Polishing pad cleaning device

Abstract

The utility model provides a polishing pad cleaning device. The polishing pad cleaning device comprises a supporting table, two supporting pieces arranged on the supporting face of the supporting table and a cleaning roller unit arranged between the supporting pieces. The cleaning roller unit comprises a driving roller and a driven roller; sponge bodies are arranged on the peripheries of the driving roller and the driven roller; the driving roller is mounted on the two supporting pieces through bearings at the two ends of a central shaft of the driving roller respectively; the driven rollers are respectively mounted on the two supporting pieces through bearings at the two ends of a central shaft of the driven rollers; and when the polishing pad to be cleaned is cleaned, the driving roller and the driven roller rotate to trim the polishing pad to be cleaned between the driving roller and the driven roller. The polishing pad cleaning device is used for cleaning the polishing pad needing to be replaced, and therefore the situation that grinding fluid remaining on the polishing pad drips on an FAB floor, and consequently FAB pollution is caused is avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment, and more specifically, to a polishing pad cleaning device. Background Technology

[0002] With the development of semiconductor manufacturing technology and the trend towards thinner and lighter semiconductor devices, the miniaturization of device feature dimensions (CD) has accelerated, and integrated circuits are constantly moving towards higher integration levels. To achieve higher integration levels, the flatness requirements for the surfaces of semiconductor devices have become more stringent. Among existing planarization technologies, Chemical Mechanical Polishing (CMP) is a comprehensive planarization technique that simultaneously utilizes mechanical polishing with abrasive materials and chemical polishing with acid and alkali solutions to remove material from the wafer surface, achieving comprehensive planarization to facilitate subsequent thin film deposition or etching steps. Since comprehensive planarization is a fundamental requirement for multilayer interconnect metallization, and CMP is currently recognized as the only feasible method to achieve comprehensive planarization, it is widely used in modern semiconductor manufacturing processes.

[0003] In chemical mechanical polishing (CMP) processes, the polishing slurry is delivered via a slurry arm to the polishing pad. The polishing pad, polishing head, and cleaner work together to evenly distribute the slurry onto the polishing pad on the CMP machine, achieving chemical mechanical polishing of the wafer. However, in existing CMP equipment, when polishing pads that have reached the end of their lifespan need to be replaced, residual slurry on the removed pads accumulates, causing slurry to drip onto the floor during transportation or storage, resulting in contamination in the FAB (Fabrication Equipment) workshop of semiconductor manufacturing plants. There is an urgent need to develop a device that can quickly clean the slurry from discarded polishing pads to prevent slurry dripping and subsequent contamination.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this utility model, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] To address the problems in the existing technology, the purpose of this utility model is to provide a polishing pad cleaning device that can conveniently and quickly clean the polishing pads that need to be replaced, preventing residual polishing fluid from contaminating the FAB.

[0006] This utility model provides a polishing pad cleaning device, including a support platform, two support members disposed on the support surface of the support platform, and a cleaning roller unit disposed between the support members;

[0007] The cleaning roller unit includes a driving roller and a driven roller; both the driving roller and the driven roller are provided with sponge material on their outer periphery;

[0008] The drive roller is mounted on the two support members respectively via bearings at both ends of its central shaft;

[0009] The driven roller is mounted on the two support members respectively via bearings at both ends of its central shaft;

[0010] When cleaning the polishing pad, the rotation of the active roller and the driven roller adjusts the polishing pad between the active roller and the driven roller.

[0011] According to some examples of this utility model, a first gear is provided at one end of the central shaft of the driving roller, and a second gear is provided at one end of the central shaft of the driven roller. The first gear meshes with the second gear, and the rotation of the central shaft of the driving roller drives the rotation of the central shaft of the driven roller.

[0012] According to some examples of this utility model, the polishing pad cleaning device further includes a motor, and the central shaft of the active roller is connected to the output shaft of the motor, and the rotation of the output shaft of the motor drives the rotation of the active roller.

[0013] According to some examples of the present invention, the polishing pad cleaning device further includes a motor, and the output shaft of the motor is provided with a third gear;

[0014] A first gear is provided at one end of the central shaft of the driving roller, and a second gear is provided at one end of the central shaft of the driven roller;

[0015] The third gear meshes with the first gear and the second gear respectively, and drives the first gear and the second gear to rotate.

[0016] According to some examples of this utility model, the active roller is a hollow structure connected to a first drain pipe, and the outer circumferential surface of the active roller is provided with multiple holes, and / or

[0017] The driven roller is a hollow structure connected to a second drain pipe, and the outer circumferential surface of the driven roller is provided with multiple holes.

[0018] According to some examples of the present invention, the polishing pad cleaning device further includes a plurality of air blowing nozzles;

[0019] The air blowing nozzle is disposed between the active roller and the support surface of the support platform.

[0020] According to some examples of this invention, the tilt angle of the plurality of air nozzles is adjustable.

[0021] According to some examples of the present invention, the polishing pad cleaning device further includes two slide rails and a slider disposed on each of the slide rails;

[0022] The two slide rails are disposed on the support surface of the support platform;

[0023] The two support members are respectively disposed on one of the sliders.

[0024] According to some examples of the present invention, the polishing pad cleaning device further includes a cylinder, the piston of which is connected to the slider.

[0025] According to some examples of this utility model, the support surface of the support platform is provided with a U-shaped pool, and the U-shaped pool is connected to the third drainage pipe.

[0026] According to some examples of the present invention, the polishing pad cleaning device further includes a through-beam sensor, wherein the transmitting end and the receiving end of the through-beam sensor are respectively disposed on the two support members.

[0027] According to some examples of this utility model, the support surface of the support platform is provided with a liquid baffle.

[0028] The polishing pad cleaning device of this invention is used to clean polishing pads that need to be replaced, thereby preventing residual polishing liquid on the polishing pad from dripping onto the FAB floor and causing FAB contamination. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. It is obvious that the drawings described below are merely some embodiments of this invention, and those skilled in the art can obtain other drawings based on these drawings without inventive effort. Furthermore, the drawings are merely illustrative diagrams of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore, repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities.

[0030] Figure 1 This is a schematic diagram of the structure of a polishing pad cleaning device according to an embodiment of the present invention; and

[0031] Figure 2 This is a top view of a polishing pad cleaning device according to an embodiment of the present invention. Detailed Implementation

[0032] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0033] In this specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics represented in connection with that embodiment or example, which are included in at least one embodiment or example of this specification. Furthermore, the specific features, structures, materials, or characteristics represented may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples represented in this specification, as well as the features of different embodiments or examples.

[0034] Throughout this specification, when it is said that a device is "connected" to another device, this includes not only "direct connection" but also "indirect connection" by placing other components in between. Terms indicating relative space, such as "front," "back," "up," and "down," are used to more easily explain the relationship of one device relative to another illustrated in the figures. These terms refer not only to their meaning in the figures but also to other meanings or operations of the device in use. For example, if the device in the figures is flipped, a device previously described as "below" another device may now be described as "above" another device. Therefore, the exemplary term "down" includes both "up" and "below." The device may be rotated 90° or other angles, and the terms representing relative space are interpreted accordingly.

[0035] Although the terms first, second, etc., are used in some instances herein to refer to various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, first interface and second interface, etc., are used. Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to also include the plural forms unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, component, item, kind, and / or group, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0036] Although not fully defined, all terms, including technical and scientific terms used herein, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this specification pertains. Terms defined in commonly used dictionaries shall be further interpreted as having a meaning consistent with the relevant technical literature and the content of this present instruction, and shall not be over-interpreted as having an ideal or overly formulaic meaning unless otherwise defined.

[0037] The structure of the polishing pad cleaning device of this utility model is further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments are not intended to limit the scope of protection of this utility model.

[0038] Figure 1 and Figure 2 The following are schematic diagrams of the polishing pad cleaning device from different angles according to an embodiment of the present invention. Specifically, the polishing pad cleaning device includes a support platform 1, two support members 2, and a cleaning roller unit; the support platform 1 is not limited to... Figure 1The structure consists of a support surface 11 and components supporting the support surface 11. Two support members 2 are positioned opposite each other on the support surface 11 of the support platform 1. The cleaning roller unit includes a driving roller 3 and a driven roller 3C, positioned between the two support members 2. The lengths of the driving roller 3 and the driven roller 3C, as well as the gap between them, can be set according to the structure of the polishing pad to be cleaned. Both the driving roller 3 and the driven roller 3C have sponge bodies on their outer peripheries. The driving roller 3 is mounted on the support members 2 on both sides via bearings 32 at both ends of its central shaft 31. The driven roller 3C is mounted on the support members 2 on both sides via bearings 32C at both ends of its central shaft 31C. When cleaning the polishing pad, the polishing pad is placed vertically between the driving roller 3 and the driven roller 3C. The rotation of the driving roller 3 and the driven roller 3C adjusts the polishing pad between them. The active roller 3 and the driven roller 3C can be arranged in parallel to better hold the polishing pad to be dressed and cleaned.

[0039] The rotation of the driving roller 3 and the driven roller 3C can be achieved through different technical solutions. Figure 1 and Figure 2 In one embodiment, a first gear 33 may be provided at one end of the central shaft 31 of the driving roller 3, and a second gear 33C may be provided at one end of the central shaft 31C of the driven roller 3C. The first gear 33 meshes with the second gear 33C. When the central shaft 31 of the driving roller 3 rotates, the first gear 33 drives the second gear 33C to rotate, thereby driving the central shaft of the driven roller and the driven roller 3C thereon to rotate.

[0040] For ease of operation and control, the polishing pad cleaning device may also include a motor 39, with the central shaft 31 of the drive roller connected to the output shaft of the motor 39. The rotation of the output shaft of the motor 39 drives the central shaft 31 of the drive roller 3 and the drive roller 3 to rotate.

[0041] In another embodiment (not shown in the figures), the polishing pad cleaning device may further include a motor, the output shaft of which is provided with a third gear, one end of the central shaft of the driving roller is also provided with a first gear, and one end of the central shaft of the driven roller is provided with a second gear. The difference is that in this embodiment, the third gear meshes with the first gear and the second gear respectively, thereby driving the rotation of the first gear and the second gear, that is, driving the central shaft of the driving roller and the central shaft of the driven roller to rotate.

[0042] To enhance the cleaning or trimming effect of the cleaning roller unit, the driving roller 3 can be a hollow structure fitted onto the central shaft. Multiple holes 34 are provided on the outer circumferential surface of the driving roller 3, and the hollow structure is connected to the first drain pipe 35. The driven roller 3C can have a similar structure to the driving roller 3, i.e., the driven roller 3C is a hollow structure connected to a second drain pipe (not shown in the figure), and multiple holes 34C are provided on the outer circumferential surface of the driven roller 3C. The structure of the holes 34 / 34C is not limited and can be as follows: Figure 2 The cross-section shown is a circular hole, but other shapes are also possible. Multiple holes 34 / 34C can be arrayed on the driving roller 3 / driven roller 3C. When the driving roller 3 and driven roller 3C rotate to clean the polishing pad between them, the sponges on the driving roller 3 and driven roller 3C absorb / collect the residual polishing liquid on the polishing pad, which then enters the hollow structure through the holes 34 / 34C, and flows into the waste liquid collection point of the device through the first drain pipe 35 / second drain pipe.

[0043] The sponge on the active roller 3 / driven roller 3C absorbs and removes most of the polishing liquid from the polishing pad, but some polishing liquid drips onto the support surface 11 of the support platform 1. In this embodiment, the support surface 11 of the support platform 1 may be provided with a U-shaped pool 111, which may be located below the active roller 3 and the driven roller 3C. After the active roller 3 and the driven roller 3C squeeze the polishing pad, the polishing liquid can drip into the U-shaped pool 111. The U-shaped pool may also be connected to the third drain pipe 1111, flowing into the waste liquid collection point of the device through the third drain pipe 1111.

[0044] Furthermore, the support surface 11 of the support platform 1 can be provided with a baffle plate 112. The baffle plate 112 can effectively block the overflow of polishing liquid dripping onto it, so that the polishing liquid is concentrated on it, making it easy to collect and discharge. Of course, the support surface 11 can be provided with a fourth drain pipe 113, through which the liquid flows into the waste liquid collection point of the device, thereby preventing the waste polishing liquid in the FAB from being contaminated.

[0045] In some embodiments, the polishing pad cleaning device may further include two slide rails and a slider (not shown in the figures) disposed on each slide rail, the slider being able to slide smoothly along the extension of the slide rail. The two slide rails are disposed on the support surface of the support platform, and two support members are respectively disposed on one slider. In practical use, the two slide rails may be arranged perpendicular to the central axis of the driving roller or driven roller. Further, the polishing pad cleaning device may also include cylinders 6, the pistons of two cylinders 6 being respectively connected to a slider, thereby driving the slider and the support members thereon to reciprocate. The above structure allows the cleaning roller of this invention to be movable, thereby adjusting the position of the polishing liquid dripping.

[0046] In other embodiments, the polishing pad cleaning device further includes a plurality of air nozzles 4, which may be disposed below the driving roller 3 / driven roller 3C, or between the driving roller 3 / driven roller 3C and the support surface 11 of the support platform. As the polishing pad moves between the driving roller 3 and the driven roller 3C, the plurality of air nozzles 4 blow air across the polishing pad, further removing polishing liquid from the pad, thereby improving the efficiency of cleaning the polishing pad. Preferably, the tilt angle of the plurality of air nozzles 4 is adjustable.

[0047] Considering safety issues, in practice, the polishing pad cleaning device may also include a through-beam sensor. The transmitter 21a and receiver 21b of the through-beam sensor can be respectively mounted on two support members 2. If an operator approaches the driving roller 3 / driven roller 3C, triggering the through-beam sensor, the sensor can issue an alarm or automatically stop the motor (if any) or other components through the control system. It should be noted that in the technical solution of this utility model, each functional module and module unit can correspond to a specific hardware circuit in an integrated circuit structure. Therefore, it only involves the improvement of the specific hardware circuit. The hardware part is not merely a carrier for executing control software or computer programs. Therefore, solving the corresponding technical problem and obtaining the corresponding technical effect does not involve the application of any control software or computer programs. In other words, this utility model can solve the technical problem and obtain the corresponding technical effect simply by utilizing the improvements in the hardware circuit structure involved in these modules and units, without the need for specific control software or computer programs to achieve the corresponding function.

[0048] In summary, the polishing pad cleaning device of this utility model is used to clean polishing pads that need to be replaced, thereby preventing residual polishing liquid on the polishing pad from dripping onto the FAB floor and causing FAB contamination.

[0049] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention and should not be construed as limiting the specific implementation of the present invention to these descriptions. It will be apparent to those skilled in the art that this application is not limited to the details of the above exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A polishing pad cleaning apparatus, comprising: The cleaning roller unit comprises a driving roller and a driven roller; the outer periphery of the driving roller and the driven roller is provided with a sponge body; The driving roller is installed on the two support members through bearings at both ends of the central shaft of the driving roller; The driven roller is installed on the two support members through bearings at both ends of the central shaft of the driven roller; When cleaning the polishing pad, the rotation of the driving roller and the driven roller trims the polishing pad between the driving roller and the driven roller. One end of the central shaft of the driving roller is provided with a first gear, one end of the central shaft of the driven roller is provided with a second gear, the first gear is engaged with the second gear, and the rotation of the central shaft of the driving roller drives the rotation of the central shaft of the driven roller.

2. The polishing pad cleaning apparatus of claim 1, wherein Further comprising a motor, the central shaft of the driving roller is connected with the output shaft of the motor, and the rotation of the output shaft of the motor drives the rotation of the driving roller.

3. The polishing pad cleaning apparatus of claim 2, wherein Further comprising a motor, the output shaft of the motor is provided with a third gear; 4. The polishing pad cleaning apparatus of claim 1, wherein One end of the central shaft of the driving roller is provided with a first gear, one end of the central shaft of the driven roller is provided with a second gear; The third gear is engaged with the first gear and the second gear respectively and drives the rotation of the first gear and the second gear. The driving roller is a hollow structure connected with a first drain pipe, and the outer periphery of the driving roller is provided with a plurality of holes; and / or 5. The polishing pad cleaning apparatus of claim 1, wherein The driven roller is a hollow structure connected with a second drain pipe, and the outer periphery of the driven roller is provided with a plurality of holes. Further comprising a plurality of air blowing nozzles; 6. The polishing pad cleaning apparatus of claim 1, wherein The air blowing nozzles are arranged between the driving roller and the support surface of the support table. The inclination angle of the plurality of air blowing nozzles is adjustable.

7. The polishing pad cleaning apparatus of claim 6, wherein Further comprising two slide rails and a sliding block arranged on each slide rail; 8. The polishing pad cleaning apparatus of claim 1, wherein, The two slide rails are arranged on the support surface of the support table; The two support members are arranged on a sliding block respectively. Further comprising a gas cylinder, the piston of the gas cylinder is connected with the sliding block.

9. The polishing pad cleaning apparatus of claim 8, wherein, The support surface of the support table is provided with a U-shaped pool, and the U-shaped pool is communicated with a third drain pipe.

10. The polishing pad cleaning apparatus of claim 1, wherein Further comprising a pair of sensors, the emitting end and the receiving end of the pair of sensors are arranged on the two support members respectively.

11. The polishing pad cleaning apparatus of claim 1, wherein The support surface of the support table is provided with a liquid blocking plate.

12. The polishing pad cleaning apparatus of claim 1, wherein, ​

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