Protective LED lamp bead structure

Abstract

The utility model discloses a protective LED lamp bead structure, which relates to the technical field of LED lamp beads and comprises a ceramic substrate body, an LED chip component is welded at the top of the ceramic substrate body, copper radiating fins are fixedly connected at the bottom of the ceramic substrate body, and an optical lens component is in threaded connection with the top of the ceramic substrate body. Through the arrangement of the copper heat dissipation fins and the ceramic substrate body, the heat dissipation and safety effects are achieved when a person operates the device, the copper heat dissipation fins are in a multi-layer sheet array, the heat dissipation surface area is increased, ventilation gaps are reserved between the fins, heat dissipation is accelerated through cooperation with an external fan or natural convection, the lamp replacement frequency is reduced, and the service life of the lamp is prolonged. Resource waste is reduced, the long-term and uninterrupted operation requirement of the lighting system is met, heat is continuously taken away, the heat dissipation effect is enhanced, it is ensured that the working temperature of the LED chip is maintained within a safety interval, the LED lamp is suitable for long-time continuous lighting scenes, and the reliability of the lighting system is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, specifically a protective LED lamp bead structure. Background Technology

[0002] In today's rapidly evolving lighting technology, LED chips, as a core component of the next generation of lighting sources, have deeply penetrated diverse fields such as daily life, industrial production, outdoor landscaping, and automotive lighting. Although LED lighting has significant advantages over traditional incandescent and fluorescent lamps, such as low energy consumption, high luminous efficiency, and long lifespan, its wide range of applications also places stringent demands on the performance of LED chips. The traditional structure of LED chips has revealed many shortcomings that urgently need to be addressed in practical use. An LED chip is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electricity into light. LED chips are widely used in many production fields such as decorative lighting, LED large-screen displays, traffic lights, advertising, and urban lighting projects.

[0003] Utility model announcement CN207458982U discloses a novel structure for ceramic LED beads, comprising a substrate, four transparent lenses placed above the substrate, and four LED chips. Each LED chip is fixed above the substrate and placed inside a transparent lens. This novel structure for ceramic LED beads improves the brightness and performance of the LED beads.

[0004] When using the above technical solution,

[0005] (1) In terms of heat dissipation, LED chips generate a lot of heat when they are working. If the heat dissipation is not smooth, the chip temperature will rise sharply, which will not only greatly reduce the luminous efficiency, but also greatly reduce the service life, and even cause catastrophic consequences such as chip burnout.

[0006] (2) Conventional LED beads have insufficient protection in their packaging, and moisture can easily enter the interior, causing short circuits and oxidation of the chip pins, which seriously affects the conductivity and light-emitting stability of the beads; dust accumulation will block the light propagation path, reduce the light output efficiency, and accelerate chip aging.

[0007] To address the above problems, this utility model provides a protective LED bead structure. Utility Model Content

[0008] The purpose of this invention is to provide a protective LED bead structure. This invention provides an LED bead structure that can operate stably in complex environments and has efficient heat dissipation, good optical performance and reliable protection functions, thereby solving the problems in the background technology.

[0009] To achieve the above objectives, this utility model provides the following technical solution: a protective LED bead structure, comprising a ceramic substrate body, an LED chip assembly welded to the top of the ceramic substrate body, a copper heat sink fin fixedly connected to the bottom of the ceramic substrate body, an optical lens assembly threadedly connected to the top of the ceramic substrate body, a sealing ring fixedly connected to the bottom of the optical lens assembly, a protective component threadedly connected to the bottom of the ceramic substrate body, and a fixing component threadedly connected to the bottom of the protective component.

[0010] Furthermore, the LED chip assembly includes an LED chip soldered to the top of the ceramic substrate body, and a flexible silicone sealing layer is fixedly connected around the LED chip to achieve a sealing effect.

[0011] Furthermore, the optical lens assembly includes an optical lens threadedly connected to one side of the top of the ceramic substrate body, and a limiting member is threadedly connected to one side of the optical lens to achieve the function of illumination.

[0012] Furthermore, the protective component includes a protective housing threaded to the bottom of the ceramic substrate body, and a bolt is threaded to the top of the protective housing to achieve the protective function.

[0013] Furthermore, the fixing component includes a fixing plate fixedly connected to the bottom of the protective component. The top of the fixing plate is threaded with fasteners, and the front of the fixing plate has holes to achieve the function of connection and fixing.

[0014] Furthermore, the optical lens is made of high borosilicate glass, and the surface of the optical lens is coated with multiple anti-reflection films. The surface of the LED chip is coated with a fluorescent layer, thereby achieving the effect of reducing reflection.

[0015] Furthermore, the copper heat dissipation fins are arranged in a multi-layered array, with ventilation gaps between the fins to achieve the function of heat dissipation.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] This utility model provides a protective LED bead structure.

[0018] (1) By setting up copper heat dissipation fins and ceramic substrate body, the personnel can achieve heat dissipation and safety when operating the device. The copper heat dissipation fins are in a multi-layer plate array, which increases the heat dissipation surface area. Ventilation gaps are reserved between the fins. With the help of external fans or natural convection, heat dissipation is accelerated, the frequency of lamp replacement is reduced, and resource waste is reduced. It meets the long-term and uninterrupted operation requirements of the lighting system, continuously removes heat, enhances the heat dissipation effect, and ensures that the LED chip operating temperature is maintained in a safe range. It is suitable for long-term continuous lighting scenarios and improves the reliability of the lighting system.

[0019] (2) By setting up sealing rings and protective components, the personnel can achieve the effect of protection when operating the device. The protective shell and the flexible silicone sealing layer provide double protection, which is effective in waterproofing, dustproofing and insect prevention. It can operate stably in humid, dusty and insect-infested environments, reduce failures caused by environmental factors, extend service life, and reduce the cost and manpower consumption caused by frequent replacements. The LED chip welding process combined with the silicone sealing layer protection can prevent chip pin oxidation and short circuits. Even in environments with large temperature fluctuations, it can ensure the stability of the chip electrical connection. Moreover, the soft texture of silicone will not cause physical damage to the chip and fits the characteristics of chip thermal expansion and contraction. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the ceramic substrate body of this utility model;

[0021] Figure 2 This is a schematic diagram of the LED chip of this utility model;

[0022] Figure 3 This is a schematic diagram of the copper heat dissipation fins of this utility model;

[0023] Figure 4 This is a schematic diagram of the optical lens of this utility model;

[0024] Figure 5 This is a schematic diagram of the flexible silicone sealing layer of this utility model.

[0025] In the figure: 1. Ceramic substrate body; 2. LED chip assembly; 201. LED chip; 202. Flexible silicone sealing layer; 3. Copper heat dissipation fins; 4. Optical lens assembly; 401. Optical lens; 402. Limiting component; 5. Sealing ring; 6. Protective assembly; 601. Protective shell; 602. Bolt; 7. Fixing assembly; 701. Fixing plate; 702. Fastener. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] To solve the problem of how to effectively position and adjust the technology, such as Figure 1-5 As shown, the following preferred technical solutions are provided:

[0028] A protective LED chip structure includes a ceramic substrate body 1. An LED chip assembly 2 is welded to the top of the ceramic substrate body 1. The LED chip assembly 2, through a flexible silicone sealing layer 202, prevents oxidation and short circuits of the LED chip 201's pins. Even under environments with significant temperature fluctuations, it ensures stable electrical connections of the LED chip 201, thus achieving a stable protective effect. A copper heat sink fin 3 is fixedly connected to the bottom of the ceramic substrate body 1. The copper heat sink fin 3 accelerates heat dissipation, continuously removes heat, and enhances the heat dissipation effect, thereby achieving a heat dissipation effect. An optical lens assembly 4 is threadedly connected to the top of the ceramic substrate body 1. By setting the optical lens assembly 4, the light distribution can be precisely adjusted, enabling on-demand switching between focused and diffused light, improving lighting efficiency, and thus increasing brightness. A sealing ring 5 is fixedly connected to the bottom of the optical lens assembly 4. The sealing ring 5 can seal the gaps between the optical lens assemblies 4, thus achieving a sealing effect. A protective assembly 6 is threadedly connected to the bottom of the ceramic substrate body 1, and a fixing assembly 7 is threadedly connected to the bottom of the protective assembly 6. The protective assembly 6 and the fixing assembly 7 can protect the entire device and prevent damage. The fixing assembly 7 connects and fixes the device body to prevent it from falling and being damaged, thus achieving a fixing effect.

[0029] Specifically, when operating the device, the operator should tightly attach the copper heat sink 3 to the bottom of the ceramic substrate body 1 to ensure that the copper heat sink 3 is in a precise and stable position. Then, screw the optical lens 401 into the corresponding threaded interface on the top of the ceramic substrate body 1 and tighten the limiting member 402 to securely lock the lens position. At the same time, check the integrity of the sealing ring 5 to ensure that it fits tightly against the ceramic substrate and performs its sealing function.

[0030] Furthermore, such as Figure 5 As shown, the following preferred technical solutions are provided:

[0031] The LED chip assembly 2 includes an LED chip 201 soldered to the top of the ceramic substrate body 1. A flexible silicone sealing layer 202 is fixedly connected around the LED chip 201. The purpose of this design is to protect the LED chip 201 through the flexible silicone sealing layer 202, thereby achieving the effect of protection.

[0032] Furthermore, such as Figure 3 As shown, the following preferred technical solutions are provided:

[0033] The optical lens assembly 4 includes an optical lens 401 that is threaded to one side of the top of the ceramic substrate body 1. One side of the optical lens 401 is threaded to a limiting member 402. The purpose of this design is to connect and fix the optical lens 401 through the limiting member 402, thereby achieving the effect of connection and fixation.

[0034] Furthermore, such as Figure 1 As shown, the following preferred technical solutions are provided:

[0035] The protective component 6 includes a protective housing 601 that is threaded to the bottom of the ceramic substrate body 1. The top of the protective housing 601 is threaded with a bolt 602. The purpose of this design is to fix the protective housing 601 to the bottom of the ceramic substrate body 1 with the bolt 602 to protect the copper heat sink fins 3, thereby achieving the protective effect.

[0036] Furthermore, such as Figure 2 As shown, the following preferred technical solutions are provided:

[0037] The fixing component 7 includes a fixing plate 701 fixedly connected to the bottom of the protective component 6. The top of the fixing plate 701 is threaded with a fastener 702. The front of the fixing plate 701 has holes. The purpose of this design is to connect and fix the entire device through the fixing plate 701 and the fastener 702, thereby achieving the effect of connection and fixation.

[0038] Furthermore, such as Figure 2 As shown, the following preferred technical solutions are provided:

[0039] The optical lens 401 is made of high borosilicate glass and has a multi-layer anti-reflective coating on its surface. The LED chip 201 is coated with a phosphor layer. The purpose of this design is to precisely adjust the light distribution through the optical lens 401, so as to achieve on-demand switching between focused and diffused light, improve lighting efficiency, and thus achieve the lighting effect.

[0040] Furthermore, such as Figure 1 As shown, the following preferred technical solutions are provided:

[0041] The copper heat dissipation fins 3 are arranged in a multi-layered array, with ventilation gaps between the fins. This design aims to improve heat dissipation, maintain the stability of the device, and thus achieve a safe effect.

[0042] Working principle:

[0043] First, in a dust-free, temperature-controlled environment, the LED chip 201 is precisely soldered to the preset position on the top of the ceramic substrate body 1, ensuring a firm solder joint and good electrical connection. Next, a flexible silicone sealing layer 202 is evenly coated around the LED chip 201, allowing the silicone to cure naturally and form a preliminary protective barrier. Then, the copper heat sink 3 is tightly fitted to the bottom of the ceramic substrate body 1, ensuring the copper heat sink 3 is accurately and stably positioned. Afterward, the optical lens 401 is screwed into the corresponding threaded interface on the top of the ceramic substrate body 1, and the limiting member 402 is tightened to securely lock the lens in position. Simultaneously, the integrity of the sealing ring 5 is checked to ensure it fits tightly against the ceramic substrate and performs its sealing function. Subsequently, the protective shell 601 is threaded to the bottom of the ceramic substrate body 1, ensuring a tight and airtight connection between the shell and the substrate, without any looseness or gaps. Finally, the solidified... The bottom of the mounting plate 701 is aligned and attached to the protective component 6. The fastener 702 is screwed in. According to the installation scenario requirements, a suitable hole position is selected, and the lamp bead structure is securely installed to the external carrier. When the lamp bead is powered on, the LED chip 201 is excited and begins to emit light. After the light is refracted, reflected and enhanced by the anti-reflection film of the optical lens 401, it is accurately emitted according to the predetermined optical design to meet the lighting scenario requirements. The large amount of heat generated by the chip is quickly conducted to the copper heat sink fins 3 through the ceramic substrate body 1. With the help of natural convection formed by the ventilation gaps between the fins, or with the assistance of an external fan, the heat is efficiently dissipated to the surrounding environment with the airflow, maintaining the low temperature operation of the chip. The protective shell 601 blocks the intrusion of external impurities such as dust, water vapor, and insects throughout the process. The flexible silicone sealing layer 202 prevents internal water vapor condensation and chip pin damage, ensuring stable electrical performance.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A protective LED lamp bead structure comprising a ceramic substrate body (1), characterized in that: The top of the ceramic substrate body (1) is welded with an LED chip assembly (2), the bottom of the ceramic substrate body (1) is fixedly connected with a copper heat sink fin (3), the top of the ceramic substrate body (1) is threaded with an optical lens assembly (4), the bottom of the optical lens assembly (4) is fixedly connected with a sealing ring (5), the bottom of the ceramic substrate body (1) is threaded with a protective assembly (6), and the bottom of the protective assembly (6) is threaded with a fixing assembly (7).

2. The protective LED lamp bead structure according to claim 1, characterized in that: The LED chip assembly (2) includes an LED chip (201) soldered to the top of the ceramic substrate body (1), and a flexible silicone sealing layer (202) is fixedly connected around the LED chip (201).

3. The protective LED lamp bead structure according to claim 1, characterized in that: The optical lens assembly (4) includes an optical lens (401) threaded to one side of the top of the ceramic substrate body (1), and a limiting member (402) is threaded to one side of the optical lens (401).

4. The protective LED bead structure according to claim 1, characterized in that: The protective component (6) includes a protective housing (601) threaded to the bottom of the ceramic substrate body (1), and a bolt (602) threaded to the top of the protective housing (601).

5. The protective LED bead structure according to claim 1, characterized in that: The fixing component (7) includes a fixing plate (701) fixedly connected to the bottom of the protective component (6), the top of the fixing plate (701) is threaded with a fastener (702), and the front of the fixing plate (701) has a hole.

6. The protective LED bead structure according to claim 1, characterized in that: The optical lens (401) is made of high borosilicate glass, and the surface of the optical lens (401) is coated with a multi-layer anti-reflection film. The surface of the LED chip (201) is coated with a fluorescent layer.

7. The protective LED bead structure according to claim 4, characterized in that: The copper heat dissipation fins (3) are arranged in a multi-layered sheet array, with ventilation gaps between the fins.

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