Heating furnace placing tool for diode chip production

Abstract

The utility model belongs to the field of equipment for diode chip production, and provides a heating furnace placing tool for diode chip production, which comprises a placing frame, the placing frame comprises a vertical shaft, an upper supporting seat, a lower supporting seat, a spacer sleeve and a supporting plate, the supporting plate is of a circular structure and is provided with at least four supporting openings which are distributed in a circular array, and the vertical shaft is provided with a vertical shaft. A hoop piece is arranged in the supporting opening, a notch used for being connected with the edge of a wafer in a clamped mode is formed in the inner wall of the hoop piece, and the hoop piece comprises a left hoop, a right hoop, an upper arc protrusion and a lower arc protrusion. According to the placing rack provided by the utility model, the space utilization rate of the tool can be improved, and a plurality of wafers can be arranged on each supporting plate through the hoop pieces, so that the distribution density of the wafers in a heating furnace can be effectively improved, and the utilization rate of the heating furnace is improved; the hoop piece not only can improve the placing stability of the wafer, but also is favorable for protecting the safety of the wafer in the taking and placing process, and is reasonable in design, simple in structure and suitable for large-scale popularization.

Description

Technical Field

[0001] This utility model belongs to the field of equipment for diode chip production, and in particular relates to a fixture for placing a heating furnace for diode chip production. Background Technology

[0002] Zener diodes are categorized based on their breakdown voltage. Due to this characteristic, Zener diodes are primarily used as voltage regulators or voltage reference components. A key feature of Zener diodes is that the current across them remains essentially constant until they break down under reverse current. Traditional diode chip manufacturing processes include the following steps: silicon wafer cleaning, phosphorus removal, phosphorus diffusion, wafer slicing, single-sided sandblasting, pre-boron coating cleaning, boron coating, boron diffusion, double-sided sandblasting, photoresist coating, and photoresist curing.

[0003] In chip manufacturing workshops, wafers need to undergo multiple photoresist coating and curing processes. The heating furnace used for curing photoresist is equipped with wafer racks, but the racks have a low placement density, and the wafers are thin, so a lot of space and heat energy are wasted. Furthermore, if wafers are placed directly on the racks, on the one hand, wafers may shift or overlap when the racks are pulled out; on the other hand, there is a risk of bumping into adjacent wafers when handling wafers, and even wafers may slip out of hand and fall to the ground. Utility Model Content

[0004] This invention addresses the technical problems existing in the wafer arrangement and placement of the aforementioned heating furnaces by proposing a heating furnace placement fixture for diode chip production that is rationally designed, simple in structure, and conducive to improving the utilization rate of the heating furnace and ensuring wafer stability.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: The heating furnace placement fixture for diode chip production provided by this utility model includes a placement frame, the placement frame including a vertical shaft, an upper support seat and a lower support seat respectively provided at the top and bottom of the vertical shaft, a plurality of spacer sleeves provided on the axial surface of the vertical shaft, a support plate provided between the spacer sleeves, a shaft hole for cooperating with the vertical shaft provided at the center of the support plate, the support plate having a circular structure and at least four support openings arranged in a circular array, a clamping member provided in the support opening, the inner wall of the clamping member having an annular groove, the groove being used to engage with the edge of the wafer, the clamping member including a left clamp and a right clamp hinged to each other, the top of the left clamp and the right clamp each having a plurality of upper arc protrusions, the bottom of the left clamp and the right clamp each having a plurality of lower arc protrusions, the inner diameter of the lower arc protrusions being smaller than the inner diameter of the upper arc protrusions, the outer side of the lower arc protrusions engaging with the support openings.

[0006] Preferably, the mating ends of the left and right hoops are provided with clamping handles, and the clamping handles are provided with a pair of clamping holes. The clamping handles face the distal end of the support plate, and the edge of the support plate is provided with a positioning port that communicates with the support opening. The positioning port is engaged with the clamping handle.

[0007] Preferably, both the upper support and the lower support include a shaft tube, which is threaded to a vertical shaft and has a support plate at one end. The support plate is provided with reinforcing ribs that are connected to the shaft tube.

[0008] Preferably, the shaft tube has a spherical support roller at one end away from the vertical shaft, and the shaft tube has a roller groove inside that mates with the support roller.

[0009] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0010] 1. The diode chip production heating furnace placement fixture provided by this utility model improves the space utilization of the fixture by adopting a placement rack composed of a vertical shaft, an upper support base, a lower support base, a spacer sleeve, and multiple trays. Furthermore, each tray can accommodate multiple wafers through clamping components, which can effectively increase the distribution density of wafers in the heating furnace and improve the utilization rate of the heating furnace. The clamping components can not only improve the placement stability of wafers but also help protect the safety of wafers during the handling process. Moreover, the design is reasonable and the structure is simple, making it suitable for large-scale promotion. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 An isometric view of a fixture for placing a heating furnace in diode chip manufacturing, provided as an example.

[0013] Figure 2 A cross-sectional view of the fixture for placing a heating furnace in diode chip manufacturing provided in an embodiment;

[0014] Figure 3 An isometric view of the clamp provided in the embodiment;

[0015] Figure 4 The front view of the clamp provided in the embodiment is shown in the open position.

[0016] In the above figures, 1. Placement rack; 11. Vertical shaft; 12. Upper support base; 13. Lower support base; 14. Spacer sleeve; 15. Pallet; 151. Support opening; 152. Positioning opening; 16. Shaft tube; 17. Support plate; 18. Reinforcing rib; 2. Clamping part; 21. Groove; 22. Left clamp; 23. Right clamp; 24. Upper arc protrusion; 25. Lower arc protrusion; 26. Clamping handle; 27. Clamping hole; 3. Support roller; 4. Wafer. Detailed Implementation

[0017] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other. For ease of description, the terms "upper," "lower," "left," and "right" appearing below only indicate that they correspond to the upper, lower, left, and right directions in the accompanying drawings and do not limit the structure.

[0018] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0019] Examples, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the diode chip production heating furnace placement fixture provided by this utility model includes a placement rack 1. The placement rack 1 includes a vertical shaft 11. An upper support 12 and a lower support 13 are respectively provided at the top and bottom of the vertical shaft 11. A plurality of spacer sleeves 14 are provided on the axial surface of the vertical shaft 11. A support plate 15 is provided between the spacer sleeves 14. The center of the support plate 15 is provided with a shaft hole that mates with the vertical shaft 11. The support plate 15 has a circular structure and is provided with at least four support plates arranged in a circular array. The support opening 151 is provided with a clamping member 2. The inner wall of the clamping member 2 is provided with an annular groove 21, which is used to engage with the edge of the wafer 4. The clamping member 2 includes a left clamp 22 and a right clamp 23 that are hinged to each other. The top of the left clamp 22 and the right clamp 23 are provided with multiple upper arc protrusions 24, and the bottom of the left clamp 22 and the right clamp 23 are provided with multiple lower arc protrusions 25. The inner diameter of the lower arc protrusions 25 is smaller than the inner diameter of the upper arc protrusions 24, and the outer side of the lower arc protrusions 25 engages with the support opening 151.

[0020] Specifically, the vertical shaft 11, upper support 12, and lower support 13 of the placement rack 1 constitute the actual height of the placement rack 1. The top surface of the upper support 12 contacts the inner top surface of the heating furnace, and the bottom surface of the lower support 13 contacts the inner bottom surface of the heating furnace. The spacer sleeve 14 is used to control the axial spacing of adjacent trays 15, and the trays 15 provide multiple placement positions for the wafers 4. The trays 15 on adjacent placement racks 1 in the heating furnace can be distributed in an axially staggered manner. Thus, the multiple devices distributed in the heating furnace can make full use of the space and heating environment of the heating furnace. In addition, each tray 15 provided by this utility model can arrange multiple wafers 4 through the clamp 2, which can effectively improve the distribution density of the wafers 4 in the heating furnace and improve the utilization rate of the heating furnace.

[0021] Furthermore, the clamping member 2 holds the wafer 4 by clamping it from both sides. The diameter formed by the lower arc protrusion 25 allows it to fit precisely into the support opening 151. This not only improves the placement stability of the wafer 4 but also serves as a protective structure for the edge of the wafer 4, ensuring its safety during handling. The diameter formed by the upper arc protrusion 24 on each clamping member 2 facilitates stacking the clamping members 2 during storage. If the lower arc protrusion 25 is clamped inside the upper arc protrusion 24, it improves the practicality of the clamping member 2.

[0022] To facilitate the removal and placement of the clamping member 2 from the tray 15, the tray 15 is designed with a shaft hole to allow it to rotate, so that the tray opening 151 for removing and placing the clamping member 2 faces the furnace door. Furthermore, clamping handles 26 are provided at the mating ends of the left clamp 22 and right clamp 23, each with a pair of clamping holes 27. The clamping handles 26 face the distal end of the tray 15, and the edge of the tray 15 has a positioning opening 152 communicating with the tray opening 151, which engages with the clamping handles 26. This design, by engaging the clamping handles 26 of the clamping member 2 in the positioning opening 152, improves the stability of the clamping member 2 and the wafer 4 during the curing process. A pin-operated tool, clamped in the clamping hole 27, allows the clamping member 2 to be removed from the tray opening 151.

[0023] To improve the compatibility of this tooling with the heating furnace, both the upper support 12 and the lower support 13 provided by this invention include a shaft tube 16. The shaft tube 16 is threadedly connected to the vertical shaft 11, and a support plate 17 is provided at one end of the shaft tube 16. The support plate 17 is provided with reinforcing ribs 18 that are connected to the shaft tube 16. By adjusting the engagement depth between the shaft tube 16 and the vertical shaft 11, different combined heights of the placement frame 1 can be obtained, allowing the support plate 17 of the upper support 12 and the support plate 17 of the lower support 13 to make better contact with the upper and lower surfaces of the heating furnace.

[0024] To facilitate the movement of this tooling within the heating furnace, the shaft tube 16 provided by this invention has a spherical support roller 3 at the end away from the vertical shaft 11. The shaft tube 16 also has a roller groove inside that mates with the support roller 3. The support roller 3 provides a rolling support node for the support disc 17, reducing the resistance to manually adjusting the actual position of this tooling within the heating furnace. This facilitates the overall coordination of the distribution of all components within the heating furnace, thereby ensuring the utilization rate of the heating furnace.

[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A fixture for placing a heating furnace in diode chip manufacturing, comprising a placement rack, characterized in that, The placement rack includes a vertical shaft, with an upper support and a lower support at its top and bottom, respectively. Multiple spacer sleeves are provided on the shaft surface of the vertical shaft, and a support plate is positioned between the spacer sleeves. The center of the support plate has a shaft hole that mates with the vertical shaft. The support plate has a circular structure and at least four trays arranged in a circular array. A clamping member is provided in each tray, and the inner wall of the clamping member has an annular groove for engaging with the edge of the wafer. The clamping member includes a left clamp and a right clamp that are hinged together. The top of both the left and right clamps has multiple upper arc protrusions, and the bottom of both the left and right clamps has multiple lower arc protrusions. The inner diameter of the lower arc protrusions is smaller than the inner diameter of the upper arc protrusions, and the outer side of the lower arc protrusions engages with the tray.

2. The fixture for placing a heating furnace in diode chip production according to claim 1, characterized in that, Both the left and right hoops are provided with clamping handles at their mating ends. Each clamping handle has a pair of clamping holes. The clamping handles face the distal end of the support plate. The edge of the support plate is provided with a positioning port that communicates with the support opening. The positioning port engages with the clamping handles.

3. The fixture for placing a heating furnace in diode chip production according to claim 2, characterized in that, Both the upper support and the lower support include a shaft tube, which is threaded to a vertical shaft and has a support plate at one end. The support plate is provided with reinforcing ribs that are connected to the shaft tube.

4. The fixture for placing a heating furnace in diode chip production according to claim 3, characterized in that, The shaft tube has a spherical support roller at one end away from the vertical shaft, and the inside of the shaft tube has a roller groove that mates with the support roller.

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