Wafer adsorption device for gluing developing machine

Abstract

The utility model discloses a wafer adsorption device for a gluing developer, which relates to the field of developer equipment and comprises a rotating base, a circular hanging plate arranged on one side of the top of the rotating base, an annular mounting plate hung below the circular hanging plate, and a plurality of adsorption parts arranged below the annular mounting plate in an annular matrix manner, the third-level hinge plates are arranged on the outer side of the annular mounting plate, the overturning components are arranged on the outer sides of the third-level hinge plates, and the correcting components are arranged on the inner sides of the third-level hinge plates; the wafer adsorption device for the gluing developing machine is non-contact, can prevent the wafer from falling off during adsorption, and can keep the position of the wafer not deviating in the adsorption process.

Description

Technical Field

[0001] This utility model mainly relates to the technical field of developing equipment, specifically a wafer adsorption device for a coating developing machine. Background Technology

[0002] The main function of a wafer adsorption device is to firmly fix the wafer onto the operating platform of the coating and developing machine using adsorption force. This fixing method ensures the stability and accuracy of the wafer during the coating and developing process, avoiding problems such as pattern misalignment and uneven coating caused by wafer movement or shaking. The wafer adsorption device helps to achieve high-precision and high-efficiency coating and developing operations, which can not only improve the production quality of semiconductor chips, but also shorten the production cycle. Existing wafer adsorption devices usually use suction cups as adsorption elements, which can easily cause wafer surface contamination. When the wafer is not firmly adsorbed, it can also easily cause the wafer to fall or shift its position.

[0003] According to application number CN202322066037.1, a wafer chuck for a coating and developing machine is provided, aiming to provide a wafer chuck for a coating and developing machine that effectively reduces workpiece falling. The key technical points of the solution are: a hollow base with pushing devices on both sides of the base, a supporting device at the outlet of the pushing device, the supporting device including a connecting block at the outlet of the pushing device, a telescopic block on the connecting block, and a pop-out device at the bottom of the telescopic block, the pop-out device including electromagnetic relays on both sides of the bottom of the telescopic block, a spring in the center of the telescopic block, and a supporting plate at the top of the spring, and adsorption plates matching the electromagnetic relays on both sides of the supporting plate.

[0004] The aforementioned document proposes using a support device placed below the wafer chuck to catch falling wafers and prevent them from dropping. However, this presents a problem of wafer contamination due to direct contact between the chuck and the support plate. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide a wafer adsorption device for a coating and developing machine to solve the technical problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A wafer adsorption device for a coating and developing machine includes a rotating base, a circular hanging plate disposed on one side of the top of the rotating base, an annular mounting plate suspended below the circular hanging plate, a plurality of adsorption components arranged in an annular matrix below the annular mounting plate, several three-stage hinge plates disposed on the outer side of the annular mounting plate, a flipping component disposed on the outer side of the three-stage hinge plates, and a correction component disposed on the inner side of the three-stage hinge plates.

[0008] Preferably, the three-stage hinge plate includes a first connecting plate disposed on the outside of the annular mounting plate, a second connecting plate hinged to the other side of the first connecting plate, and a third connecting plate hinged to the other side of the second connecting plate.

[0009] Preferably, the adsorption component includes a plurality of first Bernoulli suction cups arranged in a ring matrix below the ring mounting plate, and second Bernoulli suction cups respectively disposed on each of the third connecting plates away from the flipping component.

[0010] Preferably, the flipping component includes a first hinge shaft disposed on the top of the annular mounting plate, a second hinge shaft disposed on the outside of the second connecting plate, a third hinge shaft disposed on the outside of the third connecting plate, a second telescopic rod whose two ends are respectively connected to the first hinge shaft and the second hinge shaft, and a third telescopic rod whose two ends are respectively connected to the second hinge shaft and the third hinge shaft.

[0011] Preferably, the correction component includes an arc-shaped frame disposed in the middle of the second connecting plate, a plurality of jet cores disposed inside the arc-shaped frame, and a distance sensor disposed above the arc-shaped frame.

[0012] Preferably, the circular suspended platform includes multiple first telescopic rods passing through its edge and a positioning device located at the bottom of the circular suspended platform.

[0013] In summary, this technical solution has the following main advantages:

[0014] In this embodiment, by setting appropriate positions and numbers of Bernoulli chucks at both the top and bottom, the wafers used in the coating and developing machine are picked up and transported non-contactly using the Bernoulli principle. This avoids the problem of the wafer surface being contaminated due to direct contact between the chucks and the wafers. By setting the lower Bernoulli chuck to hold the wafer in place, the problem of the wafer falling due to unstable non-contact adsorption can be prevented.

[0015] The flip-grip design allows each of the three-stage hinge plates to be unfolded in parallel before the wafer is picked up, preventing them from interfering with the first Bernoulli suction cup under the annular mounting plate's ability to grip and pick up the stacked wafers. When the wafer is picked up and lifted, the flip-over mechanism positions other stabilizing components. An additional jet core located on the side of the wafer, capable of measuring distance, allows the wafer's position under the annular mounting plate to be adjusted without contacting the wafer, preventing wafer displacement during transport and ensuring proper placement. Attached Figure Description

[0016] Figure 1 This is a bottom-view axonometric drawing of the overall structure of this utility model;

[0017] Figure 2 This is a front view of the overall structure of this utility model;

[0018] Figure 3 This is an exploded view of the main structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the main structure of this utility model.

[0020] Figure 5 The top view shows the main structure of this utility model.

[0021] Figure Descriptions: 10. Rotating base; 11. Circular hanging plate; 12. Annular mounting plate; 13. Adsorption component; 14. Three-stage hinge plate; 15. Flipping component; 16. Correction component; 111. First telescopic rod; 112. Positioning device; 131. First Bernoulli suction cup; 132. Second Bernoulli suction cup; 141. First connecting plate; 142. Second connecting plate; 143. Third connecting plate; 151. First hinge shaft; 152. Second hinge shaft; 153. Third hinge shaft; 154. Second telescopic rod; 155. Third telescopic rod; 161. Arc frame; 162. Air jet core; 163. Distance sensor. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0023] Example

[0024] Please refer to the attached document carefully. Figure 1 , 2 As shown, a wafer adsorption device for a coating and developing machine includes a rotating base 10, a circular hanging plate 11 disposed on one side of the top of the rotating base 10, an annular mounting plate 12 suspended below the circular hanging plate 11, a plurality of adsorption components 13 arranged in an annular matrix below the annular mounting plate 12, a plurality of three-stage hinge plates 14 disposed on the outer side of the annular mounting plate 12, a flipping component 15 disposed on the outer side of the three-stage hinge plates 14, and a straightening component 16 disposed on the inner side of the three-stage hinge plates 14; the circular hanging plate 11 includes a plurality of first telescopic rods 111 passing through its edge, and a positioning device 112 disposed at the bottom of the circular hanging plate 11; the adsorption components 13 include a plurality of first Bernoulli suction cups 131 arranged in an annular matrix below the annular mounting plate 12, and second Bernoulli suction cups 132 respectively disposed on each third connecting plate 143 away from the flipping component 15.

[0025] It should be noted that the rotating base 10 is an auxiliary mechanical structure adapted to the transfer of wafers in the coating and developing machine. It can perform corresponding transfer mechanical movements such as rotation, displacement, and extension. The annular mounting plate 12 and the three-stage hinge plate 14 have various air supply lines that connect the first Bernoulli chuck 131, the second Bernoulli chuck 132 and the air jet core 162. The positioning device 112 is responsible for observing the position of the wafer and then sending electrical signals to drive the operation of each component.

[0026] Furthermore, when it is necessary to adsorb the wafer, the rotating base 10 drives the circular hanging plate 11 to approach the wafer stack, and the positioning device 112 continuously observes the relative position of the wafer. When the positioning device 112 is at the center of the wafer, it sends an electrical signal to start other components.

[0027] Furthermore, after receiving the signal, the multiple first telescopic rods 111 on the circular hanging plate 11 are all extended, driving the annular mounting plate 12 to move downward, so that the multiple first Bernoulli chucks 131 approach the wafer.

[0028] Furthermore, multiple first Bernoulli suction cups 131 blow air towards the center of the wafer and the annular mounting plate 12 under continuous external air supply, increasing the airflow velocity on the upper surface of the wafer, and adsorbing the wafer non-contactly through the Bernoulli principle.

[0029] Please refer to the attached document carefully. Figure 2 , 3 As shown in Figures 4 and 5, the three-stage hinge plate 14 includes a first connecting plate 141 located on the outside of the annular mounting plate 12, a second connecting plate 142 hinged to the other side of the first connecting plate 141, and a third connecting plate 143 hinged to the other side of the second connecting plate 142; the flipping component 15 includes a first hinge shaft 151 located at the top of the annular mounting plate 12, a second hinge shaft 152 located on the outside of the second connecting plate 142, a third hinge shaft 153 located on the outside of the third connecting plate 143, a second telescopic rod 154 whose two ends are respectively connected to the first hinge shaft 151 and the second hinge shaft 152, and a third telescopic rod 155 whose two ends are respectively connected to the second hinge shaft 152 and the third hinge shaft 153; the straightening component 16 includes an arc-shaped frame 161 located in the middle of the second connecting plate 142, a plurality of jet cores 162 located inside the arc-shaped frame 161, and a distance sensor 163 located above the arc-shaped frame 161.

[0030] It should be noted that before adsorbing the wafer, the flipping component 15 controls the three-stage hinge plate 14 to be in the unfolded state to prevent affecting the adsorption process. The second hinge axis 152 and the third hinge axis 153 are at right angles. The arrangement of the three-stage hinge plate 14 should follow the principle that when fully retracted, the second connecting plate 142 and the annular mounting plate 12 are perpendicular, and the third connecting plate 143 and the annular mounting plate 12 are parallel. The arc center of the arc frame 161 is the same as the wafer center, and the arc radius is slightly larger than the wafer radius.

[0031] Furthermore, when multiple first Bernoulli suction cups 131 adhere to the suction cups, all first telescopic rods 111 slowly retract, lifting the wafer to a certain height;

[0032] Furthermore, the second telescopic rod 154 extends out and drives the second connecting plate 142 to rotate 90° relative to the first connecting plate 141 through the first hinge shaft 151 and the second hinge shaft 152, so that the second connecting plate 142 is perpendicular to the annular mounting plate 12.

[0033] Furthermore, the third telescopic rod 155 extends out and drives the third connecting plate 143 to rotate 90° relative to the second connecting plate 142 through the second hinge shaft 152 and the third hinge shaft 153, so that the third connecting plate 143 is in a parallel state with the annular mounting plate 12.

[0034] Furthermore, the distance sensors 163 on each of the second connecting plates 142 monitor the relative distance of the wafers. When the monitoring result is different from the predetermined parameters, an electrical signal is sent to control the multiple jet cores 162 inside the arc frame 161 to change the jet intensity, thereby adjusting the relative position of the wafers without contact.

[0035] Furthermore, the second Bernoulli chuck 132 above the third connecting plate 143 is activated and operates in the same manner as the first Bernoulli chuck 131, so that the wafer is confined in the central area by various airflows without contact and will not fall off.

[0036] The working principle of this utility model is as follows:

[0037] First, when wafers need to be picked up, the rotating base 10 moves the circular lifting plate 11 closer to the wafer stack. The positioning device 112 continuously observes the relative position of the wafers. When the positioning device 112 is at the exact center of the wafer, it sends an electrical signal to activate other components. After receiving the signal, the multiple first telescopic rods 111 on the circular lifting plate 11 extend, causing the annular mounting plate 12 to move downward, bringing multiple first Bernoulli suction cups 131 closer to the wafer. With continuous external air supply, the multiple first Bernoulli suction cups 131 blow air towards the center between the wafer and the annular mounting plate 12, increasing the airflow velocity on the upper surface of the wafer. Through the Bernoulli principle, the wafer is picked up without contact. When the multiple first Bernoulli suction cups 131 pick up the suction cups, all the first telescopic rods 111 slowly retract, lifting the wafer to a certain height. The second telescopic rod 154 extends, driving the second connecting plate 142 through the first hinge shaft 151 and the second hinge shaft 152. The second connecting plate 142 rotates 90° relative to the first connecting plate 141, making it perpendicular to the annular mounting plate 12. The third telescopic rod 155 extends and, through the second hinge shaft 152 and the third hinge shaft 153, drives the third connecting plate 143 to rotate 90° relative to the second connecting plate 142, making the third connecting plate 143 parallel to the annular mounting plate 12. The distance sensors 163 on each of the second connecting plates 142 monitor the relative distance of the wafers. When the monitoring result is different from the predetermined parameters, an electrical signal is sent to control the multiple jet cores 162 inside the arc frame 161 to change the jet intensity, thereby adjusting the relative position of the wafers without contact. The second Bernoulli suction cup 132 above the third connecting plate 143 is activated and operates in the same way as the first Bernoulli suction cup 131, so that the wafers are restricted in the central area without contact by various airflows and will not fall off. When it is necessary to release the wafers, the operation is reversed as described above.

[0038] The above embodiments are only for illustrating the technical concept of this utility model and should not be construed as limiting the scope of protection of this utility model. Any modifications made to the technical solution based on the technical concept proposed by this utility model shall fall within the scope of protection of this utility model.

Claims

1. A wafer adsorption device for a coating and developing machine, comprising a rotating base (10) and a circular hanging plate (11) disposed on one side of the top of the rotating base (10), characterized in that... An annular mounting plate (12) suspended below the circular mounting plate (11), multiple adsorption components (13) arranged in an annular matrix below the annular mounting plate (12), several three-level hinge plates (14) arranged on the outside of the annular mounting plate (12), a flipping component (15) arranged on the outside of the three-level hinge plates (14), and a correction component (16) arranged on the inside of the three-level hinge plates (14).

2. The wafer adsorption device for a coating and developing machine according to claim 1, characterized in that, The three-stage hinge plate (14) includes a first connecting plate (141) disposed on the outside of the annular mounting plate (12), a second connecting plate (142) hinged to the other side of the first connecting plate (141), and a third connecting plate (143) hinged to the other side of the second connecting plate (142).

3. The wafer adsorption device for a coating and developing machine according to claim 2, characterized in that, The adsorption component (13) includes a plurality of first Bernoulli suction cups (131) arranged in a ring matrix below the ring mounting plate (12), and second Bernoulli suction cups (132) respectively arranged on each of the third connecting plates (143) away from the flipping component (15).

4. The wafer adsorption device for a coating and developing machine according to claim 2, characterized in that, The flipping component (15) includes a first hinge shaft (151) located on the top of the annular mounting plate (12), a second hinge shaft (152) located on the outside of the second connecting plate (142), a third hinge shaft (153) located on the outside of the third connecting plate (143), a second telescopic rod (154) whose two ends are respectively connected to the first hinge shaft (151) and the second hinge shaft (152), and a third telescopic rod (155) whose two ends are respectively connected to the second hinge shaft (152) and the third hinge shaft (153).

5. A wafer adsorption device for a coating and developing machine according to claim 2, characterized in that, The correction component (16) includes an arc-shaped frame (161) located in the middle of the second connecting plate (142), a plurality of jet cores (162) located inside the arc-shaped frame (161), and a distance sensor (163) located above the arc-shaped frame (161).

6. The wafer adsorption device for a coating and developing machine according to claim 1, characterized in that, The circular hanging plate (11) includes multiple first telescopic rods (111) passing through its edge, and a positioning device (112) located at the bottom of the circular hanging plate (11).

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