is the second reflow side, which is the side on which the components are soldered for the second time in the reflow soldering process, and serves as the back side of the circuit board 1.

[0041] In this embodiment, the controller chip 2 is disposed on the first surface 11, and a plurality of power chips 3 and a plurality of inductors 4 are disposed on the second surface 12.

[0042] By placing the controller chip 2 on the first side 11, which is the primary return side, the stability and electrical performance of the heavier core components are ensured. The numerous power chips 3 and inductors 4 are arranged on the second side 12, which is the secondary return side, to avoid electromagnetic radiation interference from the power chips 3 and inductors 4 to the controller chip 2 on the other side, thus ensuring the working stability of each component on the circuit board 1.

[0043] Figure 3 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 3 ,like Figure 3 As shown, in some possible embodiments, the anti-interference structure of the vehicle core gateway chip further includes a first housing 5. The first housing 5 is made of conductive material and is disposed on the second surface 12 of the circuit board 1 to shield the electromagnetic interference of the components on the second surface 12. The conductive material first housing 5 forms a closed or near-closed space, acting like a Faraday cage. The metal housing blocks external electromagnetic waves from entering the interior of the first housing 5, and the internal electromagnetic waves are confined within the first housing 5 and cannot propagate outward.

[0044] In some possible embodiments, the conductive material of the first housing 5 may be copper, aluminum or other conductive metal materials to ensure good shielding effect.

[0045] Figure 4 This is a schematic diagram of an anti-interference structure for an in-vehicle core gateway chip provided in an embodiment of this application. Figure 4 ,like Figure 3-4 As shown, in some possible embodiments, a shielding metal ring 13 is also provided on the second surface 12. The shielding metal ring 13 is disposed along the edge of the second surface 12, and the first housing 5 is connected to the second surface 12 through the shielding metal ring 13. The shielding metal ring 13 forms a complete conductive path along the edge of the second surface 12 and is tightly connected to the first housing 5, ensuring that the contact resistance between the housing and the circuit board 1 is minimized, thereby forming a continuous and reliable shielding layer to prevent leakage of electromagnetic radiation.

[0046] In this embodiment, the shielding metal ring 13 is a ring of bright copper disposed along the second surface 12.

[0047] In some possible embodiments, a folded edge is provided at the edge where the first housing 5 connects to the shielding metal ring 13. By providing the folded edge, the contact area between the first housing 5 and the shielding metal ring 13 can be increased, ensuring the strength and stability of the connection between the first housing 5 and the shielding metal ring 13, and avoiding the shielding effect being affected by mechanical vibration or stress.

[0048] In another possible embodiment, the first housing 5 is a fully enclosed enclosure. A fully enclosed first housing 5 can completely block electromagnetic radiation from both inside and outside, maximizing the isolation from electromagnetic interference.

[0049] Continue as Figure 3 As shown, in some possible embodiments, a plurality of heat dissipation protrusions 51 are provided on the inner wall of the first housing 5; the positions of the plurality of heat dissipation protrusions 51 correspond to the positions of the plurality of power chips 3 and the plurality of inductors 4, and the height of the plurality of heat dissipation protrusions 51 corresponds to the height of the plurality of power chips 3 and the plurality of inductors 4.

[0050] In some possible embodiments, thermal pads 52 are disposed between the ends of the plurality of heat dissipation protrusions 51 and the plurality of power chips 3 and the plurality of inductors 4. The thermal pads 52 can fit well between the power chips 3 and the heat dissipation protrusions 51, thereby providing heat dissipation for the power chips 3. Specifically, the thermal pads 52 can be made of materials such as silicone with good thermal conductivity, insulation, and impact resistance.

[0051] With the above configuration, the first housing 5, which is fully enclosed and has added heat dissipation protrusions 51 and thermal pads 52, has higher shielding performance and improves heat dissipation efficiency through heat dissipation protrusions 51 and thermal pads 52, making it suitable for devices with high power consumption or high heat dissipation requirements.

[0052] In some possible embodiments, the anti-interference structure of the vehicle core gateway chip also includes a second housing made of a non-conductive material. The second housing is disposed on the first surface 11 of the circuit board 1 to protect the components on the first surface 11. The non-conductive second housing can protect the control chip, peripheral interfaces and other components on the first surface 11 from external physical damage, and also prevent dust and other debris from falling into the interior of the second housing. It can be made of a lightweight plastic material.

[0053] In some possible embodiments, such as Figure 3 As shown, a main heat sink 61 is provided on the second housing 6. The position of the main heat sink 61 corresponds to the controller chip 2, and a thermal pad 52 is provided between the main heat sink 61 and the controller chip 2. The thermal pad 52 can transfer the heat emitted by the controller chip 2 to the main heat sink 61, and then to the outside of the second housing 6.

[0054] In this embodiment, the second surface 12 is provided with a plurality of heat dissipation metal disks and a plurality of heat dissipation through holes. The plurality of heat dissipation metal disks and a plurality of heat dissipation through holes are connected to the first housing 5 through a plurality of heat dissipation protrusions 51 and thermal pads 52, so as to conduct the heat generated by the power chip 3 and the inductor 4 of the second surface 12 to the outside of the first housing 5 of the second surface 12 and further dissipate it, thereby optimizing the heat dissipation on the back of the anti-interference structure of the vehicle core gateway chip. The heat dissipation metal disks can be configured as heat dissipation bright copper.

[0055] This application embodiment also provides an in-vehicle core gateway chip, which includes the aforementioned anti-interference structure. By setting the anti-interference structure on the in-vehicle core gateway chip, the controller chip 2 is placed on the first side 11, which is the primary return surface, to ensure the stability and electrical performance of the heavier core components. The numerous power chips 3 and inductors 4 are arranged on the second side 12, which is the secondary return surface, to avoid electromagnetic radiation interference from the power chips 3 and inductors 4 to the controller chip 2 on the other side, thus ensuring the working stability of each component on the circuit board 1.

[0056] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, specific embodiments have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in a different order than that shown in the embodiments and still achieve the desired result. Additionally, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0057] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0058] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0059] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An anti-interference structure for an on-board core gateway chip, characterized in that, It includes a circuit board (1), a controller chip (2), multiple peripheral interfaces, multiple power chips (3) and multiple inductors (4); the multiple power chips (3) provide power to the multiple peripheral interfaces and the controller chip (2) respectively; The circuit board (1) includes a first surface (11) and a second surface (12), the first surface (11) being a primary return surface and the second surface (12) being a secondary return surface; the controller chip (2) and the plurality of peripheral interfaces are disposed on the first surface (11), and the plurality of power chips (3) and the plurality of inductors (4) are disposed on the second surface (12).

2. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 1, characterized in that, It also includes a first housing (5) made of a conductive material; The first housing (5) is disposed on the second surface (12) of the circuit board (1) to shield the electromagnetic interference of the components on the second surface (12).

3. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 2, characterized in that, A shielding metal ring (13) is also provided on the second surface (12). The shielding metal ring (13) is provided along the edge of the second surface (12). The first housing (5) is connected to the second surface (12) through the shielding metal ring (13).

4. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 3, characterized in that, The first housing (5) has a folded edge at the edge where it connects to the shielding metal ring (13).

5. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 2, characterized in that, The first housing (5) is fully enclosed.

6. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 2, characterized in that, The inner wall of the first housing (5) is provided with a plurality of heat dissipation protrusions (51); The positions of the plurality of heat dissipation protrusions (51) correspond to the positions of the plurality of power chips (3) and the plurality of inductors (4), and the heights of the plurality of heat dissipation protrusions (51) correspond to the heights of the plurality of power chips (3) and the plurality of inductors (4).

7. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 6, characterized in that, A thermal pad (52) is provided between the ends of the plurality of heat dissipation protrusions (51) and the plurality of power chips (3) and the plurality of inductors (4).

8. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 7, characterized in that, The second surface (12) is also provided with a plurality of heat dissipation metal plates and a plurality of heat dissipation through holes. The plurality of heat dissipation metal plates and the plurality of heat dissipation through holes are connected to the first housing (5) through the plurality of heat dissipation bosses (51) and the heat-conducting pads (52).

9. The anti-interference structure of the vehicle-mounted core gateway chip according to claim 1, characterized in that, It also includes a second housing (6), which is made of a non-conductive material; the second housing (6) is disposed on the first surface (11) of the circuit board (1) and is used to protect the components on the first surface (11); The second housing (6) is provided with a main heat sink (61), the position of which corresponds to the controller chip (2), and a thermal pad (52) is provided between the main heat sink (61) and the controller chip (2).

10. A vehicle-mounted core gateway chip, characterized in that, It includes the anti-interference structure for the vehicle core gateway chip as described in any one of claims 1 to 9.

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