Test board for wafer aging

Abstract

A test board for wafer aging relates to the technical field of wafer test equipment, is used for performing aging test on a wafer in a wafer aging test fixture, and comprises a test drive board module, a lifting module, a translation module and a bearing table, the test drive board module comprises a drive board bottom board, a drive board assembly and a drive switching probe board, the lifting module comprises a testboard bottom plate and lifting cylinder assemblies on the two sides of the testboard bottom plate, the translation module comprises a translation bottom plate and a translation cylinder assembly at the bottom of the translation bottom plate, and the bearing table comprises a clamp carrying plate and a clamp base plate. The device is small in size and small in occupied space, in addition, the structure of the device is designed in a modularized mode, operation of testers is facilitated, testing efficiency is improved, and large-batch testing is achieved.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing equipment technology, and in particular to a test station for wafer aging. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal ingot forms a silicon wafer. After processes such as photolithography and etching, the wafer needs to undergo testing, one of which is aging testing.

[0003] The existing wafer aging test equipment has the following problems: 1. The equipment is large in size and occupies a lot of space; 2. The equipment structure is complex, making it inconvenient for testers to operate, resulting in low testing efficiency and making it unsuitable for large-scale testing; 3. The equipment has low reliability and is prone to damaging wafer devices during the aging test. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of the prior art by providing a test station for wafer aging. The equipment is small in size, thus occupying little space. In addition, the modular design of the equipment structure facilitates operation by test personnel, improves testing efficiency, and enables large-scale testing.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A test station for wafer aging, used to perform aging tests on wafers in a wafer aging test fixture, the test station including a test drive board module, a lifting module, a translation module and a support stage.

[0007] The test drive board module includes a drive board base plate, a drive board assembly fixed to the top surface of the drive board base plate, and a drive adapter probe board fixed to the bottom surface of the drive board assembly. The drive board base plate has a circular hole in the center, and the drive adapter probe board is located within this hole and has probes arranged in an array on it. The drive board assembly includes a drive board and a relay board module on it. The probes of the drive adapter probe board correspond to the adapter contact points on the top surface of the adapter board. During aging testing, the two contact points abut against each other to transmit test signals.

[0008] The lifting module includes a test platform base plate and lifting cylinder assemblies on both sides. The movable end of each lifting cylinder assembly has a lifting mounting plate, and the two sides of the drive plate base plate are fixed to the lifting mounting plate. The lifting cylinder assembly includes a lifting cylinder and guide column structures on both sides. The lifting module is used to test the rising and falling of the drive plate module. During falling, the probes of the drive adapter probe plate abut against the transfer contact points on the top surface of the adapter plate, thus performing the aging test.

[0009] The translation module includes a translation base plate and a translation cylinder assembly at its bottom. The inner end of the translation base plate is fixed to the middle of the test platform base plate, forming a T-shape. The support platform includes a fixture carrier plate and a fixture pad plate fixed to its top surface. The bottom surface of the fixture carrier plate is fixed to the movable end of the translation cylinder assembly. The fixture carrier plate on the front side of the fixture pad plate is provided with several front fixture blocks, and the fixture carrier plate on the rear side is provided with several rear fixture blocks. The wafer aging test fixture is placed on the fixture pad plate of the support platform. The front and rear fixture blocks are located on the outer periphery of the chuck base, limiting their horizontal movement. The translation cylinder assembly can drive the support platform and the wafer aging test fixture on it to move horizontally inward or outward.

[0010] Preferably, the front end of the clamp carrier plate is provided with a strip-shaped hole to facilitate manual gripping.

[0011] Preferably, the drive adapter probe plate is arranged in a ring.

[0012] Preferably, the fixture pad has a raised fixture limiting strip in the middle, and the bottom surface of the wafer aging test fixture has a corresponding fixture limiting groove to limit the rotation of the wafer aging test fixture in the circumferential direction.

[0013] Preferably, the drive board assembly has a through hole in the middle to dissipate heat and prevent heat accumulation. Additionally, several heat dissipation holes may be formed on the bottom plate of the drive board.

[0014] Preferably, the top surface of the outer periphery of the drive plate bottom plate is provided with a reinforcing plate, which has the function of improving structural strength and protecting the drive plate assembly.

[0015] Preferably, the test bench base plate is equipped with a station protection air circuit control component and a temperature control component. The station protection air circuit control component includes a mounting plate and an air switch, pressure transmitter, power supply, etc., and the temperature control component includes a mounting plate and a control board, power supply, etc.

[0016] Preferably, the top surface of the translation base plate is provided with two linear slide rails, and the linear slide rails are provided with linear sliders that are fixed to the bottom surface of the clamping plate.

[0017] Preferably, the top surface of the rear end of the translation base plate is provided with a buffer limiting component, which includes a limiting pin and hydraulic buffers on both sides, for limiting and buffering the translation module to drive the carrier platform to move inward.

[0018] Preferably, the top surface of the rear end of the translation base plate is provided with a fixture adapter assembly. The fixture adapter assembly includes a fixture adapter mounting plate fixed to the translation base plate. The fixture adapter mounting plate is provided with an inflation valve, an air extraction connector, and a probe plate module. The inflation valve can deliver inert gas into the wafer aging test fixture. The air extraction connector can create negative pressure by evacuating the wafer aging test fixture to adsorb the wafer. The probe plate module can transmit power and signals to the wafer aging test fixture.

[0019] Preferably, there are two inflation valves. One structural distribution of the fixture adapter assembly is as follows: the air extraction connector is located in the middle of the probe plate module, and the inflation valves are located on both sides of the probe plate module. During operation, one inflation valve supplies inert gas into the inner cavity of the wafer aging test fixture, and the gas in the inner cavity of the wafer aging test fixture is discharged through the other inflation valve. After the inner cavity of the wafer aging test fixture is filled with inert gas, one channel is closed, and the other channel is used for pressure maintenance.

[0020] Preferably, the inflation valve includes a guide limiting connector fixed to the clamp adapter mounting plate and a movable inflation connector passing through the guide limiting connector. The movable inflation connector has several pin holes on its front outer periphery, with guide positioning pins inside each hole. The inner end of each guide positioning pin connects to the guide limiting connector, and a compression spring is sleeved on the guide positioning pin between the guide limiting connector and the front end of the movable inflation connector. The movable inflation connector of the inflation valve can move within a certain range, preventing hard contact between the inflation valve and the valve, and ensuring a seal under the action of the compression spring.

[0021] Preferably, the device also includes a housing and a support within it. Multiple test stands are mounted in an array on the support, and the number of wafer aging test fixtures is greater than or equal to the number of test stands. When the test stands are operating, wafers to be tested can be loaded into other wafer aging test fixtures and replaced promptly after testing, improving testing efficiency.

[0022] The advantages of this utility model are: 1. The equipment is small in size, which reduces the space occupied; 2. The modular design of the equipment structure facilitates operation by testers, improves testing efficiency, and enables large-scale testing; 3. It improves the reliability of the equipment and ensures the protection of wafer devices during the aging test. Attached Figure Description

[0023] Figure 1 This is a perspective view of the present utility model;

[0024] Figure 2 This is a side view of the present invention;

[0025] Figure 3 This is a top view of the present invention;

[0026] Figure 4This utility model provides a three-dimensional view of the test drive board module. Figure 1 ;

[0027] Figure 5 This utility model provides a three-dimensional view of the test drive board module. Figure 2 ;

[0028] Figure 6 This is a perspective view of the lifting module in this utility model;

[0029] Figure 7 This is a front view of the lifting module in this utility model;

[0030] Figure 8 The three-dimensional translation module in this utility model Figure 1 ;

[0031] Figure 9 The three-dimensional translation module in this utility model Figure 2 ;

[0032] Figure 10 This is a side view of the translation module in this utility model;

[0033] Figure 11 This is a perspective view of the clamp adapter assembly in this utility model;

[0034] Figure 12 This is a front view of the clamp adapter assembly in this utility model;

[0035] Figure 13 for Figure 12 Sectional view along the AA direction.

[0036] Explanation of key component symbols in the diagram:

[0037] 100. Wafer aging test fixture;

[0038] 200. Test bench;

[0039] 210. Test driver board module; 211. Driver board base plate; 212. Driver board assembly; 213. Driver adapter probe board; 214. Through hole; 215. Reinforcing plate;

[0040] 220. Lifting module; 221. Test bench base plate; 222. Lifting cylinder assembly; 223. Lifting mounting plate; 224. Workstation protection air circuit control assembly; 225. Temperature control assembly;

[0041] 230. Translation module; 231. Translation base plate; 232. Translation cylinder assembly; 233. Linear slide rail; 234. Linear slider; 235. Buffer limit assembly; 235.1. Limit pin; 235.2. Hydraulic damper;

[0042] 240. Support platform; 241. Fixture carrier plate; 241.1. Strip hole; 242. Fixture pad; 243. Fixture front stop; 244. Fixture rear stop; 245. Fixture limit strip;

[0043] 250. Fixture adapter assembly; 251. Fixture adapter mounting plate; 252. Inflation valve; 252.1. Guide limit joint; 252.2. Movable inflation joint; 252.3. Guide positioning pin; 252.4. Compression spring; 253. Air extraction joint; 254. Probe plate module. Detailed Implementation

[0044] To more clearly illustrate this utility model, the following description, in conjunction with the accompanying drawings, will provide further details.

[0045] Example 1: As Figure 1-3 As shown, a test station for wafer aging is used to perform aging tests on wafers in a wafer aging test fixture 100. The test station 200 includes a test drive board module 210, a lifting module 220, a translation module 230, and a support stage 240.

[0046] Combination Figure 4-5 As shown, the test drive board module 210 includes a drive board base plate 211, a drive board assembly 212 fixed on the top surface of the drive board base plate 211, and a drive adapter probe plate 213 fixed on the bottom surface of the drive board assembly 212. The drive board base plate 211 has a circular hole in the middle, and the drive adapter probe plate 213 is located in the circular hole and has probes arranged in an array on it.

[0047] Combination Figure 6-7 As shown, the lifting module 220 includes a test bench base plate 221 and lifting cylinder assemblies 222 on both sides. The movable end of the lifting cylinder assembly 222 is provided with a lifting mounting plate 223, and the two sides of the drive plate base plate 211 are fixed to the lifting mounting plate 223.

[0048] Combination Figure 8-10 As shown, the translation module 230 includes a translation base plate 231 and a translation cylinder assembly 232 at its bottom, with the inner end of the translation base plate 231 fixed to the middle of the test bench base plate 221.

[0049] Combination Figure 8-10 As shown, the support platform 240 includes a clamping carrier plate 241 and a clamping pad 242 fixed on its top surface. The bottom surface of the clamping carrier plate 241 is fixed to the movable end of the translation cylinder assembly 232. A plurality of clamping front blocks 243 are provided on the clamping carrier plate 241 on the front side of the clamping pad 242, and a plurality of clamping rear blocks 244 are provided on the clamping carrier plate 241 on the rear side.

[0050] Example 2: Combination Figure 8-9As shown, based on Embodiment 1, the front end of the fixture carrier plate 241 is provided with a strip hole 241.1.

[0051] Example 3: Combination Figure 5 As shown, based on Embodiment 1 or Embodiment 2, the drive adapter probe plate 213 is arranged in a ring.

[0052] Example 4: Combination Figure 8 , Figure 10 As shown, based on Embodiment 1, Embodiment 2 or Embodiment 3, a protruding clamp limiting strip 245 is provided in the middle of the clamp pad 242.

[0053] Example 5: Combination Figure 4-5 As shown, based on the above embodiment, the drive plate assembly 212 has a through hole 214 in the middle, and the drive plate bottom plate 211 has a reinforcing plate 215 on the top surface of its outer periphery.

[0054] Example 6: Combination Figure 6 As shown, based on the above embodiment, the test bench base plate 221 is provided with a workstation protection air circuit control component 224 and a temperature control component 225.

[0055] Example 7: Combination Figure 8 , Figure 10 As shown, based on the above embodiment, the top surface of the translation base plate 231 is provided with two linear slide rails 233, and the linear slide rails 233 are provided with linear sliders 234 that are fixed to the bottom surface of the clamp carrier plate 241.

[0056] The rear top surface of the translation base plate 231 is provided with a buffer limiting component 235, which includes a limiting pin 235.1 and hydraulic buffers 235.2 on both sides.

[0057] Example 8: Combination Figure 8 , Figure 10-13 As shown, based on the above embodiment, the top surface of the rear end of the translation base plate 231 is provided with a clamping adapter assembly 250. The clamping adapter assembly 250 includes a clamping adapter mounting plate 251 fixed to the translation base plate 231. The clamping adapter mounting plate 251 is provided with an inflation valve 252, an air extraction connector 253, and a probe plate module 254.

[0058] Example 9: Combination Figure 11-13As shown, based on Embodiment 8, the number of inflation valves 252 is two. Each inflation valve 252 includes a guide limiting connector 252.1 fixed on the fixture adapter mounting plate 251 and a movable inflation connector 252.2 passing through the guide limiting connector 252.1. The outer periphery of the front end of the movable inflation connector 252.2 is provided with several pin holes, and a guide positioning pin 252.3 is provided in the pin holes. The inner end of the guide positioning pin 252.3 is connected to the guide limiting connector 252.1. A compression spring 252.4 is sleeved on the guide positioning pin 252.3 between the guide limiting connector 252.1 and the front end of the movable inflation connector 252.2.

[0059] Example 10: Based on the above examples, the test bench of this utility model further includes a housing and a support inside it. The number of test benches 200 is multiple and they are arranged in an array on the support. The number of wafer aging test fixtures 100 is greater than or equal to the number of test benches 200.

[0060] The above description is only a specific embodiment of the present utility model, but the structural features of the present utility model are not limited thereto. The present utility model can be used in similar products. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.

Claims

1. A test board for wafer burn-in, for performing burn-in testing on a wafer within a wafer burn-in test fixture (100), characterized by: The test bench (200) comprises a test driving board module (210), a lifting module (220), a translation module (230) and a bearing table (240); The test driving board module (210) comprises a driving board bottom plate (211), a driving board assembly (212) fixed on the top surface of the driving board bottom plate (211) and a driving adapter probe board (213) fixed on the bottom surface of the driving board assembly (212), a circular hole is arranged in the middle of the driving board bottom plate (211), the driving adapter probe board (213) is located in the circular hole and is provided with probes arranged in an array on the driving adapter probe board (213); The lifting module (220) comprises a test bench bottom plate (221) and lifting cylinder assemblies (222) on both sides of the test bench bottom plate (221), the lifting cylinder assemblies (222) are provided with lifting mounting plates (223) at the movable ends, and the driving board bottom plate (211) is fixed on both sides of the lifting mounting plates (223); The translation module (230) comprises a translation bottom plate (231) and a translation cylinder assembly (232) at the bottom of the translation bottom plate (231), and the inner end of the translation bottom plate (231) is fixed to the middle of the test bench bottom plate (221); The bearing table (240) comprises a clamp carrier plate (241) and a clamp backing plate (242) fixed on the top surface of the clamp carrier plate (241), the bottom surface of the clamp carrier plate (241) is fixed to the movable end of the translation cylinder assembly (232), and the clamp backing plate (242) is arranged on the front side of the clamp carrier plate (241) and is provided with a plurality of clamp front stop blocks (243), and the clamp backing plate (242) is arranged on the rear side of the clamp carrier plate (241) and is provided with a plurality of clamp rear stop blocks (244).

2. A test board for wafer burn-in as defined in claim 1, wherein: The front end of the clamp carrier plate (241) is provided with a strip-shaped hole (241.1), and the driving adapter probe board (213) is arranged in a ring shape.

3. The test board for wafer burn-in as recited in claim 1, wherein: The clamp backing plate (242) is provided with a protruding clamp limiting strip (245) in the middle.

4. The test board for wafer burn-in as recited in claim 1, wherein: The driving board assembly (212) is provided with a through hole (214) in the middle, and the outer peripheral top surface of the driving board bottom plate (211) is provided with a reinforcing plate (215).

5. The test board for wafer burn-in as recited in claim 1, wherein: The test bench bottom plate (221) is provided with a work station protection gas path control assembly (224) and a temperature control assembly (225).

6. The test board for wafer burn-in as recited in claim 1, wherein: The top surface of the translation bottom plate (231) is provided with two straight line sliding rails (233), and the straight line sliding rails (233) are provided with straight line sliding blocks (234) fixed to the bottom surface of the clamp carrier plate (241).

7. The test board for wafer burn-in as recited in claim 6, wherein: The rear end top surface of the translation bottom plate (231) is provided with a buffer limiting assembly (235), and the buffer limiting assembly (235) comprises limiting pins (235.1) and oil pressure buffers (235.2) on both sides of the limiting pins (235.1).

8. The test board for wafer burn-in as recited in claim 1, wherein: The rear end top surface of the translation bottom plate (231) is provided with a clamp adapter assembly (250), and the clamp adapter assembly (250) comprises a clamp adapter mounting plate (251) fixed to the translation bottom plate (231), and the clamp adapter mounting plate (251) is provided with an inflation valve (252), a gas extraction connector (253) and a probe board module (254).

9. The test board for wafer burn-in of claim 8, wherein: The number of the inflation valves (252) is two, the inflation valve (252) comprises a guide limiting joint (252.1) fixed on the clamp adapter mounting plate (251) and a movable inflation joint (252.2) penetrating through the guide limiting joint (252.1), the outer periphery of the front end of the movable inflation joint (252.2) is provided with a plurality of pin holes, a guide positioning pin (252.3) is arranged in the pin hole, the inner end of the guide positioning pin (252.3) is connected with the guide limiting joint (252.1), and the guide positioning pin (252.3) is sleeved with a compression spring (252.4) between the guide limiting joint (252.1) and the front end of the movable inflation joint (252.2).

10. A test bench for wafer burn-in as claimed in any of claims 1 to 9, characterized in that: Further comprising a device shell and a support in the device shell, the number of the test benches (200) is multiple and the test benches (200) are installed in an array on the support, and the number of the wafer aging test clamps (100) is greater than or equal to the number of the test benches (200).

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