Automatic production equipment of PZT film wafer

Abstract

The utility model discloses an automatic production device of a PZT film wafer, which comprises a fixed cylinder, a fixed block is fixed on the outer side wall of the fixed cylinder, a fixed hydraulic rod is fixed on the top of the fixed block, a support plate is fixed at the top end of an output shaft of the fixed hydraulic rod, a circular plate is fixed at the bottom of the support plate, and the circular plate is fixed on the outer side wall of the fixed cylinder. And a plurality of pressing mechanisms are fixed to the bottom of the circular plate and the lower surface of the interior of the fixing cylinder correspondingly, each pressing mechanism comprises a cylinder, and the cylinders are fixedly connected with the bottom of the circular plate and the lower surface of the interior of the fixing cylinder correspondingly. According to the automatic production equipment for the PZT thin film wafer, the pressing mechanism is arranged, the upper universal wheel and the lower universal wheel are folded to clamp the wafer, and therefore the situation that the wafer moves during polishing, and polishing is affected can be prevented.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, specifically to an automated production equipment for PZT thin film wafers. Background Technology

[0002] A wafer is a circular silicon wafer used to fabricate integrated circuits. During the manufacturing process, wafers require grinding and polishing. The main purpose of wafer grinding is to remove mechanical damage layers, oxides, and other impurities from the surface, and to initially smooth the surface. This process is achieved through physical or chemical mechanical polishing (CMP) technology, which utilizes the friction between abrasive particles and the wafer surface to remove surface materials.

[0003] A search revealed an existing patent (publication number: CN212553076U) that discloses a wafer polishing mechanism, arranged adjacent to the processing spindle. The mechanism includes a base, a polishing machine, a first driving device, and a second driving device. The polishing machine is connected to the base via the first and second driving devices. The first driving device drives the polishing machine to move axially along the processing spindle, and the second driving device drives the polishing machine to move radially along the processing spindle. These two driving devices enable the polishing machine to move both axially and radially along the processing spindle. When the polishing machine moves axially along the processing spindle under the drive of the first driving device, it can move relative to the wafer along its axial direction to polish the outer circumferential surface of the wafer. The contact area between the polishing machine and the wafer gradually increases, preventing wafer chipping and fragmentation.

[0004] Although it can polish wafers, it has low automation. It requires manual loading and unloading of wafers during polishing, and it lacks a wafer fixing mechanism. The wafers still need to be fixed manually while polishing, which is time-consuming and labor-intensive, resulting in low polishing efficiency. In addition, the dust generated during polishing will be scattered, causing pollution to the working environment. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides an automated production equipment for PZT thin film wafers, solving the problems mentioned in the background section.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: an automated production equipment for PZT thin film wafers, including a fixed cylinder, a fixed block fixed to the outer wall of the fixed cylinder, a fixed hydraulic rod fixed to the top of the fixed block, a support plate fixed to the top of the output shaft of the fixed hydraulic rod, a circular plate fixed to the bottom of the support plate, and multiple pressing mechanisms fixed to the bottom of the circular plate and the inner lower surface of the fixed cylinder, the pressing mechanism including a cylinder, and multiple cylinders respectively fixedly connected to the bottom of the circular plate and the inner lower surface of the fixed cylinder;

[0007] A spring is fixed inside the cylinder, and a moving rod is fixed to the other end of the spring. A caster wheel is installed at the other end of the moving rod. Two support blocks are fixed to the bottom of the circular plate and the lower inner surface of the fixed cylinder. A grinding roller is rotatably connected between the two support blocks. A grinding motor is fixed to the right side of the right support block. The output shaft of the grinding motor passes through the right support block and is fixedly connected to the grinding roller. A control device and a timing device are fixed to the top of the support plate.

[0008] Preferably, two limiting semi-rings are fixed to the inner wall of the fixed cylinder.

[0009] Preferably, two connecting blocks are fixed to the front and rear sides of the outer side wall of the fixed cylinder. A rotating hydraulic rod is rotatably connected inside the upper connecting block. A fixing plate is fixed to the top of the rotating hydraulic rod. A suction nozzle is fixed to the bottom of the fixing plate. An air pipe is fixed inside the fixing plate. A rotary motor is fixed to the bottom of the lower connecting block. The output shaft of the rotary motor passes through the lower connecting block and is fixedly connected to the bottom of the rotating hydraulic rod.

[0010] Preferably, a hydraulic push rod is fixed inside the fixed cylinder, the output shaft of the hydraulic push rod is fixed to a fixed frame, a roller is rotatably connected inside the fixed frame, a rotating motor is fixed to the bottom of the fixed frame, and the output shaft of the rotating motor passes through the fixed frame and is fixedly connected to the bottom of the roller.

[0011] Preferably, the fixed cylinder has two spray pipes inside, and multiple nozzles are fixed on the outer wall of the spray pipes. The fixed cylinder has two connecting pipes inside, and an arc-shaped pipe is provided on the outer side of the fixed cylinder. The two ends of the connecting pipes are fixedly connected to the spray pipes and the arc-shaped pipes, respectively.

[0012] Preferably, the fixed cylinder has a leakage hole inside, and multiple pads are fixed to the bottom of the fixed cylinder. Beneficial effects

[0013] This invention provides an automated production equipment for PZT thin film wafers. Compared with the prior art, it has the following advantages:

[0014] 1. The automated production equipment for PZT thin film wafers uses a clamping mechanism where the upper and lower casters close together to clamp the wafer, preventing it from moving during polishing and affecting the polishing process.

[0015] 2. The automated production equipment for PZT thin film wafers is equipped with a push hydraulic rod, a fixed frame, rollers, and a rotating motor. When the push hydraulic rod is activated, the rollers move and come into contact with the wafer. When the rotating motor is activated, the rotating motor drives the rollers to rotate, and the rollers drive the wafers to rotate, which facilitates the polishing of the wafers.

[0016] 3. This automated production equipment for PZT thin film wafers is equipped with a rotary motor, a rotating hydraulic rod, a fixed plate, a suction nozzle, and an air pipe. The air pipe is connected to an external air pump. The rotating hydraulic rod on the left descends to hold the wafer, and then pushes the fixed plate and suction nozzle upwards. The rotary motor is started, positioning the wafer above the fixed cylinder. Then, the rotating hydraulic rod descends to transport the wafer into the interior of the fixed cylinder. This eliminates the need for manual transport. After polishing, the suction nozzle on the right and the rotating hydraulic rod remove the wafer. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0019] Figure 3 This is a cross-sectional view of the cylindrical structure in this utility model.

[0020] In the diagram: 1. Fixed hydraulic rod; 2. Timing device; 3. Support plate; 4. Grinding roller; 5. Limiting semi-ring; 6. Rotating hydraulic rod; 7. Rotating motor; 8. Foot pad; 9. Fixed cylinder; 10. Arc-shaped tube; 11. Pushing hydraulic rod; 12. Clamping mechanism; 13. Nozzle; 14. Fixed plate; 15. Air pipe; 16. Circular plate; 17. Control device; 18. Timing device; 19. Support block; 20. Grinding motor; 21. Spray pipe; 22. Rotating motor; 23. Leakage hole; 24. Connecting pipe; 25. Fixed frame; 26. Nozzle; 27. Cylinder; 28. Universal wheel; 29. ​​Moving rod; 30. Spring; 31. Connecting block; 32. Roller; 24. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3This utility model provides a technical solution: an automated production equipment for PZT thin film wafers, including a fixed cylinder 9, a fixed block 18 fixed to the outer wall of the fixed cylinder 9, a fixed hydraulic rod 1 fixed to the top of the fixed block 18, a support plate 3 fixed to the top of the output shaft of the fixed hydraulic rod 1, a circular plate 16 fixed to the bottom of the support plate 3, and multiple pressing mechanisms 12 fixed to the bottom of the circular plate 16 and the lower inner surface of the fixed cylinder 9, each pressing mechanism 12 including a cylindrical cylinder 27, the multiple cylindrical cylinders 27 being fixedly connected to the bottom of the circular plate 16 and the lower inner surface of the fixed cylinder 9 respectively, a spring 30 fixed inside the cylindrical cylinder 27, a moving rod 29 fixed to the other end of the spring 30, a universal wheel 28 installed at the other end of the moving rod 29, two support blocks 19 fixed to the bottom of the circular plate 16 and the lower inner surface of the fixed cylinder 9, and a grinding roller 4 rotatably connected between the two support blocks 19. A grinding motor 20 is fixed to the right side of the side support block 19. The output shaft of the grinding motor 20 passes through the right support block 19 and is fixedly connected to the grinding roller 4. A control device 17 and a timing device 2 are fixed to the top of the support plate 3, so that the wafer can be automatically ground and the grinding powder will not be scattered. Two limiting semi-rings 5 ​​are fixed to the inner side wall of the fixed cylinder 9, so that the wafer is limited. Two connecting blocks 31 are fixed to the front and rear sides of the outer side wall of the fixed cylinder 9. A rotating hydraulic rod 6 is rotatably connected inside the upper connecting block 31. A fixed plate 14 is fixed to the top of the rotating hydraulic rod 6. A suction nozzle 13 is fixed to the bottom of the fixed plate 14. An air pipe 15 is fixed inside the fixed plate 14. A rotary motor 7 is fixed to the bottom of the lower connecting block 31. The output shaft of the rotary motor 7 passes through the lower connecting block 31 and is fixedly connected to the bottom of the rotating hydraulic rod 6, so that the wafer can be loaded and unloaded.

[0023] Furthermore, a hydraulic push rod 11 is fixed inside the fixed cylinder 9, and a fixed frame 25 is fixed to the output shaft of the hydraulic push rod 11. A roller 32 is rotatably connected inside the fixed frame 25, and a rotating motor 22 is fixed to the bottom of the fixed frame 25. The output shaft of the rotating motor 22 passes through the fixed frame 25 and is fixedly connected to the bottom of the roller 32, so that the wafer can be rotated.

[0024] Furthermore, the fixed cylinder 9 has two spray pipes 21 inside, and multiple nozzles 26 are fixed on the outer wall of the spray pipes 21. The fixed cylinder 9 has two connecting pipes 24 inside, and an arc-shaped pipe 10 is provided on the outer side of the fixed cylinder 9. The two ends of the connecting pipe 24 are fixedly connected to the spray pipes 21 and the arc-shaped pipe 10 respectively. This allows the polished wafer to be cleaned. The fixed cylinder 9 has a drain hole 23 inside, and multiple pads 8 are fixed at the bottom of the fixed cylinder 9 to allow wastewater to be discharged.

[0025] During operation, an air pump is connected to the air pipe 15, and a water pipe is connected to the arc-shaped pipe 10. The water pipe is connected to the water pump. Then, the left-side rotating hydraulic rod 6 is activated to retract, causing the left-side fixed plate 14 to descend. The left-side suction nozzle 13 picks up the wafer. Next, the left-side rotating hydraulic rod 6 pushes the fixed plate 14 and suction nozzle 13 upward. The left-side rotary motor 7 is activated, causing the left-side rotating hydraulic rod 6, fixed plate 14, and suction nozzle 13 to rotate, positioning the wafer above the fixed cylinder 9. Then, the left-side rotating hydraulic rod 6 retracts, transporting the wafer into the fixed cylinder 9. The left-side suction nozzle 13 releases the wafer. The left-side rotating hydraulic rod 6 pushes the fixed plate 14 and suction nozzle 13 upward. The left-side rotary motor 7 reverses, causing the left-side rotating hydraulic rod 6, fixed plate 14, and suction nozzle 13 to return to their original positions. Then, the fixed hydraulic rod 1 retracts, and the support plate 3... As the circular plate 16 descends, the upper and lower casters 28 close and clamp the wafer. The upper and lower grinding rollers 4 come into contact with the wafer. The hydraulic rod 11 is activated, causing the roller 32 to move and contact the wafer. The grinding motor 20 and the rotation motor 22 are activated, and the grinding roller 4 grinds the wafer. The bottom of the circular plate 16 and the top of the fixed cylinder 9 are in contact to seal and prevent grinding dust from scattering. The roller 32 rotates with the wafer to facilitate grinding. The timing device 2 sets the grinding time. When the grinding time is up, grinding stops. After grinding, the water pump is activated, and cleaning fluid is sprayed from the nozzle 26 to clean the wafer. After cleaning, the suction nozzle 13 on the right and the rotating hydraulic rod 6 move the wafer out of the fixed cylinder 9. This eliminates the need for manual grinding and loading / unloading.

[0026] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated production apparatus of a PZT thin film wafer, comprising a fixed cylinder (9), characterized in that: The outer side wall of the fixed cylinder (9) is fixed with a fixed block (18), the top of the fixed block (18) is fixed with a fixed hydraulic rod (1), the output shaft top end of the fixed hydraulic rod (1) is fixed with a supporting plate (3), the bottom of the supporting plate (3) is fixed with a round plate (16), the bottom of the round plate (16) and the inner lower surface of the fixed cylinder (9) are both fixed with a plurality of pressing mechanisms (12), the pressing mechanism (12) comprises a cylinder (27), a plurality of the cylinders (27) are respectively and fixedly connected with the bottom of the round plate (16) and the inner lower surface of the fixed cylinder (9); The inside of the cylinder (27) is fixed with a spring (30), the other end of the spring (30) is fixed with a moving rod (29), the other end of the moving rod (29) is installed with a universal wheel (28), the bottom of the round plate (16) and the inner lower surface of the fixed cylinder (9) are both fixed with two supporting blocks (19), a polishing roller (4) is rotatably connected between the two supporting blocks (19), the right side of the right supporting block (19) is fixed with a polishing motor (20), the output shaft of the polishing motor (20) is fixedly connected through the right supporting block (19) and the polishing roller (4), the top of the supporting plate (3) is fixed with a control device (17) and a timing device (2).

2. The apparatus according to claim 1, wherein: The inner side wall of the fixed cylinder (9) is fixed with two limiting half rings (5).

3. The apparatus according to claim 2, wherein: The outer side wall of the fixed cylinder (9) is fixed with two connecting blocks (31) in front and back, a rotating hydraulic rod (6) is rotatably connected in the inner of the upper connecting block (31), the top of the rotating hydraulic rod (6) is fixed with a fixed plate (14), the bottom of the fixed plate (14) is fixed with a suction nozzle (13), the inside of the fixed plate (14) is fixed with an air pipe (15), the bottom of the lower connecting block (31) is fixed with a rotating motor (7), the output shaft of the rotating motor (7) is fixedly connected through the bottom of the lower connecting block (31) and the rotating hydraulic rod (6).

4. The apparatus according to claim 3, wherein: The inside of the fixed cylinder (9) is fixed with a pushing hydraulic rod (11), the output shaft of the pushing hydraulic rod (11) is fixed with a fixed frame (25), the inside of the fixed frame (25) is rotatably connected with a roller (32), the bottom of the fixed frame (25) is fixed with a rotating motor (22), the output shaft of the rotating motor (22) is fixedly connected through the bottom of the fixed frame (25) and the roller (32).

5. The apparatus according to claim 4, wherein: The inside of the fixed cylinder (9) is provided with two spray pipes (21), the outer side wall of the spray pipe (21) is fixed with a plurality of spray heads (26), the inside of the fixed cylinder (9) is fixed with two connecting pipes (24), the outside of the fixed cylinder (9) is provided with an arc-shaped pipe (10), the two ends of the connecting pipe (24) are respectively fixedly connected with the spray pipe (21) and the arc-shaped pipe (10).

6. The apparatus according to claim 5, wherein: The inside of the fixed cylinder (9) is provided with a leakage hole (23), the bottom of the fixed cylinder (9) is fixed with a plurality of pads (8).

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