Host machine for medical equipment

Abstract

The utility model provides a host for medical equipment. The host comprises a case and a plurality of heat source assemblies arranged in the case, an air inlet is formed in the first side face of the case, an air outlet is formed in the second side face opposite to the first side face, an air inlet fan is arranged at the air inlet, an air outlet fan is arranged at the air outlet, a heat dissipation air channel is formed in the area between the air inlet and the air outlet, and at least part of the heat source assemblies are arranged in the heat dissipation air channel. An air inlet and an air outlet are formed in the two side faces corresponding to the area where the heat source assemblies are concentrated in the case or the area where the main heat source assemblies are located respectively, an air inlet fan is arranged at the air inlet, and an air outlet fan is arranged at the air outlet. An in-out heat dissipation air channel is formed in an area where heat source assemblies are concentrated in the case or an area where main heat source assemblies are located, the air flowing efficiency of the heat source assembly area in the case is improved, and then the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to medical instrument technical field, concretely relates to a host computer for medical instrument equipment. BACKGROUND

[0002] At present, the function requirement of medical instrument equipment is increasing, the number of electronic components in the host computer of the corresponding medical equipment is also more and more, and the size of the host computer is also required to be as small as possible. This leads to more and more heat sources in the host computer of the medical equipment, at the same time, the host computer is developing towards miniaturization, the internal space of the host computer is narrow, and the increased electronic components and corresponding structural parts gradually occupy the heat dissipation space. At present, the host computer of the medical instrument equipment has a relatively simple internal heat dissipation design, basically adopts the heat dissipation scheme of fan + natural air duct, and it is difficult to meet the increasingly stringent product requirements.

[0003] Therefore, how to improve the heat dissipation efficiency of the host computer of the medical equipment becomes a technical problem to be solved. UTILITY MODEL CONTENT

[0004] The application provides a host computer for medical instrument equipment, at least solves the technical problem of how to improve the heat dissipation efficiency of the host computer of the medical equipment in the related art.

[0005] The application provides a host computer for medical instrument equipment, which comprises a case and a plurality of heat source assemblies arranged in the case; a first side of the case is provided with an air inlet, a second side opposite to the first side is provided with an air outlet, an air inlet fan is arranged at the air inlet, an air outlet fan is arranged at the air outlet, a heat dissipation air duct is formed between the air inlet and the air outlet, and at least part of the plurality of heat source assemblies is arranged in the heat dissipation air duct; the heat source assembly comprises a main control board and a power supply assembly arranged on one side of the main control board, wherein the power supply assembly is arranged close to the first side, the main control board is arranged close to the second side, and the main control board and the power supply assembly are arranged in the heat dissipation air duct; a heat conduction heat dissipation assembly is further arranged on the main control board, one end of the heat conduction heat dissipation assembly is in contact with a heating component on the main control board, and the other end is arranged in the heat dissipation air duct and exchanges heat with the heat dissipation air duct.

[0006] Optionally, the air inlet and the air outlet are arranged opposite to each other.

[0007] Optionally, the heat conduction heat dissipation assembly comprises a base, a heat conduction assembly and a first fin module; the base is connected with the first fin module through the heat conduction assembly, the base is in contact with the heating component, and the first fin module is arranged at the air outlet.

[0008] Optionally, the heat conduction and heat dissipation assembly further includes a second fin assembly, which is disposed on the base on the side opposite to the heat-generating element, and the fins on the second fin assembly are arranged along the airflow direction in the heat dissipation duct.

[0009] Optionally, a thermally conductive medium is applied between the base and the heating element.

[0010] Optionally, the outer surface of the heat conduction and heat dissipation component is coated with a nano-carbon coating.

[0011] Optionally, the heat source assembly further includes an industrial control board, which is stacked with the main control board. A vortex fan and a shunting shroud are disposed on the side of the industrial control board away from the main control board. The air inlet of the vortex fan faces the side of the industrial control board, and the air outlet of the vortex fan faces the side away from the industrial control board. The air inlet of the shunting shroud is disposed at the air outlet of the vortex fan, and the air outlet of the shunting shroud is disposed at the air outlet.

[0012] Optionally, the structural components in the heat dissipation duct have ventilation holes.

[0013] This application has at least the following beneficial effects:

[0014] In this application, air inlets and outlets are respectively opened on two sides of the area where heat source components are concentrated or where the main heat source components are located within the chassis. An intake fan is installed at the air inlet, and an exhaust fan is installed at the air outlet. This forms an inlet-outlet cooling airflow channel in the area where heat source components are concentrated or where the main heat source components are located, improving airflow efficiency in the heat source component area and thus enhancing cooling efficiency. The power supply component, one of the heat source components, is located on one side of the main control board. The cooling airflow channel passes through the power supply component and the main control board, with air intake from the intake fan and exhaust from the exhaust fan, creating a highly fluid cooling airflow in the area of ​​the power supply component and the main control board. This effectively removes more heat from the power supply component and the main control board, further improving cooling efficiency. Furthermore, by installing a heat conduction cooling component on the main control board, the heat from the main heat-generating chips on the main control board is diffused to the heat conduction cooling component and quickly and evenly guided to the cooling airflow channel for heat exchange. This further improves the cooling efficiency of the main control board. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic layout diagram of a host computer for a medical device according to an embodiment of this application;

[0018] Figure 2 This is a schematic diagram of the overall structure of a host computer for a medical device according to an embodiment of this application;

[0019] Figure 3 This is a schematic diagram of the main structure of a host computer for a medical device according to an embodiment of this application;

[0020] Figure 4 This is a schematic diagram of the main structure of another host for a medical device according to an embodiment of this application;

[0021] Figure 5 This is a schematic diagram of the heat conduction and heat dissipation component in an embodiment of this application. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0023] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0024] like Figures 1 to 5 As shown, this application provides a host computer for a medical device, such as...Figure 1 As shown, the host includes: a chassis 10 and a plurality of heat source components 20 disposed inside the chassis 10. The chassis 10 has an air inlet on a first side and an air outlet on a second side opposite to the first side. An intake fan 11 is disposed at the air inlet and an exhaust fan 12 is disposed at the air outlet. A heat dissipation duct 13 is formed in the area between the air inlet and the air outlet. At least some of the plurality of heat source components 20 are disposed in the heat dissipation duct 13.

[0025] In this application, air inlets and outlets are respectively opened on two sides of the area where the heat source components 20 are concentrated or where the main heat source components 20 are located inside the chassis 10. An intake fan 11 is installed at the air inlet and an exhaust fan 12 is installed at the air outlet, so as to form an inlet and outlet heat dissipation air duct 13 in the area where the heat source components 20 are concentrated or where the main heat source components 20 are located inside the chassis 10, thereby improving the air flow efficiency in the area of ​​the heat source components 20 inside the chassis 10 and thus improving the heat dissipation efficiency.

[0026] In one embodiment, such as Figure 2 As shown, the main body 14, front shell assembly 15, top cover assembly 16, and interface plate 17 are composed of a main body 14, a front shell assembly 15, a top cover assembly 16, and an interface plate 17. The top cover assembly 16 may include a top cover, a first side plate, and a second side plate. The top cover, the first side plate, and the second side plate can be separate structures or an integrated structure. The air inlet is located on the first side plate, and the air outlet is located on the second side plate. To improve the airflow efficiency of the heat dissipation duct 13, the air inlet and the air outlet are arranged opposite to each other to form a straight heat dissipation duct 13, reducing airflow resistance and improving heat dissipation efficiency.

[0027] In one embodiment, such as Figure 3 As shown, the heat source component 20 includes a main control board 21 and a power supply component 22 disposed on one side of the main control board 21. The power supply component 22 is disposed near the first side, and the main control board 21 is disposed near the second side. The main control board 21 and the power supply component 22 are disposed within the heat dissipation duct 13. The main control board 21 in a medical device host often has functions such as processing image signals, and it generates a large amount of heat. The power supply component 22 needs to power the entire device and also generates a relatively large amount of heat. In this embodiment, the power supply component 22 is disposed on one side of the main control board 21. The heat dissipation duct 13 passes through the power supply component 22 and the main control board 21, and air is drawn in by the intake fan 11 and exhausted by the exhaust fan 12. This creates a highly fluid airflow in the area of ​​the power supply component 22 and the main control board 21, which can remove more heat from the power supply component 22 and the main control board 21, thereby improving heat dissipation efficiency.

[0028] In one embodiment, since the main control board 21 is the component with the largest heat generation, in order to further improve the heat dissipation efficiency of the main control board 21, such as...Figure 4 As shown, a heat conduction and heat dissipation assembly 30 is also provided on the main control board 21. One end of the heat conduction and heat dissipation assembly 30 contacts the heat-generating components on the main control board 21, and the other end is disposed in the heat dissipation duct 13. One end of the heat conduction and heat dissipation assembly 30 contacts the main heat-generating chips on the main control board 21, diffusing the heat from the main heat-generating chips onto the heat conduction and heat dissipation assembly 30 and quickly and evenly guiding it to the heat dissipation duct 13 for heat exchange. This improves the heat dissipation efficiency of the main control board 21.

[0029] In one embodiment, the heat conduction heat dissipation component 30 can be an integrated heat sink, or it can be any one of a heat pipe heat sink, a phase change heat sink, or a cold heat sink. In this embodiment, the heat conduction heat dissipation component 30 can be as follows: Figure 5 The heat sink structure shown specifically includes a base 31, a heat-conducting component 32, and a first fin module 33. The base 31 is connected to the first fin module 33 via the heat-conducting component 32, and the base 31 is in contact with the heat-generating component. The first fin module 33 is located at the air outlet. In this embodiment, the base 31 is in contact with the main heat-generating component in the main control board 21. A thermally conductive medium, such as thermal gel, silicone grease, or silicone, is applied between the base 31 and the heat-generating component to ensure no gaps between them and high heat transfer efficiency. Heat is conducted to the first fin module 33 through the heat-conducting component 32. The heat on the first fin module 33 is then rapidly exchanged with the cool air through the main airflow of the exhaust fan 12, achieving the purpose of cooling.

[0030] In one embodiment, such as Figure 5 As shown, the heat conduction and heat dissipation assembly 30 also includes a second fin assembly 34. The second fin assembly 34 is disposed on the base 31 on the side opposite to the heat-generating element, and the fins on the second fin assembly 34 are arranged along the airflow direction within the heat dissipation duct 13. The second fin assembly 34 is disposed in the heat dissipation duct 13, and the fins are arranged along the airflow direction within the heat dissipation duct 13 to enable cooling through heat exchange with the rapidly passing cold air in the heat dissipation duct 13.

[0031] In one embodiment, the outer surface of the heat conduction and heat dissipation component 30 is coated with a nano-carbon coating. Specifically, the outer surfaces of the base 31, the first fin module 33, the second fin module 34, and the heat conduction component 32 are all designed to be coated with a black nano-carbon coating to improve heat dissipation efficiency.

[0032] Since the industrial control board 23 acquires the image information processed by the main control board 21 and transmits it to external peripherals such as monitors, mice, and keyboards for users to generate inspection reports, it generates a lot of heat. Due to limited space, the industrial control board 23 is located directly above the main control board 21, away from the heat dissipation air duct 13 between the intake fan 11 and the exhaust fan 12. Therefore, an independent heat dissipation air duct 13 needs to be set up.

[0033] In one embodiment, such as Figure 4 As shown, the heat source assembly 20 also includes an industrial control board 23, which is stacked with the main control board 21. A vortex fan 231 and a shunting shroud 232 are provided on the side of the industrial control board 23 away from the main control board 21. The air inlet of the vortex fan 231 faces the side of the industrial control board 23, and the air outlet of the vortex fan 231 faces the side away from the industrial control board 23. The air inlet of the shunting shroud 232 is located at the air outlet of the vortex fan 231, and the air outlet of the shunting shroud 232 is located at the air outlet.

[0034] In this embodiment, the vortex fan 231 draws in the air below and blows it towards the exhaust vent, carrying away the heat from the industrial control board 23 or its heat sink. The design of the heat sink on the industrial control board 23 can be consistent with the design of the heat conduction and heat dissipation component 30 on the main control board 21. The design of the shroud 232 ensures that this air is directly guided to the exhaust vent, making the airflow inside the product more stable and preventing it from conflicting with the airflow formed by the intake fan 11 and the exhaust fan 12, thus avoiding turbulence.

[0035] In the direction of the heat dissipation air duct 13, structural components with ventilation holes, such as power module protective covers, need to have holes to ensure heat dissipation efficiency.

[0036] In the above embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0037] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A host for a medical instrument device, characterized by, The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof.

2. The host for a medical instrument device of claim 1, wherein, The application relates to a heat source assembly and a heat dissipation method thereof.

3. The host for a medical instrument device of claim 1, wherein, The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof.

4. The host for a medical instrument device of claim 3, wherein, The application relates to a heat source assembly and a heat dissipation method thereof.

5. The host for a medical instrument device of claim 4, wherein, The application relates to a heat source assembly and a heat dissipation method thereof.

6. The host for a medical instrument apparatus according to any one of claims 1 to 5, wherein The application relates to a heat source assembly and a heat dissipation method thereof.

7. The host for a medical instrument device of claim 1, wherein, The application relates to a heat source assembly and a heat dissipation method thereof.

8. The host for a medical instrument device of claim 1, wherein, The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. The application relates to a heat source assembly and a heat dissipation method thereof. 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