Grinding equipment and contact type thickness detection assembly

Abstract

The utility model discloses grinding equipment and a contact-type thickness detection assembly, the grinding equipment comprises the contact-type thickness detection assembly, the contact-type thickness detection assembly is provided with only one contact-type thickness gauge, the contact-type thickness gauge is provided with only one contact-type thickness gauge, and the contact-type thickness gauge is provided with only one contact-type thickness gauge. The contact type thickness detection assembly is arranged on a height adjusting mechanism which drives the contact type thickness detection assembly to move in the vertical direction so as to adjust the height, and the contact type thickness detection assembly comprises an adjustment height determining device used for determining the height adjustment amount of the height adjusting mechanism. The height of the contact type thickness gauge is adjusted through the height adjusting mechanism, the problem that a horizontally-moving thickness measuring structure is prone to interference with workpieces can be effectively avoided, meanwhile, the contact type thickness gauge can meet the machining requirements of the workpieces with various thicknesses, the application range is wide, and meanwhile the machining efficiency is improved. According to the structure, only one contact type thickness gauge is needed to realize thickness measurement, and two thickness gauges are not needed in the prior art, so that the cost of the thickness gauge is saved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device processing, and in particular to grinding equipment and contact thickness detection components. Background Technology

[0002] In the processing of semiconductor devices such as wafers, thinning is an important process achieved through grinding equipment.

[0003] Existing thinning equipment uses thickness detection components to measure the thickness of the workpiece. For example, the structure disclosed in patent document CN117128911A can be used for thickness measurement.

[0004] In this structure, two measuring heads are required for thickness measurement. At the same time, the two measuring heads need to be moved by the adjustment component to avoid the rotation of the film loading and unloading operation or the film receiving stage.

[0005] In this structure, the measuring head only moves horizontally and not vertically. This causes interference when the measuring head is moved from the outside of the workpiece to its top surface for inspection, as the bottom of the measuring head is lower than the top surface of the workpiece. This horizontal movement of the measuring head is easily damaged by the workpiece, potentially leading to damage to the measuring head and / or the wafer. Furthermore, this problem is exacerbated when the difference between the initial thickness of the workpiece and the final thickness to be ground is significant. It may even result in the measuring head being unable to meet the thickness measurement requirements. Utility Model Content

[0006] The purpose of this invention is to solve the above-mentioned problems in the prior art and to provide a grinding device and a contact thickness detection component.

[0007] The objective of this utility model is achieved through the following technical solution:

[0008] A grinding apparatus includes a contact thickness detection component, wherein the contact thickness detection component has one and only one contact thickness gauge, and the contact thickness gauge is mounted on a height adjustment mechanism that drives it to move in a vertical direction to adjust its height. The contact thickness detection component includes an adjustment height determining device for determining the height adjustment amount of the height adjustment mechanism.

[0009] Preferably, in the grinding equipment, the height adjustment mechanism includes a linear module, the movable block of the linear module is connected to a mounting frame, and the mounting frame is connected to the contact thickness gauge and the height adjustment determination device.

[0010] Preferably, in the grinding equipment, the mounting frame includes an L-shaped thickness gauge mounting plate, the vertical plate of the thickness gauge mounting plate is provided with a set of connecting holes for connecting the contact thickness gauge, and the contact thickness gauge is supported on the horizontal plate of the thickness gauge mounting plate.

[0011] Preferably, in the grinding equipment, a zero-return sensor is further provided on the side of the linear module, and a trigger element matching the zero-return sensor is provided on the mounting bracket.

[0012] Preferably, in the grinding equipment, the zero-return sensor is connected at an adjustable height in the C-shaped groove on the side of the linear module.

[0013] Preferably, in the grinding equipment, the height adjustment determining device is a grating ruler displacement sensor.

[0014] Preferably, in the grinding equipment, the height adjustment mechanism is mounted on a mounting base. The mounting base includes a support plate connected to the bottom of the height adjustment mechanism and a support plate connected to the side of the height adjustment mechanism. The support plate is connected to the support plate via a first support, and a second support is connected below the support plate.

[0015] A contact thickness detection assembly includes a contact thickness gauge, wherein there is one and only one contact thickness gauge, which is mounted on a height adjustment mechanism that drives it to move in a vertical direction to adjust its height. The contact thickness detection assembly includes an adjustment height determining device for determining the height adjustment amount of the height adjustment mechanism.

[0016] Preferably, in the contact thickness detection assembly, the height adjustment mechanism includes a linear module, the movable block of the linear module is connected to a mounting bracket, and the mounting bracket is connected to the contact thickness gauge and the height adjustment determination device.

[0017] Preferably, in the contact thickness detection assembly, a zero-return sensor is further provided on the side of the linear module, and a trigger element matching the zero-return sensor is provided on the mounting bracket.

[0018] Preferably, in the contact thickness detection assembly, the height adjustment determination device is a displacement sensor.

[0019] The advantages of this utility model's technical solution are mainly reflected in:

[0020] This invention uses a height adjustment mechanism in conjunction with a height determination device to accurately adjust the height of a contact thickness gauge. This effectively avoids the problem of interference with the workpiece that easily occurs with horizontally moving thickness measuring structures. It can also adapt to the processing needs of workpieces of various thicknesses and has a wide range of applications. Furthermore, this structure only requires one contact thickness gauge to measure thickness, eliminating the need for two thickness gauges as in existing technologies, thus saving on the cost of thickness gauges. Attached Figure Description

[0021] Figure 1 This is a perspective view of the contact thickness detection component of this utility model;

[0022] Figure 2 This is a perspective view of the linear module of this utility model fixed on the mounting base. Detailed Implementation

[0023] The purpose, advantages, and features of this utility model will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this utility model, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this utility model.

[0024] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] Example 1

[0026] The grinding equipment disclosed in this utility model will now be described with reference to the accompanying drawings. It includes a contact thickness detection component, which has one and only one contact thickness gauge 100. The contact thickness gauge 100 is mounted on a height adjustment mechanism 200 that drives it to move in the vertical direction to adjust the height. The contact thickness detection component includes an adjustment height determining device 300 for determining the height adjustment amount of the height adjustment mechanism 200.

[0027] The height adjustment mechanism 200 can adopt various feasible structures. In a preferred embodiment, the height adjustment mechanism 200 includes a linear module 210, which is fixed next to the support platform. The movable block of the linear module 210 is connected to a mounting frame 220, which is connected to the contact thickness gauge 100 and the height adjustment determination device.

[0028] The contact thickness gauge 100 can be connected to the thickness gauge mounting plate 221 on the mounting bracket 220 through the screw hole at its end. In this case, the thickness gauge mounting plate 221 can be a vertical plate 222, and the vertical plate 222 is provided with connection holes corresponding to the screw holes at the end of the thickness gauge. More preferably, in order to better support the contact thickness gauge 100, the thickness gauge mounting plate 221 is L-shaped, and the vertical plate 222 of the thickness gauge mounting plate 221 is provided with a set of connection holes for connecting the contact thickness gauge 100. The contact thickness gauge 100 is supported on the horizontal plate 223 of the thickness gauge mounting plate 221.

[0029] The mounting bracket 220 also includes a sensor connection plate 224 located on the side of the thickness gauge mounting plate 221. The sensor connection plate 224 is connected to the height adjustment determining device 300. The height adjustment determining device 300 is a known displacement sensor. Preferably, the height adjustment determining device 300 is a grating ruler displacement sensor. Thus, the grating ruler displacement sensor and the motor of the linear module 210 form a closed-loop control to ensure that the vertical movement distance of the mounting bracket 220 is accurate.

[0030] The linear module 210 also has a zero-return sensor 400 on its side. The zero-return sensor 400 can be a known proximity switch or through-beam sensor, and its specific installation position can be designed as needed; no limitation is made here. To facilitate adjustment of the position of the zero-return sensor 400, the linear module has a C-shaped groove 410 on its side. The C-shaped groove 410 extends vertically, and a fixing plate is screwed onto it at an adjustable height. The zero-return sensor 400 is fixed to the fixing plate. Simultaneously, the mounting bracket 220 has a trigger element 500 that matches the zero-return sensor 400. When the zero-return sensor 400 detects the trigger element 500, it performs a zero-return operation.

[0031] To ensure stable installation, see attached Figure 2As shown, the linear module is mounted on a mounting base 600. The mounting base 600 includes a support plate 610 connected to the bottom of the linear module and a support plate 620 connected to the side of the linear module. The support plate 620 is connected to the support plate 610 via a first support 630, which is a T-shaped plate (or other structures that provide sufficient support). A second support 640 is connected below the support plate 610. The second support 640 includes a base plate 641, which is also connected to the support plate via a T-shaped plate 642 above it. This mounting base structure provides reliable support for the linear module, thereby ensuring the accuracy of adjustment.

[0032] Correspondingly, each time the thinning equipment is turned on, a zero-return operation is performed to determine the coordinate origin of the moving block of the linear module, and after each grinding is completed, the moving block returns to the coordinate origin. Then, when there is no workpiece on the support table, the linear module drives the contact thickness gauge to move and find the measurement reference point. When the detection result of the contact thickness gauge is 0, the coordinates of the moving block at this time are recorded as the reference point coordinates.

[0033] Before the grinding assembly 400 begins grinding, it is determined whether the thickness to be ground off the workpiece exceeds the range of the contact thickness gauge, based on the initial thickness, the final thickness to be achieved, and the range of the contact thickness gauge. If the thickness to be ground off does not exceed the range of the contact thickness gauge, then before the grinding assembly 400 begins grinding, during the downward movement of the contact thickness gauge via the linear module, the coordinates to which the moving block needs to move are determined based on the coordinate origin, the initial thickness, and the reference point coordinates. The coordinates to which the moving block needs to move are equal to the reference point coordinates minus the initial thickness. When the moving block moves to the required coordinates, the measuring rod of the contact thickness gauge rests on the top surface of the workpiece on the support platform. At this time, the detection result of the contact thickness gauge is 0. Subsequently, the grinding device grinds normally, and the value measured by the contact thickness gauge is the real-time thickness ground off. Grinding stops when the initial thickness minus the real-time thickness ground off equals the final thickness to be achieved.

[0034] If the thickness to be ground exceeds the range of the contact thickness gauge, the stroke adjustment amount of the contact thickness gauge is determined based on the initial thickness, the final thickness to be achieved, and the range of the contact thickness gauge. This stroke adjustment amount can be obtained, for example, by subtracting the final thickness to be achieved from the initial thickness, and then subtracting the range of the contact thickness gauge. Alternatively, a set value can be further subtracted from the initial thickness minus the final thickness to be achieved, and then subtracting the range of the contact thickness gauge. This ensures more effective measurement by the contact thickness gauge. At this time, after the linear module mounts the probe of the contact thickness gauge on the workpiece and the detection result of the contact thickness gauge is 0, during the grinding process on the workpiece on the support stage, the linear module drives the contact thickness gauge to move synchronously downwards to keep the detection result of the contact thickness gauge at zero. When the stroke of the contact thickness gauge equals the stroke adjustment amount, the contact thickness gauge remains in its current position for detection. At this point, the result measured by the contact thickness gauge is added to the stroke adjustment amount and the thickness that has been ground off, so that grinding can be stopped when the thickness that has been ground off in real time is equal to the thickness that needs to be ground off.

[0035] In this embodiment, although the contact thickness detection component is used to measure the thickness of workpieces in a grinding equipment, it can also be used to detect the thickness of workpieces in other scenarios.

[0036] This utility model has many other embodiments. All technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this utility model.

Claims

1. A grinding apparatus, including a contact thickness detection component, characterized in that: The contact thickness detection assembly has one and only one contact thickness gauge, which is mounted on a height adjustment mechanism that drives it to move in the vertical direction to adjust its height. The contact thickness detection assembly includes an adjustment height determining device for determining the height adjustment amount of the height adjustment mechanism.

2. The grinding equipment according to claim 1, characterized in that: The height adjustment mechanism includes a linear module, the movable block of which is connected to a mounting frame, and the mounting frame is connected to the contact thickness gauge and the height adjustment determination device.

3. The grinding equipment according to claim 2, characterized in that: The mounting bracket includes an L-shaped thickness gauge mounting plate. The vertical plate of the thickness gauge mounting plate is provided with a set of connection holes for connecting the contact thickness gauge. The contact thickness gauge is supported on the horizontal plate of the thickness gauge mounting plate.

4. The grinding equipment according to claim 2, characterized in that: The linear module is also equipped with a zero-return sensor on its side, and the mounting bracket is equipped with a trigger element that matches the zero-return sensor.

5. The grinding equipment according to claim 4, characterized in that: The zero-return sensor is adjustable in height and connected to the C-shaped groove on the side of the linear module.

6. The grinding equipment according to claim 1, characterized in that: The height adjustment determination device is a grating ruler displacement sensor.

7. The grinding apparatus according to any one of claims 1-6, characterized in that: The height adjustment mechanism is mounted on a mounting base, which includes a support plate connected to the bottom of the height adjustment mechanism and a support plate connected to the side of the height adjustment mechanism. The support plate is connected to the support plate via a first support, and a second support is connected to the bottom of the support plate.

8. A contact thickness detection assembly, including a contact thickness gauge, characterized in that: There is one and only one contact thickness gauge, which is mounted on a height adjustment mechanism that drives it to move in the vertical direction to adjust its height. The contact thickness detection assembly includes an adjustment height determining device for determining the height adjustment amount of the height adjustment mechanism.

9. The contact thickness detection component according to claim 8, characterized in that: The height adjustment mechanism includes a linear module, the movable block of which is connected to a mounting frame, and the mounting frame is connected to the contact thickness gauge and the height adjustment determination device.

10. The contact thickness detection component according to claim 9, characterized in that: The linear module is also equipped with a zero-return sensor on its side, and the mounting bracket is equipped with a trigger element that matches the zero-return sensor.

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