Efficient active heat dissipation module

Abstract

The utility model discloses a high-efficiency active heat dissipation module, and belongs to the technical field of heat dissipation modules. The heat dissipation module comprises a communication shell, and a circuit board is arranged in the communication shell; the heat dissipation module is used for heat dissipation of the circuit board and comprises an upper heat conduction block and a lower heat conduction block matched with the upper heat conduction block, and the lower heat conduction block is attached to the circuit board; and the heat exchange cavity is formed in the connecting surface of the upper heat conduction block and the lower heat conduction block and is distributed in a continuous U-shaped pipeline. According to the efficient active heat dissipation module, cooling liquid can enter the heat exchange cavities through the first liquid inlet, heat exchange can be conducted on the cooling liquid and the lower heat conduction block, the circulation path of the cooling liquid can be increased through the heat exchange cavities distributed in the U shape, the heat exchange area can be increased, and the high-temperature cooling liquid obtained after heat exchange can be discharged through the first liquid outlet; therefore, the temperature of the lower heat conduction block is reduced, rapid active cooling can be realized, the heat dissipation efficiency is improved, and the damage rate of the communication equipment is reduced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation module technology, and in particular to a high-efficiency active heat dissipation module. Background Technology

[0002] Communication equipment contains many electronic components, such as resistors and transistors. When current flows through these components, heat is generated due to the resistance, which follows Joule's law (Q = I). 2 Rt), that is, the heat generated when current passes through a resistor is proportional to the square of the current, the resistance, and the duration of current flow. Therefore, communication equipment generates high temperatures when it is working. However, working in a high-temperature environment for a long time will shorten the service life of the communication equipment and make it very easy to be damaged.

[0003] Existing communication equipment typically uses heat sinks for passive cooling. In the absence of air circulation, heat cannot be effectively exchanged with the air, making it difficult for the temperature to drop. This causes the communication equipment to operate in a high-temperature environment, affecting its work efficiency. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a high-efficiency active heat dissipation module.

[0005] The technical solution of this utility model is: a high-efficiency active heat dissipation module, including a communication housing, the inside of which is a circuit board; a heat dissipation module for heat dissipation of the circuit board, the heat dissipation module including: an upper heat-conducting block, a lower heat-conducting block adapted to the upper heat-conducting block, the lower heat-conducting block being attached to the circuit board; a heat exchange cavity formed on the connecting surface of the upper heat-conducting block and the lower heat-conducting block, the heat exchange cavity being distributed in a continuous U-shaped pipeline; and a first liquid inlet and a first liquid outlet provided on the upper heat-conducting block and the lower heat-conducting block and communicating with the heat exchange cavity.

[0006] Furthermore, the heat exchange cavity is formed by a channel opened at the splicing surface of the upper heat-conducting block and the lower heat-conducting block.

[0007] Furthermore, a raised sealing strip is provided around the heat exchange cavity of the lower heat-conducting block, and a sealing groove adapted to the sealing strip is provided on the upper heat-conducting block.

[0008] Furthermore, both the upper and lower heat-conducting blocks are provided with several corresponding through holes, and the inside of each through hole is provided with an internal thread.

[0009] Furthermore, the contact surface between the lower heat-conducting block and the circuit board is provided with heat-conducting pillars, which are used to attach the heat-generating components on the circuit board.

[0010] Furthermore, the contact surface between the heat-conducting pillar and the circuit board is provided with thermal grease.

[0011] Furthermore, the upper heat-conducting block is provided with a heat exchange assembly extending to the outside of the communication housing. The heat exchange assembly includes: a heat dissipation frame fixed to the upper heat-conducting block by a bracket; a capillary structure disposed inside the heat dissipation frame; a second liquid inlet and a second liquid outlet disposed in the heat dissipation frame and communicating with the capillary structure; and a fan disposed in the heat dissipation frame with its air outlet facing the capillary structure.

[0012] The beneficial technical effects of this utility model are as follows: When the circuit board generates heat during operation, the heat can be conducted through the lower heat-conducting block, thereby reducing the operating temperature of the circuit board. The coolant can enter the heat exchange chamber through the first liquid inlet, and the coolant can exchange heat with the lower heat-conducting block. The U-shaped distribution of the heat exchange chamber can increase the flow path of the coolant and increase the heat exchange area. The high-temperature coolant after heat exchange can be discharged through the first liquid outlet, thereby reducing the temperature of the lower heat-conducting block. This achieves rapid and active cooling, improves heat dissipation efficiency, and reduces the damage rate of communication equipment. Furthermore, the high-temperature coolant can be heat exchanged through external heat exchange equipment, and then the cooled coolant can be re-entered into the heat exchange chamber through a water pump to achieve circulation, thus achieving high-efficiency long-term cooling. Attached Figure Description

[0013] Figure 1 This is a front sectional view of the structure of this utility model;

[0014] Figure 2 This is a bottom view schematic diagram of the structure of the upper heat-conducting block of this utility model;

[0015] Figure 3 This is a top view schematic diagram of the structure of the lower heat-conducting block of this utility model;

[0016] Figure 4 This is a bottom view schematic diagram of the structure of the heat exchange component of this utility model.

[0017] The numbers and letters in the diagram represent the names of the corresponding components:

[0018] 1. Communication housing; 2. Circuit board; 3. Upper heat-conducting block; 31. Lower heat-conducting block; 32. Heat exchange chamber; 33. Sealing strip; 34. Sealing groove; 35. First liquid inlet; 36. First liquid outlet; 37. Through hole; 38. Heat-conducting column; 39. Thermal grease patch; 4. Heat sink frame; 41. Capillary structure; 42. Second liquid inlet; 43. Second liquid outlet; 44. Fan. Detailed Implementation

[0019] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0020] See appendix Figure 1-4 As shown, the high-efficiency active heat dissipation module of Embodiment 1 includes a communication housing 1, the inside of which is a circuit board 2; and a heat dissipation module for heat dissipation of the circuit board 2.

[0021] The heat-generating components of communication equipment are generally integrated on the circuit board 2. Therefore, by using a heat dissipation module to dissipate heat from the circuit board 2, the temperature of the electronic components can be effectively reduced, thereby maintaining a good working environment for the electronic components.

[0022] The heat dissipation module includes: an upper heat-conducting block 3, a lower heat-conducting block 31 adapted to the upper heat-conducting block 3, the lower heat-conducting block 31 being attached to the circuit board 2; a heat exchange cavity 32 formed on the connecting surface of the upper heat-conducting block 3 and the lower heat-conducting block 31, the heat exchange cavity 32 being distributed in a continuous U-shaped pipeline; and a first liquid inlet 35 and a first liquid outlet 36 provided on the upper heat-conducting block 3 and the lower heat-conducting block 31 and communicating with the heat exchange cavity 32.

[0023] When circuit board 2 generates heat during operation, the heat can be conducted through the lower heat-conducting block 31, thereby reducing the operating temperature of circuit board 2. Coolant can enter the heat exchange chamber 32 through the first liquid inlet 35, where it can exchange heat with the lower heat-conducting block 31. The U-shaped heat exchange chamber 32 increases the flow path of the coolant and the heat exchange area. The high-temperature coolant after heat exchange can be discharged through the first liquid outlet 36, thereby reducing the temperature of the lower heat-conducting block 31. This achieves rapid and active cooling, improves heat dissipation efficiency, and reduces the damage rate of communication equipment. Furthermore, the high-temperature coolant can be heat exchanged through external heat exchange equipment, and then the cooled coolant can be re-entered into the heat exchange chamber 32 by a water pump, achieving a circulation effect and enabling efficient and long-term cooling.

[0024] Furthermore, the heat exchange cavity 32 is formed by a channel opened at the splicing surface of the upper heat-conducting block 3 and the lower heat-conducting block 31.

[0025] The upper heat-conducting block 3 and the lower heat-conducting block 31 can be produced separately. The production process of opening grooves on their surfaces is simple and the mold cost is low.

[0026] Furthermore, the lower heat-conducting block 31 has a raised sealing strip 33 around the heat exchange cavity 32, and the upper heat-conducting block 3 has a sealing groove 34 that matches the sealing strip 33.

[0027] When the upper heat-conducting block 3 and the lower heat-conducting block 31 are joined together, the sealing strip 33 will be inserted into the sealing groove 34 to increase the sealing performance and prevent leakage.

[0028] Furthermore, both the upper heat-conducting block 3 and the lower heat-conducting block 31 are provided with several corresponding through holes 37, and the inside of the through holes 37 is provided with internal threads.

[0029] The screw can be screwed into the through hole 37 through its internal thread, thus allowing the assembly of the upper heat-conducting block 3 and the lower heat-conducting block 31 to be completed using the screw.

[0030] Furthermore, the contact surface between the lower heat-conducting block 31 and the circuit board 2 is provided with heat-conducting pillars 38, which are used to attach the heat-generating components on the circuit board 2.

[0031] The heat-conducting pillars 38 can be of different shapes and sizes, and are mainly used to attach to the main heat-generating components on the circuit board 2, thereby achieving targeted cooling.

[0032] Furthermore, the contact surface between the heat-conducting pillar 38 and the circuit board 2 is provided with a thermal grease pad 39.

[0033] Thermal paste pads (39) can increase thermal conductivity and are more convenient than applying thermal paste.

[0034] Furthermore, the upper heat-conducting block 3 is provided with a heat exchange assembly extending to the outside of the communication housing 1. The heat exchange assembly includes: a heat dissipation frame 4 fixed to the upper heat-conducting block 3 by a bracket; a capillary structure 41 disposed inside the heat dissipation frame 4; a second liquid inlet 42 and a second liquid outlet 43 disposed on the heat dissipation frame 4 and communicating with the capillary structure 41; and a fan 44 disposed on the heat dissipation frame 4 and with its air outlet facing the capillary structure 41.

[0035] The first inlet 35 can be connected to the second outlet 43 through a pipeline, and the first outlet 36 can be connected to the second inlet 42. A water pump is added to the pipeline. When the water pump is working, the coolant inside the pipeline can circulate. The high-temperature coolant, after being heated by the heat-conducting block, can enter the capillary structure 41 through the second inlet 42. The capillary structure 41 can divide the coolant. Then, the fan 44 can blow air to exchange heat with the capillary structure 41, thereby reducing the temperature of the coolant. The cooled coolant will then re-enter the heat exchange chamber 32 through the second outlet 43 and the first inlet 35 to complete the circulation cooling.

[0036] The air intake of the fan 44 is preferably on the side, which can reduce the distance between the heat sink frame 4 and the upper heat conduction block 3. The fan 44 can draw in the warm air inside the communication housing 1, so that the cold air outside can enter the communication housing 1, thereby performing air cooling on the communication housing 1.

[0037] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A high-efficiency active heat dissipation module, characterized in that, include: A communication housing (1) is provided inside which a circuit board (2) is installed; A heat dissipation module for heat dissipation of circuit board (2) includes: an upper heat-conducting block (3), a lower heat-conducting block (31) adapted to the upper heat-conducting block (3), the lower heat-conducting block (31) being attached to the circuit board (2); a heat exchange cavity (32) formed on the connecting surface of the upper heat-conducting block (3) and the lower heat-conducting block (31), the heat exchange cavity (32) being distributed in a continuous U-shaped pipeline; and a first liquid inlet (35) and a first liquid outlet (36) provided on the upper heat-conducting block (3) and the lower heat-conducting block (31) and communicating with the heat exchange cavity (32).

2. The high-efficiency active heat dissipation module according to claim 1, characterized in that, The heat exchange cavity (32) is formed by a channel opened at the splicing surface of the upper heat-conducting block (3) and the lower heat-conducting block (31).

3. The high-efficiency active heat dissipation module according to claim 1, characterized in that, The lower heat-conducting block (31) has a raised sealing strip (33) around the heat exchange cavity (32), and the upper heat-conducting block (3) has a sealing groove (34) that matches the sealing strip (33).

4. The high-efficiency active heat dissipation module according to claim 1, characterized in that, Both the upper heat-conducting block (3) and the lower heat-conducting block (31) are provided with several corresponding through holes (37), and the inside of the through holes (37) is provided with internal threads.

5. The high-efficiency active heat dissipation module according to claim 1, characterized in that, The contact surface between the lower heat-conducting block (31) and the circuit board (2) is provided with heat-conducting pillars (38), which are used to attach the heat-generating components on the circuit board (2).

6. The high-efficiency active heat dissipation module according to claim 5, characterized in that, The contact surface between the heat-conducting pillar (38) and the circuit board (2) is provided with a thermal grease pad (39).

7. The high-efficiency active heat dissipation module according to claim 1, characterized in that, The upper heat-conducting block (3) is provided with a heat exchange assembly extending to the outside of the communication housing (1). The heat exchange assembly includes: a heat dissipation frame (4) fixed to the upper heat-conducting block (3) by a bracket; a capillary structure (41) disposed inside the heat dissipation frame (4); a second liquid inlet (42) and a second liquid outlet (43) disposed in the heat dissipation frame (4) and communicating with the capillary structure (41); and a fan (44) disposed in the heat dissipation frame (4) and with its air outlet facing the capillary structure (41).

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