Special carrier for wafer

Abstract

The utility model discloses a special carrier for a wafer, which comprises a mounting substrate and a substrate carrier, the mounting substrate is provided with a sorption mechanism capable of generating suction force, the top surface of the sorption mechanism is implemented as a placement supporting surface, and the placement supporting surface is implemented as a concave surface which is matched with the wafer to be printed and is concave downwards. The substrate carrier is arranged on the mounting substrate and arranged around the peripheral surface of the sorption mechanism at intervals, and an adjusting assembly capable of horizontally moving relative to the substrate carrier is arranged on the side edge, corresponding to the sorption mechanism, of the substrate carrier; the adjusting assembly has a positioning state that the adjusting assembly moves towards the direction of the suction mechanism and abuts against the wafer on the placing supporting face and a releasing state that the adjusting assembly moves away from the direction of the suction mechanism and leaves the wafer on the installing supporting face. The adjusting assembly moves to adapt to the size error of the wafer, the adjusting assembly is pressed against the side face of the wafer to achieve transverse positioning of the wafer on the suction mechanism, it is guaranteed that the position of the wafer is fixed during printing, and then the stability of wafer printing and the product quality are guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of wafer carrier technology, and specifically to a wafer-specific carrier. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. It usually requires multiple processes to form a final product. During the processing, a carrier is used to hold the wafer.

[0003] Because wafers have dimensional tolerances, existing wafer carriers are unreliable in positioning them, leading to misalignment during wafer printing and a high defect rate. Therefore, it is necessary to improve existing wafer carriers, and this invention is the result. Utility Model Content

[0004] In view of at least one of the above-mentioned technical problems, the purpose of this utility model is to provide a wafer-specific carrier with a simple structure, stable and reliable wafer positioning, and improved wafer printing stability.

[0005] The technical solution of this utility model is:

[0006] The purpose of this utility model is to provide a wafer carrier, including a mounting substrate and a substrate carrier disposed on the mounting substrate. The mounting substrate is provided with a suction mechanism that generates suction to place the wafer to be printed. The top surface of the suction mechanism is implemented as a placement support surface, which is a downwardly recessed surface that matches the wafer to be printed. The substrate carrier is disposed on the mounting substrate and is arranged with a gap around the outer peripheral surface of the suction mechanism. An adjustment component that can move horizontally relative to the substrate carrier is provided on the side of the substrate carrier corresponding to the suction mechanism. The adjustment component has a positioning state in which it moves toward the suction mechanism and abuts against the wafer on the placement support surface, and a release state in which it moves away from the suction mechanism and moves away from the mounting support surface.

[0007] Preferably, the substrate carrier has a circular clearance through hole in the middle, and the inner peripheral surface of the clearance through hole is clearance-fitted with the outer peripheral surface of the suction mechanism. The top surface of the suction mechanism, the inner peripheral surface of the clearance through hole, and the inner end surface of the adjustment component together define a positioning space for placing the wafer to be printed.

[0008] Preferably, a downwardly recessed mounting groove with its opening facing the suction mechanism is provided on the substrate carrier corresponding to the mounting position of the adjustment component.

[0009] Preferably, the adjustment assembly includes a plate-shaped adjustment block and two adjustment connectors that are spaced apart from each other and connected to the adjustment block and the substrate carrier;

[0010] The adjusting block is slidably disposed in the mounting groove. The adjusting block has two opposing and parallel spaced adjusting holes that extend along the moving direction of the adjusting block. Any of the adjusting connectors passes through the corresponding adjusting hole and is connected to the bottom surface of the mounting groove. When in the positioning state, the adjusting connector is adapted to press against the top surface of the adjusting hole to lock the position of the adjusting block, and when switching from the positioning state to the release state or from the release state to the positioning state, it releases the top surface of the adjusting block to unlock the adjusting block.

[0011] Preferably, the suction mechanism is cylindrical and its outer peripheral surface includes a plane and an arc surface connected together, and the adjustment component is disposed on the outer side of the plane.

[0012] Preferably, the suction mechanism has a plurality of suction holes;

[0013] The mounting base plate includes an upper plate and a bottom plate assembled from the upper and lower parts. The upper plate and the bottom plate define a suction chamber that communicates with the suction hole. The side of the bottom plate is provided with an air pipe that is connected to the suction chamber and the negative pressure device.

[0014] Preferably, the upper plate has a downwardly recessed recess in the middle, and a boss is formed on each of the opposite sides of the recess. The suction mechanism is disposed in the recess, the upper surface of the substrate carrier is flush with the upper surface of the boss, and the inner sides of the two bosses constitute a limit on a set of opposite sides of the substrate carrier.

[0015] Compared with the prior art, the advantages of this utility model are:

[0016] This invention relates to a wafer carrier that features an adjustment component on the substrate carrier that can move toward or away from the central suction mechanism. The adjustment component moves to accommodate wafer size errors and presses against the side of the wafer to achieve lateral positioning of the wafer on the suction mechanism. Simultaneously, the suction force of the suction mechanism achieves longitudinal positioning of the wafer, thereby ensuring a fixed position during wafer printing and thus guaranteeing the stability of wafer printing and product quality. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0018] Figure 1 This is a three-dimensional structural diagram of a wafer carrier (containing a wafer to be printed) according to an embodiment of the present invention.

[0019] Figure 2 for Figure 1 The schematic diagram of the substrate carrier and the wafer structure is omitted in the wafer-specific carrier diagram.

[0020] Figure 3 This is a schematic diagram of the substrate carrier of the wafer-specific carrier according to an embodiment of the present invention;

[0021] Figure 4 for Figure 1 A top view of the wafer carrier in the diagram;

[0022] Figure 5 for Figure 3 Enlarged view of part A in the middle;

[0023] Figure 6 for Figure 1 A side view of the wafer carrier in the diagram;

[0024] Figure 7 for Figure 6 A magnified view of part B in the middle.

[0025] The components are as follows: 10. Mounting substrate; 11. Top plate; 111. Boss; 112. Recess; 12. Bottom plate; 121. Air pipe; 20. Substrate carrier; 21. Clearance through hole; 22. Mounting groove; 23. Connecting hole; 30. Suction mechanism; 31. Placement support surface; 32. Second arc surface; 33. Second plane; 34. Suction hole; 40. Adjustment assembly; 41. Adjustment block; 411. Adjustment hole; 42. Adjustment connector; 50. Positioning assembly; 51. Positioning plate; 511. Positioning hole; 512. Slide groove; 52. Sliding drive component; 521. Drive cylinder; 522. Slide rail; 523. Cylinder seat; 524. Limiting post; 53. Positioning block; 54. Fixing component; 60. Wafer. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0027] See Figures 1 to 7The wafer carrier of this utility model mainly includes a mounting substrate 10, a substrate carrier 20, and an adjustment assembly 40. The mounting substrate 10 is provided with a suction mechanism 30 capable of generating suction force, which is used to place the wafer 60 to be printed. The top surface of the suction mechanism 30 is configured as a support surface 31, and is a downwardly recessed surface that matches the wafer 60 to be printed, i.e., the middle is slightly lower than the edge. The substrate carrier 20 is mounted on the mounting substrate 10 and is arranged with gaps around the outer peripheral surface of the suction mechanism 30. The adjustment component 40 is used to position the wafer 60 to be printed on the suction mechanism 30. The adjustment component 40 is disposed on the substrate carrier 20 and located on the outer side of the suction mechanism 30. The adjustment component 40 can move horizontally relative to the substrate carrier 20. The adjustment component 40 has a positioning state in which the wafer 60 moves toward the suction mechanism 30 and abuts against the mounting support surface 31, and a release state in which the wafer 60 moves away from the suction mechanism 30 and leaves the mounting support surface. The wafer 60 special carrier of this utility model embodiment, by providing an adjustment component 40 on the substrate carrier 20 that can move toward or away from the central suction mechanism 30, adapts to the dimensional error of the wafer 60 by moving the adjustment component 40 and presses against the side of the wafer 60 to achieve lateral positioning of the wafer 60 on the suction mechanism 30. At the same time, the suction force of the suction mechanism 30 achieves longitudinal positioning of the wafer 60, thereby ensuring that the position of the wafer 60 is fixed during printing, thus ensuring the stability of wafer 60 printing and product quality.

[0028] like Figure 3 As shown, a circular clearance through hole 21 is opened in the middle of the substrate carrier 20. The inner peripheral surface of the clearance through hole 21 is fitted with the outer peripheral surface of the suction mechanism 30. The top surface of the suction mechanism 30, the inner peripheral surface of the clearance through hole 21 and the inner end surface of the adjustment component 40 together define the positioning space for placing the wafer 60 to be printed. Specifically, the outer peripheral surface of the wafer 60 to be printed in this invention is composed of a flat surface (to distinguish it from the flat surface of the suction mechanism 30 described below, the flat surface of the outer peripheral surface of the wafer 60 is described as the first flat surface, and the flat surface of the suction mechanism 30 is described as the second flat surface 33) and an arc surface (same as above, to distinguish it from the arc surface of the suction mechanism 30 described below, the arc surface of the outer peripheral surface of the wafer 60 is described as the first arc surface, and the arc surface of the outer peripheral surface of the suction mechanism 30 is described as the second arc surface 32) connected together. When the wafer 60 to be printed is placed on the suction mechanism 30, the first flat surface faces the adjustment component 40, the adjustment component 40 presses against the first flat surface, and the first arc surface of the wafer 60 abuts against the outer peripheral surface of the clearance through hole 21. It should be noted that the highest point of the top surface of the suction mechanism 30 is slightly lower than the upper surface of the substrate carrier 20, thereby achieving the positioning of the wafer 60. For the suction mechanism 30, to facilitate installation and alignment, the outer peripheral surface of the suction mechanism 30 matches the outer peripheral surface of the wafer 60, such as... Figure 2 As shown, it also includes a connected plane, namely the second plane 33, and an arc surface, namely the second arc surface 32. The adjustment component 40 is positioned on the outer side of the corresponding plane, namely the second plane 33. That is, during installation, the second plane 33 of the suction mechanism 30 corresponds to the position of the mounting groove 22 of the adjustment component 40 or the substrate carrier 20.

[0029] like Figure 3 As shown, a downwardly recessed and open end is provided on the substrate carrier 20 at the mounting position corresponding to the adjustment component 40 (the opening here does not refer to the opening opposite to the bottom surface of the mounting groove 22, i.e., as shown). Figure 3 The upper opening shown refers to the opening facing the center of the avoidance through hole 21. Figure 3 The rearward-facing opening (as shown) faces the mounting groove 22 of the suction mechanism 30. The mounting groove 22 is a square mounting groove 22, and after the adjustment component 40 is installed, its upper surface is flush with the top opening surface of the mounting groove 22.

[0030] like Figure 4 and Figure 5 As shown, the adjustment assembly 40 includes a plate-shaped adjustment block 41 and two relatively spaced adjustment connectors 42 connected to the adjustment block 41 and the substrate carrier 20. The adjustment block 41 is also square, matching the shape of the mounting groove 22, and is slidably disposed within the mounting groove 22. The adjustment block 41 has two relatively parallel, spaced-apart, waist-shaped adjustment holes 411 extending parallel to the moving direction of the adjustment block 41, i.e., extending radially approximately along the avoidance through hole 21. Each adjustment connector 42 passes through the corresponding adjustment hole 411 and connects to the bottom surface of the mounting groove 22 (a corresponding connection hole 23 is provided on the bottom surface of the mounting groove 22). In the positioning state, the adjustment connector 42 is adapted to press against the top surface of the adjustment hole 411 to lock the position of the adjustment block 41, and to release the top surface of the adjustment block 41 to unlock the adjustment block 41 when switching from the positioning state to the release state or from the release state to the positioning state. An example of the adjustment connector 42 is a conventional T-shaped screw.

[0031] like Figure 2 As shown, the suction mechanism 30 has a plurality of suction holes 34. The specific number is not limited, as long as it can generate suction to hold the wafer 60 placed on the support surface 31. The arrangement of the suction holes 34 is also not limited. For example, the suction holes 34 of the suction mechanism 30 in the figure are distributed in a radiating pattern. Figure 1 As shown, the mounting base plate 10 includes an upper plate 11 and a bottom plate 12 assembled from the upper and lower parts. The upper plate 11 and the bottom plate 12 define a suction chamber (not shown) that communicates with the suction hole 34. The side of the bottom plate 12 is provided with an air pipe 121 that is connected to the suction chamber and a negative pressure device (not shown, such as an air pump).

[0032] like Figure 2 As shown, the upper plate 11 is roughly U-shaped. Specifically, the upper plate 11 has a downwardly recessed portion 112 in the middle, and a boss 111 is formed on each of the opposite sides of the recess 112. The suction mechanism 30 is disposed in the recess 112. The upper surface of the substrate carrier 20 is flush with the upper surface of the boss 111, and the inner surfaces of the two bosses 111 constitute a limit on a set of opposite sides of the substrate carrier 20.

[0033] Optionally, in order to limit the other set of opposite sides of the substrate carrier 20, such as Figure 1 , Figure 2 and Figure 4 As shown, a movably positioned component 50 is provided on each of the other sets of opposite sides of the substrate carrier 20. For any one of the positioned components 50, as... Figure 2 , Figures 4 to 7 As shown, any positioning component 50 includes a positioning plate 51 (the length of the positioning plate 51 is longer than the corresponding side of the substrate carrier 20, that is, the two positioning plates 51 and the two protrusions 111 surround the substrate carrier 20 to form a U-shape). A positioning hole 511 is formed through the positioning plate 51, and a positioning block 53 is provided in the positioning hole 511. The positioning block 53 is connected to the sliding drive component 52 by a fixing component 54, such as a screw. Specifically, the positioning block 53 is connected to the sliding drive component 52, which is located on the bottom surface of the positioning plate 51 and can move towards or away from the substrate carrier 20. The positioning block 53 can abut against the side of the substrate carrier 20 to position the substrate carrier 20. For the sliding drive component 52, as shown... Figure 7 As shown, the sliding drive member 52 includes a slide rail 522 fixed in an upwardly recessed groove 512 on the bottom surface of the positioning plate 51 and extending along the moving direction of the sliding drive member 52, and a drive cylinder 521 slidably engaged with the slide rail 522. The bottom surface of the drive cylinder 521 is provided with a cylinder seat 523, and the side of the cylinder seat 523 facing the substrate carrier 20 is provided with a limiting post 524 that protrudes outward and can abut against the side of the mounting substrate 10. The limiting post 524 restricts the movement stroke of the positioning block 53, which can play a buffering and protective role, and prevent the positioning block 53 from being damaged by impact due to excessive movement stroke.

[0034] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within its protection scope. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A wafer-specific carrier, characterized in that, The device includes a mounting substrate and a substrate carrier disposed on the mounting substrate. The mounting substrate has a suction mechanism that generates suction to place a wafer to be printed. The top surface of the suction mechanism is configured as a placement support surface, which is a downwardly recessed surface that matches the wafer to be printed. The substrate carrier is disposed on the mounting substrate and is arranged with a gap around the outer peripheral surface of the suction mechanism. An adjustment component is provided on the substrate carrier corresponding to the side of the suction mechanism, which can move horizontally relative to the substrate carrier. The adjustment component has a positioning state in which it moves toward the suction mechanism and abuts against the wafer on the placement support surface, and a release state in which it moves away from the suction mechanism and moves away from the mounting support surface.

2. The wafer carrier according to claim 1, characterized in that, The substrate carrier has a circular clearance through hole in the middle. The inner peripheral surface of the clearance through hole is clearance-fitted with the outer peripheral surface of the suction mechanism. The top surface of the suction mechanism, the inner peripheral surface of the clearance through hole, and the inner end surface of the adjustment component together define a positioning space for placing the wafer to be printed.

3. The wafer carrier according to claim 2, characterized in that, A downwardly recessed mounting groove with its opening facing the suction mechanism is provided on the substrate carrier corresponding to the mounting position of the adjustment component.

4. The wafer carrier according to claim 3, characterized in that, The adjustment assembly includes a plate-shaped adjustment block and two relatively spaced adjustment connectors that are connected to the adjustment block and the substrate carrier; The adjusting block is slidably disposed in the mounting groove. The adjusting block has two opposing and parallel spaced adjusting holes that extend along the moving direction of the adjusting block. Any of the adjusting connectors passes through the corresponding adjusting hole and is connected to the bottom surface of the mounting groove. When in the positioning state, the adjusting connector is adapted to press against the top surface of the adjusting hole to lock the position of the adjusting block, and when switching from the positioning state to the release state or from the release state to the positioning state, it releases the top surface of the adjusting block to unlock the adjusting block.

5. The wafer carrier according to any one of claims 1-4, characterized in that, The suction mechanism is cylindrical and its outer peripheral surface includes a plane and an arc surface connected together. The adjustment component is disposed on the outer side of the plane.

6. The wafer carrier according to claim 1, characterized in that, The suction mechanism has several suction holes; The mounting base plate includes an upper plate and a bottom plate assembled from the upper and lower parts. The upper plate and the bottom plate define a suction chamber that communicates with the suction hole. The side of the bottom plate is provided with an air pipe that is connected to the suction chamber and the negative pressure device.

7. The wafer carrier according to claim 6, characterized in that, The upper plate has a downward recessed part in the middle, and a boss is formed on each of the opposite sides of the recess. The suction mechanism is disposed in the recess. The upper surface of the substrate carrier is flush with the upper surface of the boss. The inner sides of the two bosses constitute a limit on a set of opposite sides of the substrate carrier.

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