Efficient heat dissipation structure capable of enhancing air inlet

Abstract

The utility model discloses an efficient heat dissipation structure for enhancing air intake, which relates to the field of radiators and comprises a mounting frame, a vortex fan is mounted in the middle of the mounting frame and right faces a heat conducting plate, the mounting frame is fixedly connected with the heat conducting plate through a connecting frame, and the rear portion of the heat conducting plate is in contact with a display card in an attached mode. The display card is mounted on a mainboard of the computer; an air guide ring is fixed to the front side of the mounting frame and arranged at an air inlet of the vortex fan. According to the efficient heat dissipation structure capable of enhancing air inlet, in the using process, a large-area air inlet is formed in the front end of the heat dissipation device, the enough air inlet amount is guaranteed, airflow can be guided to be pre-running vortex airflow when entering the heat dissipation device, and therefore the air suction resistance of a turbofan can be reduced, strong air inlet can be provided, and the heat dissipation effect is improved. And flow of air in the heat dissipation structure can be accelerated, so that heat dissipation is accelerated, and the heat dissipation effect of the heat dissipation structure on the display card is improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically to a high-efficiency heat dissipation structure that enhances air intake. Background Technology

[0002] In modern computer systems, graphics cards are a crucial component. While their performance is constantly improving, their power consumption and heat generation are also increasing. Graphics cards generate a lot of heat when they are working. If this heat is not dissipated in time, it can lead to system crashes or even burn out the graphics card. Efficient heat dissipation is essential for maintaining the stable operation of the graphics card and ensuring the performance of the computer system. However, the efficient heat dissipation structure used in existing graphics cards usually involves the use of cooling fans and heat dissipation plates. In order to maintain the overall flatness of the graphics card, the thickness of the turbine fan is reduced. However, this results in a relatively reduced airflow from the turbine fan, which in turn reduces the overall heat dissipation performance of the heat sink.

[0003] Based on the above-mentioned deficiencies, an existing document (Chinese patent with announcement number CN219087625U and publication date of 2023-05-26) describes a graphics card cooling structure that enhances fan intake. By setting a fan housing through hole on the graphics card motherboard, the turbine fan can be recessed into the PCB board, thereby increasing the thickness of the turbine fan and thus increasing the airflow of the turbine fan, enhancing the heat dissipation effect on the heat sink. Furthermore, by setting a fan support plate with auxiliary air intake holes, it can assist the turbine fan in air intake. In conjunction with its main air intake hole, it can increase the intake airflow and air pressure, making the fan more uniform. This, when applied to the heat sink, can provide higher heat dissipation performance for the graphics card cooler.

[0004] The above-mentioned auxiliary air intake is located on the side of the turbine fan's air intake, and the setting of the auxiliary air intake blocks part of the air intake area, resulting in poor strong air intake effect. After the air is drawn in, it needs to be guided before it can form a fast-flowing airflow to cooperate with the heatsink to cool the graphics card. This results in a large load on the vortex fan during operation, which in turn affects the subsequent cooling work. Utility Model Content

[0005] The purpose of this invention is to provide a high-efficiency heat dissipation structure that enhances air intake, thereby solving the problem that the existing high-efficiency heat dissipation structures mentioned in the background art have a relatively slow airflow introduction method during use, and the vortex fan has a large operating load, which affects continuous heat dissipation.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat dissipation structure with enhanced air intake, including a mounting frame, a vortex fan installed in the middle of the mounting frame, the vortex fan facing the heat conduction plate, the mounting frame being fixedly connected to the heat conduction plate via a connecting bracket, the rear of the heat conduction plate being in close contact with the graphics card, and the graphics card being mounted on the motherboard of the computer.

[0007] An air guide ring is fixed to the front side of the mounting frame, and the air guide ring is located at the air inlet of the vortex fan.

[0008] Furthermore, the mounting frame is configured as a hollow rectangular frame, and the air guide ring on the front side of the mounting frame is configured as a trumpet-shaped structure.

[0009] Furthermore, guide vanes are installed at equal angles on the inner wall of the guide ring, and the guide vanes are distributed in an inclined spiral shape. The arrangement of the guide vanes is consistent with the airflow direction after the vortex fan is running.

[0010] Furthermore, the connecting bracket is symmetrically arranged on the outside of the mounting frame, and the connecting bracket is configured as a "U" shaped structure when viewed from above. The connecting bracket is clamped and fixed to the heat-conducting plate.

[0011] Furthermore, heat dissipation fins are installed at equal intervals inside the heat-conducting plate, and the heat dissipation fins have through-holes.

[0012] Furthermore, the heat-conducting plate has fixed edges on its four rear sides, and these fixed edges are fixedly connected to the motherboard by bolts.

[0013] Furthermore, the fixed side is set as an "L" shaped structure, and the distance between the fixed side and the motherboard is equal to the thickness of the graphics card.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This high-efficiency heat dissipation structure with enhanced air intake has a large air intake at the front end of the radiator to ensure sufficient air volume. When the airflow enters, it is guided to become a pre-running vortex airflow, which can reduce the intake resistance of the turbine fan to provide strong air intake and accelerate the flow of air in the heat dissipation structure to accelerate heat dissipation.

[0016] 1. Furthermore, after the vortex fan starts, the large air inlet of the air guide ring can maintain sufficient air intake. When the air enters from the air guide ring, due to the setting of the air guide plate, the airflow will form a spiral airflow, which makes the vortex fan draw in air with less resistance and greater air volume, enhances air intake, and thus better dissipates heat from the heat conduction plate, thereby quickly cooling the graphics card.

[0017] 2. Furthermore, the heat dissipation fins and through-holes inside the heat-conducting plate can provide more space for air circulation, thereby dissipating heat more quickly when the vortex fan is running.

[0018] 3. Furthermore, the fixed edge connects the heatsink to the motherboard, so that when the motherboard and graphics card generate heat, the heatsink can dissipate the heat in a timely manner through solid heat conduction, thereby improving heat dissipation efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the heat-conducting plate, vortex fan, graphics card, and motherboard of this utility model.

[0021] Figure 3 This is a schematic diagram of the front section structure of the heat-conducting plate of this utility model;

[0022] Figure 4 This is a schematic diagram of the mounting frame, connecting bracket, and air guide ring structure of this utility model;

[0023] Figure 5 This is a schematic diagram of the mounting frame, vortex fan, and connecting frame of this utility model;

[0024] Figure 6 This is a schematic diagram of the air guide ring and air guide plate structure of this utility model.

[0025] In the diagram: 1. Mounting frame; 2. Vortex fan; 3. Connecting bracket; 4. Heat conduction plate; 5. Heat dissipation fins; 6. Through-vent; 7. Fixing edge; 8. Motherboard; 9. Graphics card; 10. Air guide ring; 11. Air guide vane. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example 1: Please refer to Figure 1 - Figure 6The present invention provides the following technical solution: a high-efficiency heat dissipation structure for enhanced air intake, including a mounting frame 1, a vortex fan 2 installed in the middle of the mounting frame 1, the vortex fan 2 facing the heat conduction plate 4, the mounting frame 1 being fixedly connected to the heat conduction plate 4 through a connecting bracket 3, the rear of the heat conduction plate 4 being in contact with the graphics card 9, the graphics card 9 being installed on the motherboard 8 of the computer, an air guide ring 10 fixed on the front side of the mounting frame 1, the air guide ring 10 being set at the air inlet of the vortex fan 2, the mounting frame 1 being a hollow rectangular frame, the air guide ring 10 on the front side of the mounting frame 1 being a trumpet-shaped structure, air guide vanes 11 being installed at equal angles on the inner wall of the air guide ring 10, the air guide vanes 11 being distributed in an inclined spiral shape, and the arrangement of the air guide vanes 11 being consistent with the airflow direction after the vortex fan 2 is running;

[0028] During use, the motherboard 8 and graphics card 9 generate heat, which is then dispersed by the heatsink 4. After the vortex fan 2 on the mounting frame 1 is activated, the large air intake of the air guide ring 10 can maintain sufficient air intake. When the air enters from the air guide ring 10, the airflow will form a spiral airflow due to the setting of the air guide 11. This makes the airflow fan 2 draw in air with less resistance and a larger air volume, thus enhancing the air intake and better dissipating heat from the heatsink 4, thereby quickly cooling down the graphics card 9.

[0029] Example 2:

[0030] Based on Embodiment 1, a connecting frame 3 is also disclosed; please refer to [reference needed]. Figure 1 - Figure 5 As shown, its specific structure is as follows:

[0031] The connecting frame 3 is symmetrically arranged on the outside of the mounting frame 1. The connecting frame 3 is set as a "U" shaped structure when viewed from above. The connecting frame 3 is clamped and fixed to the heat conduction plate 4. Heat dissipation fins 5 are installed at equal intervals inside the heat conduction plate 4. The heat dissipation fins 5 have through holes 6.

[0032] When in use, the connecting frame 3 connects the mounting frame 1 and the heat conduction plate 4 together. The heat dissipation fins 5 and the through air holes 6 inside the heat conduction plate 4 can provide more airflow space, so that the heat can be dispersed more quickly when the vortex fan 2 is running.

[0033] Example 3:

[0034] Based on Embodiment 2, a fixed edge 7 is also disclosed; please refer to [reference needed]. Figure 1 As shown, its specific structure is as follows: a fixed edge 7 is provided on the four edges of the rear side of the heat conduction plate 4. The fixed edge 7 is fixedly connected to the motherboard 8 by bolts. The fixed edge 7 is set in an "L" shape. The distance between the fixed edge 7 and the motherboard 8 is equal to the thickness of the graphics card 9.

[0035] When in use, the fixed edge 7 connects the heat conduction plate 4 and the motherboard 8 together, so that when the motherboard 8 and the graphics card 9 generate heat, the heat conduction plate 4 can dissipate the heat in time through solid heat conduction, thereby improving heat dissipation efficiency.

[0036] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0037] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-efficiency heat dissipation structure with enhanced air intake, comprising a mounting frame (1), wherein a vortex fan (2) is mounted in the middle of the mounting frame (1), the vortex fan (2) is facing a heat-conducting plate (4), the mounting frame (1) is fixedly connected to the heat-conducting plate (4) through a connecting bracket (3), the rear part of the heat-conducting plate (4) is in contact with a graphics card (9), and the graphics card (9) is mounted on the motherboard (8) of a computer; Its features are: An air guide ring (10) is fixed to the front side of the mounting frame (1), and the air guide ring (10) is located at the air inlet of the vortex fan (2).

2. The high-efficiency heat dissipation structure for enhanced air intake according to claim 1, characterized in that: The mounting frame (1) is a hollow rectangular frame, and the air guide ring (10) on the front side of the mounting frame (1) is a horn-shaped structure.

3. The high-efficiency heat dissipation structure for enhanced air intake according to claim 2, characterized in that: The inner wall of the air guide ring (10) is equipped with air guide vanes (11) at equal angles. The air guide vanes (11) are distributed in an inclined spiral shape. The arrangement of the air guide vanes (11) is consistent with the airflow direction after the vortex fan (2) is running.

4. The high-efficiency heat dissipation structure for enhanced air intake according to claim 1, characterized in that: The connecting frame (3) is symmetrically arranged on the outside of the mounting frame (1). The connecting frame (3) is arranged in a "U" shape when viewed from above. The connecting frame (3) is clamped and fixed to the heat-conducting plate (4).

5. The high-efficiency heat dissipation structure for enhanced air intake according to claim 1, characterized in that: The heat-conducting plate (4) has heat dissipation fins (5) installed at equal intervals inside, and the heat dissipation fins (5) have through holes (6).

6. The high-efficiency heat dissipation structure for enhanced air intake according to claim 1, characterized in that: The heat-conducting plate (4) has a fixed edge (7) at the four edges of its rear side, and the fixed edge (7) is fixedly connected to the main board (8) by bolts.

7. The high-efficiency heat dissipation structure for enhanced air intake according to claim 6, characterized in that: The fixed edge (7) is set to an "L" shaped structure, and the distance between the fixed edge (7) and the motherboard (8) is equal to the thickness of the graphics card (9).

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