High-heat-dissipation OSFP packaging 1.6 T SR8 optical engine

Abstract

The utility model relates to a high heat dissipation OSFP package 1.6 T SR8 optical engine, an optical chip and an electric chip are respectively fixed in the coverage area of each lens on the back of a PCB, an insertion core coupled with the lens is arranged below the lens, the lower surface of the insertion core is higher than or flush with the lower surface of the lens, a guide pin on the side surface of the lens is inserted into a guide hole in the end surface of the optical port end of the insertion core, and the optical port end of the insertion core is connected with the optical chip. A notch communicated with the guide hole is formed in the position, corresponding to the end of each guide pin, of the insertion core, glue is dispensed into the notches so that the guide pins and the insertion core can be bonded and fixed, and the height of the lens is smaller than 2.5 mm. The optical engine has the advantages that the insertion core of a special structure is adopted, the lens can be designed to be very thin, namely the height of the lens is smaller than 2.5 mm, and therefore in OSFP packaging, the heat dissipation path of the optical chip and the electric chip in the scheme is that heat dissipation is conducted through the TOP face of the PCB and the upper cover of the shell, the heat dissipation performance is good, and the high-temperature performance of the optical engine is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of light engine, concretely relates to a high heat dissipation OSFP package 1.6T SR8 light engine. BACKGROUND

[0002] Traditional OSFP package 1.6T SR8 light engine at least includes: PCB board, lens, optical chip, electric chip and plug core, the lens is fixed in the TOP face (front) of PCB board, the TOP face of PCB board is fixed with the optical chip coupled with each lens in the coverage area of each lens, the TOP face of PCB board is fixed with the electric chip bonded with the optical chip below each lens in the coverage area of each lens, the optical chip is four channel optical chip, the electric chip is four channel electric chip, the lens side has a jack, the jack has two guide pins, the plug core light port end has two guide holes, the plug core light port end is inserted into the jack on the lens and is coupled with the lens, two guide pins of the lens are inserted into two guide holes on the plug core light port end end face, glue is applied on the lens side to bond and fix the lens and the plug core, as shown in Figure 1 、 Figure 2 The height of the upper surface of the lens from the TOP face of the PCB board in the scheme is greater than 3mm, that is, the height of the lens is greater than 3mm, in common OSFP package, the distance between the TOP face of the PCB board and the upper cover of the shell is greater than 4mm, the distance between the back of the PCB board and the bottom plate of the shell is less than 2.5mm, since the height of the upper surface of the lens from the TOP face of the PCB board in the traditional scheme is greater than 3mm, the lens can only be fixed on the TOP face of the PCB board, the heat dissipation path of the optical chip and the electric chip in the scheme is: heat dissipation through the back of the PCB board and the bottom plate of the shell, but the main heat dissipation of the light engine is the upper cover of the shell, so the scheme of heat dissipation through the bottom plate has the problem of poor heat dissipation performance, which leads to poor high temperature performance of the light engine. UTILITY MODEL CONTENTS

[0003] The technical problem to be solved by the utility model is to provide a high heat dissipation OSFP package 1.6T SR8 light engine to overcome the deficiencies in the prior art.

[0004] The technical scheme for solving the above technical problem of the utility model is as follows:

[0005] A high-heat-dissipation OSFP package 1.6T SR8 optical engine comprises a PCB plate and lenses fixed on the back of the PCB plate, the back of the PCB plate is fixed with optical chips and electrical chips in the coverage area of each lens, the optical chips are coupled with the lenses, the optical chips are gold wire bonded with the electrical chips, the lenses are arranged below the ferrules coupled with the lenses, the lower surface of the ferrules is higher than or flush with the lower surface of the lenses, the guide pins on the side of the lenses are inserted into the guide holes on the end face of the optical port of the ferrules, a notch is formed on the upper surface of the ferrules corresponding to the end of each guide pin, glue is injected into the notch to bond and fix the guide pins and the ferrules, and the height of the lenses is less than 2.5 mm.

[0006] On the basis of the above technical scheme, the utility model further can make improvement as follows.

[0007] Further, the height of the lenses is 2.36 mm.

[0008] Further, the glue injected into the notch is UV glue.

[0009] Further, the number of the notches on the ferrules is two, and the two notches are symmetrically distributed.

[0010] Further, the back of the PCB plate is fixed with two lenses, the back of the PCB plate is fixed with two optical chips and two electrical chips in the coverage area of each lens, the optical chips are four-channel optical chips, and the electrical chips are four-channel electrical chips.

[0011] The utility model has the advantages that: the ferrules have special structures, and glue is injected into the notches of the ferrules to bond and fix the guide pins of the lenses and the ferrules, so that the height direction space of the lenses is not increased, and the lenses can be designed to be very thin, i.e., the height of the lenses is less than 2.5 mm, so that in the OSFP package, the lenses, the optical chips, the electrical chips, and the ferrules can be arranged on the back of the PCB plate, the heat dissipation path of the optical chips and the electrical chips is: heat dissipation through the TOP surface of the PCB plate and the upper cover of the shell, the heat dissipation performance is good, and the high-temperature performance of the optical engine is improved. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a top view of a 1.6T SR8 optical engine in the prior art;

[0013] Figure 2 It is a side view of a 1.6T SR8 optical engine in the prior art;

[0014] Figure 3 It is a top view of a high-heat-dissipation OSFP package 1.6T SR8 optical engine in the utility model;

[0015] Figure 4 It is a side view of a high-heat-dissipation OSFP package 1.6T SR8 optical engine in the utility model;

[0016] Figure 5 The utility model discloses a structure diagram of the ferrule.

[0017] In the drawing, the component list represented by each sign is as follows:

[0018] 1, PCB board, 2, lens, 210, guide needle, 3, optical chip, 4, electric chip, 5, ferrule, 510, guide hole, 520, notch, 6, glue. DETAILED DESCRIPTION

[0019] The principles and characteristics of the utility model are described below in combination with the drawings, and the examples are only used to explain the utility model and not used to limit the scope of the utility model.

[0020] Example 1

[0021] As shown in Figure 3 , Figure 4 , Figure 5 A high-heat-dissipation OSFP package 1.6T SR8 optical engine, comprising: a PCB board 1, a lens 2, an optical chip 3, an electric chip 4 and a ferrule 5; the lens 2 is fixed on the back of the PCB board 1, the optical chip 3 coupled with the lens 2 is fixed on the back of the PCB board 1 in the coverage area of each lens 2, the electric chip 4 gold wire bonded with the optical chip 3 is fixed on the back of the PCB board 1 in the coverage area of each lens 2, and the electric chip 4 is gold wire bonded with the PCB board 1; the ferrule 5 coupled with the lens 2 is arranged below the lens 2, and the lower surface of the ferrule 5 is higher than or flush with the lower surface of the lens 2; the lens 2 side has two guide needles 210, the ferrule 5 light port end face has two guide holes 510, the guide needle 210 on the lens 2 side is inserted into the guide hole 510 on the ferrule 5 light port end face, a notch 520 is formed on the ferrule 5 corresponding to the end of each guide needle 210, the notch 520 is in communication with the guide hole 510 where the guide needle 210 is located, the notch 520 does not penetrate the upper surface of the ferrule 5, glue 6 is dotted into the notch 520 to bond and fix the guide needle 210 and the ferrule 5, and the height of the lens 2 is less than 2.5 mm, that is, when the structure is placed in the shell, the height of the lens 2 is less than the distance from the back of the PCB board 1 to the bottom plate of the shell.

[0022] The ferrule 5 with a special structure is used, and glue 6 is dotted into the notch 520 of the ferrule 5 to bond and fix the guide needle 210 of the lens 2 and the ferrule 5, so that the height direction space of the lens 2 is not increased, but the lens 2 can be designed to be very thin, that is, the height of the lens 2 is less than 2.5 mm, so in the OSFP package, the lens 2, the optical chip 3, the electric chip 4 and the ferrule 5 can be on the back of the PCB board 1, and the heat dissipation path of the optical chip 3 and the electric chip 4 under the scheme is: heat dissipation through the PCB board TOP surface and the upper cover of the shell, so that the heat dissipation performance is good, and the high-temperature performance of the optical engine is improved.

[0023] Embodiment 2

[0024] As shown in Figure 4 , this embodiment is a further improvement on the basis of Embodiment 1, and the specific improvements are as follows:

[0025] The height of the lens 2 can be 2.36mm, so the lens 2 can be on the back of the PCB board 1.

[0026] Embodiment 3

[0027] As shown in Figure 3 , Figure 4 , Figure 5 , this embodiment is a further improvement on the basis of Embodiment 1 or 2, and the specific improvements are as follows:

[0028] The glue 6 in the notch 520 is preferably UV glue.

[0029] Furthermore, the number of notches 520 on the ferrule 5 is two, and the two notches 520 are symmetrically distributed.

[0030] Two lenses 2 are fixed on the back of the PCB board 1, two optical chips 3 and two electrical chips 4 are respectively fixed on the covered area of each lens 2 on the back of the PCB board 1, the optical chip 3 is a four-channel optical chip, and the electrical chip 4 is a four-channel electrical chip.

[0031] Although the embodiments of the utility model have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and cannot be understood as limiting the utility model, and the ordinary skilled in the art can change, modify, replace and modify the above-mentioned embodiments within the scope of the utility model.

Claims

1. A high heat dissipation OSFP package 1.6T SR8 optical engine, characterized in that, The application relates to a PCB (1) and a lens (2) fixed on the back of the PCB (1), the back of the PCB (1) is respectively fixed with an optical chip (3) and an electric chip (4) in the covering area of each lens (2), the optical chip (3) is coupled with the lens (2), the optical chip (3) is gold wire bonded with the electric chip (4), a ferrule (5) coupled with the lens (2) is arranged below the lens (2), the lower surface of the ferrule (5) is higher than or flush with the lower surface of the lens (2), guide pins (210) on the side of the lens (2) are inserted into guide holes (510) on the end face of the light port of the ferrule (5), a notch (520) communicating with the guide hole (510) is formed on the ferrule (5) at the end of each guide pin (210), glue (6) is injected into the notch (520) to bond and fix the guide pin (210) and the ferrule (5), and the height of the lens (2) is less than 2.5 mm. The height of the lens (2) is 2.36 mm.

2. The high heat dissipation OSFP package 1.6T SR8 optical engine according to claim 1, wherein, The glue (6) injected into the notch (520) is UV glue.

3. The high heat dissipation OSFP package 1.6T SR8 optical engine according to claim 1, wherein, The number of the notches (520) on the ferrule (5) is two, and the two notches (520) are symmetrically distributed.

4. The high heat dissipation OSFP package 1.6T SR8 optical engine according to claim 1, wherein, The back of the PCB (1) is fixed with two lenses (2), the back of the PCB (1) is respectively fixed with two optical chips (3) and two electric chips (4) in the covering area of each lens (2), the optical chip (3) is a four-channel optical chip, and the electric chip (4) is a four-channel electric chip.

5. The high heat dissipation OSFP package 1.6T SR8 optical engine according to claim 1, wherein, ​

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