Computer CPU protection device

Abstract

The utility model discloses a computer CPU protection device, and belongs to the technical field of computers. The computer CPU protection device comprises a protection structure and a chip body, the chip body is located on the inner side of the protection structure, a heat dissipation structure is arranged at the top end of the protection structure, the protection structure comprises a protection cover shell, a positioning ring is fixedly connected to the outer side of the protection cover shell, and a heat conduction copper sheet is arranged in the protection cover shell. And the bottom end of the heat-conducting copper sheet is overlapped with the top end of the chip main body. According to the utility model, through the arrangement of the protection structure, the protection cover shell can be rapidly connected with the mainboard through the positioning ring, so that the protection cover shell can cover the chip main body, the chip main body is protected in a wrapping manner in the protection cover shell, and the stress around the chip main body is more uniform; and the condition that dents appear on the surface of the CPU main body due to non-uniform stress is avoided.

Description

Technical Field

[0001] This utility model belongs to the field of computer technology, and more specifically, relates to a computer CPU protection device. Background Technology

[0002] The Central Processing Unit (CPU) is an indispensable basic component of an information system. A computer system consists of five parts: the arithmetic logic unit (ALU), the control unit, the memory, input devices, and output devices. The ALU and control unit together constitute the CPU, and all software runs on the CPU. CPU security has a critical impact on the computer system.

[0003] Patent CN220381540U discloses a CPU protection structure. The method involves first fixing a mounting plate inside the computer case, then snapping the CPU body into the mounting plate. At this point, the cover plate on the mounting plate can be rotated downwards to engage, allowing the engagement holes on the cover plate to engage around the CPU heatsink area. The protruding grooves on both sides of the engagement holes also engage with the metal protrusions on both sides of the CPU body. Then, holding the fastening rod, the middle part of the fastening rod is pressed against the second engagement plate, and the end of the fastening rod is then engaged under the first engagement plate. This completes the fastening of the cover plate and the fixation of the CPU body. This method ensures that when the cover plate applies a fastening force to the CPU body, the force around the CPU body is more even, preventing dents on the CPU body surface caused by uneven force.

[0004] However, the above solution still has some shortcomings in actual use. Because the structure of a computer CPU is relatively fragile, the device needs to use a pressure plate to fix the computer CPU during use. This fixing method will directly contact the CPU, which can easily damage the CPU and reduce the practicality of the device. In addition, the protective structure does not have heat dissipation measures, which means that the heat generated by the CPU during operation cannot be quickly dissipated, and the lifespan of the CPU is greatly reduced. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a computer CPU protection device to solve the problem that existing protection devices are prone to damaging the CPU.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a computer CPU protection device, comprising a protection structure and a chip body, wherein the chip body is located inside the protection structure, and a heat dissipation structure is provided at the top of the protection structure;

[0007] The protective structure includes a protective cover, a positioning ring is fixedly connected to the outer side of the protective cover, and a thermally conductive copper sheet is provided inside the protective cover, with the bottom end of the thermally conductive copper sheet overlapping the top end of the chip body.

[0008] The heat dissipation structure includes an air exchange frame, on the inner wall of which a heat-conducting coil is fixedly installed. Both ends of the heat-conducting coil are fixedly connected to heat exchange tubes via a circulation pump and a return valve, respectively. The heat exchange tubes are located on the outside of the air exchange frame, and an intake fan and an exhaust fan are respectively installed at the top and bottom of the heat exchange tubes.

[0009] More preferably, the bottom end of the thermally conductive copper sheet is coated with thermally conductive silicone grease, and the thermally conductive copper sheet is attached to the top end of the chip body through the thermally conductive silicone grease.

[0010] More preferably, the top end of the thermally conductive copper sheet is provided with thermally conductive fins, and the top end of the thermally conductive copper sheet overlaps with the bottom end of the thermally conductive coil through the thermally conductive fins.

[0011] More preferably, a maintenance cover is movably snapped onto the top of the ventilation frame, and the maintenance cover is located above the heat-conducting coil.

[0012] More preferably, the interior of the heat-conducting serpentine tube and the interior of the heat exchange tube are filled with coolant.

[0013] Compared with the prior art, the present invention provides a computer CPU protection device, which has the following beneficial effects:

[0014] (1) By setting up a protective structure, the protective cover can be quickly connected to the motherboard through the positioning ring, so that the protective cover can cover the chip body. The chip body is wrapped and protected inside the protective cover, avoiding the damage to the CPU caused by the downward pressure in the existing solution. This makes the force around the chip body more uniform and prevents the CPU body surface from being dented due to uneven force.

[0015] (2) By setting up a heat dissipation structure, the device can absorb the heat generated by the chip body using a heat-conducting coil. In addition, the circulation pump and reflux valve can enable the heat exchange tube to perform heat exchange treatment on the heat-conducting coil, which effectively enhances the heat dissipation effect, reduces the working temperature of the chip body, and thus improves the operating efficiency and stability of the chip body. This not only helps to keep the chip body running stably at a suitable working temperature for a long time, but also helps to extend the service life of the chip body. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2This is a schematic diagram of the protective structure of this utility model;

[0018] Figure 3 This is an exploded view of the heat dissipation structure of this utility model;

[0019] Figure 4 This is a bottom view of the heat exchange tube structure of this utility model.

[0020] In the diagram: 1. Protective structure; 101. Protective cover; 102. Positioning ring; 103. Thermally conductive copper sheet; 104. Thermally conductive fins; 2. Chip body; 3. Heat dissipation structure; 301. Ventilation frame; 302. Inspection cover; 303. Thermal coil; 304. Circulation pump; 305. Heat exchange tube; 306. Return valve; 307. Intake fan; 308. Exhaust fan. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1-4 This utility model discloses a computer CPU protection device, including a protective structure 1 and a chip body 2 located inside the protective structure 1. The protective structure 1 includes a protective cover 101, a positioning ring 102 fixedly connected to the outer side of the protective cover 101, and a heat-conducting copper sheet 103 disposed inside the protective cover 101, the bottom end of the heat-conducting copper sheet 103 overlapping the top end of the chip body 2.

[0023] By setting up the protective structure 1, the protective cover 101 can be quickly connected to the motherboard through the positioning ring 102, so that the protective cover 101 can cover the chip body 2. This allows the chip body 2 to be wrapped and protected inside the protective cover 101, avoiding the damage to the CPU caused by downward pressure in the existing solution. This makes the force around the chip body 2 more uniform, and prevents the CPU body surface from being dented due to uneven force.

[0024] Although the CPU has a small fan for protection, the heat generated increases with the increase in current consumption during use, causing the CPU temperature to rise. High temperatures can easily cause electron migration in the internal circuitry, leading to frequent computer crashes and shortening the CPU's lifespan. Therefore, in the device of this invention, a heat dissipation structure 3 is provided at the top of the protective structure 1. The heat dissipation structure 3 includes an air exchange frame 301, with a heat-conducting coil 303 fixedly installed on the inner wall of the air exchange frame 301. Both ends of the heat-conducting coil 303 are fixedly connected to heat exchange tubes 305 via a circulation pump 304 and a return valve 306, respectively. Coolant is injected into the heat-conducting coil 303 and the heat exchange tubes 305. The heat exchange tubes 305 are located outside the air exchange frame 301, and an intake fan 307 and an exhaust fan 308 are respectively provided at the top and bottom of the heat exchange tubes 305.

[0025] By setting up the heat dissipation structure 3, the heat generated by the heat-conducting coil 303 can be absorbed by the heat-conducting coil 303. In conjunction with the circulating pump 304 and the return valve 306, the heat exchange tube 305 can perform heat exchange treatment on the heat-conducting coil 303, which effectively enhances the heat dissipation effect, reduces the operating temperature of the chip body 2, and thus improves the operating efficiency and stability of the chip body 2. This not only helps to maintain the stable operation of the chip body 2 at a suitable operating temperature for a long time, but also helps to extend the service life of the chip body 2.

[0026] Specifically, the bottom end of the thermally conductive copper sheet 103 is coated with thermally conductive silicone grease, and the thermally conductive copper sheet 103 is attached to the top end of the chip body 2 through the thermally conductive silicone grease. In this embodiment, applying thermally conductive silicone grease to the bottom end of the thermally conductive copper sheet 103 and then attaching the bottom end of the thermally conductive copper sheet 103 to the top end of the chip body 2 significantly improves the heat transfer efficiency between the thermally conductive copper sheet 103 and the chip body 2.

[0027] Specifically, a heat-conducting fin 104 is provided at the top of the heat-conducting copper sheet 103, and the top of the heat-conducting copper sheet 103 overlaps with the bottom of the heat-conducting coil 303 through the heat-conducting fin 104. In this embodiment, when the chip body 2 is working, it generates a large amount of heat, which is transferred to the heat-conducting coil 303 through the heat-conducting copper sheet 103 and the heat-conducting fin 104. Subsequently, the coolant inside the heat-conducting coil 303 begins to exchange the heat.

[0028] Specifically, a maintenance cover 302 is movably attached to the top of the ventilation frame 301, and the maintenance cover 302 is located above the heat-conducting coil 303. In this embodiment, the removable maintenance cover 302 allows personnel to easily perform maintenance on the device.

[0029] In use, first connect the chip body 2 to the computer motherboard, and then connect the protective cover 101 to the positioning hole on the computer motherboard through the positioning ring 102 and bolts, so that the protective cover 101 is fitted on the outside of the chip body 2.

[0030] Then, thermal grease is applied to the bottom of the thermally conductive copper sheet 103, and then the bottom of the thermally conductive copper sheet 103 is attached to the top of the chip body 2, so that the heat transfer efficiency between the thermally conductive copper sheet 103 and the chip body 2 is significantly improved.

[0031] The ventilation frame 301 is then placed on top of the protective cover 101, causing the bottom end of the heat-conducting coil 303 inside the ventilation frame 301 to overlap with the top end of the heat-conducting fin 104.

[0032] When the chip body 2 is working, it will generate a lot of heat. This heat will be transferred to the heat conduction coil 303 through the heat conduction copper sheet 103 and the heat conduction fin 104. Then the coolant inside the heat conduction coil 303 will start to exchange the heat.

[0033] Next, the circulation pump 304 is turned on to introduce the coolant inside the heat transfer coil 303 into the heat exchange tube 305. At the same time, the intake fan 307 and the exhaust fan 308 are turned on to accelerate the heat dissipation of the coolant inside the heat exchange tube 305 and improve the heat dissipation efficiency of the coolant inside the heat exchange tube 305. After the heat dissipation is completed, the coolant is introduced into the heat transfer coil 303 through the return valve 306 for circulation cooling, so that the heat of the chip body 2 can be quickly dissipated.

[0034] In summary, this utility model, by setting up a protective structure 1, utilizes a protective cover 101 that can be quickly connected to the motherboard via a positioning ring 102, allowing the protective cover 101 to completely enclose the chip body 2. This provides the chip body 2 with enclosed protection within the protective cover 101, avoiding the damage to the CPU caused by downward pressure in the comparative solution. It also ensures more even force distribution around the chip body 2, preventing dents on the CPU surface due to uneven force. By setting up a heat dissipation structure 3, the heat-conducting coil 303 absorbs the heat generated by the chip body 2. Combined with the circulating pump 304 and the return valve 306, the heat exchange tube 305 can exchange heat with the heat-conducting coil 303, effectively enhancing heat dissipation, reducing the operating temperature of the chip body 2, and thus improving the operating efficiency and stability of the chip body 2. This not only helps maintain the chip body 2 under suitable operating temperatures for extended periods but also helps extend the lifespan of the chip body 2.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A computer CPU shield comprising a shield structure (1) and a chip body (2), characterized in that: The chip body (2) is located inside the protective structure (1), and the top end of the protective structure (1) is provided with a heat dissipation structure (3); The protective structure (1) comprises a protective cover (101), the outer side of the protective cover (101) is fixedly connected with a positioning ring (102), and the inside of the protective cover (101) is provided with a heat-conducting copper sheet (103), and the bottom end of the heat-conducting copper sheet (103) is overlapped with the top end of the chip body (2); The heat dissipation structure (3) comprises an air exchange frame (301), the inner wall of the air exchange frame (301) is fixedly installed with a heat-conducting coil pipe (303), the two ends of the heat-conducting coil pipe (303) are fixedly connected with heat exchange pipes (305) through circulating pumps (304) and backflow valves (306) respectively, the heat exchange pipes (305) are located outside the air exchange frame (301), and the top end and the bottom end of the heat exchange pipes (305) are provided with air inlet fans (307) and air outlet fans (308) respectively.

2. The computer CPU shield of claim 1, wherein: The bottom end of the heat-conducting copper sheet (103) is coated with heat-conducting silicone grease, and the heat-conducting copper sheet (103) is combined with the top end of the chip body (2) through the heat-conducting silicone grease.

3. The computer CPU shield of claim 1, wherein: The top end of the heat-conducting copper sheet (103) is provided with a heat-conducting fin (104), and the top end of the heat-conducting copper sheet (103) is overlapped with the bottom end of the heat-conducting coil pipe (303) through the heat-conducting fin (104).

4. The computer CPU shield of claim 1, wherein: The top end of the air exchange frame (301) is movably clamped with an inspection cover (302), and the inspection cover (302) is located above the heat-conducting coil pipe (303).

5. The computer CPU shield of claim 1, wherein: The inside of the heat-conducting coil pipe (303) is injected with cooling liquid, and the inside of the heat exchange pipe (305) is injected with cooling liquid.

Images