Airtight packaging light source device and CPO silicon light engine
By employing glass solder and optical adhesive bonding technology in the light source device, the expensive gold plating and soldering processes are eliminated, solving the problems of high cost, low airtightness and difficult packaging in traditional light engines, and achieving a smaller shell size and a higher airtightness pass rate.
Patent Information
- Application Number
- CN202520549471.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-03-26
AI Technical Summary
Traditional CPO silicon photonics engines suffer from high costs, low airtightness compliance, and packaging difficulties due to the gold plating of polarization-maintaining fibers and the airtightness of solder, resulting in large housing sizes.
The outer shell window is bonded with glass solder and the multi-channel fiber array is bonded with optical adhesive, eliminating the expensive gold plating and soldering processes. The laser is placed inside the shell and equipped with a cooler for heat dissipation.
It reduces the production cost of light source devices, improves the airtightness qualification rate, reduces the size of the housing, and saves packaging space.
Smart Images
Figure CN223796730U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of light engine technology, specifically to a hermetically sealed light source device and a CPO silicon photonics engine. Background Technology
[0002] Traditional CPO silicon photonics engines have 16 high-power light sources, typically broken down into four light source devices. Each light source device contains four lasers. The light source devices are generally hermetically sealed in a box. The specific structure of the light source device is as follows: Figure 1 As shown, it includes at least: a housing, a multi-channel fiber array, a cooler, and four lasers. The multi-channel fiber array is rigidly bonded to the bottom of the housing's inner cavity. The cooler is fixed to the bottom of the housing's inner cavity. The four lasers are each fixed to the cooler, and each laser is sequentially coupled to a lens and an optical isolator along the light propagation direction. The lenses and optical isolators are respectively fixed to the cooler. Four fiber optic holes are opened on the side of the housing. The four polarization-maintaining fibers of the multi-channel fiber array pass through the four fiber optic holes to the outside of the housing. A pigtail protective sleeve is provided at the exit point of the four polarization-maintaining fibers on the outside of the housing. The areas of the polarization-maintaining fibers inside the fiber optic holes and the areas of the pigtail protective sleeves are gold-plated. The housing is gold-plated, and the polarization-maintaining fibers and the housing are airtightly soldered. This type of light source device has the following problems:
[0003] 1) The cost is high because the polarization-maintaining fiber is gold-plated in the area inside the fiber passage and in the area of the pigtail protective sleeve, and the outer shell is also gold-plated.
[0004] 2) Because the polarization-maintaining fiber and the outer shell are airtight with solder, the solder area is large, resulting in a low airtightness pass rate;
[0005] 3) Due to the hard welding of polarization-maintaining fiber to the shell and the hard bonding of multi-channel fiber array to the shell, at least 5mm of length is usually reserved to absorb deformation in order to avoid the polarization-maintaining fiber in the middle area from breaking due to high and low temperature deformation. This results in the shell being larger, usually greater than 15mm, which ultimately makes it more difficult to package the light source device in the CPO silicon photonics engine. Utility Model Content
[0006] The technical problem to be solved by this utility model is to provide a hermetically sealed light source device and a CPO silicon photonic engine to overcome the shortcomings of the prior art.
[0007] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:
[0008] A hermetically sealed light source device includes: a housing and a multi-channel fiber array. A piece of glass is bonded to a window on the side of the housing using glass solder to seal the window. The multi-channel fiber array is arranged outside the housing. The optical port of the multi-channel fiber array is in close contact with the outer surface of the glass. The edge of the multi-channel fiber array is bonded to the glass using optical adhesive. Multiple lasers coupled to the multi-channel fiber array are arranged in the inner cavity of the housing.
[0009] The beneficial effects of this utility model are as follows: In this utility model, the glass and the shell are bonded with glass solder, while the optical port end of the multi-channel fiber array is closely attached to the outer surface of the glass and bonded to it with optical adhesive. This allows the laser to be hermetically sealed inside the shell, thus eliminating the need for expensive gold plating and soldering processes, resulting in a high airtightness rate. Since the multi-channel fiber array is located outside the shell, the polarization-maintaining fiber does not need to reserve at least 5mm of length to absorb deformation, allowing the shell size to be reduced and saving subsequent packaging space.
[0010] Based on the above technical solution, the present invention can be further improved as follows.
[0011] Furthermore, the glass is made of sapphire glass.
[0012] Furthermore, the outer casing uses a standard nickel-plated casing.
[0013] The further beneficial effects of adopting the above are as follows: since the polarization-maintaining fiber of the multi-channel fiber array does not need to be soldered to the outer shell for airtightness, the outer shell can be a regular nickel-plated shell, thereby effectively reducing costs.
[0014] Furthermore, the length of the outer casing is less than 15mm.
[0015] Furthermore, the length of the outer shell is 7.58mm.
[0016] The further beneficial effects of adopting the above are: the shell size is reduced by more than half compared with the existing technology, which greatly saves subsequent packaging space.
[0017] Furthermore, the multi-channel fiber array adopts a four-channel fiber array, with four lasers coupled to the four-channel fiber array arranged in the inner cavity of the housing.
[0018] Furthermore, a cooler is fixed at the bottom of the inner cavity of the outer shell, and the laser is fixed on the cooler via a heat sink.
[0019] The further beneficial effect of adopting the above is that the laser can be cooled by the cooler to maintain it at a suitable operating temperature.
[0020] Furthermore, the refrigeration unit adopts a TEC refrigeration unit.
[0021] Furthermore, each laser is sequentially coupled with a lens and an optical isolator along the light propagation direction to the multi-channel fiber array, and the lens and optical isolator are fixed on the cooler.
[0022] Based on the above technical solution, this utility model also provides a CPO silicon photonics engine, including: the above-mentioned hermetically sealed light source device.
[0023] The further beneficial effects of adopting the above are: applying small-sized hermetically sealed light source devices into CPO silicon photonics engines can save packaging space and reduce packaging difficulty. Attached Figure Description
[0024] Figure 1 This is a structural diagram of a light source device in the prior art;
[0025] Figure 2 This is a structural diagram of the hermetically sealed light source device of this utility model.
[0026] The attached diagram lists the components represented by each number as follows:
[0027] 1. Housing, 2. Multi-channel fiber array, 3. Glass, 4. Optical adhesive, 5. Cooler, 6. Laser, 7. Lens, 8. Optical isolator, 9. Heat sink. Detailed Implementation
[0028] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0029] Example 1
[0030] like Figure 2 As shown, a hermetically sealed light source device includes: a housing 1 and a multi-channel fiber array 2. A window communicating with its inner cavity is opened on the side of the housing 1. A glass 3 is arranged inside the window on the side of the housing 1, and the glass 3 is bonded to the housing 1 using glass solder, thereby sealing the window on the side of the housing 1. The multi-channel fiber array 2 is arranged outside the housing 1, and the optical port of the multi-channel fiber array 2 is in close contact with the outer surface of the glass 3. The edge of the multi-channel fiber array 2 is bonded to the glass 3 using optical adhesive 4. Multiple optical channels are arranged inside the inner cavity of the housing 1. The laser 6 is coupled to the multi-channel fiber array 2. In this invention, the glass 3 and the outer shell 1 are bonded with glass solder, while the optical port end of the multi-channel fiber array 2 is closely attached to the outer surface of the glass 3 and bonded to it with optical adhesive 4. This allows the laser 6 to be hermetically sealed inside the outer shell 1, thus eliminating the need for expensive gold plating and soldering processes, resulting in a high hermeticity rate. Since the multi-channel fiber array 2 is located outside the outer shell 1, the polarization-maintaining fiber does not need to reserve at least 5mm of length to absorb deformation, allowing the size of the outer shell 1 to be reduced and saving subsequent packaging space.
[0031] Example 2
[0032] like Figure 2 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:
[0033] When selecting glass material 3, it is preferable to choose materials with high temperature resistance and strong thermal stress resistance, such as common sapphire glass. Of course, this is just an example, and the use of other glass materials is not excluded in practice.
[0034] Example 3
[0035] like Figure 2 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:
[0036] Since the polarization-maintaining fiber of the multi-channel fiber array 2 does not need to be soldered to the outer shell 1 for airtight sealing, the outer shell 1 can be a regular nickel-plated shell, thereby effectively reducing costs.
[0037] Example 4
[0038] like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below:
[0039] Since the multi-channel fiber array 2 is not built into the housing 1, the polarization-maintaining fiber does not need to reserve at least 5mm in length to absorb deformation, thus reducing the size of the housing 1. That is, the length of the housing 1 can be less than 15mm, and even further, the length of the housing 1 can be 7.58mm, which is more than half the size of the existing technology, greatly saving subsequent packaging space.
[0040] Example 5
[0041] like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 4, as detailed below:
[0042] The multi-channel fiber array 2 adopts a four-channel fiber array, and four lasers 6 coupled to the four-channel fiber array are arranged in the inner cavity of the outer shell 1.
[0043] Example 6
[0044] like Figure 2 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below:
[0045] A cooler 5 is fixed at the bottom of the inner cavity of the outer shell 1. The laser 6 is fixed on the cooler 5 via a heat sink 9. The cooler 5 can dissipate heat from the laser 6 to maintain it at a suitable operating temperature.
[0046] Furthermore, the cooler 5 is preferably a TEC cooler. Of course, this is just an example and does not exclude the use of other types of coolers 5.
[0047] Example 7
[0048] like Figure 2 As shown, this embodiment is a further improvement on embodiment 6, as detailed below:
[0049] Each laser 6 is coupled to a lens 7 and an optical isolator 8 in sequence along the light propagation direction. The emitted light emitted by the laser 6 is coupled into the multi-channel fiber array 2 after passing through the lens 7 and the optical isolator 8 in sequence. Since there are four lasers 6, there are four lenses 7 and four optical isolators 8. The lenses 7 and optical isolators 8 are fixed on the cooler 5, and the fixing method can be adhesive bonding.
[0050] Example 8
[0051] A CPO silicon photonics engine includes: a hermetically sealed light source device as described in any of Examples 1 to 7.
[0052] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A hermetically sealed light source device, characterized in that, include: The outer shell (1) and the multi-channel fiber array (2) are provided. A piece of glass (3) is bonded to the window on the side of the outer shell (1) to seal the window. The multi-channel fiber array (2) is arranged outside the outer shell (1). The optical port of the multi-channel fiber array (2) is close to the outer side of the glass (3). The edge of the multi-channel fiber array (2) is bonded to the glass (3) with optical adhesive (4). Multiple lasers (6) coupled to the multi-channel fiber array (2) are arranged in the inner cavity of the outer shell (1).
2. The hermetically sealed light source device according to claim 1, characterized in that, The glass (3) is made of sapphire glass.
3. The hermetically sealed light source device according to claim 1, characterized in that, The outer casing (1) is a common nickel-plated casing.
4. The hermetically sealed light source device according to claim 1, characterized in that, The length of the outer shell (1) is less than 15 mm.
5. The hermetically sealed light source device according to claim 4, characterized in that, The length of the outer shell (1) is 7.58 mm.
6. The hermetically sealed light source device according to claim 1, characterized in that, The multi-channel fiber array (2) adopts a four-channel fiber array, and four lasers (6) coupled to the four-channel fiber array are arranged in the inner cavity of the outer shell (1).
7. A hermetically sealed light source device according to any one of claims 1 to 6, characterized in that, A cooler (5) is fixed to the bottom of the inner cavity of the outer shell (1), and the laser (6) is fixed to the cooler (5) via a heat sink (9).
8. The hermetically sealed light source device according to claim 7, characterized in that, The cooler (5) is a TEC cooler.
9. A hermetically sealed light source device according to claim 7, characterized in that, Each laser (6) is coupled with a lens (7) and an optical isolator (8) in sequence along the light propagation direction to the multi-channel fiber array (2), and the lens (7) and the optical isolator (8) are respectively fixed on the cooler (5).
10. A CPO silicon photonics engine, characterized in that, include: The hermetically sealed light source device as described in any one of claims 1 to 9.