5G double-vision thermal difference fault detection equipment
By installing thermal imaging probes and 5G detection terminals at the front and rear ends of cable joints, the problems of accuracy and real-time detection of cable joint faults have been solved, enabling efficient and real-time monitoring and management of cable faults.
Patent Information
- Application Number
- CN202423319663.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing fault detection methods for cable joints suffer from low accuracy, poor real-time performance, and data transmission delays, particularly in the centralized monitoring of multiple joints.
The equipment employs a 5G dual-view thermal differential fault detection system, which includes a 5G detection terminal and at least two thermal imaging probes. The probes are fixed at the front and rear ends of the cable intermediate joint. Temperature data is analyzed through a data processing module, and real-time data transmission and early warning are achieved using a 5G communication module.
It improves the accuracy of cable fault diagnosis, enables real-time centralized control of cable faults, shortens fault information transmission time, and enhances the response speed and management capabilities for faults.
Smart Images

Figure CN223796139U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power cable fault detection technology, and in particular to a 5G dual-view thermal differential fault detection device. Background Technology
[0002] In power systems, cable joints are weak points in cable lines, and their failures can lead to serious problems such as power outages. Currently, there are several methods for detecting faults in cable joints: traditional manual inspection, where workers periodically perform visual inspections and temperature measurements. This method is inefficient and difficult to implement in real-time. Some detection equipment based on single thermal imaging technology can detect the temperature of cable joints, but lacks comparative analysis, limiting the accuracy of fault identification. Some remote monitoring systems exist, but they suffer from data transmission delays, limited transmission capacity, and difficulties in centralized monitoring of multiple joints. Utility Model Content
[0003] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a 5G dual-view thermal difference fault detection device with high fault detection accuracy.
[0004] The technical solution adopted by this utility model is:
[0005] A 5G dual-view thermal difference fault detection device includes a 5G detection terminal and at least two thermal imaging probes. Each thermal imaging probe is connected to the 5G detection terminal via a probe lead. Each thermal imaging probe is fixed at the front and rear ends of a cable intermediate joint. The input end of the thermal imaging probe is used to collect temperature data of the front and rear ends of the cable.
[0006] Furthermore, the 5G detection terminal also includes a data processing module. The input end of the data processing module is connected to the output end of each of the thermal imaging probes. The data processing module is used to input the front and rear temperature data and output cable fault signals.
[0007] Furthermore, the 5G detection terminal also includes a 5G communication module. The output end of the data processing module is connected to the input end of the 5G communication module. The 5G communication module is used to input the cable fault signal and output a communication warning signal.
[0008] Furthermore, the 5G testing terminal also includes a communication level debugging module, and the 5G communication module is connected to the communication level debugging module.
[0009] Furthermore, the 5G detection terminal also includes a power module, and the input terminals of the data processing module, the 5G communication module, and each of the thermal imaging probes are all connected to the output terminal of the power module.
[0010] Furthermore, the 5G dual-view thermal difference fault detection device also includes a mounting bracket, fastening screws, and a universal joint. The thermal imaging probe is connected to the mounting bracket via the fastening screws and the universal joint.
[0011] Furthermore, the 5G testing terminal also includes a protective shell, and the data processing module, the 5G communication module, and the power module are all located inside the protective shell.
[0012] Furthermore, the 5G testing terminal is equipped with a power inlet port, which is used to connect to an external power source.
[0013] Furthermore, the 5G detection terminal is equipped with a probe outlet, which is used to connect the probe lead.
[0014] Furthermore, the 5G detection terminal is equipped with an antenna interface for inserting a 5G antenna.
[0015] The beneficial effects of this invention are as follows: It includes a 5G detection terminal and at least two thermal imaging probes. Each thermal imaging probe is connected to the 5G detection terminal via probe leads and is fixed at both ends of the cable joint. The thermal imaging probes collect temperature data from both ends of the cable. The 5G detection terminal outputs cable fault signals and communication warning signals based on the collected temperature data, thus achieving cable fault detection and communication warning. This invention improves the accuracy of cable fault diagnosis by setting thermal imaging probes at both ends of the cable joint to collect temperature data. Furthermore, by utilizing 5G technology for communication warning, it enables real-time centralized control of temperature faults in a large number of cable joints. Attached Figure Description
[0016] Figure 1 A structural block diagram of a 5G dual-view thermal difference fault detection device provided by this utility model;
[0017] Figure 2 A circuit diagram of the thermal imaging probe provided by this utility model;
[0018] Figure 3 The circuit schematic diagram of the main processor provided by this utility model;
[0019] Figure 4 Circuit schematic diagram of the data storage section provided by this utility model;
[0020] Figure 5 Circuit schematic diagram of the 5G communication module provided by this utility model;
[0021] Figure 6 Circuit schematic diagram of the communication level debugging module provided by this utility model;
[0022] Figure 7 The circuit schematic diagram of the power supply module provided by this utility model;
[0023] Figure 8 A schematic diagram of the structure of a 5G dual-view thermal difference fault detection device provided by this utility model.
[0024] Reference numerals: J3, third interface; J4, fourth interface; Q1, first transistor; Q2, second transistor; Q3, third transistor; Q4, fourth transistor; Q5, fifth transistor; Q6, sixth transistor; U1, first chip; U2, second chip; U3, third chip; U4, fourth chip; U5, fifth chip; U7, seventh chip; U8, eighth chip; R51, resistor; C22, capacitor; FB1, first ferrite bead; FB2, second ferrite bead; FB3, third ferrite bead; FB4, fourth ferrite bead; 01, thermal imaging probe; 101, mounting bracket; 102, fastening screw; 103, universal joint; 104, probe lead wire; 105, protective housing; 106, power inlet; 107, probe outlet; 108, 5G antenna. Detailed Implementation
[0025] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0026] In power systems, cable joints are weak points in cable lines, and their failures can lead to serious problems such as power outages. Currently, there are several methods for detecting faults in cable joints: traditional manual inspection, where workers periodically perform visual inspections and temperature measurements. This method is inefficient and difficult to implement in real-time. Some detection equipment based on single thermal imaging technology can detect the temperature of cable joints, but lacks comparative analysis, limiting the accuracy of fault identification. Some remote monitoring systems exist, but they suffer from data transmission delays, limited transmission capacity, and difficulties in centralized monitoring of multiple joints.
[0027] In terms of accuracy: a single thermal imaging device cannot simultaneously compare and inspect the front and rear ends of a cable joint, and cannot accurately identify potential faults caused by uneven heat conduction. For example, when one end of a cable joint starts to heat up due to poor local contact, while the other end is at a normal temperature, a single thermal imaging device may not be able to detect this potential local fault in time.
[0028] In terms of real-time performance: Traditional detection methods rely on manual inspections, which cannot capture information about the moment a fault occurs in a timely manner.
[0029] Regarding data transmission: Some existing remote monitoring systems are prone to delays and packet loss when transmitting large amounts of real-time temperature data, which affects the timely judgment and handling of faults.
[0030] To address this issue, this invention proposes a 5G dual-view thermal imaging fault detection device, comprising a 5G detection terminal and at least two thermal imaging probes. Each thermal imaging probe is connected to the 5G detection terminal via probe leads and is fixed at both ends of a cable joint. The probes collect temperature data from both ends of the cable. The 5G detection terminal outputs cable fault signals and communication warning signals based on the collected temperature data, thus achieving cable fault detection and communication warning. This invention improves the accuracy of cable fault diagnosis by using thermal imaging probes at both ends of the cable joint to collect temperature data, and the use of 5G technology for communication warning enables real-time centralized control of temperature faults in a large number of cable joints.
[0031] Reference Figure 1 , Figure 1 This is a structural block diagram of a 5G dual-view thermal differential fault detection device. The 5G dual-view thermal differential fault detection device includes a 5G detection terminal and at least two thermal imaging probes 01. Each thermal imaging probe 01 is connected to the 5G detection terminal through a probe lead 104. Each thermal imaging probe 01 is fixed at the front and rear ends of the cable intermediate joint. The input end of the thermal imaging probe 01 is used to collect the temperature data of the front and rear ends of the cable.
[0032] Specifically, in this embodiment of the invention, at least two thermal imaging probes 01 are used to simultaneously detect the front and rear ends of the same cable joint. During installation, the two thermal imaging probes 01 are fixed at appropriate distances and angles before and after the cable joint to ensure accurate acquisition of temperature information at both ends. It should be noted that the number of thermal imaging probes 01 can be set according to actual needs, for example, expanded to 4-channel thermal imaging probes, 6-channel thermal imaging probes, etc.
[0033] For example, when using a 2-channel thermal imaging probe 01, such as Figure 2 The diagram shows a circuit schematic of a thermal imaging probe. The third interface J3 and the fourth interface J4 are used to connect to the thermal imaging sensor to collect temperature data from the front and rear ends. The thermal imaging sensor is a high-resolution, high-sensitivity thermal imaging probe to ensure accurate acquisition of temperature data from the cable joint. The third transistor Q3, the fourth transistor Q4, the fifth transistor Q5, and the sixth transistor Q6 form a combined switching circuit for power management of the infrared imaging probe.
[0034] Reference Figure 1 As an optional implementation, the 5G detection terminal also includes a data processing module. The input end of the data processing module is connected to the output end of each thermal imaging probe 01. The data processing module is used to input front-end and back-end temperature data and output cable fault signals.
[0035] Specifically, the data processing module is connected to the thermal imaging probe 01 to receive the front and rear temperature data collected by the probe. Under normal conditions, the temperature collected by thermal imaging of power cables is basically consistent. Under the influence of current, the temperature in the cable area will be greater than or equal to the ambient temperature, with the highest temperature appearing in the cable area. When the cable joint is abnormal, localized heating will occur. The data processing module compares the imaging area by region, outputs the highest temperature difference data between the front and rear ends, and then compares the temperature difference data with a preset temperature difference threshold (e.g., within the range of 5℃-10℃). If the preset temperature difference threshold is exceeded, a cable fault signal is output. The data processing module can quickly and accurately process a large number of temperature data points, find the highest real-time temperature value between the front and rear ends, and obtain the temperature difference.
[0036] In some alternative embodiments, such as Figure 3 The diagram shows the circuit schematic of the main processor. The first chip, U1, is used for temperature data acquisition and calculation. Chip U1 employs a high-performance ARM microprocessor chip, combined with a specially written temperature data processing algorithm program, to form a data processing module. Resistor R51 and capacitor C22 form a power-on reset circuit, used to provide a reset signal to the main processor upon power-on. Figure 4 The circuit diagram shown is for the data storage section, where the fourth chip U4 and the fifth chip U5 are used to store data.
[0037] Reference Figure 1 As an optional implementation, the 5G detection terminal also includes a 5G communication module. The output of the data processing module is connected to the input of the 5G communication module. The 5G communication module is used to input cable fault signals and output communication warning signals.
[0038] Specifically, the 5G communication module is used to transmit the collected and processed temperature data, temperature difference data, and cable fault signals to the monitoring center in real time. For example, if the temperature difference data in the thermal imaging area exceeds a preset temperature difference threshold, an event flag and mailbox will be triggered. After receiving the event flag, the data processing module transmits the mailbox content to the monitoring center via the 5G module. The monitoring center can centrally process and analyze data from multiple 5G detection terminals, achieving real-time centralized control of temperature faults in a large number of cable joints. This 5G communication module can support simultaneous connection of multiple devices to ensure high-speed and stable data transmission, and maintain low-latency data transmission even in complex electromagnetic environments.
[0039] In some alternative embodiments, such as Figure 5 The diagram shows the circuit schematic of the 5G communication module. The second chip U2 is used to transmit data to the monitoring center via the 5G network. The first transistor Q1 and the second transistor Q2 are switching transistors used for level conversion.
[0040] Reference Figure 1 As an optional implementation, the 5G testing terminal also includes a communication level debugging module, and the 5G communication module is connected to the communication level debugging module.
[0041] Specifically, such as Figure 6 The circuit diagram shown is of the communication level debugging module. The seventh chip U7 and the eighth chip U8 are used for communication level conversion, and the first magnetic bead FB1, the second magnetic bead FB2, the third magnetic bead FB3 and the fourth magnetic bead FB4 are used for signal anti-interference processing.
[0042] Reference Figure 1 As an optional implementation, the 5G detection terminal also includes a power module, a data processing module, a 5G communication module, and the input terminals of each thermal imaging probe 01 are all connected to the output terminal of the power module.
[0043] Specifically, the power module is used to provide a stable power supply for the entire 5G testing terminal. It can use a rechargeable lithium battery or be directly connected to an AC220V external power supply to ensure normal operation in different application scenarios.
[0044] In some alternative embodiments, such as Figure 7 The circuit diagram of the power module is shown, in which the third chip U3 is used for voltage regulation.
[0045] As an optional implementation, the 5G testing terminal is equipped with a power inlet 106 for connecting to an external power source.
[0046] In some optional embodiments, each thermal imaging probe 01 works synchronously. When connected to an external power source through the power inlet port 106, each thermal imaging probe 01 can achieve real-time data acquisition at the second level under external power supply. When self-powered by a power module, the thermal imaging probe 01 can achieve real-time data acquisition at the minute level under self-powered mode, and obtain temperature information of the front and rear ends of the cable intermediate joint in real time, which can accurately and timely reflect abnormal temperature changes.
[0047] The above describes the composition and structure of the 5G testing terminal. The 5G testing terminal of this utility model can pass the electrostatic discharge immunity level 4, radio frequency electromagnetic field radiation immunity level 4, power frequency magnetic field immunity level 4, pulse magnetic field immunity level 4, and damped oscillation magnetic field immunity level 4.
[0048] Reference Figure 8 , Figure 8 The diagram shows the structure of a 5G dual-view thermal difference fault detection device. As an optional implementation, the 5G dual-view thermal difference fault detection device also includes a mounting bracket 101, fastening screws 102, and a universal joint 103. The thermal imaging probe 01 is connected to the mounting bracket 101 via the fastening screws 102 and the universal joint 103.
[0049] Reference Figure 8 As an optional implementation, the 5G detection terminal is provided with a probe outlet 107, which is used to connect the probe lead 104.
[0050] Specifically, each thermal imaging probe 01 is located at the rear end of the terminal, and the probe lead 104 is up to 5 meters long. Each thermal imaging probe 01 is fixed on a magnetic universal bracket and points in different directions to detect the front and rear ends of the cable joint. It can obtain all the temperature information of the same cable joint comprehensively and accurately under any circumstances.
[0051] Reference Figure 8 As an optional implementation, the 5G testing terminal also includes a protective housing 105, in which the data processing module, 5G communication module and power module are all located.
[0052] In some optional embodiments, the data processing module may be located in the center inside the protective housing 105, while the 5G communication module and power module may be located at opposite ends of the protective housing 105. The protective housing 105 may be designed as a cuboid shape with a rainproof, suspended structure.
[0053] Reference Figure 8 As an optional implementation, the 5G testing terminal is equipped with an antenna interface for inserting a 5G antenna 108.
[0054] In summary, the installation and debugging process of the 5G dual-view thermal differential fault detection equipment of this utility model is as follows: First, install the detection terminal in a suitable position near the cable intermediate joint. Use a special bracket to fix the detection terminal at a distance of approximately 0.5 to 1.5 meters from the cable intermediate joint, ensuring that each thermal imaging probe can accurately align with the front and rear ends of the cable intermediate joint. During the debugging process, first use a standard temperature source to calibrate the probes, ensuring the accuracy of temperature measurements by each thermal imaging probe. Then, using debugging tools, complete approximately three reports and comparisons of thermal imaging data within 5 minutes. Finally, check whether the 5G communication connection with the monitoring center is normal and whether the data transmission is stable. This can be tested by sending test data packets to ensure normal operation under different network environments.
[0055] The above description explains the structure and working principle of the 5G dual-view thermal difference fault detection device of this utility model. It can be understood that, compared with existing cable fault detection devices, this utility model has the following advantages:
[0056] I. Improved Accuracy: Through dual-view thermal differential detection, potential faults in cable joints can be accurately identified. For example, in actual testing, for some early-stage localized overheating faults, the 5G detection terminal of this invention has a probability of detecting potential faults more than 30% earlier than a single thermal imaging device.
[0057] II. Enhanced Real-Time Performance: Utilizing 5G technology enables real-time data transmission, allowing fault information to be promptly transmitted to the monitoring center. In simulated fault experiments, the time from the occurrence of a fault to the monitoring center receiving the alarm information was reduced to less than one second, significantly improving the response speed to faults.
[0058] III. Centralized Control Capability: It enables centralized monitoring of a large number of cable joints, facilitating power maintenance personnel's management of the entire power system's cable network. For example, a monitoring center can simultaneously manage hundreds of testing terminals, covering the testing tasks of thousands of cable joints.
[0059] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0060] In this utility model, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0062] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.
Claims
1. A 5G dual vision thermographic fault detection device, characterized by: The 5G detection terminal comprises a 5G detection terminal and at least two thermal imaging probes, each of the thermal imaging probes is connected with the 5G detection terminal through a probe lead, each of the thermal imaging probes is fixed to the front and rear ends of a cable intermediate joint, an input end of each of the thermal imaging probes is used to collect temperature data of the front and rear ends of the cable, the 5G detection terminal comprises a data processing module, an input end of the data processing module is connected with an output end of each of the thermal imaging probes, the data processing module is used to input the front and rear end temperature data and output a cable fault signal, the 5G detection terminal further comprises a 5G communication module, an output end of the data processing module is connected with an input end of the 5G communication module, the 5G communication module is used to input the cable fault signal and output a communication early warning signal, and the 5G detection terminal further comprises a communication level debugging module, the 5G communication module is connected with the communication level debugging module.
2. The 5G dual vision thermographic fault detection device of claim 1, wherein: The 5G detection terminal further comprises a power module, and the input ends of the data processing module, the 5G communication module and each of the thermal imaging probes are connected with an output end of the power module.
3. The 5G dual vision thermographic fault detection device of claim 1, wherein: The 5G double-view thermal difference fault detection device further comprises a mounting bracket, a fastening screw and a universal joint, and the thermal imaging probes are in transmission connection with the mounting bracket through the fastening screw and the universal joint.
4. The 5G dual-view thermographic fault detection device of claim 2, wherein: The 5G detection terminal further comprises a protective shell, and the data processing module, the 5G communication module and the power module are located in the protective shell.
5. The 5G dual vision thermographic fault detection device of claim 1, wherein: A power line inlet is arranged on the 5G detection terminal, and the power line inlet is used to access an external power supply.
6. The 5G dual vision thermographic fault detection device of claim 1, wherein: A probe lead outlet is arranged on the 5G detection terminal, and the probe lead outlet is used to access the probe lead.
7. The 5G dual vision thermographic fault detection device of claim 1, wherein: An antenna interface is arranged on the 5G detection terminal, and the antenna interface is used to insert a 5G antenna.