Electroplating equipment

Abstract

The electroplating equipment comprises an electroplating cylinder, a bearing part, two limiting parts and two anode plates, the two limiting parts are arranged at the two opposite ends in the electroplating cylinder and extend to the bottom wall of the electroplating cylinder, each limiting part comprises a limiting groove and two partition plates, and the two partition plates are connected to the two sides of the limiting groove respectively; the two partition plates are further connected with the two opposite inner walls of the electroplating cylinder correspondingly, and a notch of the limiting groove in one limiting part is right opposite to a notch of the limiting groove in the other limiting part. The bearing part is slidably arranged at the top of the electroplating cylinder, and the sliding direction of the bearing part is parallel to the limiting groove; the two anode plates are fixed to the bearing part and arranged on the two sides of the limiting groove respectively, and each anode plate is located between the opposite partition plates. Therefore, the current between the two cylinder bodies can be adjusted according to the electroplating effect of the two cylinder bodies in actual work, so that a metal layer attached to the electroplating carrier plate is more uniform.

Description

Technical Field

[0001] This utility model relates to the field of electroplating, specifically to an electroplating device. Background Technology

[0002] In recent years, integrated circuit technology has developed rapidly. Manufacturing integrated circuits requires first etching the circuitry onto the surface of a substrate. After etching, a metal layer needs to be applied to the surface of the substrate to make the entire integrated circuit conductive, ultimately shaping the substrate. The application of this metal layer requires electroplating. Electroplating involves placing the integrated circuit substrate, which serves as both an anode and a cathode, into the electroplating equipment. A power source is connected to the anode, creating an electric field between it and the cathode. This ionizes the metal ions in the electroplating solution, causing them to adhere to the cathode.

[0003] In traditional electroplating equipment, the integrated circuit carrier plate, acting as the cathode, needs to be continuously moved within the electroplating solution during the electroplating process to ensure better adhesion of metal ions. However, the anode plate in most electroplating equipment is stationary, leading to relative movement between the cathode and anode plates. When the cathode and anode movements are misaligned, a portion of the integrated circuit carrier plate (acting as the cathode) will experience no current or current of varying magnitudes. This results in uneven adhesion of metal ions to the carrier plate's surface, leading to an uneven metal layer thickness on the electroplated integrated circuit carrier plate. Consequently, this affects the yield rate in integrated circuit carrier plate production. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides an electroplating device.

[0005] The objective of this utility model is achieved through the following solution:

[0006] An electroplating apparatus includes: an electroplating tank, a support unit, two limiting units, and two anode plates. The two limiting units are disposed at opposite ends within the electroplating tank and extend to the bottom wall of the electroplating tank. Each limiting unit includes a limiting groove and two partition plates. The two partition plates are respectively connected to both sides of the limiting groove and are also respectively connected to two opposite inner walls of the electroplating tank. The opening of the limiting groove in one limiting unit is directly opposite to the opening of the limiting groove in the other limiting unit. The support unit is slidably disposed on the top of the electroplating tank, and the sliding direction of the support unit is parallel to the limiting groove. The two anode plates are fixed on the support unit and are respectively disposed on both sides of the limiting groove, with each anode plate located between opposite partition plates.

[0007] In one embodiment, the support part includes a sliding component and a support component, the sliding component being slidably connected to the electroplating tank; the support component is fixed on the sliding component, and the two anode plates are fixed on the support component.

[0008] In one embodiment, the sliding assembly includes multiple pulleys and multiple slide rails. The slide rails are respectively disposed on the top of the electroplating tank and are parallel to the limiting groove. The multiple pulleys are respectively disposed on the bottom of the bearing assembly, and each pulley is slidably disposed on a corresponding slide rail.

[0009] In one embodiment, the support component includes a support frame, a placement clamp, and a placement rod. A sliding component is arranged around the bottom of the support frame, the placement clamp is arranged at both ends of the support frame, the placement rod is arranged on the placement clamp, and the placement rod is located directly above the opening of the two limiting grooves.

[0010] In one embodiment, the support frame includes two hanging rods and a frame body, a sliding component is disposed at the bottom of the frame body, the two hanging rods are disposed on the frame body along a sliding direction parallel to the sliding component, and each hanging rod is provided with an anode plate.

[0011] In one embodiment, the placement rod includes two hooks and a rod body. The two hooks are respectively disposed at both ends of the rod body, and the rod body is disposed on the placement clamp. The rod body is located directly above the opening of the two limiting grooves.

[0012] In one embodiment, the carrier component further includes multiple buffer components, each buffer component having one end fixed to the carrier frame and the other end connected to the placement clip.

[0013] In one embodiment, it further includes two abutting grooves, the openings of which extend out of the limiting groove. The width of the abutting groove is smaller than that of the limiting groove. Each limiting groove contains an abutting groove, and there is a gap between the bottom wall of the abutting groove and the bottom wall of the limiting groove.

[0014] In one embodiment, limiters are provided at both ends of the multiple slide rails.

[0015] In one embodiment, the edge of the placement clip is also provided with multiple limiting holes, and the multiple limiting holes are disposed on the same side as the buffer component.

[0016] Compared with the prior art, the present invention has at least the following advantages:

[0017] The electroplating equipment of this utility model divides the electroplating tank into two cylinders during operation by means of two limiting parts, thereby forming two cylinders that do not interfere with each other during operation.

[0018] Therefore, the current between the two cylinders can be adjusted according to the electroplating effect of the two cylinders in actual work, so that the metal layer attached to the electroplating substrate is more uniform.

[0019] Since both the anode plate and the cathode plate are mounted on the support, the support can drive the anode plate and the cathode plate to move simultaneously within the electroplating tank, thereby avoiding relative movement between the anode plate and the cathode plate, preventing uneven current flow on the cathode plate, and preventing uneven metal layer thickness on the integrated circuit substrate. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0021] Figure 1 A three-dimensional view of an electroplating device;

[0022] Figure 2 for Figure 1 Exploded view of part of the structure of electroplating equipment;

[0023] Figure 3 for Figure 1 An exploded view of another part of the electroplating equipment;

[0024] Figure 4 for Figure 1 An exploded view of another part of the electroplating equipment;

[0025] Figure 5 for Figure 1 A top view of part of the structure of a medium-sized electroplating equipment;

[0026] Figure 6 for Figure 5 A top view of another embodiment of the electroplating equipment;

[0027] Figure 7 for Figure 1 Side view of the electroplating equipment;

[0028] Figure 8 for Figure 1 Enlarged view of the structure at point A of the electroplating equipment;

[0029] In the attached drawings, the reference numerals are as follows: 1. Electroplating tank; 11. Tank body; 2. Supporting part; 21. Sliding assembly; 211. Pulley; 212. Slide rail; 2121. Limiting component; 22. Supporting assembly; 221. Supporting frame; 2211. Hanging rod; 2212. Frame body; 222. Placement clamp; 2222. Limiting hole; 223. Placement rod; 2231. Hook; 2232. Rod body; 224. Buffer assembly; 3. Limiting part; 31. Limiting groove; 32. Divider plate; 33. Blocking groove; 4. Anode plate; 5. Cathode plate. Detailed Implementation

[0030] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0031] It should be noted that all directional indicators in this utility model embodiment, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicator will also change accordingly.

[0032] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0033] To further understand the utility model's content, features, and effects, the following embodiments are provided, along with detailed descriptions in conjunction with the accompanying drawings:

[0034] like Figure 1 As shown, Figure 1 This utility model relates to an electroplating device, comprising: an electroplating tank 1, a support unit 2, two limiting units 3, and two anode plates 4. The electroplating tank 1 is used to hold the electroplating solution. In specific operation, such as... Figure 2 and Figure 3 As shown, the anode plate 4 is fixed to the support part 2, and the cathode plate 5 is hung on the support part 2. The cathode plate 4 and the anode 5 are placed into the electroplating tank 1 at the same time. During the electroplating operation, the support part 2 can slide on the top of the electroplating tank 1, so that the cathode plate 5 can fully contact the electroplating solution. At the same time, two limiting parts 3 are provided to prevent the anode 4 and the cathode plate 5 from colliding with the electroplating tank 1 when the support part 2 slides.

[0035] Specifically, such as Figure 4 , Figure 5 and Figure 6As shown, two limiting parts 3 are disposed at opposite ends inside the electroplating tank 1 and extend to the bottom wall of the electroplating tank 1. The limiting part 3 includes a limiting groove 31 and two partition plates 32. The two partition plates 32 are respectively connected to the two sides of the limiting groove 31, and the two partition plates 32 are also respectively connected to the two opposite inner walls of the electroplating tank 1. The groove opening of the limiting groove 31 in one limiting part 3 is directly opposite to the groove opening of the limiting groove 31 in the other limiting part 3. The bearing part 2 is slidably disposed on the top of the electroplating tank 1, and the sliding direction of the bearing part 2 is parallel to the limiting groove 31. Two anode plates 4 are fixed on the bearing part 2, and the two anode plates 4 are respectively disposed on the two sides of the limiting groove 31. Each anode plate 4 is located between the opposite partition plates 32. In actual operation, since both the anode plate 4 and the cathode plate 5 are mounted on the support part 2, the support part 2 can drive the anode plate 4 and the cathode plate 5 to move simultaneously within the electroplating tank 1. This avoids relative movement between the anode plate 4 and the cathode plate 5, prevents uneven current flow on the cathode plate 5, and avoids uneven metal layer thickness on the integrated circuit substrate. Simultaneously, a partition plate 32 is provided to prevent the anode plate 4 from colliding with the electroplating tank 1. However, since the cathode plate 5 is mounted on the support part 2, the cathode plate 5 will shift slightly when the support part 2 moves. Therefore, a limiting groove 31 is also provided within the electroplating tank 1 to place the cathode plate 5 between the limiting grooves 31, thus limiting the shift of the cathode plate 5. During electroplating, when the anode plate 4 contacts one side of the partition plate 32 in its movement path, it moves in the opposite direction to the other side of the partition plate 32.

[0036] It should be noted that, as Figure 5 and Figure 6 As shown, by combining the two limiting parts 3 with the cathode plate 5, the electroplating tank 1 is divided into two tanks 11 during electroplating. Thus, the electroplating tank 1 will function as two independent tanks 11 during operation. During the plating process, rectifiers are installed on one side of each of the two tanks 11. This allows the output current of the electroplating finishing machine to be adjusted according to the actual electroplating effect of the two tanks 11, resulting in a more uniform metal layer adhering to the substrate.

[0037] Specifically, such as Figure 7 As shown, the support part 2 includes a sliding component 21 and a support component 22. The sliding component 21 is slidably connected to the electroplating tank 1; the support component 22 is fixed on the sliding component 21. The support component 22 is used to hang the anode plate 4 and the cathode plate 5 during operation, and the sliding component 21 can drive the support component 22 to move back and forth inside the electroplating tank 1.

[0038] Specifically, such as Figure 7As shown, the sliding assembly 21 includes multiple pulleys 211 and multiple slide rails 212. The slide rails 212 are respectively disposed on the top of the electroplating tank 1, and are parallel to the limiting groove 31. The multiple pulleys 211 are respectively disposed on the bottom of the bearing assembly 22, and each pulley 211 is slidably disposed on a corresponding slide rail 212. By sliding the pulleys 211 on the slide rails 212, the bearing assembly 22 is driven to perform reciprocating motion.

[0039] Specifically, such as Figure 3 and Figure 7 As shown, the support assembly 22 includes a support frame 221, a placement clip 222, and a placement rod 223. A sliding assembly 21 is arranged around the bottom of the support frame 221. The placement clip 222 is located at both ends of the support frame 221. The placement rod 223 is mounted on the placement clip 222 and is positioned directly above the openings of the two limiting grooves 31. The placement clip 222 is used to fix the placement rod 223, preventing the cathode 5 mounted on the placement rod 223 from shifting.

[0040] Specifically, such as Figure 3 As shown, the support frame 221 is also provided with two hanging rods 2211 and a frame 2212. The sliding component 21 is located at the bottom of the frame 2212, and the two hanging rods 2211 are arranged on the frame 2212 along the sliding direction parallel to the sliding component 21.

[0041] Among them, such as Figure 3 As shown, two anode plates 4 are fixed on the two hanging rods 2211 respectively. When the support frame 221 moves at the top of the electroplating tank 1, the two anode plates 4 can reciprocate with the support frame 221 within the electroplating tank 1. The frame 2212 is rectangular. In this example, four pulleys 211 are used, which are respectively set at the four corners of the rectangle. Each pulley 211 is slidably set on the slide rail 212. The pulleys 211 drive the support frame 221 to reciprocate horizontally at the top of the electroplating tank 1, so that the anode plates 4 and cathode plates 5 can reciprocate within the electroplating tank 1.

[0042] It should be noted that, in actual operation, after the anode 5 is fixed on the two hanging rods 2211, the cathode plate 5 is hung on the placement rod 223. The cathode plate 5 is an integrated circuit carrier plate. The pulley 211 can drive the carrier frame 221 to move on the slide rail 212. Thus, the cathode plate 4 and the anode plate 5 can move back and forth in the electroplating tank, so that the cathode plate 4 and the anode plate 5 can fully contact the electroplating solution and better attach the metal ions in the electroplating solution to the integrated circuit carrier plate.

[0043] like Figure 2As shown, the placement rod 223 includes two hooks 2231 and a rod body 2232. Preferably, the two hooks 2231 are located at both ends of the rod body 2232. In actual operation, since the electroplating solution is corrosive, and to prevent damage to the integrated circuit carrier board mounted on the placement rod 223, a crane is used to lift the hooks 2231 to raise the entire rod body 2232, further avoiding manual operation and preventing personnel injury.

[0044] Preferably, such as Figure 3 and Figure 7 As shown, the support component 22 also includes a plurality of buffer components 224, one end of each buffer component 224 being fixed to the support frame 221 and the other end being connected to the placement clip 222.

[0045] In this example, the buffer assembly 224 is a shock-absorbing rubber block. The buffer assembly 224 is respectively disposed on both sides of the placement clamp 222 and is in contact with the support frame 221. The buffer assembly 224 can reduce vibration when the support rod 223 is placed on the placement clamp 222. In actual operation, when the crane places the placement rod 223 on the placement clamp 222, the placement clamp 222 will vibrate. Since the integrated circuit carrier board is the cathode 5, the vibration will affect the components on the integrated circuit carrier board. Therefore, in order to prevent the components on the integrated circuit carrier board from being affected, the buffer assembly 224 is used to reduce the vibration of the placement rod 223 during placement.

[0046] Preferably, such as Figure 6 As shown, the electroplating equipment also includes two abutment grooves 33, the openings of which extend out of the limiting grooves 31. The width of the abutment grooves 33 is smaller than the width of the limiting grooves 31. Each limiting groove 31 contains an abutment groove 33, and there is a gap between the bottom wall of the abutment groove 33 and the bottom wall of the limiting groove 31. Because the limiting groove 31 has a larger width, the abutment grooves 33 can reduce the width of the limiting groove 31, thereby better restricting the movement trajectory of the cathode plate 5. At the same time, it can also better divide the electroplating tank 1 into two independent tank bodies 11, preventing the currents of the rectifiers on both sides of the tank body 11 from affecting each other.

[0047] Among them, review Figure 4 The baffle 33 is set in a "Y" shape. During operation, the operator can observe the working condition of the cathode plate 5 in the electroplating tank 1 through the opening above the "Y" shape. At the same time, the baffle can better divide the electroplating tank 1 into two tanks 11 to ensure that the current of the rectifiers on both sides of the tank will not affect each other.

[0048] Preferably, such as Figure 1 and Figure 8As shown, limiters 2121 are also provided at both ends of the slide rail 212. When the pulley 211 drives the support frame 221 to slide, in order to prevent the pulley 211 from slipping off the slide rail 212 when it slides on the slide rail 212, limiters 2121 are installed at both ends of the slide rail 212 to prevent the pulley 212 from slipping off the slide rail.

[0049] Preferably, such as Figure 7 As shown, the edge of the placement clamp 222 is also provided with limiting holes 2222, which are located on the same side as the adjusting wheel assembly 2221. When it is necessary to adjust the position of the placement clamp 222, the adjusting wheel assembly 2221 is moved for adjustment. Multiple limiting holes 2222 are located on the same side as the buffer assembly 224.

[0050] The placement clip 222 can be fixed by screws through the limiting hole 2222 to prevent the placement clip 222 from shifting.

[0051] In summary, the electroplating equipment of this utility model, through the two limiting parts 3, divides the electroplating tank 1 into two tank bodies 11 with the cathode plate 5 during operation, thus forming two non-interfering tank bodies 11 during operation. During electroplating, rectifiers are respectively installed on one side of each of the two tank bodies 11, and the rectifiers are connected to the anode plates 4. Therefore, two electric fields are formed between the two anode plates 4 and the two sides of the cathode plate 5 within the two tank bodies 11. Because the electroplating tank 1 forms two non-interfering tank bodies 11 during operation, the current from the two rectifiers can act on the two sides of the cathode plate 5 respectively, and the currents from the two rectifiers will not affect each other, thereby improving the efficiency of electroplating the integrated circuit substrate serving as the cathode plate 5.

[0052] Therefore, the output current of the rectifier can be adjusted according to the electroplating effect of the two cylinders 11 in actual operation, thereby adjusting the intensity between the two electric fields so that the metal layer attached to the carrier plate is more uniform.

[0053] The above are merely embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. An electroplating device, characterized in that, The utility model relates to an electroplating tank, which comprises a bearing part (2), two limiting parts (3) and two anode plates (4), the two limiting parts (3) are arranged at opposite ends of the electroplating tank (1) and extend to the bottom wall of the electroplating tank (1), each limiting part (3) comprises a limiting groove (31) and two partition plates (32), the two partition plates (32) are connected to the two sides of the limiting groove (31) respectively, and the two partition plates (32) are connected to the two inner walls of the electroplating tank (1) respectively, the opening of the limiting groove (31) in one limiting part (3) is opposite to the opening of the limiting groove (31) in the other limiting part (3), the bearing part (2) is arranged on the top of the electroplating tank (1) in a sliding mode, the sliding direction of the bearing part (2) is parallel to the limiting groove (31), the two anode plates (4) are fixed on the bearing part (2), and the two anode plates (4) are arranged on the two sides of the limiting groove (31) respectively, and each anode plate (4) is located between the opposite partition plates (32). The anode plate (4) and the cathode plate (5) are arranged on the bearing part (2), and the bearing part (2) can drive the anode plate (4) and the cathode plate (5) to move simultaneously in the electroplating tank (1). The two limiting parts (3) combine the cathode plate (5), the electroplating tank (1) is divided into two cylinder bodies (11) during electroplating work, so that the electroplating tank (1) forms two cylinder bodies (11) that do not interfere with each other during work. The bearing part (2) comprises a sliding assembly (21) and a bearing assembly (22), the sliding assembly (21) is connected to the electroplating tank (1) in a sliding mode, and the bearing assembly (22) is fixed on the sliding assembly (21), and the two anode plates (4) are fixed on the bearing assembly (22).

2. The electroplating apparatus of claim 1, wherein The sliding assembly (21) comprises a plurality of pulleys (211) and a plurality of slide rails (212), the plurality of slide rails (212) are arranged on the top of the electroplating tank (1) in a distributed mode, the slide rails (212) are parallel to the limiting groove (31), and the plurality of pulleys (211) are arranged on the bottom of the bearing assembly (22) respectively, and each pulley (211) is arranged on a corresponding slide rail (212) in a sliding mode.

3. An electroplating apparatus according to claim 2, wherein The bearing assembly (22) comprises a bearing frame (221), a placing clamp (222) and a placing rod (223), the sliding assembly (21) is arranged around the bottom of the bearing frame (221), the placing clamp (222) is arranged at the two ends of the bearing frame (221), the placing rod (223) is arranged on the placing clamp (222), and the placing rod (223) is located directly above the openings of the two limiting grooves (31).

4. An electroplating apparatus according to claim 2 or 3, wherein The bearing frame (221) comprises two hanging rods (2211) and a frame body (2212), the sliding assembly (21) is arranged at the bottom of the frame body (2212), the two hanging rods (2211) are arranged on the frame body (2212) in a direction parallel to the sliding direction of the sliding assembly (21), and each hanging rod (2211) is provided with an anode plate (4).

5. An electroplating apparatus according to claim 4, wherein ​ 6. The electroplating apparatus of claim 4, wherein, The placing rod (223) comprises two hooks (2231) and a rod body (2232), the two hooks (2231) are arranged at two ends of the rod body (2232), the rod body (2232) is arranged on the placing clamp (222), and the rod body (2232) is located directly above the slot of the two limiting grooves (31).

7. The electroplating apparatus of claim 4, wherein, The bearing assembly (22) further comprises a plurality of buffer assemblies (224), one end of each buffer assembly (224) is fixed on the bearing frame (221), and the other end is connected with the placing clamp (222).

8. The electroplating apparatus of any one of claims 1-3, wherein, The two resisting grooves (33) are arranged in the limiting grooves (31), the slot of the resisting groove (33) extends out of the limiting groove (31), the slot width of the resisting groove (33) is smaller than that of the limiting groove (31), one resisting groove (33) is embedded in each limiting groove (31), and a spacing is formed between the groove bottom wall of the resisting groove (33) and the groove bottom wall of the limiting groove (31).

9. The electroplating apparatus of claim 3, wherein, Limiting pieces (2121) are further arranged at two ends of the plurality of slide rails (212).

10. The electroplating apparatus of claim 7, wherein, The edge of the placing clamp (222) is further provided with a plurality of limiting holes (2222), and the plurality of limiting holes (2222) and the buffer assemblies (224) are arranged on the same side.

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