Laser processing equipment

Abstract

The utility model discloses laser processing equipment, which comprises a rotary table used for bearing a semiconductor product, the semiconductor product comprises a supporting substrate, a semiconductor layer and a packaging structure, and the supporting substrate comprises an outer periphery and a positioning notch; the laser device is arranged on the rotating table and is used for removing the packaging structure along the edge of the semiconductor product; the visual processing device is provided with a standard image information corresponding to the supporting substrate, and the standard image information comprises an outer periphery, a positioning notch and two positioning features located at the two ends of the positioning notch and is used for inspecting the outer periphery and the two ends of the positioning notch; an actual contour of the branch positioning gap is established through the two positioning characteristics of the standard image data, so that the laser device can remove the covering packaging structure. Therefore, the packaging structure can be quickly and accurately processed to expose a complete positioning gap, and the time and errors of known multi-station processing are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor processing equipment, especially the laser processing equipment of semiconductor. BACKGROUND

[0002] At present, after the mold sealing process in the semiconductor packaging process, the packaging material will cover the semiconductor layer and the support substrate to form a semiconductor product with a packaging structure. The packaging structure covers the positioning notch of the support substrate, which causes the subsequent vision or scanning system to be unable to correctly read the positioning notch of the support substrate, and the positioning cannot be effectively performed.

[0003] At present, in order to correctly find the positioning notch of the support substrate of the semiconductor product, different workstations or devices need to be used, which increases the time for moving and positioning the semiconductor product in different workstations or devices, and is not conducive to production efficiency.

[0004] Furthermore, in order to mark the identity or model of the support substrate on the packaging structure, the semiconductor product also needs to be transferred to a marking device or workstation, which requires an additional movement of a workstation. INVENTION CONTENTS

[0005] In view of the above-mentioned deficiencies, the purpose of the utility model is to provide a laser processing equipment which can quickly and accurately remove the packaging structure at the edge of the support substrate and process the packaging structure to expose the complete positioning notch, thereby reducing the time and error of multi-station processing.

[0006] In order to achieve the above-mentioned purpose, the laser processing equipment includes a rotating table for carrying and horizontally rotating a semiconductor product, the semiconductor product including a support substrate, a semiconductor layer and a packaging structure, the support substrate including an outer periphery, a positioning notch and a support surface, two ends of the positioning notch being recessed from the outer periphery, the outer periphery and the positioning notch forming the support surface, the semiconductor layer being connected to the support substrate and being located on the support surface, and the packaging structure covering the semiconductor layer and the support substrate; a laser device arranged at a position opposite to the rotating table and used to remove the packaging structure along the edge of the semiconductor product; and a vision processing device arranged at a position opposite to the rotating table and having a standard map corresponding to the support substrate, the standard map including the outer periphery, the positioning notch and two positioning features located at two ends of the positioning notch, the vision processing device being used to view the outer periphery of the support substrate and the two ends of the positioning notch exposed by the laser device removing the packaging structure, to establish an actual contour of the positioning notch of the support substrate through the two positioning features of the standard map, and the laser device removes the packaging structure covering the positioning notch of the support substrate according to the actual contour to expose the complete positioning notch of the support substrate.

[0007] By removing the package structure supporting the edge of the substrate by the above device, the positioning gap is quickly and accurately repositioned, and the package structure is processed to expose the complete positioning gap, so that the time and error of multi-station processing can be reduced.

[0008] Preferably, the two positioning features of the standard pattern each have a straight line segment and an inclined segment connecting the ends of the straight line segment, the straight line segment being a part of the outer periphery, and the inclined segment being a part of the positioning gap.

[0009] Preferably, the two positioning features are symmetrical, and the two ends of the positioning gap are simultaneously within a visual range of the visual processing device.

[0010] Preferably, the laser device is also used to mark an identity of the supporting substrate on the package structure.

[0011] The utility model will be described in detail below in combination with the drawings and specific embodiments, but not as the limitation of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a schematic diagram of an embodiment of the laser processing device of the utility model.

[0013] Figure 2 is Figure 1 is a schematic diagram of a package structure of a semiconductor product in the utility model covering the outer periphery of a supporting substrate.

[0014] Figure 3 is Figure 1 is a schematic diagram in which the package structure of the semiconductor product is partially removed and exposes the outer periphery of the supporting substrate.

[0015] Figure 4 is Figure 1 is a schematic diagram of the visual range of the visual processing device.

[0016] Figure 5 is Figure 1 is a schematic diagram in which the positioning gap of the supporting substrate of the semiconductor product is completely exposed.

[0017] Figure 6 is a flowchart of the laser processing method of the utility model.

[0018] Figure 7 is Figure 6 is a schematic diagram of the laser processing path of step S5.

[0019] Figure 8 is a flowchart continuing Figure 6 , and adding step S6.

[0020] Figure 9 is Figure 8A schematic diagram of step S6, which identifies the package structure.

[0021] In the attached figures, the following labels are used:

[0022] 10: Laser processing equipment

[0023] 13: Rotary table

[0024] 15: Laser device

[0025] 151: First laser beam

[0026] 153: Second laser beam

[0027] 17: Visual processing device

[0028] 171: Image Capture Unit

[0029] 30: Semiconductor products

[0030] 31: Supporting substrate

[0031] 311: Peripheral edge

[0032] 313: Support surface

[0033] 33: Semiconductor layer

[0034] 35: Packaging Structure

[0035] L1: Line segment

[0036] L2: Inclined section

[0037] M: Identity

[0038] N: Positioning gap

[0039] R: Processing path Detailed Implementation

[0040] The structure, method, and technical effects of this utility model will be clearly and completely described below with reference to embodiments and figures, so as to fully understand the purpose, technology, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0041] When a technical feature is referred to as "fixed," "set," or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed, set, or connected to the other feature. Furthermore, the directional descriptions such as up, down, left, right, top, and bottom used in this utility model are only for illustrative purposes relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.

[0042] Although the terms first, second, third, etc., may be used to describe various technical features in this invention, these technical features should not be limited to these terms. These terms are only used to distinguish technical features of the same type from each other. For example, a first technical feature may also be referred to as a second technical feature without departing from the scope of this disclosure, and similarly, a second technical feature may also be referred to as a first technical feature.

[0043] like Figures 1 to 5 As shown, a preferred embodiment of the laser processing equipment of this utility model includes a rotary table 13, a laser device 15, and a vision processing device 17.

[0044] A rotary table 13 is used to support and horizontally rotate a semiconductor product 30, which includes a support substrate 31, a semiconductor layer 33, and a package structure 35. The support substrate 31 includes an outer periphery 311, a positioning notch N, and a support surface 313. The two ends of the positioning notch N are recessed from the outer periphery 311. The outlines of the outer periphery 311 and the positioning notch N form the support surface 313. The semiconductor layer 33 is connected to the support substrate 31 and is located on the support surface 313. The package structure 35 covers the semiconductor layer 33 and the support substrate 31.

[0045] A laser device 15 is positioned relative to the rotary table 13 and is used to remove the package structure 35 along the outer periphery 311 of the semiconductor product 30. In this embodiment, the laser device 15 can generate a first laser beam 151 and a second laser beam 153. The first laser beam 151 is projected downward from above the support substrate 31, and the second laser beam 153 is projected upward from below the support substrate 31. In other embodiments, the second laser beam 153 can be omitted; in other words, the laser device 15 is not limited to generating laser beams in two directions.

[0046] A vision processing device 17 is positioned relative to the rotary table 13 and has a standard drawing corresponding to the support substrate 31. The standard drawing includes the outer periphery 311 of the support substrate 31, a positioning notch N, and two positioning features at both ends of the positioning notch N. The vision processing device 17 examines the outer periphery 311 and the two ends of the positioning notch N of the support substrate 31 exposed after the laser device 15 removes the encapsulation structure 35, establishing an actual outline of the positioning notch N of the support substrate 31 using the two positioning features of the standard drawing. The laser device 15 then removes the encapsulation structure 35 covering the positioning notch N of the support substrate 31 based on this actual outline, thus exposing the complete positioning notch N of the support substrate 31. The vision processing device 17 includes an image capturing unit 171 to identify the positioning notch N of the support substrate 31 by taking an image.

[0047] The standard map data has two positioning features, each having a straight line segment L1 and an inclined segment L2 connecting the end of the straight line segment L1. The straight line segment L1 is a part of the outer perimeter 311, and the inclined segment L2 is a part of the positioning notch N.

[0048] The two positioning features are symmetrical, and both ends of the positioning notch N exist simultaneously within the visual range of the visual processing device 17.

[0049] In this way, the semiconductor product can be rotated horizontally with the turntable, and during the rotation, the laser device 15 removes the packaging structure 35 along the outer periphery of the support substrate 31. The vision processing device 17 can continuously inspect the exposed edge within the visual range, and after discovering the two positioning features at the two ends of the positioning notch N, it performs overlay mapping through standard graphics to correctly position the actual outline of the positioning notch N. Then, the laser device is used to remove the packaging structure 35 covering the positioning notch N on the support substrate 31.

[0050] In addition to removing the packaging structure, the laser device 15 is also used to mark an identity M of the support substrate 31 on the packaging structure 35 by laser, so as to facilitate obtaining the identity of the support substrate 31 from the surface of the packaging structure 35.

[0051] Based on the above description, the semiconductor product can have its redundant packaging structure 35 removed on the laser processing equipment of this utility model, so that the positioning notch N of the support substrate 31 is completely exposed, and the identity of the support substrate can be marked on the packaging structure 35, so as to reduce the number of times and time the semiconductor product is moved or transported during the processing, thereby optimizing the process efficiency.

[0052] like Figures 1 to 7 As shown, this utility model provides an embodiment of a laser processing method, wherein the semiconductor product 30 is as described above, and the method includes the following steps:

[0053] Step S1: Read an identity M of a semiconductor product 30 to obtain a standard drawing corresponding to the identity M. The semiconductor product 30 includes a support substrate 31, a semiconductor layer 33, and a package structure 35. The support substrate 31 includes an outer periphery 311, a positioning notch N, and a support surface 313. The two ends of the positioning notch N are recessed from the outer periphery 311. The outlines of the outer periphery 311 and the positioning notch N form the support surface 313. The semiconductor layer 33 is connected to the support substrate 31 and is located on the support surface 313. The package structure 35 covers the semiconductor layer 33 and the support substrate 31. The standard drawing includes the identity M, the outer periphery 311 of the support substrate 31 corresponding to the identity M, the positioning notch N, and two positioning features located at the two ends of the positioning notch N.

[0054] The standard map data has two positioning features, each having a straight line segment L1 and an inclined segment L2 connecting the end of the straight line segment L1. The straight line segment L1 is a part of the outer perimeter 311, and the inclined segment L2 is a part of the positioning notch N.

[0055] Step S2: Use a laser to remove the package structure 35 along the edge of the semiconductor product 30 to expose the outer periphery 311 of the support substrate 31 and the two ends of the positioning notch N. Figure 2 The top view of the semiconductor product 30 shows that the outer periphery 311 of the support substrate 31 is covered by the encapsulation structure 35. Figure 3 This is a schematic diagram showing the outer periphery 311 of the support substrate 31 after the semi-encapsulated structure is removed in step S2.

[0056] In step S2, removing the package structure 35 along the outer periphery 311 of the semiconductor product 30 with the laser includes carrying the semiconductor product 30 on a rotary table 13 and rotating it horizontally, so as to remove the package structure 35 of the outer periphery 311 by rotating the semiconductor product 30 through the rotary table 13.

[0057] The laser is positioned relative to the rotating platform 13 by a laser device 15. In this embodiment, the laser device 15 can generate a first laser beam 151 and a second laser beam 153. In other embodiments, the second laser beam 153 can be omitted; in other words, the laser device 15 is not limited to generating laser beams in two directions.

[0058] Step S3: Examine along the outer periphery 311 of the support substrate 31 to find the two ends of the positioning notch N.

[0059] The two positioning features are symmetrical, and the inspection includes a visual processing device 17. Both ends of the positioning notch N are simultaneously within the visual range of the visual processing device 17. The visual processing device 17 observes the outer periphery 311 at a relatively high magnification.

[0060] The inspection involves using the vision processing device 17 to determine the two straight segments L1 and the two inclined segments L2 of the semiconductor product 30, and to locate the two ends of the positioning notch N. Although the outer periphery 311 of the support substrate 31 is... Figure 3 The image appears roughly circular, but when viewed at a higher magnification using a visual processing device, the outer perimeter 311 appears as... Figure 7 The visual range, in other words Figure 3 It is observed at a lower magnification. Figure 7 Within the visual range, it can be observed that the two ends of the positioning notch N of the support substrate 31 are respectively a straight segment L1 that is roughly straight and an inclined segment L2 that is significantly different from the straight segment L1. The inclined segment L2 can also be called the cliff segment. The two positioning features are defined by this significant difference.

[0061] After discovering the two ends of the positioning gap N, a gap center is defined by connecting the endpoints of the straight line segment L1 to the inclined segment L2, and the two ends of the positioning gap N are confirmed by the symmetrical position of the center of the visual range.

[0062] After finding the two positioning features, step S4: align the two positioning features of the standard drawing with the two ends of the positioning notch N of the support substrate 31 to establish an actual outline of the positioning notch N of the support substrate 31. However, if only one positioning feature exists within the visual range of the vision processing device 17, step S4 will not be executed, and step S3 will continue to be executed.

[0063] Step S5: Based on the actual contour, the packaging structure 35 covering the positioning notch N of the support substrate 31 is removed by the laser to expose the complete positioning notch N of the support substrate 31.

[0064] The removal of the packaging structure 35 covering the positioning notch N on the support substrate 31 by the laser, based on the actual contour, follows a processing path R. In this embodiment, the processing path R is planned by translating and expanding the positioning notch N (but this invention is not limited to this), so that the laser gradually removes the packaging structure 35 towards the concave bottom of the positioning notch N until the positioning notch N on the support substrate 31 is completely exposed. Figure 7 As shown.

[0065] The vision processing device 17 is positioned relative to the rotary table 13 and has the standard drawing data. The vision processing device 17 includes an image capturing unit 171 to identify the positioning notch N of the support substrate 31 by taking an image.

[0066] By implementing the above-mentioned laser processing method, the packaging structure 35 at the edge of the supporting substrate 31 is removed, the positioning notch N is quickly and accurately aligned, and the packaging structure 35 is processed to expose the complete positioning notch N. This reduces the time and error of multi-station processing, and thus achieves the purpose of this utility model.

[0067] like Figure 8 and Figure 9 As shown, another embodiment of the laser processing method of this utility model is generally the same as the aforementioned embodiment, except that: it further includes step S6: marking the identity M on the packaging structure 35 by the laser, the support plate includes a bottom surface facing away from the support surface 313, and the identity M is formed on the bottom surface.

[0068] Specifically, the identity M is marked on the packaging structure 35 by the laser, and the positioning notch N is used as a reference for the processing positioning.

[0069] Thus, the identification process can also be completed using the laser processing equipment of this invention, without the need to repeatedly transport or move semiconductor products, thereby reducing the number of product positioning operations and improving process efficiency.

[0070] Of course, there may be other embodiments of this utility model. Without departing from the spirit and essence of this utility model, those skilled in the art can make various corresponding changes and modifications based on this utility model, but these corresponding changes and modifications should all fall within the protection scope of the claims of this utility model.

Claims

1. A laser processing apparatus characterized by comprising: The application relates to a device for removing a packaging structure from a semiconductor product, comprising: a rotating table for carrying and horizontally rotating a semiconductor product, the semiconductor product comprising a support substrate, a semiconductor layer and a packaging structure, the support substrate comprising an outer periphery, a positioning notch and a support surface, two ends of the positioning notch being recessed from the outer periphery, the outer periphery and the positioning notch forming the support surface, the semiconductor layer being connected to the support substrate and being located on the support surface, and the packaging structure covering the semiconductor layer and the support substrate; a laser device arranged at a position opposite to the rotating table and used for removing the packaging structure along the edge of the semiconductor product; and a vision processing device arranged at a position opposite to the rotating table and having a standard map corresponding to the support substrate, the standard map comprising the outer periphery, the positioning notch and two positioning features located at two ends of the positioning notch, the vision processing device being used for observing the outer periphery and the two ends of the positioning notch of the support substrate exposed by the laser device removing the packaging structure, establishing an actual profile of the positioning notch of the support substrate through the two positioning features of the standard map, and removing the packaging structure covering the positioning notch of the support substrate according to the actual profile by the laser device to expose the complete positioning notch of the support substrate. The two positioning features of the standard map respectively have a straight segment and an inclined segment connected to the end of the straight segment, the straight segment is a part of the outer periphery, and the inclined segment is a part of the positioning notch. The two positioning features are symmetrical, and the two ends of the positioning notch are simultaneously present in a visual range of the vision processing device. The laser device is also used for marking an identity of the support substrate on the packaging structure.

2. The laser processing apparatus according to claim 1, characterized by, ​ 3. The laser processing apparatus according to claim 2, characterized by, ​ 4. The laser processing apparatus according to claim 1, characterized by ​

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