Polishing device for semiconductor production

Abstract

The utility model discloses a polishing device for semiconductor production, which relates to the technical field of wafer processing and comprises a base, a support is mounted at the upper end of the base, a polishing mechanism is arranged at the lower end of the support and comprises an electric push rod mounted at the lower end of the support, and a servo motor is mounted at the end of a piston rod of the electric push rod. The end part of an output shaft of the servo motor is fixedly connected with an upper tripod; the lower end of the upper tripod is connected with a lower tripod; a driving gear is arranged in the middle of the lower end of the lower tripod, a connecting shaft connected with the lower tripod through a bearing is fixedly connected to the driving gear, and a worm gear is fixedly connected to the upper end of the connecting shaft; the driving gear is adopted to drive the driven gear to rotate so as to drive the linkage rod to rotate, and the caliber between the polishing rollers is adjusted, so that the polishing requirements of wafers with different outer diameters are met; and automatic uniform polishing is adopted, the polishing uniformity of the corners of the wafer is guaranteed, the polishing efficiency of the semiconductor wafer is high, and practicability is achieved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically a grinding device for semiconductor production. Background Technology

[0002] A wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. After semiconductor wafers are sliced ​​from silicon ingots, the edges and corners of the wafers need to be polished. Currently, most wafer edge polishing is done manually by workers holding sandpaper or using polishing wheels. This requires changing the polishing position and can easily lead to insufficient uniformity of wafer edge polishing. Furthermore, wafers have different outer diameters, and there is a lack of wafer polishing devices that can meet the needs of different outer diameters. In order to solve the above-mentioned problems, this utility model proposes a polishing device for semiconductor production. Utility Model Content

[0003] The purpose of this invention is to provide a polishing device for semiconductor manufacturing, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a polishing device for semiconductor production, comprising a base, a bracket mounted on the upper end of the base, and a polishing mechanism provided at the lower end of the bracket, the polishing mechanism comprising an electric push rod mounted on the lower end of the bracket, and a servo motor mounted on the piston rod end of the electric push rod, an upper tripod fixedly connected to the end of the output shaft of the servo motor, and a lower tripod connected to the lower end of the upper tripod;

[0005] The lower tripod has a drive gear at the middle of its lower end, and a connecting shaft that is connected to the lower tripod via a bearing is fixedly connected to the drive gear. A worm gear is fixedly connected to the upper end of the connecting shaft. Driven gears are rotatably connected to the triangular part of the lower tripod via shafts. The driven gears are arranged in an array with the drive gear as the center. The driven gears mesh with the drive gears. A connecting rod is fixedly connected to the lower end of each driven gear, and a grinding roller is fixedly connected to the lower end of the other side of the connecting rod.

[0006] The lower tripod is equipped with a worm gear, which is meshed with a worm wheel.

[0007] Preferably, each of the triangular parts of the lower tripod is fixedly connected with a locking bolt, and the lower tripod and the upper tripod are locked together by locking bolts and nuts.

[0008] Preferably, the lower tripod is provided with a bearing seat, the worm gear is rotatably connected between the bearing seats, and one end of the worm gear is provided with an adjusting cap.

[0009] Preferably, a controller is installed on the side wall of the bracket, and the electric push rod and the servo motor are both electrically connected to the controller.

[0010] Preferably, a wafer chuck is installed in the middle of the base, and the wafer chuck is located directly below the drive gear.

[0011] Compared with the prior art, the beneficial effects of this utility model are: this utility model uses an active gear to drive the driven gear to rotate, which in turn drives the connecting rod to rotate, adjusting the diameter between the grinding rollers to meet the grinding requirements of wafers with different outer diameters; and it adopts automated uniform grinding to ensure the uniformity of grinding the edges and corners of the wafer, resulting in high efficiency in semiconductor wafer grinding and practicality. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the grinding mechanism of this utility model;

[0014] Figure 3 This is a schematic diagram of the disassembled structure of the grinding mechanism of this utility model.

[0015] In the diagram: 1. Base; 11. Bracket; 12. Controller; 13. Wafer chuck; 2. Grinding mechanism; 21. Electric push rod; 22. Servo motor; 23. Upper tripod; 24. Lower tripod; 241. Locking bolt; 25. Drive gear; 26. Worm gear; 27. Connecting shaft; 28. Driven gear; 29. ​​Linkage rod; 210. Grinding roller; 211. Worm gear; 212. Adjusting cap. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-3 The present invention provides a technical solution: a polishing device for semiconductor production, including a base 1, a bracket 11 installed on the upper end of the base 1, and a polishing mechanism 2 provided on the lower end of the bracket 11. The polishing mechanism 2 includes an electric push rod 21 installed on the lower end of the bracket 11, and a servo motor 22 is installed on the piston rod end of the electric push rod 21. An upper tripod 23 is fixedly connected to the end of the output shaft of the servo motor 22, and a lower tripod 24 is connected to the lower end of the upper tripod 23.

[0018] The lower tripod 24 has a drive gear 25 at the middle of its lower end, and a connecting shaft 27 connected to the lower tripod 24 via a bearing is fixedly connected to the drive gear 25. A worm gear 26 is fixedly connected to the upper end of the connecting shaft 27. Driven gears 28 are rotatably connected to the triangular part of the lower tripod 24 via shafts. The driven gears 28 are arranged in an array with the drive gear 25 as the center. The driven gears 28 mesh with the drive gear 25. A connecting rod 29 is fixedly connected to the lower end of each driven gear 28. A grinding roller 210 is fixedly connected to the lower end of the other side of the connecting rod 29.

[0019] A worm gear 211 is installed on the lower tripod 24, and the worm gear 211 is meshed with the worm wheel 26.

[0020] Furthermore, each of the triangular sections of the lower tripod 24 is fixedly connected with a locking bolt 241, and the lower tripod 24 and the upper tripod 23 are locked together by the locking bolts 241 and nuts. The locking bolts 241 and nuts between the lower tripod 24 and the upper tripod 23 facilitate the assembly and disassembly of the lower tripod 24 and the upper tripod 23, as well as the installation of the internal structure.

[0021] Furthermore, the lower tripod 24 is equipped with bearing seats, and the worm gear 211 is rotatably connected between the bearing seats. One end of the worm gear 211 is equipped with an adjusting cap 212. By rotating the adjusting cap 212, the worm gear 211 is driven to rotate, which in turn drives the worm wheel 26 and the driving gear 25, realizing the synchronous rotation of the three driven gears 28. This, in turn, causes the connecting rod 29 and the grinding roller 210 to rotate, adjusting the diameter between the grinding rollers 210 to meet the grinding needs of semiconductor wafers of different sizes.

[0022] Furthermore, a controller 12 is installed on the side wall of the support 11, and the electric push rod 21 and the servo motor 22 are both electrically connected to the controller 12. The controller 12 is a TB6600 model, which automates the grinding of the semiconductor wafer, ensuring the efficiency of semiconductor wafer processing.

[0023] Furthermore, a wafer chuck 13 is mounted in the middle of the base 1, and the wafer chuck 13 is located directly below the drive gear 25. The wafer chuck 13 is axially aligned with the drive gear 25, and the wafer chuck 13 is used to position the semiconductor wafer to facilitate the rotation and polishing of the polishing roller 210.

[0024] Specifically, the semiconductor wafer is first positioned on the wafer chuck 13. Then, the power is connected and the electric push rod 21 is activated via the controller 12, which drives the servo motor 22 and the components below it to descend, completely covering the wafer sidewall with the polishing roller 210. Next, the adjusting worm gear 211 is rotated, which drives the meshing worm wheel 26 and the drive gear 25 to rotate, thereby achieving synchronous rotation of the three driven gears 28. This, in turn, drives the connecting rod 29 and the polishing roller 210 to rotate, bringing the polishing roller 210 into contact with the wafer sidewall. Finally, the servo motor 22 is activated, which drives the upper tripod 23 and the components below it to rotate, thereby rotating the polishing roller 210 to polish the wafer sidewall. This meets the polishing requirements of wafers with different outer diameters and adopts automated uniform polishing to ensure the uniformity of wafer edge polishing. The semiconductor wafer polishing efficiency is high and it is practical.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A polishing apparatus for semiconductor manufacturing, comprising a base (1), characterized in that: The base (1) is equipped with a bracket (11) at the upper end, and a grinding mechanism (2) is provided at the lower end of the bracket (11). The grinding mechanism (2) includes an electric push rod (21) installed at the lower end of the bracket (11), and a servo motor (22) is installed at the piston rod end of the electric push rod (21). An upper tripod (23) is fixedly connected to the end of the output shaft of the servo motor (22), and a lower tripod (24) is connected to the lower end of the upper tripod (23). The lower tripod (24) has a drive gear (25) at the middle of its lower end, and a connecting shaft (27) is fixedly connected to the drive gear (25) and connected to the lower tripod (24) via a bearing. A worm gear (26) is fixedly connected to the upper end of the connecting shaft (27). Driven gears (28) are rotatably connected to the triangle of the lower tripod (24) via shafts. The driven gears (28) are arranged in an array with the drive gear (25) as the center. The driven gears (28) mesh with the drive gear (25). A connecting rod (29) is fixedly connected to the lower end of the driven gears (28). A grinding roller (210) is fixedly connected to the lower end of the other side of the connecting rod (29). The lower tripod (24) is provided with a worm gear (211), which is meshed with a worm wheel (26).

2. The polishing apparatus for semiconductor manufacturing according to claim 1, characterized in that: The lower tripod (24) is fixedly connected to the triangular part with locking bolts (241), and the lower tripod (24) and the upper tripod (23) are locked together by locking bolts (241) and nuts.

3. The polishing apparatus for semiconductor manufacturing according to claim 1, characterized in that: The lower tripod (24) is provided with a bearing seat, the worm gear (211) is rotatably connected between the bearing seats, and one end of the worm gear (211) is provided with an adjusting cap (212).

4. The polishing apparatus for semiconductor manufacturing according to claim 1, characterized in that: A controller (12) is installed on the side wall of the bracket (11), and the electric push rod (21) and the servo motor (22) are both electrically connected to the controller (12).

5. A polishing apparatus for semiconductor manufacturing according to claim 1, characterized in that: A wafer chuck (13) is installed in the middle of the base (1), and the wafer chuck (13) is located directly below the drive gear (25).

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