Wafer unloading device capable of automatically unloading wafers

Abstract

The utility model relates to the technical field of wafer unloading, in particular to a wafer unloading device capable of automatically unloading wafers. The utility model provides the wafer unloading device capable of automatically unloading the wafer, which can automatically take down the wafer and improve the wafer unloading efficiency and the wafer quality. A wafer unloading device capable of unloading wafers automatically comprises a base, a rotating cylinder, a heating table, a first supporting frame and the like, the rotating cylinder is connected to the upper side of the front portion of the base, the heating table is connected to an output shaft of the rotating cylinder, and the first supporting frame is connected to the upper side of the rear portion of the base. According to the utility model, the shovel blade is shoveled between the wafer and the ceramic disc, then the first cylinder is started, the shovel blade moves upwards to lift the wafer, at the moment, the second motor is started to drive the connector and the rotating frame to rotate, and the fourth support frame drives the scraping line to rotate to scrape the wafer away from the ceramic disc, so that the wafer can be automatically taken down; the wafer unloading efficiency and the wafer quality are improved; and the wafer can be automatically unloaded.

Description

Technical Field

[0001] This utility model relates to the field of wafer unloading technology, and in particular to a wafer unloading device capable of automatic unloading. Background Technology

[0002] A wafer is a thin, sheet-like material used in semiconductor manufacturing, typically made of semiconductor materials such as silicon, gallium arsenide, and silicon carbide. It serves as the fundamental platform for producing integrated circuits, optoelectronic devices, and other microelectronic components. During wafer processing, the wafer is usually mounted onto a ceramic disk. However, after processing, the wafer must be manually removed from the ceramic disk using tools such as blades and tweezers. This process is time-consuming, labor-intensive, and prone to damaging the wafer, making it quite inconvenient.

[0003] Therefore, a wafer unloading device has now been developed that can automatically remove wafers, thereby improving wafer unloading efficiency and quality. Utility Model Content

[0004] To overcome the drawbacks of manually removing wafers from ceramic trays using blades, tweezers, or other tools after wafer processing, which is time-consuming, labor-intensive, and prone to damaging the wafers, this invention provides an automatic wafer unloading device that can automatically remove wafers, improving wafer unloading efficiency and quality.

[0005] The technical solution of this utility model is as follows: a wafer unloading device capable of automatic unloading, comprising a base, a rotary cylinder, a heating stage, a first support frame, an adsorption component, a scraping component, and a linear wax scraping component. The rotary cylinder is connected to the upper front side of the base, and the heating stage is connected to the output shaft of the rotary cylinder. The first support frame is connected to the upper rear side of the base. The first support frame is provided with an adsorption component capable of adsorbing wafers. The adsorption component is provided with a scraping component capable of scraping wafers. The adsorption component is also provided with a linear wax scraping component capable of scraping wax.

[0006] As a further preferred option, the base has multiple handles on its upper side.

[0007] As a further preferred embodiment, the adsorption assembly includes an electric slide rail, a sliding block, a first motor, a transmission assembly, a rotating shaft, and a vacuum adsorption disk. The upper part of the first support frame is connected to the electric slide rail, the slider of the electric slide rail is connected to the sliding block, the lower right side of the sliding block is connected to the first motor, the left side of the sliding block is rotatably connected to the rotating shaft, a transmission assembly is provided between the rotating shaft and the output shaft of the first motor, and the lower side of the rotating shaft is connected to the vacuum adsorption disk.

[0008] As a further preferred embodiment, the transmission assembly includes a belt and drive pulleys, with drive pulleys connected to both the rotating shaft and the output shaft of the first motor, and a belt wound around the drive pulleys.

[0009] As a further preferred embodiment, the shovel assembly includes a second support frame, a first cylinder, a second cylinder, and a shovel blade. The second support frame is connected to the lower part of the rotating shaft, the first cylinder is connected to the second support frame, the second cylinder is connected to the telescopic end of the first cylinder, and the shovel blade is connected to the telescopic end of the second cylinder.

[0010] As a further preferred embodiment, the linear scraping assembly includes a third support frame, a second motor, a connector, a rotating frame, a fourth support frame, a third motor, a rotating rod, a winding wheel, a top pressure frame, a telescopic spring, and a scraping wire. The third support frame is connected to the front side of the sliding block, and the second motor is connected to the front side of the third support frame. The connector is connected to the output shaft of the second motor, and the rotating frame is connected to the connector. The rotating frame is rotatably connected to the third support frame, and the fourth support frame is connected to the rotating frame. The third motor is connected to the upper left and right sides of the fourth support frame, and the rotating rod is connected to the output shaft of each of the third motors. The top pressure frame is slidably connected to the lower left and right sides of the fourth support frame. A winding wheel is engaged between each top pressure frame and the adjacent rotating rod. A telescopic spring is connected between each top pressure frame and the fourth support frame. The scraping wire is wound between the winding wheels and passes through the top pressure frame.

[0011] The present invention has the following advantages: 1. The present invention uses a scraper to scrape between the wafer and the ceramic disk, and then starts the first cylinder to move the scraper upward to lift the wafer. At this time, the second motor is started to drive the connector and the rotating frame to rotate, so that the fourth support frame drives the scraper to rotate and scrape the wafer away from the ceramic disk. This achieves the effect of automatically removing the wafer, improving the wafer unloading efficiency and wafer quality.

[0012] 2. When changing the wafer model, this utility model starts the first motor, which drives the rotating shaft to rotate through the transmission component, causing the second support frame and the scraper to rotate and adjust the position of the scraper, thus achieving the effect of adapting to different product models.

[0013] 3. When the scaffold needs to be replaced, the third motor is started to drive the rotating rod to rotate, which in turn causes the winding wheel to rotate and rewind the used part of the scaffold, thus achieving a quick and convenient replacement of the scaffold and avoiding affecting the wafer unloading efficiency. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0015] Figure 2 This is a three-dimensional structural diagram of the rotary cylinder of this utility model.

[0016] Figure 3 This is a three-dimensional structural diagram of the adsorption mechanism of this utility model.

[0017] Figure 4 This is a three-dimensional structural diagram of the shovel mechanism of the components of this utility model.

[0018] Figure 5 This is a three-dimensional structural diagram of the linear wax scraping mechanism of this utility model.

[0019] Figure 6 This is a three-dimensional structural schematic diagram of the cross-section of the linear wax scraping mechanism of this utility model.

[0020] The components are: 1-base, 2-rotary cylinder, 210-heating table, 3-first support frame, 4-electric slide rail, 5-sliding block, 6-first motor, 7-transmission assembly, 8-rotating shaft, 9-vacuum adsorption plate, 10-second support frame, 11-first cylinder, 12-second cylinder, 13-shovel, 14-third support frame, 15-second motor, 16-connector, 17-rotating frame, 18-fourth support frame, 19-third motor, 20-rotating rod, 21-winding wheel, 22-top pressure frame, 23-telescopic spring, 24-scraper. Detailed Implementation

[0021] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0022] A wafer unloading device capable of automatic unloading, such as Figures 1-6As shown, the system includes a base 1, a rotary cylinder 2, a heating platform 210, a first support frame 3, an adsorption assembly, a scraping assembly, and a linear wax scraping assembly. The rotary cylinder 2 is connected to the upper front side of the base 1, and four handles are provided on the upper side of the base 1 for easy handling. The heating platform 210 is connected to the output shaft of the rotary cylinder 2. The first support frame 3 is connected to the upper rear side of the base 1. The adsorption assembly is provided on the first support frame 3. The adsorption assembly includes an electric slide rail 4, a sliding block 5, a first motor 6, a transmission assembly 7, a rotating shaft 8, and a vacuum adsorption disk 9. The electric slide rail 4 is connected to the upper part of the first support frame 3, and the sliding block is connected to the slider of the electric slide rail 4. 5. The right lower side of the sliding block 5 is connected to the first motor 6, and the left side of the sliding block 5 is rotatably connected to the rotating shaft 8. The rotating shaft 8 and the output shaft of the first motor 6 are provided with the transmission assembly 7. The transmission assembly 7 includes a belt and a transmission wheel. The rotating shaft 8 and the output shaft of the first motor 6 are both connected to the transmission wheel, and a belt is wound between the transmission wheels. The lower side of the rotating shaft 8 is connected to the vacuum adsorption disk 9. The adsorption assembly is provided with a shoveling assembly. The shoveling assembly includes a second support frame 10, a first cylinder 11, a second cylinder 12, and a shovel 13. The lower part of the rotating shaft 8 is connected to the second support frame 10, and the second support frame 10 is connected to the first cylinder. 11. The first cylinder 11 is connected to the extension end of the second cylinder 12, and the second cylinder 12 is connected to the extension end of the scraper 13. The adsorption assembly is also provided with a linear wax scraping assembly, which includes a third support frame 14, a second motor 15, a connector 16, a rotating frame 17, a fourth support frame 18, a third motor 19, a rotating rod 20, a winding wheel 21, a top pressure frame 22, a telescopic spring 23, and a scraping wire 24. The sliding block 5 is connected to the front side of the third support frame 14, and the third support frame 14 is connected to the front side of the second motor 15. The output shaft of the second motor 15 is connected to the connector 16, and the rotating frame is connected to the connector 16. 17. The rotating frame 17 is rotatably connected to the third support frame 14. The fourth support frame 18 is connected to the rotating frame 17. The third motor 19 is connected to the upper left and right sides of the fourth support frame 18. The rotating rod 20 is connected to the output shaft of the third motor 19. The top pressure frame 22 is slidably connected to the lower left and right sides of the fourth support frame 18. The top pressure frame 22 is engaged with the winding wheel 21 between the adjacent rotating rod 20. The telescopic spring 23 is connected between the top pressure frame 22 and the fourth support frame 18. The scraper 24 is wound between the winding wheels 21 and passes through the top pressure frame 22.

[0023] When using this invention, firstly, the base 1 is placed in the wafer under-wafer area, then the ceramic disk containing the wafer is placed on the heating stage 210, so that the heating stage 210 heats the ceramic disk to a specified temperature and maintains it at this temperature. Then, the electric slide rail 4 is activated, pushing the sliding block 5 downwards, so that the vacuum suction disk 9 is positioned on the upper side of the wafer. Next, the first cylinder 11 is activated, pushing the scraper 13 downwards, so that the scraper 13 contacts the upper surface of the ceramic disk. Simultaneously, as the sliding block 5 moves downwards, it also drives the third support frame 14 downwards, so that the... The scraper 24 contacts the upper surface of the ceramic disk. Then, the second cylinder 12 is activated, pushing the scraper 13 to move, causing it to scrape between the wafer and the ceramic disk. Next, the first cylinder 11 is activated, causing the scraper 13 to move upwards and lift the wafer. At this time, the second motor 15 is activated, driving the connector 16 and the rotating frame 17 to rotate, causing the fourth support frame 18 to rotate the scraper 24, scraping the wafer away from the ceramic disk. After the wafer is scraped away, the vacuum adsorption disk 9 is activated, allowing it to adsorb the wafer. Then, the scraper 13 and the scraper 24... 4. Reset the slide block 5, then close the vacuum suction disk 9, remove the wafer, and start the rotary cylinder 2 to rotate the heating table 210 and ceramic disk to remove the remaining wafers. This achieves the function of automatically removing wafers, improving wafer unloading efficiency and quality. When changing the wafer model, the first motor 6 can be started, which drives the rotating shaft 8 to rotate through the transmission component 7, causing the second support frame 10 and the scraper 13 to rotate. The position of the scraper 13 can be adjusted to adapt to different product models. When the scraper 24 needs to be replaced, the third motor 19 can be started to drive the rotating rod 20 to rotate, causing the winding wheel 21 to rotate and rewind the used part of the scraper 24. When the winding wheel 21 needs to be removed, the top pressure frame 22 can be pressed down, the telescopic spring 23 is compressed and contracted, and then the winding wheel 21 can be removed. After releasing the top pressure frame 22, the telescopic spring 23 rebounds, causing the top pressure frame 22 to return to its original position. This allows for quick and convenient replacement of the scraper 24, avoiding any impact on wafer unloading efficiency.

[0024] Those skilled in the art should understand that the above embodiments do not limit the present invention in any way, and all technical solutions obtained by means of equivalent substitution or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A wafer unloading device capable of automatic unloading, characterized in that: It includes a base (1), a rotary cylinder (2), a heating platform (210), a first support frame (3), an adsorption component, a scraping component, and a linear wax scraping component. The rotary cylinder (2) is connected to the upper front side of the base (1), and the heating platform (210) is connected to the output shaft of the rotary cylinder (2). The first support frame (3) is connected to the upper rear side of the base (1). The first support frame (3) is equipped with an adsorption component that can adsorb wafers. The adsorption component is equipped with a scraping component that can scrape wafers. The adsorption component is also equipped with a linear wax scraping component that can scrape wax.

2. The wafer unloading device capable of automatic unloading as described in claim 1, characterized in that: The base (1) has multiple handles on its upper side.

3. The wafer unloading device capable of automatic unloading as described in claim 1, characterized in that: The adsorption assembly includes an electric slide rail (4), a sliding block (5), a first motor (6), a transmission assembly (7), a rotating shaft (8), and a vacuum adsorption disk (9). The upper part of the first support frame (3) is connected to the electric slide rail (4), the slider of the electric slide rail (4) is connected to the sliding block (5), the lower right side of the sliding block (5) is connected to the first motor (6), the left side of the sliding block (5) is rotatably connected to the rotating shaft (8), the transmission assembly (7) is provided between the rotating shaft (8) and the output shaft of the first motor (6), and the lower side of the rotating shaft (8) is connected to the vacuum adsorption disk (9).

4. The wafer unloading device capable of automatic unloading as described in claim 3, characterized in that: The transmission assembly (7) includes a belt and a drive wheel. The shaft (8) and the output shaft of the first motor (6) are both connected to drive wheels, and a belt is wound around the drive wheels.

5. The wafer unloading device capable of automatic unloading as described in claim 1, characterized in that: The shovel assembly includes a second support frame (10), a first cylinder (11), a second cylinder (12), and a shovel blade (13). The lower part of the rotating shaft (8) is connected to the second support frame (10), the first cylinder (11) is connected to the second support frame (10), the second cylinder (12) is connected to the telescopic end of the first cylinder (11), and the shovel blade (13) is connected to the telescopic end of the second cylinder (12).

6. The wafer unloading device capable of automatic unloading as described in claim 1, characterized in that: The linear scraper assembly includes a third support frame (14), a second motor (15), a connector (16), a rotating frame (17), a fourth support frame (18), a third motor (19), a rotating rod (20), a winding wheel (21), a top pressure frame (22), a telescopic spring (23), and a scraper wire (24). The sliding block (5) is connected to the front of the third support frame (14), and the third support frame (14) is connected to the front of the second motor (15). The output shaft of the second motor (15) is connected to the connector (16), and the connector (16) is connected to the rotating frame (17). The rotating frame (17) rotates with the third support frame (14). The rotating frame (17) is connected to a fourth support frame (18). The upper sides of the left and right sides of the fourth support frame (18) are connected to a third motor (19). The output shaft of the third motor (19) is connected to a rotating rod (20). The lower sides of the left and right sides of the fourth support frame (18) are slidably connected to a top pressure frame (22). The top pressure frame (22) is engaged with the adjacent rotating rod (20) by a winding wheel (21). The top pressure frame (22) is connected to the fourth support frame (18) by a telescopic spring (23). The winding wheel (21) is wound with a scraper (24). The scraper (24) passes through the top pressure frame (22).

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