Uniform tin coating device for circuit board electroplating

Abstract

The uniform tin coating device for electroplating the circuit board comprises a plating tank, a partition plate I, a tin material frame and the like, a cavity is formed in the plating tank, a central cylinder is arranged in the plating tank, an annular channel is annularly formed in the peripheral area of the central cylinder, the annular channel is used for storing an electroplating solution in the tank, and the partition plate I and the tin material frame are arranged in the plating tank. First partition plates are arranged on the front side and the rear side of the left portion of the plating tank, the first partition plates divide the front side and the rear side of the left portion of the plating tank into equipment tanks, and a tin material frame is installed on the side, away from the first partition plates, in the plating tank. According to the utility model, the annular channel is arranged in the plating tank, and the circulating water pump is arranged, so that liquid continuously circulates in the annular channel, the electroplating liquid is uniformly distributed in the whole plating tank during processing, the thickness difference of a plating layer caused by non-uniform circulating flow velocity of the liquid is avoided, meanwhile, the design of the annular channel is beneficial to natural discharge of bubbles, and the production efficiency is improved. The influence of bubbles on the quality of the coating is reduced, and the uniformity and the stability of the tin coating are improved.

Description

Technical Field

[0001] This utility model relates to a tin-coating device, and more particularly to a device for uniform tin coating in circuit board electroplating. Background Technology

[0002] In the electroplating process of circuit boards, the tin plating process uses a combination of an electrolytic cell and a chemical solution to deposit tin ions onto the surface of the circuit board by means of an electric current.

[0003] To meet production demands for tin plating on circuit boards, existing electroplating equipment is equipped with multi-stage control technology and optimized electroplating solution circulation systems. Continuous operation is achieved through auxiliary suspension or conveying equipment. However, existing electroplating tanks are typically linear structures. Due to this linear structure, liquid flow usually occurs from one end of the tank to the other, resulting in a long and unidirectional flow. This makes it difficult to maintain a consistent solution temperature across different areas of the tank, leading to uneven liquid flow rates: faster flow near the inlet and slower flow further away. This uneven flow rate affects the uniform distribution of tin ions, thus impacting the uniformity of the plating layer. Furthermore, air bubbles tend to accumulate in dead corners and edges, hindering effective tin deposition. These factors result in excessively thick tin layers in some areas while other areas may be under-covered, severely affecting the electroplating quality. Utility Model Content

[0004] In order to overcome the shortcomings mentioned in the background art, the purpose of this utility model is to provide a uniform tin-coating device for electroplating circuit boards that ensures uniform tin coating by distributing the electroplating solution evenly in the plating tank.

[0005] The technical implementation scheme of this utility model is as follows: A uniform tin coating device for circuit board electroplating includes a plating tank, a partition plate, a tin frame, a circulating water pump, a circulating water pipe, and a filter screen. The plating tank has a cavity, and a central cylinder is provided inside the plating tank. An annular channel is provided around the central cylinder for storing the electroplating solution. The plating tank has a partition plate on both the front and rear sides of the left side, and the partition plate separates an equipment tank on each of the front and rear sides of the left side of the plating tank. A tin frame is installed on the side of the plating tank away from the partition plate, and the tin frame is arranged along the inner wall of the plating tank. The plating tank has several solder passages. The internal space of the solder frame is connected to the annular channel in the plating tank through the solder passages. A circulating water pump is provided on the upper left side of the plating tank. The input and output ends of the circulating water pump are connected to circulating water pipes. One end of each circulating water pipe extends into the annular channel of the plating tank. The circulating water pump causes the liquid in the annular channel to circulate. A filter screen is provided in the annular channel on the left side of the plating tank. The filter screen is located in the area between two circulating water pipes and blocks the annular channel.

[0006] Furthermore, it also includes a second partition plate, a slag pump, and a slag suction pipe. The second partition plate is provided on the left side of the plating tank near the filter screen. The second partition plate has several through holes evenly spaced on it. The second partition plate and the filter screen are arranged in the same direction. There is a gap between the filter screen and the second partition plate. The slag pump is installed on the outer side of the left side of the plating tank. The input end of the slag pump is connected to the annular channel inside the plating tank through the slag suction pipe. The opening of the slag suction pipe extends into the gap between the second partition plate and the filter screen.

[0007] Furthermore, the sludge extraction pipe is provided with multiple water inlets, which are arranged at intervals from top to bottom.

[0008] Furthermore, it also includes ultrasonic modules and conductive rods. The plating tank is equipped with multiple ultrasonic modules, each of which is equipped with a conductive rod that extends into the annular channel of the plating tank.

[0009] Furthermore, it also includes an activated carbon mesh cylinder, with the activated carbon mesh cylinder sleeved on the outer side of the central cylinder inside the plating tank.

[0010] Compared with the prior art, the present invention has the following advantages: By setting an annular channel inside the plating tank and equipping it with a circulating water pump, the liquid continuously circulates in the annular channel. During processing, the electroplating solution is evenly distributed throughout the plating tank, avoiding differences in plating thickness caused by uneven liquid circulation speed. At the same time, the design of the annular channel helps the natural discharge of air bubbles, reducing the impact of air bubbles on the plating quality and further improving the uniformity and stability of the tin-coated layer.

[0011] This invention sets up a barrier filter screen along the flow path of the circulating liquid to block impurities in the liquid. When impurities are generated during processing and flow with the liquid, they are blocked by the filter screen and no longer participate in the circulation process. This avoids the problem of uneven plating and defects caused by impurities depositing on the surface of the circuit board, and significantly improves the quality and uniformity of the tin coating. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0013] Figure 2 This is a three-dimensional structural diagram of the present invention, omitting the circulating water pump and vibration module.

[0014] Figure 3 This is a three-dimensional structural diagram of the slag pump and slag pipe of this utility model.

[0015] Figure 4 This is a three-dimensional structural diagram of the partition plate 2 of this utility model.

[0016] Figure 5 This is a top view of the present invention.

[0017] The components in the attached diagram are labeled as follows: 1. Plating tank, 2. Partition 1, 3. Tin material frame, 4. Circulating water pump, 5. Circulating water pipe, 6. Filter screen, 61. Partition 2, 610. Through hole, 62. Slag pump, 63. Slag pipe, 7. Ultrasonic module, 8. Conducting rod, 9. Activated carbon mesh cylinder. Detailed Implementation

[0018] First, it should be noted that in different described embodiments, the same components are given the same reference numerals or the same component names. The disclosure contained throughout this specification can be applied semantically to the same components having the same reference numerals or the same component names. The location descriptions selected in the specification, such as upper, lower, lateral, etc., also refer to the directly described and illustrated figures and are semantically applied to the new location when the location changes.

[0019] Example 1

[0020] A device for uniform tin plating of circuit boards, such as Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, it includes a plating tank 1, a partition 2, and a tin frame 3. The plating tank 1 has a cavity and a central cylinder in the center. The outer area of ​​the central cylinder has an annular channel for storing the electroplating solution. The front and rear sides of the left side of the plating tank 1 are equipped with partitions 2, which divide the front and rear sides of the left side of the plating tank 1 into equipment slots for installing related equipment, such as heating devices, to heat the liquid in the plating tank 1, ensuring a compact layout and clear functional zoning.

[0021] A tin frame 3 is installed on the side of the plating tank 1 away from the partition 2. The tin frame 3 is arranged along the inner wall of the plating tank 1. The tin frame 3 is equipped with a feeding port, and several tin passage grooves are opened on its frame wall, so that the internal space of the tin frame 3 is connected to the annular channel in the plating tank 1 through these passage grooves. This design not only facilitates the addition and replacement of tin, but also ensures that the electroplating solution can flow smoothly between the tin frame 3 and the annular channel, thereby improving the material exchange efficiency in the electroplating process.

[0022] A circulating water pump 4 is installed on the upper left side of the plating tank 1. Both the input and output ends of the circulating water pump 4 are connected to circulating water pipes 5. One end of the circulating water pipe 5 extends into the annular channel of the plating tank 1. Through the action of the circulating water pump 4, the liquid in the annular channel of the plating tank 1 is continuously circulated, ensuring the uniform distribution of the electroplating solution in the entire plating tank. This continuous liquid circulation effectively avoids the difference in plating thickness caused by uneven liquid circulation speed, ensuring the consistency of electroplating quality.

[0023] In addition, a filter screen 6 is installed in the annular channel on the left side of the plating tank 1. The filter screen 6 is located in the area between the two circulating water pipes 5, which partially blocks the annular channel. The design of the filter screen 6 can not only effectively filter the impurities generated during the electroplating process, but also further stabilize the liquid flow and reduce the generation of bubbles. At the same time, compared with the conventional straight tank, the design of the annular channel avoids the occurrence of dead corners and edge areas, which helps the bubbles to be discharged naturally, reduces the impact of bubbles on the plating quality, and further improves the uniformity and stability of the tin coating.

[0024] Among them, such as Figure 5 As shown, during tin plating, the circuit board is transported in the plating tank 1 according to the material transport line shown in the figure through a suspended conveyor device pre-installed at the processing station of this device. The circuit board entering the annular area is immersed in the liquid pre-filled in the plating tank 1. Before this, the tin material frame contains tin material. Through the current control module, the tin material is dissolved in the electroplating solvent and adheres to the surface of the circuit board. When the circuit board enters the annular area, it is immersed in the electroplating solution pre-filled in the plating tank 1. At this time, the circulating water pump 4 continuously circulates the electroplating solution in the annular channel through the circulating water pipe 5 to ensure that the electroplating solution is evenly distributed in the entire plating tank 1, avoiding the difference in plating thickness caused by uneven liquid flow rate. At the same time, the filter screen 6 is located in the area between the two circulating water pipes 5, effectively filtering the impurities generated during the electroplating process, reducing the generation of bubbles, and further improving the plating quality. During the entire tin plating process, the circuit board moves slowly under the drive of the suspended conveyor device to ensure that each part can fully contact the evenly flowing electroplating solution, so that the tin layer is evenly adhered to the surface of the circuit board. This design not only improves the uniformity and stability of the tin coating, but also reduces defects caused by bubbles and impurities, making it suitable for the electroplating processes required for high-precision circuit boards.

[0025] Among them, such as Figure 1-5 As shown, it also includes a second baffle plate 61, a slag pump 62, and a slag suction pipe 63. The second baffle plate 61 is provided on the left side of the plating tank 1 near the filter screen 6. Several through holes 610 are evenly spaced on the second baffle plate 61. These through holes 610 ensure that the liquid can flow smoothly on both sides of the second baffle plate 61, while also limiting the liquid flow rate. The second baffle plate 61 and the filter screen 6 are arranged in the same direction, and there is a gap between the filter screen 6 and the second baffle plate 61 to form an independent slag discharge area, which further improves the filtration effect.

[0026] A slag pump 62 is installed on the outer left side of plating tank 1. The input end of the slag pump 62 is connected to the annular channel inside plating tank 1 through a slag suction pipe 63. The opening of the slag suction pipe 63 extends into the gap between the partition plate 61 and the filter screen 6. Figure 4As shown, the sludge suction pipe 63 is equipped with multiple water inlets, which are arranged at intervals from top to bottom to ensure that impurities in the liquid are extracted from different heights, achieving all-round impurity collection. This design not only improves the sludge suction efficiency, but also avoids the clogging problem that may be caused by a single water inlet.

[0027] During operation, the electroplating solution flows continuously under the action of the circulating water pump 4. After preliminary filtration by the filter screen 6, it enters the interval area between the second baffle 61 and the filter screen 6. In this area, the particulate impurities of the filter screen 6 will remain inside. After the solvent has been used for a period of time, the slag pump 62 is started. When the slag pump 62 is working, the liquid containing impurities is extracted from this interval area through the slag extraction pipe 63. During slag extraction, due to the presence of the second baffle 61, when the slag pump has a large discharge capacity, the liquid outside the second baffle of the annular channel cannot quickly fill the interval between the filter screen 6 and the second baffle through these holes 610. Therefore, the mixed liquid is quickly extracted, and the slag extraction work is completed in a short time, without significantly affecting the liquid circulation in the annular channel. The slag extraction work can effectively prevent impurities from re-entering the annular channel and ensure the purity of the electroplating solution. In addition, the design of multiple water inlets is to ensure the rapid discharge of liquid in the interval.

[0028] Example 2:

[0029] Based on Example 1, such as Figure 1 and Figure 5 As shown, it also includes an ultrasonic module 7 and a conductive rod 8. Multiple ultrasonic modules 7 are provided on the plating tank 1. These ultrasonic modules 7 are evenly distributed on the outer wall of the plating tank 1. Each ultrasonic module 7 is equipped with a conductive rod 8. One end of the conductive rod 8 is tightly connected to the ultrasonic module 7, and the other end extends into the annular channel of the plating tank 1. The ultrasonic module 7 efficiently transmits ultrasonic energy to the electroplating solution through the conductive rod 8, generating a strong cavitation effect, which causes the tiny bubbles in the electroplating solution to expand and burst rapidly, thereby effectively removing tiny bubbles and impurities from the surface of the circuit board and significantly improving the adhesion and uniformity of the tin coating.

[0030] In addition, such as Figure 2 and Figure 5 As shown, an activated carbon mesh cylinder 9 is fitted around the outer side of the central cylinder in the plating tank 1. The activated carbon mesh cylinder 9 is firmly installed on the central cylinder by a fixed bracket. The activated carbon mesh cylinder 9 is filled with high-efficiency activated carbon material, which can adsorb harmful gases and organic pollutants generated during the electroplating process, purify the electroplating solution, and maintain the stability of its chemical composition. At the same time, the activated carbon mesh cylinder 9 also has a certain filtering effect, further reducing suspended particles in the electroplating solution and preventing these particles from affecting the quality of the plating layer.

[0031] In summary, the combined design of the ultrasonic module 7 and the conduction rod 8 utilizes the cavitation effect of ultrasound to effectively improve the removal efficiency of bubbles and impurities in the electroplating solution, ensuring the quality and uniformity of the tin coating. Meanwhile, the activated carbon mesh cylinder 9 purifies the electroplating solution through adsorption and filtration, maintaining the stability of its chemical composition and reducing the impact of harmful substances on the coating.

[0032] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A uniform tin plating apparatus for circuit board electroplating, comprising a plating tank (1); Its characteristics are, It also includes a partition (2), a tin frame (3), a circulating water pump (4), a circulating water pipe (5), and a filter screen (6). The plating tank (1) has a cavity. The plating tank (1) has a central cylinder inside. The outer area of ​​the central cylinder has an annular channel for storing the electroplating solution. The plating tank (1) has partitions (2) on both the front and back sides of the left side. The partitions (2) divide the plating tank (1) into equipment slots on both the front and back sides of the left side. A tin frame (3) is installed on the side of the plating tank (1) away from the partitions (2). The tin frame (3) is arranged along the inner wall of the plating tank (1) and has several tin passages. The internal space of the tin frame (3) is connected to the annular channel in the plating tank (1) through the tin passage. A circulating water pump (4) is provided on the upper left side of the plating tank (1). The input and output ends of the circulating water pump (4) are connected to circulating water pipes (5). One end of each circulating water pipe (5) extends into the annular channel of the plating tank (1). The circulating water pump (4) causes the liquid in the annular channel to circulate. A filter screen (6) is provided in the annular channel on the left side of the plating tank (1). The filter screen (6) is located in the area between the two circulating water pipes (5). The filter screen (6) blocks the annular channel.

2. The uniform tin plating apparatus for circuit board electroplating according to claim 1, characterized in that, It also includes a second partition (61), a slag pump (62), and a slag pipe (63). The second partition (61) is provided on the left side of the plating tank (1) near the filter screen (6). The second partition (61) has several through holes (610) evenly spaced on it. The second partition (61) and the filter screen (6) are arranged in the same direction. There is a gap between the filter screen (6) and the second partition (61). The slag pump (62) is installed on the outer side of the left side of the plating tank (1). The input end of the slag pump (62) is connected to the annular channel inside the plating tank (1) through the slag pipe (63). The opening of the slag pipe (63) extends into the gap between the second partition (61) and the filter screen (6).

3. A uniform tin plating apparatus for circuit board electroplating according to claim 2, characterized in that, The slag extraction pipe (63) is provided with multiple water inlets, which are arranged at intervals from top to bottom.

4. A uniform tin plating apparatus for circuit board electroplating according to claim 3, characterized in that, It also includes an ultrasonic module (7) and a conductive rod (8). The plating tank (1) is provided with multiple ultrasonic modules (7), and each ultrasonic module (7) is equipped with a conductive rod (8). The conductive rod (8) extends into the annular channel of the plating tank (1).

5. A uniform tin plating apparatus for circuit board electroplating according to claim 4, characterized in that, It also includes an activated carbon mesh cylinder (9), which is fitted on the outside of the central cylinder in the plating tank (1).

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