Crystal grinding device

Abstract

The utility model provides a crystal grinding device, belongs to the technical field of silicon carbide crystal processing, and solves the problem of complex structure of a crystal grinding device in the prior art. The grinding device comprises a machine tool, a bearing assembly and a grinding assembly, the bearing assembly comprises a bearing seat, a bearing table and a vacuum suction cup, the bearing seat is arranged on the machine tool and has the moving freedom degree in the horizontal direction, the bearing table is rotationally arranged on the bearing seat, and the vacuum suction cup is arranged on the bearing table. The bearing table is arranged on the machine tool, the vacuum suction cup is rotationally arranged on the bearing table, the vacuum suction cup has an adsorption effect towards one side deviating from the bearing table to form an adsorption surface, the grinding assembly comprises a grinding seat and a grinding wheel, the grinding seat is arranged on the machine tool, and the grinding wheel is rotationally arranged on the grinding seat; and the grinding seat has moving degrees of freedom in at least two directions so as to drive the grinding wheel to be close to or far away from the adsorption surface.

Description

Technical Field

[0001] This application belongs to the field of silicon carbide crystal processing technology, and more specifically, relates to a crystal grinding device. Background Technology

[0002] The processing of silicon carbide crystals requires multiple steps. In each step, the silicon carbide crystal needs a carrier to provide support and requires high positioning accuracy to reduce processing errors.

[0003] Existing crystal grinding equipment typically uses a headstock and a tailstock to clamp and fix the crystal. However, crystal grinding requires machining the outer circumferential surface and two end faces. If multiple headstocks or tailstocks are used for clamping and switching, the horizontal layout area of ​​the entire equipment will increase, and the processing steps will become more complex and cumbersome.

[0004] Based on the above, the technical problem to be solved by this application is: how to simplify the overall structure of the crystal grinding device. Utility Model Content

[0005] The purpose of this application is to address the aforementioned problems in the prior art by proposing a crystal grinding device that solves the problem of complex structure in existing crystal grinding devices and simplifies the overall structure of the crystal grinding device.

[0006] The objective of this application can be achieved through the following technical solution: a crystal grinding apparatus, comprising: a machine tool; a support assembly, the support assembly comprising: a support base disposed on the machine tool and having a horizontal degree of freedom of movement; a support platform rotatably disposed on the support base; a vacuum chuck rotatably disposed on the support platform, the vacuum chuck adsorbing towards the side away from the support platform to form an adsorption surface; and a grinding assembly comprising: a grinding seat disposed on the machine tool; and a grinding wheel rotatably disposed on the grinding seat; wherein the grinding seat has at least two degrees of freedom of movement to drive the grinding wheel toward or away from the adsorption surface.

[0007] Understandably, the machine tool is used to support multiple components, such as a support component and a grinding component. The support component's support seat can move the support table, which supports the vacuum chuck and provides a rotation switching function. The adsorption surface on the vacuum chuck moves synchronously with the support table and the vacuum chuck. That is, when the crystal is placed on the adsorption surface, the movement of the support seat and the rotation of the support table, in conjunction with the grinding component, complete the grinding of the crystal's outer circumferential surface and end face. Compared to existing technologies, this saves on the tailstock and its clamping structure, simplifying the overall structure of the device and reducing the footprint. Preferably, the grinding seat of the grinding component has vertical and horizontal degrees of freedom. In some embodiments, such as when the vacuum chuck is tilted, the grinding seat can also be adaptively configured with degrees of freedom that are not parallel to the vertical or horizontal directions. The grinding wheel of the grinding component grinds the crystal on the adsorption surface through the feed motion of the grinding seat.

[0008] In the aforementioned crystal grinding apparatus, a first rotating shaft is provided between the vacuum chuck and the support stage, and a second rotating shaft is provided between the grinding wheel and the grinding seat. The axes of the first and second rotating shafts are at least parallel or perpendicular to each other. It can be understood that when the axes of the first and second rotating shafts are parallel, the outer circle of the grinding wheel faces the outer circle of the crystal, and the grinding wheel can perform grinding on the outer circumferential surface of the crystal. When the axes of the first and second rotating shafts are perpendicular, the outer circle of the grinding wheel faces the end face of the crystal, and the grinding wheel can perform grinding on the end face of the crystal. In addition to the cases where the axes of the first and second rotating shafts are parallel or perpendicular, the first rotating shaft also has a switching state; that is, when the support stage rotates, the axes of the first and second rotating shafts intersect, but do not reach a parallel or perpendicular state.

[0009] In the aforementioned crystal grinding apparatus, the grinding wheel includes a main grinding wheel and a V-groove grinding wheel, which are coaxially mounted on the second rotating shaft. It is understood that the main grinding wheel is used to grind the outer circumferential surface and end face of the crystal, while the V-groove grinding wheel is used to machine V-grooves on the crystal. The machined V-grooves can be used to indicate the crystal orientation. By coaxially mounting the two, a single drive mechanism can be used for driving.

[0010] In the aforementioned crystal grinding apparatus, the second rotating shaft passes through both sides of the grinding stand, and the main grinding wheel and the V-groove grinding wheel are respectively disposed on both sides of the grinding stand. It is understood that by arranging the main grinding wheel and the V-groove grinding wheel in opposite directions on both sides of the grinding stand, space can be saved, and better balance can be achieved.

[0011] In the aforementioned crystal grinding apparatus, the second rotating shaft extends at least through one side of the grinding base, and the main grinding wheel and the V-groove grinding wheel are arranged in the same direction on one side of the grinding base. It is understood that arranging the main grinding wheel and the V-groove grinding wheel in the same direction facilitates the drive mechanism's control.

[0012] In the aforementioned crystal grinding apparatus, the machine tool is equipped with a crystal orientation detector, which has a degree of freedom of movement to move closer to or further away from the adsorption surface. It is understood that by installing a crystal orientation detector on the machine tool and configuring it with appropriate degrees of freedom of movement, such as sliding it to the machine tool, the detection position can be flexibly adjusted to match the location of the crystal.

[0013] In the aforementioned crystal grinding apparatus, a crystal orientation detector is fixedly mounted on the machine tool, and the support seat has the freedom to move closer to or further away from the crystal orientation detector. It can be understood that by moving the support seat toward the crystal orientation detector, the crystal position can be matched with the detection position.

[0014] In the aforementioned crystal grinding apparatus, the crystal orientation detector is mounted on the machine tool and positioned directly opposite the grinding assembly, while the support assembly is positioned between the crystal orientation detector and the grinding assembly. It is understood that by positioning the support assembly between the crystal orientation detector and the grinding assembly, the displacement of the support assembly can be reduced, and switching between the two opposing workstations is more convenient.

[0015] In the aforementioned crystal grinding apparatus, the crystal orientation detector is mounted on the machine tool and positioned on one side of the carrier's moving path. Alternatively, placing the crystal orientation detector on one side of the carrier's moving path allows for crystal orientation detection along the moving path itself.

[0016] In the aforementioned crystal grinding apparatus, the machine tool is further equipped with a loading and unloading assembly, which includes a robotic arm with degrees of freedom to move closer to or further away from the adsorption surface. By using this loading and unloading assembly to load and unload crystals, the robotic arm, which typically has multiple joints and degrees of freedom, can flexibly load and unload crystals, eliminating the need for manual handling, improving loading and unloading efficiency, and reducing the risk of crystals falling off and damaging the crystals during handling.

[0017] Compared with the prior art, this application has the following beneficial effects:

[0018] 1. This application uses a vacuum chuck to adsorb and fix the crystal, and utilizes the movement of the support seat and the rotation of the support table, in conjunction with the grinding assembly, to complete the grinding of the outer circumferential surface and end face of the crystal, saving the tailstock and its clamping structure, thus simplifying the overall structure of the device and reducing the floor space.

[0019] 2. This application saves space and achieves better balance by setting the main grinding wheel and the V-groove grinding wheel in opposite directions on both sides of the grinding seat;

[0020] 3. By placing the carrier component between the crystal orientation detector and the grinding component, this application can reduce the displacement of the carrier component and facilitate the switching between the two opposing workstations. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the crystal grinding apparatus of this application;

[0022] Figure 2 This is a schematic diagram of the structure of Embodiment 1 of the carrier component of this application;

[0023] Figure 3 This is a schematic diagram of the structure of embodiment 1 of the grinding assembly of this application;

[0024] Figure 4 This is a schematic diagram of the structure of Embodiment 2 of the crystal grinding apparatus of this application;

[0025] Figure 5 This is a schematic diagram of the structure of Embodiment 3 of the crystal grinding apparatus of this application;

[0026] Figure 6 This is a schematic diagram of the structure of Embodiment 2 of the carrier component of this application;

[0027] Figure 7 This is a schematic diagram of the structure of embodiment 2 of the grinding assembly of this application;

[0028] Figure 8 This is a schematic diagram of the structure of Embodiment 4 of the crystal grinding apparatus of this application;

[0029] In the figure, 100 is the machine tool; 200 is the bearing assembly; 210 is the bearing seat; 220 is the bearing platform; 230 is the vacuum chuck; 231 is the adsorption surface; 240 is the first rotating shaft; 300 is the grinding assembly; 310 is the grinding seat; 320 is the grinding wheel; 321 is the main grinding wheel; 322 is the V-groove grinding wheel; 330 is the second rotating shaft; and 400 is the crystal orientation detector. Detailed Implementation

[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0036] Please refer to the attached diagram in the instruction manual. Figure 1 and Figure 2 This application includes a machine tool 100, a support assembly 200, and a grinding assembly 300. The support assembly 200 includes a support base 210, a support table 220, and a vacuum chuck 230. The support base 210 is mounted on the machine tool 100 and has a horizontal degree of freedom of movement. The support table 220 is rotatably mounted on the support base 210. The vacuum chuck 230 is rotatably mounted on the support table 220 and performs an adsorption action towards the side away from the support table 220 to form an adsorption surface 231. The grinding assembly 300 includes a grinding seat 310 and a grinding wheel 320. The grinding seat 310 is mounted on the machine tool 100, and the grinding wheel 320 is rotatably mounted on the grinding seat 310. The grinding seat 310 has at least two degrees of freedom of movement to drive the grinding wheel 320 towards or away from the adsorption surface 231.

[0037] It is understood that the machine tool 100 is used to support multiple components, such as the support component 200 and the grinding component 300. The support base 210 of the support component 200 can move the support table 220, which supports the vacuum chuck 230 and provides a rotation switching function. The adsorption surface 231 on the vacuum chuck 230 moves synchronously with the movement of the support table 220 and the vacuum chuck 230. That is, when the crystal is placed on the adsorption surface 231, the grinding component 300 can complete the grinding of the outer circumferential surface and end face of the crystal through the movement of the support base 210 and the rotation of the support table 220. Compared with the prior art, this saves the tailstock and its clamping structure, thus simplifying the overall structure of the device and reducing the footprint. The grinding base 310 of the grinding component 300 preferably has vertical and horizontal degrees of freedom of movement. In some embodiments, such as when the vacuum chuck 230 is tilted, the grinding base 310 can also be adaptively configured with degrees of freedom of movement that are not parallel to the vertical or horizontal directions. The grinding wheel 320 of the grinding assembly 300 can perform grinding on the crystal on the adsorption surface 231 through the feed motion of the grinding seat 310.

[0038] See Figure 1In some embodiments, the machine tool 100 is equipped with a crystal orientation detector 400, which has a degree of freedom of movement to move closer to or further away from the adsorption surface 231. It is understood that by providing the crystal orientation detector 400 on the machine tool 100 and configuring it with appropriate degrees of freedom of movement, such as sliding it to the machine tool 100, the detection position can be flexibly adjusted to match the location of the crystal.

[0039] Continue to refer to Figure 1 and Figure 2 In some embodiments, a first rotating shaft 240 is provided between the vacuum chuck 230 and the support stage 220, and a second rotating shaft 330 is provided between the grinding wheel 320 and the grinding seat 310. The axis of the first rotating shaft 240 and the axis of the second rotating shaft 330 are at least parallel or perpendicular to each other. It is understood that when the axis of the first rotating shaft 240 and the axis of the second rotating shaft 330 are parallel, the outer circle of the grinding wheel 320 is directly opposite the outer circle of the crystal, and the grinding wheel 320 can perform grinding on the outer circumferential surface of the crystal. When the axis of the first rotating shaft 240 and the axis of the second rotating shaft 330 are perpendicular, the outer circle of the grinding wheel 320 is directly opposite the end face of the crystal, and the grinding wheel 320 can perform grinding on the end face of the crystal. In addition, besides the case where the axes of the first rotating shaft 240 and the second rotating shaft 330 are parallel or perpendicular to each other, the first rotating shaft 240 also has a switching state, that is, when the support platform 220 rotates, the axis of the first rotating shaft 240 intersects with the axis of the second rotating shaft 330, but does not reach a parallel or perpendicular state.

[0040] See Figure 1 and Figure 3 In some embodiments, the grinding wheel 320 includes a main grinding wheel 321 and a V-groove grinding wheel 322, which are coaxially mounted on the second rotating shaft 330. It is understood that the main grinding wheel 321 is used to grind the outer circumferential surface and end face of the crystal, while the V-groove grinding wheel 322 is used to machine V-grooves on the crystal. The machined V-grooves can be used to indicate the crystal orientation. By coaxially mounting the two, a single drive mechanism can be used for driving.

[0041] like Figure 3 As shown, in some embodiments, the second rotating shaft 330 extends through both sides of the grinding seat 310, and the main grinding wheel 321 and the V-groove grinding wheel 322 are respectively disposed on both sides of the grinding seat 310. It can be understood that by distributing the main grinding wheel 321 and the V-groove grinding wheel 322 in opposite directions on both sides of the grinding seat 310, space can be saved and the balance can be improved.

[0042] like Figure 4As shown, in some embodiments, a crystal orientation detector 400 is fixedly mounted on the machine tool 100, and the support 210 has the freedom to move closer to or further away from the crystal orientation detector 400. It can be understood that by moving the support 210 toward the crystal orientation detector 400, the crystal position can also be matched with the detection position.

[0043] See Figure 1 or Figure 4 or Figure 5 In some embodiments, the crystal orientation detector 400 is mounted on the machine tool 100 and directly opposite the grinding assembly 300, with the support assembly 200 positioned between the crystal orientation detector 400 and the grinding assembly 300. It is understood that by positioning the support assembly 200 between the crystal orientation detector 400 and the grinding assembly 300, the displacement of the support assembly 200 can be reduced, and it is more convenient to move and switch between the two directly opposite workstations.

[0044] See Figure 6 In some embodiments, the support assembly 200 includes a support base 210, a support platform 220, and a vacuum suction cup 230, but differs from... Figure 2 The vertical support component 200 is shown. Figure 6 The support component 200 is horizontal, and the adsorption surface 231 of the vacuum suction cup 230 and the axial direction of the first rotating shaft 240 are both set to be horizontal.

[0045] like Figure 7 As shown, in some embodiments, the second rotating shaft 330 extends at least through one side of the grinding seat 310, and the main grinding wheel 321 and the V-groove grinding wheel 322 are arranged in the same direction on one side of the grinding seat 310. It can be understood that by arranging the main grinding wheel 321 and the V-groove grinding wheel 322 in the same direction, it is convenient for the drive mechanism to drive and control.

[0046] See Figure 8 In some embodiments, the crystal orientation detector 400 is mounted on the machine tool 100 and arranged on one side of the moving path of the carrier 210. As another layout, arranging the crystal orientation detector 400 on one side of the moving path of the carrier 210 allows for crystal orientation detection to be performed on the moving path.

[0047] In some embodiments, the machine tool 100 is further provided with a loading and unloading assembly (not shown), which has a robotic arm (not shown) with degrees of freedom to move closer to or away from the adsorption surface 231. The loading and unloading assembly is used to load and unload crystals. The robotic arm typically has multiple joints and degrees of freedom, allowing for flexible loading and unloading, eliminating the need for manual handling, improving loading and unloading efficiency, and preventing crystals from easily falling off and damaging the crystals during handling.

[0048] Beneficial effects:

[0049] This application uses a vacuum chuck 230 to adsorb and fix the crystal, and utilizes the movement of the support seat 210 and the rotation of the support table 220, along with the grinding assembly 300, to complete the grinding of the outer circumferential surface and end face of the crystal. This saves the tailstock and its clamping structure, thus simplifying the overall structure of the device and reducing the floor space. By setting the main grinding wheel 321 and the V-groove grinding wheel 322 in opposite directions on both sides of the grinding seat 310, space can be saved and the balance can be improved. By setting the support assembly 200 between the crystal orientation detector 400 and the grinding assembly 300, the displacement of the support assembly 200 can be reduced, and it is more convenient to move and switch between the two opposing workstations.

[0050] The specific embodiments described herein are merely illustrative examples of the spirit of this application. Those skilled in the art to which this application pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this application or exceeding the scope defined by the appended claims.

Claims

1. A crystal grinding device, characterized by, The machine tool (100) comprises: a bearing assembly (200) comprising: a bearing seat (210) arranged on the machine tool (100) and having a horizontal movement degree of freedom; a bearing table (220) rotatably arranged on the bearing seat (210); a vacuum chuck (230) rotatably arranged on the bearing table (220), wherein one side of the vacuum chuck (230) facing away from the bearing table (220) is an adsorption surface (231); and a grinding assembly (300) comprising: a grinding seat (310) arranged on the machine tool (100); a grinding wheel (320) rotatably arranged on the grinding seat (310); wherein the grinding seat (310) has at least two movement degrees of freedom to drive the grinding wheel (320) to approach or move away from the adsorption surface (231). A first rotation shaft (240) is arranged between the vacuum chuck (230) and the bearing table (220), and a second rotation shaft (330) is arranged between the grinding wheel (320) and the grinding seat (310), wherein the axis of the first rotation shaft (240) and the axis of the second rotation shaft (330) have at least a parallel or vertical state.

2. The crystal grinding device according to claim 1, characterized in that The grinding wheel (320) comprises a main grinding wheel (321) and a V-groove grinding wheel (322), which are coaxially arranged on the second rotation shaft (330).

3. The crystal grinding device according to claim 2, characterized in that The second rotation shaft (330) penetrates both sides of the grinding seat (310), and the main grinding wheel (321) and the V-groove grinding wheel (322) are arranged on both sides of the grinding seat (310), respectively.

4. The crystal grinding device according to claim 3, characterized in that The second rotation shaft (330) penetrates at least one side of the grinding seat (310), and the main grinding wheel (321) and the V-groove grinding wheel (322) are arranged on one side of the grinding seat (310) in the same direction.

5. The crystal grinding device according to claim 3, wherein A crystal direction detector (400) is arranged on the machine tool (100), and the crystal direction detector (400) has a movement degree of freedom to approach or move away from the adsorption surface (231).

6. The crystal grinding apparatus according to claim 1, wherein A crystal direction detector (400) is fixedly arranged on the machine tool (100), and the bearing seat (210) has a movement degree of freedom to approach or move away from the crystal direction detector (400).

7. The crystal grinding apparatus according to claim 1, wherein The crystal direction detector (400) is arranged on the machine tool (100) and opposite to the grinding assembly (300), and the bearing assembly (200) is arranged between the crystal direction detector (400) and the grinding assembly (300).

8. The crystal grinding device according to claim 6 or 7, characterized in that The crystal direction detector (400) is arranged on the machine tool (100), and the crystal direction detector (400) is arranged on one side of the movement path of the bearing seat (210).

9. The crystal grinding device according to claim 6 or 7, characterized in that The machine tool (100) further comprises a feeding and discharging assembly, and the feeding and discharging assembly comprises a mechanical hand, and the mechanical hand has an activity degree of freedom to approach or move away from the adsorption surface (231).

10. The crystal grinding apparatus of claim 1, wherein ​

Images