Controller and vehicle

Abstract

The utility model relates to the technical field of vehicle production and manufacturing, in particular to a controller and a vehicle. The cross-sectional area of the water channel is gradually increased from the water inlet to the communicating port, the whole water channel is in a shape with the front portion narrow and the rear portion wide, smooth transition is achieved, the flow speed and the flow can be reasonably distributed according to the flowing characteristics of cooling liquid, the flow speed of the cooling liquid is increased through the front-end narrow portion, the heat dissipation capacity is enhanced, and the flow resistance is reduced through the rear-end wide portion, so that smooth flowing of the cooling liquid is guaranteed. Therefore, the efficiency of the whole heat dissipation system is improved. The cross-sectional area of the water channel is larger than that of the water channel, so that the flow resistance of the water channel and the water channel can be further reduced, and a better heat dissipation effect is further achieved. Therefore, through the design, the IGBT module, the capacitor and the filtering assembly can be cooled, the flow velocity and the flow can be reasonably distributed, the flow resistance is reduced, and a better cooling effect is further achieved.

Description

Technical Field

[0001] This utility model relates to the technical field of vehicle production and manufacturing, specifically to a controller and a vehicle. Background Technology

[0002] With the rapid development of the automotive industry, the market share of electric vehicles is constantly increasing. As one of the core components of electric vehicles, the performance and reliability of the automotive electric drive controller are crucial. Traditional flat-type electric drive controllers have many problems in terms of heat dissipation: First, the heat dissipation efficiency is low. The water channel is only located at the bottom of the IGBT module, and there are no heat dissipation measures for capacitors and filter components with high operating temperatures. It is impossible to dissipate the heat generated by the controller operation in a timely and effective manner, resulting in excessively high internal temperature of the controller, which affects the performance and lifespan of electronic components; Second, the heat dissipation flow resistance is large, which affects the flow speed and uniformity of the coolant, further reducing the heat dissipation effect. Utility Model Content

[0003] The purpose of this application is to provide a controller and a vehicle.

[0004] This application provides a controller, including an IGBT module, a capacitor, a filter component, and a housing; the housing forms a cavity, and the filter component, the capacitor, and the IGBT module are sequentially laid flat in the cavity. The housing forms a water channel and a water tank. The water channel is arranged corresponding to the filter component and the capacitor, and the water channel extends in a curved direction from the filter component to the capacitor. The water tank is arranged corresponding to the IGBT module, and the water channel connects to the water tank to form a communication port. The water channel has an inlet, and the water tank has an outlet. The cross-sectional area of ​​the water channel gradually increases from the inlet to the communication port, and the cross-sectional area of ​​the water tank is larger than the cross-sectional area of ​​the water channel.

[0005] In one exemplary embodiment of this application, the waterway includes a first flow section, an arc-shaped section, a second flow section, and a third flow section. The first flow section, the arc-shaped section, the second flow section, and the third flow section are connected in sequence. The first flow section is disposed corresponding to the filter component, the second flow section is disposed corresponding to the capacitor, the arc-shaped section is disposed between the first flow section and the second flow section, and the third flow section is connected to the second flow section and the water tank.

[0006] In one exemplary embodiment of this application, the bottom wall of the water tank has a bottom surface, the bottom surface including a boss surface and a guide surface, the guide surface being disposed on the side of the boss surface near the communication port, and the height of the boss surface being greater than the height of the guide surface in a first direction; the controller includes a heat-conducting component, one end of the heat-conducting component being connected to the IGBT module, the other end of the heat-conducting component being inserted into the water tank, a portion of the heat-conducting component being located on the boss surface, and a portion of the heat-conducting component being located on the guide surface.

[0007] In one exemplary embodiment of this application, the connection port is located on the side of the bottom surface facing the sidewall, and in a first direction, the height of the guide surface gradually increases from the side close to the connection port to the side away from the connection port.

[0008] In one exemplary embodiment of this application, the accommodating cavity includes a first accommodating cavity, a second accommodating cavity, and a third accommodating cavity, which are arranged in parallel in sequence. The filter component is disposed in the first accommodating cavity, the capacitor is disposed in the second accommodating cavity, and the IGBT module is disposed in the third accommodating cavity.

[0009] In one exemplary embodiment of this application, the bottom surface of the first accommodating cavity and the bottom surface of the second accommodating cavity are planes, and the water channel is disposed at the bottom of the first accommodating cavity.

[0010] In one exemplary embodiment of this application, the capacitor includes a first housing and a heat sink, the heat sink being disposed on the side of the first housing facing the bottom surface of the second accommodating cavity, and the heat sink abutting against the bottom surface of the second accommodating cavity.

[0011] In one exemplary embodiment of this application, the heat sink is provided with a plurality of circular holes; the controller further includes an adhesive portion disposed between the heat sink and the bottom surface of the second accommodating cavity, and a portion of the adhesive portion fills the circular holes.

[0012] In one exemplary embodiment of this application, the filtering component includes a plastic part, a high-voltage copper busbar, a nanocrystalline magnetic ring, and a safety capacitor. The nanocrystalline magnetic ring and the safety capacitor are sleeved on the high-voltage copper busbar. The high-voltage copper busbar, the nanocrystalline magnetic ring, and the safety capacitor are integrated into a single structure through the plastic part. The plastic part has a first plane and a second plane on the side facing the bottom surface of the first accommodating cavity. The first plane is disposed corresponding to the nanocrystalline magnetic ring, and the second plane is disposed corresponding to the safety capacitor.

[0013] This application also provides a vehicle including the aforementioned controller.

[0014] The controller and vehicle proposed in this application have the following advantages: A water channel is positioned to correspond to the filter components and capacitors, enabling heat dissipation for the capacitors and filter components, which operate at high temperatures. The water channel extends in a curved manner from the filter components to the capacitors, increasing the heat dissipation area of ​​the capacitors and filter components compared to a straight extension, further improving the heat dissipation effect. A water tank is positioned to correspond to the IGBT module, enabling heat dissipation for the IGBT module. Coolant flows from the water channel to the water tank, entering through the inlet of the water channel and exiting through the outlet of the water tank, forming a water circulation through the connecting port. The cross-sectional area of ​​the water channel gradually increases from the inlet to the connecting port, exhibiting a shape that is narrow at the front and wide at the back, achieving a smooth transition. This allows for the rational allocation of flow velocity and flow rate according to the coolant flow characteristics. The narrow front section accelerates the coolant flow velocity, enhancing heat dissipation capacity, while the wide rear section reduces flow resistance, ensuring smooth coolant flow and thus improving the efficiency of the entire cooling system. The cross-sectional area of ​​the water tank is larger than that of the water channel, further reducing the flow resistance of the water channel and water tank, resulting in even better heat dissipation. Therefore, this design can effectively dissipate heat from the IGBT module, capacitors, and filter components, while also rationally distributing flow rate and volume, reducing flow resistance, and further enhancing heat dissipation.

[0015] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0018] Figure 1 This is a schematic diagram of the structure of a controller according to an embodiment of the present utility model;

[0019] Figure 2 This is a bottom view of the lower shell in an embodiment of this utility model;

[0020] Figure 3 This is a top view of the lower shell in an embodiment of this utility model;

[0021] Figure 4 This is a schematic diagram of the shell structure in an embodiment of this utility model;

[0022] Figure 5 yes Figure 4 Schematic diagram of the cross section at point AA;

[0023] Figure 6 yes Figure 5 Schematic diagram of the cross section at point BB;

[0024] Figure 7 This is a schematic diagram of the capacitor structure in an embodiment of this utility model;

[0025] Figure 8 This is a schematic diagram of the structure of the filter component in an embodiment of this utility model;

[0026] Figure 9 This is a bottom view of the filter component in an embodiment of this utility model.

[0027] Explanation of reference numerals in the attached figures:

[0028] 10. IGBT module; 20. Capacitor; 21. First housing; 22. Heat sink; 221. Circular hole; 30. Filter assembly; 31. Plastic part; 311. First plane; 312. Second plane; 32. High voltage copper busbar; 33. Nanocrystalline magnetic ring; 34. Safety capacitor; 40. Housing; 401. Upper housing; 402. Lower housing; 41. Receiving cavity; 411. First receiving cavity; 412. Second receiving cavity; 413. Third receiving cavity; 42. Water channel; 421. Water inlet; 422. First flow section; 423. Arc-shaped section; 424. Second flow section; 425. Third flow section; 43. Water tank; 431. Bottom surface; 4311. Boss surface; 4312. Guide surface; 432. Water outlet; 44. Connecting port; 50. Heat-conducting component. Detailed Implementation

[0029] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0030] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0031] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0032] It should be noted that "multiple" in this article refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0033] With the rapid development of the automotive industry, the market share of electric vehicles is constantly increasing. As one of the core components of electric vehicles, the performance and reliability of the automotive electric drive controller are crucial. Traditional flat-type electric drive controllers have many problems in terms of heat dissipation: First, the heat dissipation efficiency is low. The water channel is only located at the bottom of the IGBT module, and there are no heat dissipation measures for capacitors and filter components with high operating temperatures. It is impossible to dissipate the heat generated by the controller operation in a timely and effective manner, resulting in excessively high internal temperature of the controller, which affects the performance and lifespan of electronic components; Second, the heat dissipation flow resistance is large, which affects the flow speed and uniformity of the coolant, further reducing the heat dissipation effect.

[0034] To address the aforementioned technical problems, this application provides a controller, with reference to... Figure 1 As shown, the system includes an IGBT module 10, a capacitor 20, a filter assembly 30, and a housing 40; the housing 40 forms a receiving cavity 41, and the filter assembly 30, capacitor 20, and IGBT module 10 are sequentially arranged in the receiving cavity 41. (Refer to...) Figure 2 and Figure 3As shown, the housing 40 forms a water channel 42 and a water tank 43. The water channel 42 is positioned corresponding to the filter component 30 and the capacitor 20, and extends in a curved manner from the filter component 30 to the capacitor 20. The water tank 43 is positioned corresponding to the IGBT module 10, and the water channel 42 connects to the water tank 43 to form a connecting port 44. The water channel 42 has an inlet 421, and the water tank 43 has an outlet 432. The cross-sectional area of ​​the water channel 42 gradually increases from the inlet 421 to the connecting port 44, and the cross-sectional area of ​​the water tank 43 is larger than that of the water channel 42. The water channel 42, positioned corresponding to the filter component 30 and the capacitor 20, can dissipate heat from the capacitor 20 and the filter component 30, which operate at high temperatures. The curved extension of the water channel 42 from the filter component 30 to the capacitor 20, compared to a straight extension, increases the heat dissipation area of ​​the capacitor 20 and the filter component 30, further improving the heat dissipation effect. The water tank 43, positioned corresponding to the IGBT module 10, can dissipate heat from the IGBT module 10. Coolant flows from water channel 42 to water tank 43, entering through inlet 421 and exiting through outlet 432 of water tank 43, forming a water circulation through connecting port 44. The cross-sectional area of ​​water channel 42 gradually increases from inlet 421 to connecting port 44, exhibiting a shape that is narrower at the front and wider at the back, achieving a smooth transition. This allows for the rational allocation of flow velocity and volume according to the coolant's flow characteristics. The narrower front section accelerates the coolant flow, enhancing heat dissipation, while the wider rear section reduces flow resistance, ensuring smooth coolant flow and improving the overall efficiency of the cooling system. Water tank 43 has a larger cross-sectional area than water channel 42, further reducing the flow resistance of both water channel 42 and water tank 43, resulting in even better heat dissipation. Therefore, this design effectively dissipates heat from the IGBT module 10, capacitor 20, and filter component 30, while also rationally allocating flow velocity and volume and reducing flow resistance, thus achieving superior heat dissipation.

[0035] In some embodiments, refer to Figure 1 As shown, the accommodating cavity 41 includes a first accommodating cavity 411, a second accommodating cavity 412, and a third accommodating cavity 413. The first accommodating cavity 411, the second accommodating cavity 412, and the third accommodating cavity 413 are arranged side-by-side. The filter component 30 is disposed in the first accommodating cavity 411, the capacitor 20 is disposed in the second accommodating cavity 412, and the IGBT module 10 is disposed in the third accommodating cavity 413. By accommodating the filter component 30, the capacitor 20, and the IGBT module 10 side-by-side through the first accommodating cavity 411, the second accommodating cavity 412, and the third accommodating cavity 413 respectively, electromagnetic interference among the three components can be reduced, resulting in better electromagnetic shielding performance.

[0036] In some embodiments, refer to Figure 2 and Figure 3As shown, the water channel 42 includes a first flow section 422, an arc-shaped section 423, a second flow section 424, and a third flow section 425. These sections are sequentially connected. The first flow section 422 corresponds to the filter assembly 30, the second flow section 424 corresponds to the capacitor 20, the arc-shaped section 423 is located between the first and second flow sections 422, and the third flow section 425 connects the second flow section 424 and the water tank 43. The first and second flow sections 422 and 424 correspond to the filter assembly 30 and the capacitor 20, respectively; this refers to their approximate positions. The first and second flow sections 422 and 424 are inclinedly arranged on the bottom surface of the housing 40, further increasing the heat dissipation area. The arc-shaped portion 423 connects the first flow portion 422 and the second flow portion 424, which can reduce the flow resistance between the first flow portion 422 and the second flow portion 424, and also make the flow between the first flow portion 422 and the second flow portion 424 smoother and reduce flow noise, etc.

[0037] In some embodiments, refer to Figure 2 and Figure 3 As shown, the water channel 42 and the water tank 43 are integrated on the shell 40. The main body of the water channel 42 and the main body of the water tank 43 are integrally die-cast with the shell 40. The main body of the water channel 42 is the part that discharges the water inlet 421, and the main body of the water tank 43 is the part that discharges the water outlet 432.

[0038] In some embodiments, the upper sidewall of the water channel 42 is a cover, and the upper sidewall of the water channel 42 is connected to the housing 40 by friction stir welding, which ensures the connection strength and effectively prevents coolant leakage.

[0039] In some embodiments, the height of the copper busbar at the controller bus connector is limited by assembly requirements, making it difficult to fill the space between it and the housing 40 with thermally conductive material. Furthermore, the temperature of the copper busbar at the overlapping surface is too high due to changes in the overlapping resistance and current-carrying area. The design of the water channel 42 at this location is prone to condensation. Therefore, the water channel 42 is designed to not pass through the controller bus connector, which reduces the risk of condensation and also provides good heat dissipation.

[0040] In some embodiments, refer to Figure 4 As shown, the housing includes an upper housing 401 and a lower housing 402, which are connected by screws. A cavity 41 is formed between the upper housing 401 and the lower housing 402. A water channel 42 and a water tank 43 are provided in the lower housing 402, and a sealing part can be provided between the upper housing 401 and the lower housing 402 to ensure sealing performance.

[0041] In some embodiments, refer to Figure 5 and Figure 6As shown, the bottom wall of the water tank 43 has a bottom surface 431, which includes a boss surface 4311 and a guide surface 4312. The guide surface 4312 is located on the side of the boss surface 4311 near the communication port 44. In a first direction, the height of the boss surface 4311 is greater than the height of the guide surface 4312. The controller includes a heat-conducting element 50. One end of the heat-conducting element 50 is connected to the IGBT module 10, and the other end of the heat-conducting element 50 is inserted into the water tank 43. Part of the heat-conducting element 50 is located on the boss surface 4311, and part of the heat-conducting element 50 is located on the guide surface 4312. The number of heat-conducting elements 50 located on the boss surface 4311 is greater than the number of heat-conducting elements 50 located on the guide surface 4312. As a result, the area of ​​the boss surface 4311 is greater than the area of ​​the guide surface 4312. In order to accommodate the distribution requirements of the heat-conducting elements 50, the height of the boss surface 4311 needs to be greater than the height of the guide surface 4312 so that the heat-conducting pillars can be as close as possible to the bottom surface 431, thereby reducing the amount of coolant used and allowing the heat-conducting elements 50 inserted into the water tank 43 to be submerged with limited coolant, thereby increasing the heat dissipation effect.

[0042] In some embodiments, the heat-conducting element 50 includes a heat-conducting pillar that can reduce resistance to the coolant while providing a heat-conducting effect.

[0043] In some embodiments, refer to Figure 5 and Figure 6 As shown, the connecting port 44 is located on the side of the bottom surface 431 facing the sidewall. In the first direction, the height of the guide surface 4312 gradually increases from the side close to the connecting port 44 to the side away from the connecting port 44. The first direction is the height direction of the controller. The gradual increase in the height of the guide surface 4312 can gradually transition from the connecting port 44 to the boss surface 4311, effectively reducing the flow resistance from the flow port to the boss surface 4311.

[0044] In some embodiments, combined with Figure 1 As shown, the bottom surface 431 of the first accommodating cavity 411 and the bottom surface 431 of the second accommodating cavity 412 are planar, and the water channel 42 is located at the bottom of the first accommodating cavity 411. (Refer to...) Figure 7 As shown, capacitor 20 includes a first housing 21 and a heat sink 22. The heat sink 22 is disposed on the side of the first housing 21 facing the bottom surface 431 of the second accommodating cavity 412, and abuts against the bottom surface 431 of the second accommodating cavity 412. Furthermore, the heat sink 22 has a plurality of circular holes 221. The controller also includes an adhesive portion (not shown in the figure), which is disposed between the heat sink 22 and the bottom surface 431 of the second accommodating cavity 412, and part of the adhesive portion fills the circular holes 221. This increases the contact area of ​​the adhesive portion and improves the heat dissipation efficiency of capacitor 20.

[0045] In some embodiments, refer to Figure 8 and Figure 9As shown, the filter assembly 30 includes a plastic part 31, a high-voltage copper busbar 32, a nanocrystalline magnetic ring 33, and a safety capacitor 34. The nanocrystalline magnetic ring 33 and the safety capacitor 34 are sleeved on the high-voltage copper busbar 32. The high-voltage copper busbar 32, the nanocrystalline magnetic ring 33, and the safety capacitor 34 are integrated into a single structure through the plastic part 31. The side of the plastic part 31 facing the bottom surface 431 of the first accommodating cavity 411 has a first plane 311 and a second plane 312. The first plane 311 is disposed corresponding to the nanocrystalline magnetic ring 33, and the second plane 312 is disposed for the safety capacitor 34. Therefore, due to process and functional considerations, it is difficult to make the bottom surface 431 of the plastic part 31 corresponding to the high voltage copper busbar 32, nanocrystalline magnetic ring 33 and safety capacitor 34 on the same plane. So, after designing the safety capacitor 34 and magnetic ring of the filter component 30 as close to the same plane as possible, grooves are designed in the places where there is a plane difference. After injection molding, the grooves are filled with adhesive material to achieve a large-area flat bottom design of the filter component 30, thereby forming at least the first plane 311 and the second plane 312, increasing the contact area between the filter component 30 and the bottom surface 431 of the accommodating cavity 41, and thus increasing the heat dissipation area.

[0046] In some embodiments, there are gaps of 1mm-2mm between the capacitor 20 and the bottom surface 431 of the accommodating cavity 41, between the first plane 311 and the bottom surface 431 of the accommodating cavity 41, and between the second plane 312 and the bottom surface 431 of the accommodating cavity 41. After applying adhesive to these gaps, the assembly is connected to the housing 40. Specifically, the adhesive is a thermally conductive adhesive. The excellent thermal conductivity of the adhesive rapidly conducts the heat generated by the capacitor 20 and the filter assembly 30 to the housing 40, achieving heat dissipation. Simultaneously, the gaps and the thermally conductive adhesive provide shock absorption, reducing the impact of vehicle vibrations on the assembly. Because the capacitor 20 and the filter assembly 30 adopt a large-area flat-bottom design, and the gap between the heating element and the housing 40 is filled with a thermally conductive interface material, air between the heating element and the housing 40 is eliminated. This also prevents moisture from condensing on the assembly surface during temperature changes, protecting the electronic components.

[0047] This application also provides a vehicle, including a controller.

[0048] In this application, unless otherwise expressly specified and limited, the terms "set up (provided)" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0049] In the description of this specification, references to terms such as "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0050] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A controller, characterized in that, The device includes an IGBT module, a capacitor, a filter assembly, and a housing. The housing forms a cavity, and the filter assembly, the capacitor, and the IGBT module are sequentially laid flat within the cavity. The housing forms a water channel and a water tank. The water channel is positioned corresponding to the filter assembly and the capacitor, and extends in a curved manner from the filter assembly to the capacitor. The water tank is positioned corresponding to the IGBT module, and the water channel connects to the water tank to form a connecting opening. The water channel has an inlet, and the water tank has an outlet. The cross-sectional area of ​​the water channel gradually increases from the inlet to the connecting opening, and the cross-sectional area of ​​the water tank is larger than that of the water channel.

2. The controller according to claim 1, characterized in that, The waterway includes a first flow section, an arc-shaped section, a second flow section, and a third flow section. The first flow section, the arc-shaped section, the second flow section, and the third flow section are connected in sequence. The first flow section is disposed corresponding to the filter component, the second flow section is disposed corresponding to the capacitor, the arc-shaped section is disposed between the first flow section and the second flow section, and the third flow section is connected to the second flow section and the water tank.

3. The controller according to claim 1, characterized in that, The bottom wall of the water tank has a bottom surface, which includes a boss surface and a guide surface. The guide surface is located on the side of the boss surface near the communication opening, and the height of the boss surface is greater than the height of the guide surface in a first direction. The controller includes a heat-conducting component, one end of which is connected to the IGBT module, and the other end of which is inserted into the water tank. Part of the heat-conducting component is located on the boss surface, and part of the heat-conducting component is located on the guide surface.

4. The controller according to claim 3, characterized in that, The connection port is located on the side of the bottom surface facing the sidewall, and in a first direction, the height of the guide surface gradually increases from the side close to the connection port to the side away from the connection port.

5. The controller according to claim 1, characterized in that, The accommodating cavity includes a first accommodating cavity, a second accommodating cavity, and a third accommodating cavity, which are arranged in parallel in sequence. The filter component is disposed in the first accommodating cavity, the capacitor is disposed in the second accommodating cavity, and the IGBT module is disposed in the third accommodating cavity.

6. The controller according to claim 5, characterized in that, The bottom surfaces of the first accommodating cavity and the second accommodating cavity are flat, and the water channel is located at the bottom of the first accommodating cavity.

7. The controller according to claim 6, characterized in that, The capacitor includes a first housing and a heat sink, the heat sink being disposed on the side of the first housing facing the bottom surface of the second accommodating cavity, and the heat sink abutting against the bottom surface of the second accommodating cavity.

8. The controller according to claim 7, characterized in that, The heat sink is provided with a plurality of circular holes; the controller further includes an adhesive part, which is disposed between the heat sink and the bottom surface of the second accommodating cavity, and part of the adhesive part fills the circular holes.

9. The controller according to claim 5, characterized in that, The filtering component includes a plastic part, a high-voltage copper busbar, a nanocrystalline magnetic ring, and a safety capacitor. The nanocrystalline magnetic ring and the safety capacitor are sleeved on the high-voltage copper busbar. The high-voltage copper busbar, the nanocrystalline magnetic ring, and the safety capacitor are integrated into a single structure through the plastic part. The side of the plastic part facing the bottom of the first accommodating cavity has a first plane and a second plane. The first plane is positioned corresponding to the nanocrystalline magnetic ring, and the second plane is positioned corresponding to the safety capacitor.

10. A vehicle, characterized in that, Includes the controller as described in any one of claims 1 to 9.

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